CN109195341A - A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width - Google Patents
A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width Download PDFInfo
- Publication number
- CN109195341A CN109195341A CN201811059297.3A CN201811059297A CN109195341A CN 109195341 A CN109195341 A CN 109195341A CN 201811059297 A CN201811059297 A CN 201811059297A CN 109195341 A CN109195341 A CN 109195341A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- printed circuit
- nickel
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses the preparation methods of a kind of raising route copper layer thickness and the precise printed circuit board of width, the following steps are included: prepared substrate: having plating barrier layer and line pattern on the substrate, the line pattern be layers of copper, the layers of copper with a thickness of 5-75 μm；Nickel plating: by plating pure nickel technique, increasing by one layer of nickel protection layer on exposed layers of copper surface, the nickel protection layer with a thickness of 0.8-2.5 μm；Removal plating barrier layer: the plating barrier layer is removed by moving back membrane process；Alkali etching: the copper that breaks off the base is gone by alkaline etching process；Except nickel: removing the nickel protection layer, show complete layers of copper line pattern, obtain the printed circuit board.A kind of preparation method of the precise printed circuit board of of the invention raising route copper layer thickness and width, can produce the precise printed circuit board of 5-75 μm of route copper layer thickness and line width and route spacing are greater than or equal to 20 μm.
Description
Technical field
The invention belongs to printed circuit board preparation technical fields, and in particular to a kind of route copper layer thickness and width of improving
The preparation method of precise printed circuit board.
Background technique
With electronics miniaturization, densification, the printed board assembly needed is further to high current-carrying, high density, height
Heat-sinking capability, ultra-thin development.It in order to improve precision printed board current-carrying capability, immobilizes in wiring density, it is thick to increase copper conductor
Degree is good solution.But in precise printed circuit board manufacturing process, with subtracting for line width and route spacing
It is small, dry film and wet film resolution are required also more harsh.The increase of dry film and wet-film thickness certainly will will lead to resolution decline,
The precise printed circuit board of high copper thickness can not be made；In addition, as dry film and wet film width become smaller, it is easier to be floating when thickness is higher
From, want increase route copper layer thickness become very difficult.Subtractive process is bigger by copper thickness limitation, and fully-additive process process control is difficult
And at high cost, production 50 μm/50 μm printed boards below of line width line-spacing are not selected generally, mostly use semi-additive process.
20 μm/20 μm of line width line-spacing of printed board can have been made of semi-additive process, but as copper thickness increases, led
Liquid medicine exchange is insufficient between line, and the increase microetch amount generally required at double could etch kept on file copper completely, but use this
Problem brought by the method for sample be will lead to simultaneously the thickness and route of route layers of copper width decline it is obvious.
In view of the above-mentioned problems, having had technical staff now using metal layer covering protection copper face is increased to reduce etching
Amount, to improve route copper layer thickness and line width.Problem remain, however, that
1, plating barrier layer is clipped between route layers of copper, is adopted when line width and spacing are larger, route copper layer thickness is relatively thin
It can be removed with membrane process is moved back.But with the diminution of line width and spacing, the increase of route copper layer thickness is especially smart
Close route often line width and route spacing when 30 μm or less, route copper layer thickness are at 25 μm or more, plating barrier layer
Removal can be increasingly difficult to, using it is traditional move back membrane process after often there are problems that plating barrier layer residual, plating barrier layer
Residual can cause to dodge the generation that copper at the bottom of when losing remained and caused poor short circuit again；
2, the area of increased coat of metal and the area of electroplating line are consistent, tend to exceed the 60% of whole plate suqare, with
On solution proposed using the noble metals such as palladium, silver can because cost be too high to mass production；Tin and slicker solder
Alloy can not it is resistance to live wet process except glue liquid medicine attack, can because aoxidize and lose protective effect；Nickel and nickel-phosphorus alloy are often through change
Prepared by method, the alkaline environment in preparation process directly can destroy plating barrier layer and preparation is caused to fail；
3, layers of copper also will receive influence when removing coat of metal, and the reaction time of the thicker needs of the thickness of coat of metal is more
Long, the probability of layers of copper under fire is higher；Meanwhile the blocked up thickness that also can have coat of metal of thickness of coat of metal adds
The overall thickness of the thickness of upper layers of copper is more than plating barrier layer thickness, is extended so as to cause the part that coat of metal exceeds to both sides
And plating barrier layer is sandwiched, cause plating barrier layer that can not completely remove；The thickness of coat of metal is too thin and will lead to densification
Property it is insufficient, and it is unprotected and under attack part layers of copper occur；
4, since the line pattern in printed board has been formed, during removing coat of metal, electricity is had between conductor
Son transfer, forms that potential is poor, and the peeling rate for isolating coat of metal in route and route close quarters reduces, when processing
Between can extend, can further lead to attack of the layers of copper by liquid medicine in this way.
