CN104511402B - A kind of spin coating device at wafer surface applying solid melt substance - Google Patents
A kind of spin coating device at wafer surface applying solid melt substance Download PDFInfo
- Publication number
- CN104511402B CN104511402B CN201310449494.7A CN201310449494A CN104511402B CN 104511402 B CN104511402 B CN 104511402B CN 201310449494 A CN201310449494 A CN 201310449494A CN 104511402 B CN104511402 B CN 104511402B
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- CN
- China
- Prior art keywords
- material containing
- containing tank
- wafer surface
- spin coating
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1042—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
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- Coating Apparatus (AREA)
Abstract
The present invention relates at crystal column surface waxing or the equipment of solid melt substance, a kind of spin coating device at wafer surface applying solid melt substance.Including material containing canister assembly, material containing tank heater, nozzle assembly and rotating mechanism, wherein material containing tank heater is connected with material containing canister assembly, described material containing canister assembly and nozzle assembly connect, described rotating mechanism is arranged at material containing canister assembly and the lower section of nozzle assembly corresponding with nozzle assembly, wafer is arranged on described rotating mechanism, material in described material containing canister assembly is molten condition through material containing tank heating devices heat, the material of described molten condition is sprayed to, in the wafer surface that is rotated by described rotating mechanism, be coated by nozzle assembly.Present configuration is compact, layout specification, can realize automatically being coated with；Use the mode of rotary coating, the problem both having solved membrane thickness unevenness, create condition easily for fully-automatic production again.
Description
Technical field
The present invention relates to exist at crystal column surface waxing or the equipment of solid melt substance, specifically one
The spin coating device of wafer surface applying solid melt substance.
Background technology
At present, in the crystal column surface waxing mode using static extrusion more.This mode needs manually to place
With collection wafer, it is unfavorable for large-scale automated production, and the thickness of extrusion mode is the most undesirable.
Summary of the invention
For the problems referred to above, it is an object of the invention to provide a kind of at wafer surface applying solid fused mass
The spin coating device of matter.The mode of this device employing rotary coating, the problem both having solved membrane thickness unevenness,
Condition easily is created again for fully-automatic production.
To achieve these goals, the present invention is by the following technical solutions:
A kind of spin coating device at wafer surface applying solid melt substance, including material containing canister assembly, material containing
Tank heater, nozzle assembly and rotating mechanism, wherein material containing tank heater is connected with material containing canister assembly,
Described material containing canister assembly and nozzle assembly connect, and described rotating mechanism is arranged at material containing canister assembly and nozzle sets
The lower section of part is the most corresponding with nozzle assembly, and wafer is arranged on described rotating mechanism, described material containing tank
Material in assembly is molten condition through material containing tank heating devices heat, and the material of described molten condition is by spraying
Nozzle assembly sprays to, in the wafer surface that is rotated by described rotating mechanism, be coated.
Described material containing canister assembly includes material containing tank and fixed sleeves, and wherein fixed sleeves is arranged at material containing tank
Outside is also connected with material containing tank heater, and described fixed sleeves is arranged on electricity cylinder by Pneumatic slid platform,
Realize the motion both horizontally and vertically gone up.It is provided with thermal insulation board between described fixed sleeves and Pneumatic slid platform.
Described nozzle assembly includes steel pipe, needle nozzle, barrier film on-off valve and metering valve, and wherein steel pipe sets
Being placed on the sidewall of described fixed sleeves in the through hole being provided with along its length, the two ends of described steel pipe are respectively
With the bottom of material containing tank and be arranged at the needle nozzle outside fixed sleeves and be connected, described needle nozzle and rotation
Rotation mechanism is corresponding, and described barrier film on-off valve and metering valve may be contained within side and the steel of fixed sleeves
Pipe connects.
Described fixed sleeves is provided with temperature sensor.The upper end of described material containing tank is provided with material containing tank pressurization hole,
External air source is connected with material containing tank by this pressurization hole.Described material containing tank heater is heating rod.
Described rotating mechanism includes vacuum absorption device, chip heating device and waste material collection device, wherein
Vacuum absorption device includes that electric rotating machine, magnetic fluid seal and vacuum cup, described electric rotating machine pass through
Magnetic fluid seal is connected with vacuum cup, and described waste material collection device is arranged at the outside of vacuum cup,
Described wafer heating plate is arranged at the lower section of vacuum cup and is connected with waste material collection device.
