CN109207932A - Film formation device - Google Patents
Film formation device Download PDFInfo
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- CN109207932A CN109207932A CN201710524216.1A CN201710524216A CN109207932A CN 109207932 A CN109207932 A CN 109207932A CN 201710524216 A CN201710524216 A CN 201710524216A CN 109207932 A CN109207932 A CN 109207932A
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- China
- Prior art keywords
- container
- nozzle
- temperature
- heating mechanism
- film formation
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
- B05B1/10—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in the form of a fine jet, e.g. for use in wind-screen washers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C15/00—Enclosures for apparatus; Booths
Abstract
The present invention discloses a kind of film formation device, comprising: container, inside can accommodate substrate；It can be by the exhaust gear of the container exhaust gas inside to vacuum state；The preservation mechanism of stock solution；The nozzle that the solution can be expelled on the substrate；Heating mechanism, can be to heating inside the nozzle and/or the container.Film formation device provided by the invention can reduce or eliminate the liquid mark that substrate is formed in film forming procedure.
Description
Technical field
The present invention relates to films to form field more particularly to a kind of film formation device.
Background technique
Known to use rubbing method, the damp process such as infusion process are as formation film, such as organic film, nothing on a surface of a substrate
The film build method of machine film.For example, proposing a kind of film build method in patent document 1, wherein in an atmosphere, in glass, plastics etc.
On the surface of substrate, the indentation (scratch) of deep 10~400nm is carved, the fine bumps of the striated of prescribed direction are made it have
Face, the coating fluid (dilute solution) made later by coating by composition requirement simultaneously makes it dry, thus in the fine bumps
The anti-soil film (organic film) of composition requirement is formed on face.In addition, proposing a kind of film build method in patent document 2, wherein by oxygen
Change titanium particle, which is mixed in water, forms suspension, and after being further adjusted to specific pH, which is coated on supporter
And make it dry, inorganic oxide titanium film (inoranic membrane) is consequently formed.
The weak solution that coating fluid used in damp process, suspension use solute concentration low.Therefore, after heat drying
The density of obtained film is low, there are problems that the function evanescence of the film formed therewith.For example, anti-being coated with damp process
In dirty film, the film formed in most surface is easy to be scraped due to wiping, and grease proofness disappears sometimes.
In contrast, it is also considered that form the film build method of film on substrate using vacuum vapour deposition (dry method), use
In the case where this method, when film forming, needs to form high vacuum condition, needs the vacuum pumping system of high price.As a result, being difficult to reality
Film forming under existing low cost.
Existing technical literature
Patent document 1: Japanese Unexamined Patent Publication 9-309745 bulletin
Patent document 2: Japanese Unexamined Patent Publication 6-35 bulletin
Summary of the invention
To solve the above problems, Chinese patent application " 20800002404 " propose a kind of film film build method and at
Film device, the film build method and film formation device of the film are by the solution containing two or more material based on constituting each of the solution
The vapour pressure of material and be expelled on substrate under the atmosphere of pressure that sets and form film, the durable of film not only can be improved
Property, cost of manufacture can also be reduced.In the disclosure in this patent, the filmogen in solution can be expelled to substrate under nozzle act
Upper formation film, and the other materials in solution can gasify rapidly when entering in container, to separate with filmogen, not join
With formed film, and then formed have preferable durability film.
But find can there is liquid mark 100 as shown in Figure 2 on substrate when collecting substrate after film forming, to formation film
Substrate form pollution, to remove the liquid mark 100, need by manually or mechanically being wiped, which not only improves manufacture at
This, also reduces production efficiency, sometimes, also will affect quality of forming film.
According to the problem, inventor by test of many times and analysis and research discovery, other materials in solution can into
Gasify rapidly when entering in container, although this ensure that film can be formed by filmogen merely, without mixing impurity,
It is that other materials can absorb a large amount of heat in gasification, so that the temperature around gasification position is lower, leads to part liquid
Body is aggregated in the temperature lower position, is finally formed drips in container and is formed liquid mark 100 on substrate.
Just gasify in view of most material has just enter into container, therefore the gasification phenomenon can carry out near the nozzle,
Cause nozzle and surrounding temperature lower, so that partially liq can eventually form drop drop gradually in nozzle and agglutination nearby
Fall in formation liquid mark 100 on substrate.
In view of the above technical problem, it is necessary to provide a kind of film formation devices by the present invention, are existed with that can reduce or eliminate substrate
The liquid mark formed in film forming procedure.