Summary of the invention
In view of this, in order to overcome the drawbacks of the prior art, it is thick that the object of the present invention is to provide a kind of raising route layers of copper
The preparation method of the precise printed circuit board of degree and width, can significantly improve the copper layer thickness and width of route.
In order to achieve the above object, the invention adopts the following technical scheme:
A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width, comprising the following steps:
1) prepared substrate: having plating barrier layer and line pattern on the substrate, the line pattern is layers of copper, the copper
Layer with a thickness of 5-75 μm；
2) nickel plating: by plating pure nickel technique, increasing by one layer of nickel protection layer on exposed layers of copper surface, the nickel protection layer
With a thickness of 0.8-2.5 μm；
3) it removes plating barrier layer: removing the plating barrier layer by moving back membrane process；
4) copper that breaks off the base alkali etching: is gone by alkaline etching process；Alkali etching can etched copper without attack nickel protect
Sheath makes route copper layer thickness not reduce to reach the nondecreasing purpose of route copper layer thickness in vertical direction；Vertical Square
To by nickel protection layer protection and route side direction layers of copper will receive liquid medicine attack, need to control alkali etching temperature herein in 40-
45 DEG C, and etching speed is improved to reduce alkali etching microetch amount, it reduces to the stinging erosion of route side and improves line width；
5) it removes nickel: removing the nickel protection layer, show complete layers of copper line pattern, obtain the printed circuit board.It is going
Except in the process to make medical fluid not attack layers of copper, a certain amount of copper protective agent is added, and handle according to nickel meltage or product
Amount is supplemented.
Wherein, plating pure nickel technological parameter in step 2 are as follows: current density 4-8ASF, electroplating time 300-600s,
By the thickness for controlling the state modulator nickel protection layer of nickel plating.
The specific processing step of membrane process is moved back described in step 3) are as follows: logical using strong alkali solution or organic stripping solution
It crosses spray or immersion way handles the substrate, remove plating barrier layer.The strong alkali solution is mass percent
The sodium hydroxide or potassium hydroxide solution of concentration 4%-6%；The main ingredient of organic stripping solution includes monoethanolamine and tetramethyl
Base ammonium hydroxide.
In some embodiments, when the thickness of layers of copper is more than or equal to 25 μm on the substrate in step 1), after moving back membrane process
It needs to increase the wet process plating barrier layer remaining except adhesive process removal, completely removes plating except glue impregnate by increasing wet process
Barrier layer.
Preferably, the wet process removes glue specific steps are as follows: using alkalinity potassium permanganate system medical fluid to remaining in layers of copper line
Plating barrier layer between road carries out immersion or spray process, and remaining plating barrier layer is dissolved and is removed.
The specific steps of alkaline etching process described in step 4) are as follows: be mixed into using copper chloride, ammonium hydroxide and ammonium chloride
Alkaline etch solution carries out spray process to the substrate.Wherein the concentration of copper chloride is 100-150g/L, the concentration of ammonium hydroxide is
The concentration of 670-700mL/L and ammonium chloride is 90-110g/L.
Preferably, the operation temperature of the alkali etching is 40-45 DEG C, and etching is reduced under the premise of guaranteeing etch quantity
Time, reduction guarantee the stinging erosion of route layers of copper side the width of route layers of copper.
Using going nickel liquid medicine to remove nickel protection layer, described goes added with copper protective agent in nickel liquid medicine step 5), described
Copper protective agent are as follows: benzotriazole and its derivative, imidazole and its derivants or 5- aminotetrazole and its derivative, it is described
The additive amount of copper protective agent is that described to go the concentration of copper protective agent in nickel liquid medicine be 5 ± 2g/L.
In some embodiments, the preparation of substrate described in step 1) is the following steps are included: choosing bottom copper thickness is 6-12 μ
Bottom copper thickness is reduced to 2-4 μm by subtracting process for copper by the copper foil base material of m；It is produced on the copper foil base material after being thinned
Through-hole or blind hole；Metalized is carried out to through-hole or blind hole；High-res light-sensitive surface is pasted on copper foil base material surface, according to
Product copper layer thickness requires selection patch 1 time or 2 light-sensitive surfaces, meets copper layer thickness requirement to increase photographic film thickness；It is logical
The figure transfer process such as overexposure, development, form plating barrier layer on copper foil base material；By copper-plating technique, stop in plating
Layer uncovered area is electroplated upper layers of copper and forms line pattern, obtains the substrate.