Described waste material collection device includes garbage collection cup, drainage conduit and waste material box, and described vacuum cup sets
Being placed in garbage collection cup, the bottom of described garbage collection cup is connected with waste material box by drainage conduit.Described
In wafer heating plate is arranged at garbage collection cup and it is connected with garbage collection cup.
Advantages of the present invention and providing the benefit that:
Spent material the most of the present invention heating and quantitative projecting device integrative-structure, both can greatly save sky
Between, can ensure that again material is in stable condition in spraying process.
2. present configuration is compact, layout specification, can realize automatically being coated with, can simply with complete from
Motivation platform combines, it is achieved large-scale production.
3. the present invention is compared with common static extrusion mode, and film thickness uniformity is more preferable.
4. the present invention is in spin coating process, is furnished with special waste collection systems, can returning with convenience and high-efficiency
Receive waste material, do not result in external contamination, it is possible to by waste recovery again with.
Accompanying drawing explanation
Fig. 1 is material containing tank and the axis side view of nozzle assembly in the present invention；
Fig. 2 is material containing tank and the cross section view of nozzle assembly in the present invention；
Fig. 3 is the structural representation of rotating mechanism in the present invention；
Fig. 4 is the top view of Fig. 3.
Wherein: 1 is material containing tank, and 2 is barrier film on-off valve, and 3 is metering valve, and 4 is needle nozzle, and 5 for adding
Hot pin, 6 is thermal insulation board, and 7 is Pneumatic slid platform, and 8 is electricity cylinder, and 9 is temperature sensor, and 10 is steel pipe,
11 is fixed sleeves, and 12 is material containing tank pressurization hole, and 13 is garbage collection cup, and 14 is wafer heating plate,
15 is vacuum cup, and 16 is magnetic fluid seal, and 17 is waste pipe, and 18 is waste material box I, and 19 is useless
Magazine II, 20 is electric rotating machine.
Detailed description of the invention
The present invention is described in detail below in conjunction with the accompanying drawings.
As shown in Figure 1 and Figure 2, the present invention includes material containing canister assembly, material containing tank heater, nozzle assembly
And rotating mechanism, wherein material containing tank heater is connected with material containing canister assembly, described material containing canister assembly and spray
Nozzle assembly connects, and described rotating mechanism is arranged at material containing canister assembly and the lower section of nozzle assembly and nozzle
Assembly is corresponding, and wafer is arranged on described rotating mechanism, and the material in described material containing canister assembly is through material containing
Tank heating devices heat is molten condition, and the material of described molten condition is sprayed to by described by nozzle assembly
In the wafer surface that rotating mechanism is rotated, it is coated.
Described material containing canister assembly includes material containing tank 1 and fixed sleeves 11, and wherein fixed sleeves 11 is arranged at load
The outside of batch can 1 is also connected with material containing tank heater, and described material containing tank heater uses heating rod 5.
Described fixed sleeves 11 is arranged on electricity cylinder 8 by Pneumatic slid platform 7, it is achieved both horizontally and vertically go up
Motion.Thermal insulation board 6 it is provided with, to ensure that Pneumatic slid platform 7 is between fixed sleeves 11 and Pneumatic slid platform 7
In the range of normal working temperature.Described fixed sleeves 11 is provided with temperature sensor, and is controlled by temp controlled meter
Heating-up temperature processed.The upper end of described material containing tank 1 is provided with material containing tank pressurization hole 12, and external air source is added by this
Material containing tank pressure hole 12 connects with material containing tank 1.
Described nozzle assembly includes steel pipe 10, needle nozzle 4, barrier film on-off valve 2 and metering valve 3, wherein
Steel pipe 10 is arranged on the sidewall of fixed sleeves 11 in the through hole being provided with along its length, material containing tank 1 He
Steel pipe 10 is structure as a whole, and the two is simultaneously in heated condition, it is ensured that solid melt substance is located always
Under constant temperature, stable in properties.The two ends of steel pipe 10 respectively with the bottom of material containing tank 1 and outside being arranged at
Needle nozzle 4 outside fixed cover 11 connects, and needle nozzle 4 is corresponding with rotating mechanism, described barrier film
On-off valve 2 and metering valve 3 may be contained within the side of fixed sleeves 11 and be connected with steel pipe 10, steel pipe
10 is stainless steel tube.