Foregoing invention purpose is implemented with the following technical solutions in the present invention:
A kind of film formation device, comprising:
Container, inside can accommodate substrate；
It can be by the exhaust gear of the container exhaust gas inside to vacuum state；
The preservation mechanism of stock solution；
The nozzle that the solution can be expelled on the substrate；
Heating mechanism, can be to heating inside the nozzle and/or the container.
As a preferred embodiment, the heating mechanism is set in the container.
As a preferred embodiment, the heating mechanism is arranged close to the nozzle.
As a preferred embodiment, the heating mechanism includes resistance wire.
As a preferred embodiment, further including temperature survey mechanism, the nozzle or the appearance can be measured
Temperature inside device.
As a preferred embodiment, the temperature survey mechanism is located inside the container and is set to the spray
On mouth.
As a preferred embodiment, further including the thermoregulation mechanism being connect with heating mechanism, can adjust
Heating temperature size provided by the heating mechanism.
As a preferred embodiment, further include the controller connecting with heating mechanism, the controller can be
The nozzle, which starts to control the heating mechanism before hydrojet, is heated to the first set temperature and after the nozzle starts hydrojet
It controls the heating mechanism and is heated to the second set temperature.
As a preferred embodiment, second set temperature is higher than first set temperature.
As a preferred embodiment, the heating temperature of the heating mechanism is in the solution at normal temperatures and pressures
Solvent boiling point ± 100 DEG C.
In the present invention, heating mechanism can make up the band due to gasification of non-film material to heating inside nozzle and/or container
Come thermal loss, prevent because in container temperature reduce due to occurs agglutination drips liquid mark is led to the problem of on substrate.
Referring to following description and accompanying drawings, only certain exemplary embodiments of this invention is disclosed in detail, specifies original of the invention
Reason can be in a manner of adopted.It should be understood that embodiments of the present invention are not so limited in range.In appended power
In the range of the spirit and terms that benefit requires, embodiments of the present invention include many changes, modifications and are equal.
The feature for describing and/or showing for a kind of embodiment can be in a manner of same or similar one or more
It uses in a other embodiment, is combined with the feature in other embodiment, or the feature in substitution other embodiment.
It should be emphasized that term "comprises/comprising" refers to the presence of feature, one integral piece, step or component when using herein, but simultaneously
It is not excluded for the presence or additional of one or more other features, one integral piece, step or component.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those skilled in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the film formation device structural schematic diagram that one embodiment of the present invention provides；
Fig. 2 is the substrate picture after prior art film formation device film forming；
Fig. 3 is using the substrate picture after film formation device of the present invention film forming.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to guarantor of the present invention
The range of shield.
It should be noted that it can directly on the other element when element is referred to as " being set to " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more
Any and all combinations of relevant listed item.
Referring to Fig. 1,1 structural schematic diagram of a kind of film formation device provided for one embodiment of the present invention.In this implementation
In mode, which includes: container 11, inside can accommodate substrate 100；It can be by 11 exhaust gas inside of container to true
The exhaust gear 15 of dummy status；The preservation mechanism 23 of stock solution 21；The solution 21 can be expelled on the substrate 100
Nozzle 17；Heating mechanism 10, can be to heating inside the nozzle 17 and/or the container 11.
In the present embodiment, container 11 has vacuum chamber of the accommodating as the substrate 100 of film forming object, to be thin
The formation of film provides vacuum environment.In the present embodiment, which can be the middle control body of substantially rectangular parallelepiped, but this hair
It is bright to be not limited to the shape, correspondingly, the shape of vacuum chamber can match with container 11, it is empty to provide preferably film forming
Between.Certainly, the shape of vacuum chamber is also not limited to the point in the present invention.
In the present embodiment, the exhaust gear 15 communicated with its internal (vacuum chamber) can be set on container 11,
The gas in container 11 is sucked out by suction for exhaust gear 15, to maintain the air pressure in container 11 in desirable value.
Specifically, exhaust gear 15 can be vacuum pump 15.The side wall lower ends of container 11 nearby can be set exhaust and use
Exhaust outlet (not shown).The exhaust outlet can connect one end of pipeline 13, and the other end of the pipeline 13 connects vacuum pump 15.