Compared with prior art, the beneficial effects of the present invention are: a kind of raising route copper layer thickness of the invention and width
Precise printed circuit board preparation method, by route layers of copper increase nickel protection layer, using alkali etching remove bottom copper
And control the technological parameter of alkali etching and increase copper protective agent when removing nickel protection layer, route copper can be produced
The precise printed circuit board and line width and route spacing of 5-75 μm of thickness degree are more than or equal to 20 μm；It is designed in same route
When, obtained printed circuit board line width makes resulting line width than common semi-additive process and increases 2-8 μm.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the sectional view of copper foil base material in the preferred embodiment of the present invention；
Fig. 2 is that copper foil base material subtracts the sectional view after copper in the preferred embodiment of the present invention；
Fig. 3 is that copper foil base material opens up the sectional view after through-hole in the preferred embodiment of the present invention；
Fig. 4 is to carry out the sectional view after metalized in the preferred embodiment of the present invention to through-hole or blind hole；
Fig. 5 is to be prepared with the sectional view after plating barrier layer on copper foil base material in the preferred embodiment of the present invention；
Fig. 6 is the sectional view of substrate in the preferred embodiment of the present invention；
Fig. 7 is the sectional view after being coated with nickel protection layer in the route layers of copper of substrate in the preferred embodiment of the present invention；
Fig. 8 is the sectional view after the plating barrier layer removed on substrate in the preferred embodiment of the present invention；
Fig. 9 is the sectional view after the etching of preferred embodiment of the present invention neutral and alkali；
Figure 10 is the sectional view after the nickel protection layer removed on substrate in the preferred embodiment of the present invention；
Figure 11 is the preparation method flow chart of the printed circuit board in the preferred embodiment of the present invention；
In attached drawing: dielectric material -1, bottom copper -2, through-hole or blind hole -3, hole metallization layer -4, plating barrier layer -5, layers of copper -6,
Nickel protection layer -7.
Specific embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, implement below in conjunction with the present invention
Attached drawing in example, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment
Only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to protection of the present invention
Range.
Please refer to Fig. 1 to Figure 10, the precise printed circuit board of a kind of the raising route copper layer thickness and width of the present embodiment
Preparation method, as shown in figure 11, specifically includes the following steps:
Step S1: prepared substrate
Substrate includes being located in the middle dielectric material 1, the bottom copper 2 on dielectric material 1, the mesoporous metal being covered on bottom copper 2
Change layer 4 and plating barrier layer 5 and line pattern on hole metallization layer 4, line pattern is layers of copper 6, the thickness of layers of copper 6
Degree is 5-75 μm.
The preparation of substrate is the following steps are included: selection bottom copper 2 is incited somebody to action with a thickness of 6-12 μm of copper foil base material by subtracting process for copper
The thickness of bottom copper 2 is reduced to 2-4 μm；Through-hole or blind hole 3 are produced on the copper foil base material after being thinned；To through-hole or blind hole
3 carry out metalized, and one layer of hole metallization layer 4 is covered on through-hole or blind hole 3；High-res are pasted on copper foil base material surface
Light-sensitive surface selects patch 1 time or 2 light-sensitive surfaces according to the thickness requirement of route layers of copper 6, to increase the superposition thickness of light-sensitive surface
Meet the requirement of 6 thickness of layers of copper；By the figure transfer process such as expose, develop, plating barrier layer 5 is formed on copper foil base material；
By copper-plating technique, upper layers of copper 6 is electroplated in the unlapped region of plating barrier layer 5 and forms line pattern, obtains substrate.
Step S2: nickel plating
By plating pure nickel technique, increase by one layer of nickel protection layer 7 on exposed 6 surface of layers of copper, controls the thickness of nickel protection layer 7
It is 0.8-2.5 μm.
The specific steps of plating pure nickel technique are as follows: current density control is in 4-8ASF, electroplating time: 300- when plating pure nickel
600s, the thickness of the state modulator nickel protection layer 7 by controlling nickel plating.
Step S3: removal plating barrier layer
Plating barrier layer 5 is removed by moving back membrane process.