As shown in Figure 3, Figure 4, described rotating mechanism includes vacuum absorption device, chip heating device and gives up
Material collection device, wherein vacuum absorption device includes that electric rotating machine 20, magnetic fluid seal 16 and vacuum are inhaled
Dish 15, described electric rotating machine 20 is connected with vacuum cup 15 by magnetic fluid seal 16, and magnetic fluid is close
Sealing 16 is prior art.Described waste material collection device includes garbage collection cup 13, drainage conduit 17 and gives up
Magazine, described vacuum cup 15 is arranged in garbage collection cup 13, the bottom of described garbage collection cup 13
Being connected with waste material box by drainage conduit 17, described waste material box includes waste material box I18 and waste material box II19.Institute
State in wafer heating plate 14 is arranged at garbage collection cup 13 and be positioned at the lower section of vacuum cup 15, wafer
Heating plate 14 is connected with garbage collection cup 13.Wafer heating plate 14 can make wafer be brought rapidly up, to protect
In card spin coating process, the physical property of material does not changes.
The specific works process of the present invention is as follows:
After filling solid material in material containing tank 1, heating rod 5 works and heats to material containing tank 1, passes through temperature
Sensor 9 feeds back, it is ensured that material containing tank 1 temperature constant.After material all becomes molten condition, open
Begin to be coated work.External air source provides high pure nitrogen, gives material containing tank 1 via material containing tank pressurization hole 12
Pressurization, the opening and closing of barrier film on-off valve 2 control piper, the speed of high-precision metering valve 3 coutroi velocity.
Needle nozzle 4 and the distance of vacuum cup 15 is adjusted, to reach optimal Painting effect by hardware configuration.
During wafer surface is coated with full with substance, wafer is in high speed rotating state, it is achieved all with coating.Brilliant
Sheet is by vac sorb on vacuum cup 15, and electric rotating machine 20 drives wafer by magnetic fluid seal 16
Rotate.There is hard-wired wafer heating plate 14 below wafer, be used for heating to wafer, make material always
It is in molten condition.Unnecessary material is got rid of in wafer rotary course in garbage collection cup 13, wherein
Waste material be flowed in waste material box I18 and waste material box II19 via waste pipe 17, need to regularly clear up
And replacing.Whole material containing canister assembly and nozzle assembly realize level by electricity cylinder 8 and Pneumatic slid platform 7 and hang down
Nogata motion upwards.
Claims (8)
1. the spin coating device at wafer surface applying solid melt substance, it is characterised in that: include carrying
Batch can assembly, material containing tank heater, nozzle assembly and rotating mechanism, wherein material containing tank heater with
Material containing canister assembly is connected, and described material containing canister assembly and nozzle assembly connect, and described rotating mechanism is arranged at load
Batch can assembly and the lower section of nozzle assembly are the most corresponding with nozzle assembly, and wafer is arranged at described whirler
On structure, the material in described material containing canister assembly is molten condition through material containing tank heating devices heat, described molten
Melt the material of state to be sprayed to, in the wafer surface that is rotated by described rotating mechanism, enter by nozzle assembly
Row coating；
Described material containing canister assembly includes material containing tank (1) and fixed sleeves (11), wherein fixed sleeves (11)
It is arranged at the outside of material containing tank (1) and is connected with material containing tank heater, described fixed sleeves (11)
It is arranged on electricity cylinder (8) by Pneumatic slid platform (7), it is achieved the motion both horizontally and vertically gone up；
Described nozzle assembly includes steel pipe (10), needle nozzle (4), barrier film on-off valve (2) and metering
Valve (3), wherein steel pipe (10) is arranged on the sidewall of described fixed sleeves (11) and sets along its length
In some through holes, the two ends of described steel pipe (10) respectively with the bottom of material containing tank (1) and be arranged at outer solid
The needle nozzle (4) that fixed set (11) is outside connects, and described needle nozzle (4) is relative with rotating mechanism
Should, described barrier film on-off valve (2) and metering valve (3) may be contained within fixed sleeves (11) side,
And be connected with steel pipe (10).
2. the spin coating device at wafer surface applying solid melt substance as described in claim 1, it is special
Levy and be: between described fixed sleeves (11) and Pneumatic slid platform (7), be provided with thermal insulation board (6).
3. the spin coating device at wafer surface applying solid melt substance as described in claim 1, it is special
Levy and be: described fixed sleeves (11) is provided with temperature sensor.
4. the spin coating device at wafer surface applying solid melt substance as described in claim 1, it is special
Levying and be: the upper end of described material containing tank (1) is provided with material containing tank pressurization hole (12), external air source is by being somebody's turn to do
Pressurization hole connects with material containing tank (1).