For vacuum pump 15, as long as being pressed onto middle vacuum (0.1Pa~100Pa) in the present embodiment for atmosphere can be manufactured
Pump of the vacuum state of degree, such as rotary pump (oily rotary vacuum pump) etc..Although turbomolecular pump (TMP), oil diffusion
Pump etc. can manufacture the vacuum state of high vacuum (being less than 0.1Pa), but be not necessarily to the pump at high cost using introducing.So
Installation cost can be made cheap in the present embodiment.
Vacuum pump 15 is operated according to the instruction from controller 16 (control unit), is made by pipeline true in container 11
Reciprocal of duty cycle (pressure) decline.Container 11 is provided with the pressure sensing cell 18 (for example, pressure gauge etc.) of pressure in detection container 11.
The information of pressure in the container 11 detected by pressure sensing cell 18, gradually outputs to controller 16.Sentenced by controller 16
When pressure reaches specified value in disconnected container 11, operation instruction is sent to gas supply source 29 (seeing below text).
It should be noted that for example, in automatic pressure controller (Auto Pressure Controller:APC) equipressure
Under the monitoring of force control unit (diagram is omitted), pass through the flows such as mass flow controller (Mass Flow Controller:MFC)
Adjustment section (diagram is omitted) imports the gases such as argon gas in container, thus also can control the pressure in container 11.Further, it is also possible to
Using the composition for being provided with valve (diagram omit) on the pipeline of the pipeline of the exhaust outlet and pump of connection container 11, by
The aperture of the status adjustment valve of operating is pumped to control the pressure in container 11.
In the present embodiment, the nozzle 17 as discharge 21 component of solution can be set in the top of container 11, thus
Spray solution 21 is carried out from the top down.Certainly, it the setting position of nozzle 17 and is not fixed, need to only be arranged to nozzle 17 can be with
By (vertically downward or tilting downward) discharge downward of solution 21.
Specifically, being inserted into one end of nozzle 17 downward in the top of the inside of container 11, the other end of nozzle 17 can reveal
Outside container 11.The one end for being present in the nozzle 17 inside container 11 has discharge unit 19.It should be noted that insertion is held
The quantity (radical) of nozzle 17 in device 11 does not limit.According to the size of container 11, two are also used sometimes in single container 11
A above nozzle 17.
In the present embodiment, it when axis, relative to the central axis, will can will be arranged centered on the extending direction of nozzle 17
The agent solution 21 that is configured to will to form a film of portion 19 is sprayed with such as 30 degree or more 80 degree of angle, θs below in full cone cell or fan shape out
Mist.The 21 shape particle of solution of for example hundreds of μ m in size is discharged by discharge unit 19.
In the present embodiment, nozzle 17 is connected with preservation mechanism 23 by perfusion tube 25.Wherein, preservation mechanism 23 is
The container 11 of one storage film forming agent solution 21, can supply solution 21 to nozzle 17, by 17 spraying operation of nozzle.
As shown in Figure 1, one end of the other end connection perfusion tube 25 for the nozzle 17 being exposed to outside container 11, the infusion
The other end of pipe 25 is inserted into inside the preservation mechanism 23 of closed receiving film forming agent solution 21.It can be equipped with and carry out on perfusion tube 25
The valve of on-off control.When valve is opened, (film forming agent) solution 21 is conveyed from preservation mechanism 23 by perfusion tube 25 and is discharged, so
It is discharged afterwards from the discharge unit 19 of nozzle 17 to 11 lower inside of container.
In the present embodiment, it is constantly pressurizeed its internal solution 21 by inputting gas by perfusion tube in preservation mechanism 23
Discharge.As shown in Figure 1, appendix 27 and perfusion tube 25 have been respectively protruding into preservation mechanism 23 (being referred to as tank),
The port that perfusion tube 25 protrudes into is located at the liquid level of solution 21 hereinafter, the port that appendix 27 protrudes into is located on the liquid level of solution 21
Side.
The other end of appendix 27 can connect gas supply source 29.Gas supply source 29 is according to from controller 16
Instruction operating, into preservation mechanism 23 supply gas come push push preservation mechanism 23 liquid level.As a result, in embodiments,
Gas supply source 29 by appendix 27 inputs gas into preservation mechanism 23 to apply pressure to the liquid level of preservation mechanism 23, from forming
Film solution 21 is by force feed to perfusion tube 25.It should be noted that in the present invention, being not limited by such pressurization output
The mode of solution 21.
In the present embodiment, it can be adapted with the position of nozzle 17 as the substrate 100 of film forming object, it can position
In the lower section of nozzle 17, the opposite side of nozzle 17 can also be located at.In the present embodiment, nozzle 17 and substrate 100 exist
Position in container 11 is mutually adapted, and can be formed a film on substrate 100 with the filmogen that nozzle 17 sprays.Certainly, as
Preferred or common, nozzle 17 is located at the top of container 11, and substrate 100 is located at the bottom of container 11.In present embodiment
In, film formation device 1 can also have automation (in line) mode of the carrying mechanism of handling substrate 100, thus using automatic
Change mode forms a film, and improves production efficiency.
Specifically, the lower inside in container 11 can be configured with the substrate branch for keeping the substrate 100 as film forming object
Frame 31.In the present embodiment, it waits the carrying mechanism of compositions to support substrate holder 31 with more than two rollers 33,33 ..., passes through
The operating of carrying mechanism, substrate holder 31 can move in container 11.It should be noted that removing movement (this embodiment party of straight line
Formula) except, movement herein further includes rotation.In the case where rotation, as long as such as by substrate holder 31 in the form of turntable etc. structures
At.The inner surface of substrate holder 31 has concave 100 retaining surface of substrate, when film forming, makes the substrate as film forming object
The back side of 100 (no matter single or more than two) is connected to this, thus keeps substrate 100.
In the present invention, as long as the distance between discharge unit 19 and substrate 100 D are from discharge unit 19 with liquid discharge
Film forming agent solution 21 can reach the distance of substrate 100 in liquid form, and there is no particular limitation as to it.This is because at
Film solution 21 can from discharge unit 19 reach substrate 100 distance can because discharge unit 19 direction, from discharge unit 19 be discharged when
The initial velocity of film forming agent solution 21, non-film material contained in film forming agent solution 21 room temperature under vapour pressure (P2) etc.
A variety of causes and change.
In the discharge direction present embodiment directed downwardly of film forming agent solution 21, by adjusting discharge unit 19 and substrate holder
31 configuration makes the following degree of distance D 300mm, and the film for being easy to make reaches sufficient film-strength, and is easy to keep its resistance to
Long property level improves.
In the discharge direction present embodiment directed downwardly of film forming agent solution 21, by configuring discharge unit 19, make it to base
The distance D of plate 100 is 150mm or more, it can be ensured that sufficient effective discharge domain of film forming agent solution 21 is conducive to inhibit film forming
The useless consumption of agent solution 21, result can be more advantageous to the cost effective of film forming.
It should be noted that in the case where the discharge direction present embodiment directed downwardly of film forming agent solution 21, distance D mistake
When remote, the volatilization of the diluent (solvent) of film forming agent solution 21 is caused in discharge process, the levelling after reaching substrate 100 becomes
It is difficult to happen, thus film distribution becomes uneven, and film properties also decline sometimes.When distance D is excessively close, correspond to this, is effectively discharged
Domain becomes narrow, therefore the useless consumption for the agent solution 21 that forms a film becomes more, furthermore also generates film spot sometimes.
Controller 16 is to have pressure control function in container 11 first, transports vacuum pump 15 and pressure sensing cell 18
Turn, the vacuum degree (that is, pressure when film forming starts) inside container 11 is adjusted to state appropriate.At the same time, it is also equipped with
Liquid Level Pressure pressure control function, to the pressure applied from the gas of gas supply source 29 supply to the liquid level in preservation mechanism 23
Power is adjusted.It should be noted that controller 16 is also equipped with to the fortune of the carrying mechanism of the compositions such as more than two rollers 33
Turn, stop the function of being controlled.
In the present embodiment, heating mechanism 10 can make up to heating inside nozzle 17 and/or container 11 because of non-film material
Material gasification and bring thermal loss, prevent because in container 11 temperature reduce due to occurs agglutination drips produce on the substrate 100
The problem of raw liquid mark 100.
It is carried out inside container 11 in view of gasifying, so that the temperature inside container 11 is reduced, even if a certain in container 11
Regional temperature declines by a big margin, and the region can also absorb heat near zone, so as to influence in whole container 11
The temperature in portion.Based on this consideration, heating mechanism 10 can be to heating, at this point, heating mechanism 10 can be to container inside container 11
11 inside is integrally heated, and can also be heated to a certain region inside container 11, present embodiment is not made particularly
Limitation.But preferably, heating mechanism 10 heats as currently preferred 11 inside of container close to the region of nozzle 17
Scheme.