5. the spin coating device at wafer surface applying solid melt substance as described in claim 1, it is special
Levy and be: described material containing tank heater is heating rod (5).
6. the spin coating device at wafer surface applying solid melt substance as described in claim 1, it is special
Levy and be: described rotating mechanism includes vacuum absorption device, chip heating device and waste material collection device,
Wherein vacuum absorption device includes electric rotating machine (20), magnetic fluid seal (16) and vacuum cup (15),
Described electric rotating machine (20) is connected with vacuum cup (15) by magnetic fluid seal (16), described
Waste material collection device is arranged at the outside of vacuum cup (15), and described wafer heating plate (14) is arranged at
The lower section of vacuum cup (15) is also connected with waste material collection device.
7. the spin coating device at wafer surface applying solid melt substance as described in claim 6, it is special
Levy and be: described waste material collection device includes garbage collection cup (13), drainage conduit (17) and waste material box,
Described vacuum cup (15) is arranged in garbage collection cup (13), described garbage collection cup (13)
Bottom is connected with waste material box by drainage conduit (17).
8. the spin coating device at wafer surface applying solid melt substance as described in claim 7, it is special
Levy and be: described wafer heating plate (14) is arranged in garbage collection cup (13) and and garbage collection
Cup (13) connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310449494.7A CN104511402B (en) | 2013-09-27 | 2013-09-27 | A kind of spin coating device at wafer surface applying solid melt substance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310449494.7A CN104511402B (en) | 2013-09-27 | 2013-09-27 | A kind of spin coating device at wafer surface applying solid melt substance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104511402A CN104511402A (en) | 2015-04-15 |
| CN104511402B true CN104511402B (en) | 2016-08-17 |
Family
ID=52787614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310449494.7A Expired - Fee Related CN104511402B (en) | 2013-09-27 | 2013-09-27 | A kind of spin coating device at wafer surface applying solid melt substance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104511402B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101709704B1 (en) * | 2015-07-01 | 2017-03-08 | 한국과학기술연구원 | Transfer method of materials by using petroleum jelly |
| CN105214899A (en) * | 2015-10-30 | 2016-01-06 | 江苏吉星新材料有限公司 | A kind of liquid wax of wafer revolves wax apparatus and method of waxing |
| CN106493044A (en) * | 2016-12-21 | 2017-03-15 | 华讯方舟科技（湖北）有限公司 | A kind of spot gluing equipment and dispensing method for microwave product |
| CN109158270A (en) * | 2018-09-14 | 2019-01-08 | 深圳市永轮智能设备科技有限公司 | A kind of Wax polishing device |
| CN109731820A (en) * | 2019-01-22 | 2019-05-10 | 上海提牛机电设备有限公司 | A kind of wafer cleaner |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002045757A (en) * | 2001-06-06 | 2002-02-12 | Tokyo Electron Ltd | Apparatus for forming coating film |
| CN201030353Y (en) * | 2007-04-30 | 2008-03-05 | 沈阳芯源微电子设备有限公司 | Square sheet rotating gumming mechanism |
| CN201157813Y (en) * | 2008-01-25 | 2008-12-03 | 沈阳芯源微电子设备有限公司 | Glue spreading apparatus |
| CN201231201Y (en) * | 2008-04-14 | 2009-05-06 | 李新亮 | Seal hot-melt adhesive spraying device |
| CN103301993A (en) * | 2012-03-08 | 2013-09-18 | 株式会社东芝 | Coating apparatus and manufacturing method of coated body |
-
2013
- 2013-09-27 CN CN201310449494.7A patent/CN104511402B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002045757A (en) * | 2001-06-06 | 2002-02-12 | Tokyo Electron Ltd | Apparatus for forming coating film |
| CN201030353Y (en) * | 2007-04-30 | 2008-03-05 | 沈阳芯源微电子设备有限公司 | Square sheet rotating gumming mechanism |
| CN201157813Y (en) * | 2008-01-25 | 2008-12-03 | 沈阳芯源微电子设备有限公司 | Glue spreading apparatus |
| CN201231201Y (en) * | 2008-04-14 | 2009-05-06 | 李新亮 | Seal hot-melt adhesive spraying device |
| CN103301993A (en) * | 2012-03-08 | 2013-09-18 | 株式会社东芝 | Coating apparatus and manufacturing method of coated body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104511402A (en) | 2015-04-15 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Yang Inventor before: Zhang Yang |
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| COR | Change of bibliographic data | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20170927 |