Heating mechanism 10 is by heating the inside of container 11 (vacuum chamber), should thus to heat is inputted inside container 11
Heat can make up due to the heat that material gasifies and loses, to reduce the drop amount that agglutination is formed, eliminate on substrate 100
Liquid mark 100.
In view of tank solution 21 gasifies when nozzle 17 (discharge unit 19) sprays, so that nozzle 17 is attached
Near field and the temperature of nozzle 17 decline by a big margin, and solution 21 is easy to carry out agglutination shape in 17 near zone of nozzle in discharge
At drop, and it is attached on the exposed surface of 17 near zone of nozzle.In general, the discharge unit 19 of nozzle 17 is that position is discharged in solution 21
It sets, position also equally occurs for gasification or position occurs close to gasification, so as to cause the temperature at nozzle 17 (discharge unit 19)
Decline is also more obvious, and the fog for causing part filmogen to be formed by is aggregated to form drop in the outer surface of nozzle 17.
Based on this consideration, heating mechanism 10 can be heated (in container 11) nozzle 17 (part).Wherein, nozzle
17 receive the heat transmitted from heating mechanism 10, reduce temperature without being influenced by gasification, maintain preferably state of temperature；Together
When, heat transfer (non-absolute vacuum) near zone can also be maintained the temperature-resistant of near zone by nozzle 17 itself, from
And the heat lost due to material gasification can be made up by heating to nozzle 17, so that the drop amount that agglutination is formed is reduced,
Eliminate the liquid mark 100 on substrate 100.
It should be noted that heating mechanism 10 provided by present embodiment to inside nozzle 17 or container 11 by adding
Heat solves technical problem to make up the heat absorbed by the gasification of 11 inside non-film material of container with this.Art technology
Made any improvement should all be included in protection scope of the present invention under personnel's above-mentioned enlightenment brought by the present invention and marrow
Within.
In the present embodiment, heating mechanism 10 can be set in container 11, also can be set in outside container 11.Example
Such as, heating mechanism 10 can be set in outside container 11, by heating container 11 with the temperature inside hoisting container 11, to reduce
The drop formed is aggregated because temperature reduces；Alternatively, heating mechanism 10 is located at the part outside container 11 by heated nozzle 17,
Logical heat transfer transfers heat to the part that nozzle 17 is located in container 11, heats nozzle 17 (in container 11) with this
(part).
In the present embodiment preferably, the heating mechanism 10 is set in the container 11.Wherein, heater
Structure 10 can be fixed on the inner wall of container 11, can also be fixed on the component inside container 11.Heating mechanism 10 is consolidated
Determine mode can weld, being spirally connected, grafting etc., do not make special restriction in the present invention, heating mechanism 10 only needed to be located at
In container 11.
It continues from the preceding paragraph description, it is contemplated that nozzle 17 and its near zone are agglomerated droplets (main) generation area, to make to add
Heat needed for the heat that heat engine structure 10 generates passes to (make up) quickly gasification, the heating mechanism 10 is close to the spray
Mouth 17 is arranged.At this point, heating mechanism 10 can heat nozzle 17 and its peripheral region.
Correspondingly, heating mechanism 10 is relative concept close to nozzle 17, as shown in Figure 1, (the following resistance wires of heating mechanism 10
10) it can not generate and contact with nozzle 17, but is both on sense organ (or visually) closely spaced.With reference to shown in Fig. 1
Structure, side wall, the substrate 100 of heating mechanism 10 relative to container 11 etc. is visually closer to nozzle 17.
Specifically, the heating mechanism 10 may include resistance wire 10.Wherein, resistance wire 10 can be as shown in Figure 1 with line
The form of circle is looped around around nozzle 17, forms heating coil, to promote the heating surface (area) (HS heated to nozzle 17, Yi Jizeng
Big heating region.
It certainly, can be not in contact with to prevent, the temperature of nozzle 17 is excessively high and influences molten between resistance wire 10 and nozzle 17
The filming performance of liquid 21.Meanwhile the position that resistance wire 10 is arranged can be located on the spray cone region that nozzle 17 is formed by
Side, thus the run trace for the liquid for avoiding interference from spraying and interfere the formation of film.
In the present embodiment, resistance wire 10 can be connected with power sector by conducting wire.Power sector (not shown) can
Think attaching plug, or the battery component that film formation device 1 has itself, the present invention are not particularly limited.
It in the present embodiment, is the heating temperature convenient for knowing heating mechanism 10, film formation device 1 can also include temperature
Measuring mechanism 14 (temperature sensor) can measure the temperature inside the nozzle 17 or the container 11.Preferably, described
Temperature survey mechanism 14 can be located at 11 inside of container and be set on the nozzle 17.
Wherein, temperature survey mechanism 14 can be connected with controller 16, thus the temperature real-time delivery that measurement is obtained
Into controller 16, controller 16 regulates and controls heating mechanism 10 according to temperature measured by temperature survey mechanism 14.Such as Fig. 1 institute
Show, temperature survey mechanism 14 and heating mechanism 10 (resistance wire 10) can be connected with controller 16,16 basis of controller
The temperature that the temperature that temperature survey mechanism 14 is fed back can be heated with real-time control heating mechanism 10 is generated with providing preferable film
Environment.
Wherein, the temperature that heating mechanism 10 is heated cannot be excessively high, and being formed a film on the substrate 100 with not influence filmogen is
Preferably, certainly, heating temperature provided by heating mechanism 10 can not influence solution 21 in the discharge of nozzle 17.Preferably, described
The heating temperature of heating mechanism 10 is solvent boiling point ± 100 DEG C in the solution 21 at normal temperatures and pressures.
In the present embodiment, film formation device 1 can also include the thermoregulation mechanism that connect with heating mechanism 10 (in figure
16) label is continued to use, heating temperature size provided by the heating mechanism 10 can be adjusted.
Wherein, thermoregulation mechanism can supply electric current, the voltage swing of heating mechanism 10 by control to control heating
The heating temperature of mechanism 10.In addition, thermoregulation mechanism can also be direct when heating mechanism 10 is resistance-type heating mechanism 10
The resistance value size for adjusting heating mechanism 10, to control the heating temperature of heating mechanism 10.Schematic quality is exemplified as, heater
Structure 10 includes multiple heating resistors, thermoregulation mechanism can by adjusting the series-parallel relationship between multiple heating resistors, or
Person's cut-off parts heating resistor.
Thermoregulation mechanism and above controller 16 can be the same part, or different components.Such as temperature tune
Saving mechanism can be switch, and operator changes heating temperature by switching on-off realization；Alternatively, thermoregulation mechanism 16 with
Above controller 16 all can be CPU (or PLC) etc., can be added according to the feedback adjust automatically of temperature survey mechanism 14
The heating temperature of heat engine structure 10.
In the present embodiment, preferably to eliminate the liquid mark 100 on substrate 100, film formation device 1 can also include and add
The controller 16 that heat engine structure 10 connects.The controller 16 can control the heating mechanism before the nozzle 17 starts hydrojet
10 are heated to the first set temperature and control the heating mechanism 10 after the nozzle 17 starts hydrojet and be heated to second to set
Determine temperature；Second set temperature is higher than first set temperature.Wherein, second set temperature is higher than described first
Set temperature.
After starting hydrojet, temperature gradually can be promoted to the second set temperature by heating mechanism 10, can also be shorter
Time in temperature is promoted to the second set temperature.Specifically, heating mechanism 10 is by the first set temperature and the second setting temperature
The promotion rate of degree can match with temperature drop rate when not set heating mechanism 10 in practice, so that heating mechanism 10 be made to mention
The heat that the heat of confession is absorbed with gasification matches.
It should be noted that above controller 16, control unit and thermoregulation mechanism all can be hardware, software,
Or the combination of software and hardware.For example, controller 16, control unit and thermoregulation mechanism all can be CPU, PLC,
Circuit board or computer, to have entity structure；Or have multiple functional modules (such as obtain data module, sentence
Disconnected module, computing module etc.) software program.In addition, controller 16, control unit and thermoregulation mechanism can be with
For the same part, or different components, the present invention and with no restriction.
Please refer to Fig. 2 and Fig. 3, wherein Fig. 1 is that (decompression is spraying) film formation device 1 under the prior art is formed by band
There is 100 picture of substrate of film, Fig. 2 is that the film formation device 1 in present embodiment is formed by 100 figure of substrate with film
Piece.Wherein, the membrance casting condition of the two is identical, distinguish the film formation device 1 that is in present embodiment have in film forming procedure into
The heating mechanism 10 (resistance wire 10) of row heating.From Fig. 2 and Fig. 3 comparison as can be seen that forming a film provided by present embodiment
Device 1 can effectively eliminate the liquid mark 100 formed on the substrate 100 in film forming procedure.
Herein cited any digital value all include between lower limit value to upper limit value with the lower value of an incremented and
The all values of upper value, there are the intervals of at least two units between any lower value and any much higher value.For example, such as
Fruit elaborates that the quantity an of component or the value of process variable (such as temperature, pressure, time etc.) are from 1 to 90, preferably from 20
To 80, more preferably from 30 to 70, then purpose be in order to illustrate also clearly listed in the specification such as to 85,22 to 68,
43 to 51,30 to 32 is equivalent.For the value less than 1, suitably think that a unit is 0.0001,0.001,0.01,0.1.This
It is only intended to the example clearly expressed a bit, it is believed that all possible groups for the numerical value enumerated between minimum and peak
Conjunction is all expressly set forth in the specification in a similar manner.
Unless otherwise indicated, all ranges all include all numbers between endpoint and endpoint.It is used together with range
" about " or " approximation " be suitable for two endpoints of the range.Thus, " about 20 to 30 " are intended to cover that " about 20 to about
30 ", including at least the endpoint indicated.
All articles and reference disclosed, including patent application and publication, for various purposes by quoting knot
Together in this.Describing combined term " substantially by ... constitute " should include identified element, ingredient, component or step and reality
Other elements, ingredient, component or the step of the basic novel feature of the combination are not influenced in matter.Using term "comprising" or
" comprising " describes the combination of element here, ingredient, component or step it is also contemplated that substantially by these elements, ingredient, component
Or the embodiment that step is constituted.Here by using term " can with ", it is intended to illustrate that " can with " includes described any
Attribute is all optional.
Multiple element, ingredient, component or step can be provided by single integrated component, ingredient, component or step.Optionally
Ground, single integrated component, ingredient, component or step can be divided into multiple element, ingredient, component or the step of separation.It is used to
The open "a" or "an" for describing element, ingredient, component or step is not said to exclude other elements, ingredient, component
Or step.
It should be understood that above description is to illustrate rather than to be limited.By reading above-mentioned retouch
It states, many embodiments and many applications except provided example all will be aobvious and easy for a person skilled in the art
See.Therefore, the range of this introduction should not be determined referring to foregoing description, but should referring to appended claims and this
The full scope of the equivalent that a little claims are possessed determines.For comprehensive purpose, all articles and with reference to including special
The disclosure of benefit application and bulletin is all by reference to being incorporated herein.Theme disclosed herein is omitted in preceding claims
Any aspect is not intended to abandon the body matter, also should not be considered as inventor the theme is not thought of as it is disclosed
A part of subject matter.
Claims (10)
1. a kind of film formation device characterized by comprising
Container, inside can accommodate substrate；
It can be by the exhaust gear of the container exhaust gas inside to vacuum state；
The preservation mechanism of stock solution；
The nozzle that the solution can be expelled on the substrate；
Heating mechanism, can be to heating inside the nozzle and/or the container.
2. film formation device as described in claim 1, which is characterized in that the heating mechanism is set in the container.
3. film formation device as claimed in claim 2, which is characterized in that the heating mechanism is arranged close to the nozzle.
4. film formation device as described in claim 1, which is characterized in that the heating mechanism includes resistance wire.
5. film formation device as described in claim 1, which is characterized in that further include temperature survey mechanism, the spray can be measured
Temperature inside mouth or the container.
6. film formation device as claimed in claim 5, which is characterized in that the temperature survey mechanism is located inside the container and sets
It is placed on the nozzle.
7. film formation device as described in claim 1, which is characterized in that it further include the thermoregulation mechanism being connect with heating mechanism,
It can adjust heating temperature size provided by the heating mechanism.
8. film formation device as described in claim 1, which is characterized in that further include the controller being connect with heating mechanism, the control
Device processed can control the heating mechanism before the nozzle starts hydrojet and be heated to the first set temperature and in the nozzle
The heating mechanism, which is controlled, after beginning hydrojet is heated to the second set temperature.
9. film formation device as claimed in claim 8, which is characterized in that second set temperature is higher than the first setting temperature
Degree.
10. film formation device as described in claim 1, which is characterized in that the heating temperature of the heating mechanism is in normal temperature and pressure
Under solvent boiling point ± 100 DEG C in the solution.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524216.1A CN109207932A (en) | 2017-06-30 | 2017-06-30 | Film formation device |
| TW107115040A TW201906009A (en) | 2017-06-30 | 2018-05-03 | Film forming device |
| PCT/JP2018/024423 WO2019004299A1 (en) | 2017-06-30 | 2018-06-27 | Film forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524216.1A CN109207932A (en) | 2017-06-30 | 2017-06-30 | Film formation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109207932A true CN109207932A (en) | 2019-01-15 |
Family
ID=64742372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710524216.1A Pending CN109207932A (en) | 2017-06-30 | 2017-06-30 | Film formation device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109207932A (en) |
| TW (1) | TW201906009A (en) |
| WO (1) | WO2019004299A1 (en) |
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|---|---|---|---|---|
| EP0854024A2 (en) * | 1997-01-20 | 1998-07-22 | Agency of Industrial Science and Technology of Ministry of International Trade and Industry | Thin-film fabrication method and apparatus |
| JPH11316973A (en) * | 1998-04-28 | 1999-11-16 | Dainichiseika Color & Chem Mfg Co Ltd | Production of optical recording medium and optical recording medium produced by the method |
| CN1519391A (en) * | 2002-11-30 | 2004-08-11 | 应用菲林股份有限两合公司 | Evaporation device |
| CN104884665A (en) * | 2012-12-21 | 2015-09-02 | Posco公司 | Heating apparatus, and coating device comprising same |
| CN105377451A (en) * | 2014-05-23 | 2016-03-02 | 株式会社新柯隆 | Thin film deposition method and deposition device |
| CN207016846U (en) * | 2017-06-30 | 2018-02-16 | 株式会社新柯隆 | Film formation device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3059972B2 (en) * | 1993-03-12 | 2000-07-04 | 工業技術院長 | Manufacturing method of organic optical thin film and its equipment |
| JP3030309B2 (en) * | 1994-03-09 | 2000-04-10 | 工業技術院長 | Thin film manufacturing equipment |
| JP2599569B2 (en) * | 1994-03-09 | 1997-04-09 | 工業技術院長 | Method and apparatus for manufacturing composite optical thin film |
| KR970059323A (en) * | 1996-01-30 | 1997-08-12 | 김광호 | Thin film deposition apparatus and thin film deposition method using the same |
| JPH10156228A (en) * | 1996-12-03 | 1998-06-16 | Agency Of Ind Science & Technol | Production of thin film and producing device therefor |
| JP3012547B2 (en) * | 1997-02-25 | 2000-02-21 | 日本ビクター株式会社 | Optical recording medium and manufacturing method thereof |
| JP2002038270A (en) * | 2000-07-27 | 2002-02-06 | Murata Mfg Co Ltd | Method and apparatus for manufacturing compound oxide thin film |
| JP2003257631A (en) * | 2002-02-28 | 2003-09-12 | Sanyo Electric Co Ltd | Method of forming organic el element |
| JP2007260895A (en) * | 2006-03-28 | 2007-10-11 | Erich Thallner | Apparatus and method of coating micro-structured and/or nano-structured structural substrate |
-
2017
- 2017-06-30 CN CN201710524216.1A patent/CN109207932A/en active Pending
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2018
- 2018-05-03 TW TW107115040A patent/TW201906009A/en unknown
- 2018-06-27 WO PCT/JP2018/024423 patent/WO2019004299A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0854024A2 (en) * | 1997-01-20 | 1998-07-22 | Agency of Industrial Science and Technology of Ministry of International Trade and Industry | Thin-film fabrication method and apparatus |
| JPH10202153A (en) * | 1997-01-20 | 1998-08-04 | Agency Of Ind Science & Technol | Method and device for producing thin film |
| JPH11316973A (en) * | 1998-04-28 | 1999-11-16 | Dainichiseika Color & Chem Mfg Co Ltd | Production of optical recording medium and optical recording medium produced by the method |
| CN1519391A (en) * | 2002-11-30 | 2004-08-11 | 应用菲林股份有限两合公司 | Evaporation device |
| CN104884665A (en) * | 2012-12-21 | 2015-09-02 | Posco公司 | Heating apparatus, and coating device comprising same |
| CN105377451A (en) * | 2014-05-23 | 2016-03-02 | 株式会社新柯隆 | Thin film deposition method and deposition device |
| CN207016846U (en) * | 2017-06-30 | 2018-02-16 | 株式会社新柯隆 | Film formation device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019004299A1 (en) | 2019-01-03 |
| TW201906009A (en) | 2019-02-01 |
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