Move back the specific steps of membrane process are as follows: the sides such as spray, immersion are passed through using strong alkali solution or organic stripping solution
Formula handles substrate, removes plating barrier layer.Strong alkali solution in the present embodiment is mass percent concentration 4%-6%'s
The main ingredient of sodium hydroxide or potassium hydroxide solution, organic stripping solution includes monoethanolamine and tetramethylammonium hydroxide.
If the thickness of layers of copper 6 is more than or equal to 25 μm on the substrate in step S1, moved back after membrane process often using traditional
Can there are problems that the residual of plating barrier layer 5.So the present embodiment increases wet process except adhesive process removal is remaining after moving back membrane process
Plating barrier layer 5, by increasing wet process except glue is sprayed or impregnated and completely removes plating barrier layer 5.
Wet process removes glue specific steps are as follows: using alkalinity potassium permanganate system medical fluid to the electricity remained between 6 route of layers of copper
Plating barrier layer 5 carries out immersion or spray process, is dissolved removal.
Step S4: alkali etching
The copper that breaks off the base is removed by alkaline etching process.
The specific steps of alkaline etching process are as follows: use copper chloride (concentration 100-150g/L), ammonium hydroxide (concentration 670-
700mL/L) the alkaline etch solution being mixed into ammonium chloride (concentration 90-110g/L) carries out spray process to substrate, removes not
The bottom copper 2 for thering is nickel protection layer 7 to be protected.
The operation temperature of alkali etching is 40-45 DEG C, and the time of etching is reduced under the premise of guaranteeing etch quantity.Alkalinity erosion
Quarter, amount determined according to the thickness of bottom copper 2, if copper 2 thickness in bottom is generally 2-4 μm, then to control line width, alkali etching amount
It needs to control at 3-6 μm.Therefore wherein one section that multistage spray is often only opened in alkali etching, and control the speed of equipment line
Degree is in 5-8m/min.
Remove the copper 2 that breaks off the base by alkaline etching process, alkali etching can only etching bottom copper 2 without attacking nickel protection layer 7,
Will not reduce the thickness of route layers of copper 6 by the nondecreasing purpose of thickness for reaching route layers of copper 6 in vertical direction；Vertical Square
To by the protection of nickel protection layer 7 and the side of route layers of copper 6 will receive liquid medicine attack, so temperature when needing to control alkali etching
Degree reduces the time of etching at 40-45 DEG C under the premise of guaranteeing to bottom 2 etch quantity of copper, and 6 side of route layers of copper is stung in reduction
Lose and guarantee the width of route layers of copper 6.
Step S5: nickel is removed
Using going nickel liquid medicine to remove nickel protection layer 7, shows complete 6 line pattern of layers of copper, obtain printed circuit board.It was removing
Cheng Zhongwei makes sulfuric acid system medical fluid not attack layers of copper 6, goes in nickel liquid medicine to be added to a certain amount of copper protective agent, and dissolved according to nickel
Amount or product treating capacity are supplemented.What is used in the present embodiment goes nickel liquid medicine to call on the good limited public affairs of science and technology for commercially available Shenzhen hundred
The nickel stripper of the model Biotech NS-800 of department.
Copper protective agent in the present embodiment are as follows: benzotriazole and its derivative, imidazole and its derivants or 5- amino
Tetrazole and its derivative, the additive amount of copper protective agent are the quality hundred that copper protective agent is added to copper protective agent after nickel liquid medicine
Specific concentration is divided to be maintained at 5 ± 2g/L.
The preparation method of the precise printed circuit board of of the invention a kind of raising route copper layer thickness and width, by online
In the layers of copper of road increase nickel protection floor, using alkali etching remove bottom copper and control alkali etching technological parameter and removal nickel
Increase copper protective agent when protective layer, the precise printed circuit board of 5-75 μm of route copper layer thickness can be produced and route is wide
Degree and route spacing are more than or equal to 20 μm；In the design of same route, obtained printed circuit board line width is than common half
Addition process makes resulting line width and increases 2-8 μm.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of preparation method for the precise printed circuit board for improving route copper layer thickness and width, which is characterized in that including with
Lower step:
1) prepared substrate: having plating barrier layer and line pattern on the substrate, the line pattern is layers of copper, the copper
Layer with a thickness of 5-75 μm；
2) nickel plating: by plating pure nickel technique, increasing by one layer of nickel protection layer on exposed layers of copper surface, the nickel protection layer
With a thickness of 0.8-2.5 μm；
3) it removes plating barrier layer: removing the plating barrier layer by moving back membrane process；
4) copper that breaks off the base alkali etching: is gone by alkaline etching process；
5) it removes nickel: removing the nickel protection layer, show complete layers of copper line pattern, obtain the printed circuit board.
2. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that plating pure nickel technological parameter in step 2 are as follows: current density 4-8ASF, electroplating time 300-600s.
3. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that the specific processing step of membrane process is moved back described in step 3) are as follows: use strong alkali solution or organic stripping
Solution is handled the substrate by spray or immersion way, removes plating barrier layer.
4. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 3
Method, which is characterized in that the strong alkali solution is the sodium hydroxide or potassium hydroxide solution of mass percent concentration 4%-6%；
The main ingredient of organic stripping solution includes monoethanolamine and tetramethylammonium hydroxide.
5. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that when the thickness of layers of copper is more than or equal to 25 μm on the substrate in step 1), need to increase after moving back membrane process
The humidification method plating barrier layer remaining except adhesive process removal.
6. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 5
Method, which is characterized in that the wet process removes glue specific steps are as follows: using alkalinity potassium permanganate system medical fluid to remaining in layers of copper route
Between plating barrier layer carry out impregnate or spray process, by remaining plating barrier layer dissolve remove.
7. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that the specific steps of alkaline etching process described in step 4) are as follows: mixed using copper chloride, ammonium hydroxide and ammonium chloride
The alkaline etch solution of synthesis carries out spray process to the substrate.
8. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 7
Method, which is characterized in that the operation temperature of the alkali etching is 40-45 DEG C.
9. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that step 5) is described to go in nickel liquid medicine added with copper protective agent using going nickel liquid medicine to remove nickel protection layer,
The copper protective agent are as follows: benzotriazole and its derivative, imidazole and its derivants or 5- aminotetrazole and its derivative
Object, the additive amount of the copper protective agent are that described to go the concentration of copper protective agent in nickel liquid medicine be 5 ± 2g/L.
10. a kind of preparation side of precise printed circuit board for improving route copper layer thickness and width according to claim 1
Method, which is characterized in that the preparation of substrate described in step 1) is the following steps are included: choose the copper foil base that bottom copper thickness is 6-12 μm
Bottom copper thickness is reduced to 2-4 μm by subtracting process for copper by material；Through-hole or blind is produced on the copper foil base material after being thinned
Hole；Metalized is carried out to through-hole or blind hole；Light-sensitive surface is covered on the copper foil base material surface；By exposing, development figure
Shape shifting process, forms plating barrier layer on copper foil base material；By copper-plating technique, it is electroplated in plating barrier layer uncovered area
Upper layers of copper forms line pattern, obtains the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811059297.3A CN109195341A (en) | 2018-09-12 | 2018-09-12 | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811059297.3A CN109195341A (en) | 2018-09-12 | 2018-09-12 | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195341A true CN109195341A (en) | 2019-01-11 |
Family
ID=64910103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811059297.3A Pending CN109195341A (en) | 2018-09-12 | 2018-09-12 | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195341A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111243965A (en) * | 2020-01-16 | 2020-06-05 | 深圳市志金电子有限公司 | Preparation method of packaging substrate |
| CN112074089A (en) * | 2020-08-31 | 2020-12-11 | 珠海智锐科技有限公司 | Method for manufacturing bonding pad |
| CN115023052A (en) * | 2022-06-29 | 2022-09-06 | 生益电子股份有限公司 | Printed circuit board, preparation method thereof and micro light-emitting display device |
| CN117253805A (en) * | 2023-11-03 | 2023-12-19 | 浙江晶引电子科技有限公司 | Repeatable high-precision preparation method of flexible film packaging substrate |
| CN115023052B (en) * | 2022-06-29 | 2024-10-22 | 生益电子股份有限公司 | Printed circuit board, manufacturing method thereof and miniature luminous display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
| CN103917053A (en) * | 2014-04-22 | 2014-07-09 | 上海尚容电子科技有限公司 | Application of nickel as alkaline etching resistant layer materials |
| CN104113994A (en) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | Method for manufacturing printed circuit board by using novel and improved semi-additive process |
| CN105849641A (en) * | 2013-12-27 | 2016-08-10 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
-
2018
- 2018-09-12 CN CN201811059297.3A patent/CN109195341A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
| CN104113994A (en) * | 2013-04-22 | 2014-10-22 | 上海美维科技有限公司 | Method for manufacturing printed circuit board by using novel and improved semi-additive process |
| CN105849641A (en) * | 2013-12-27 | 2016-08-10 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board |
| CN103917053A (en) * | 2014-04-22 | 2014-07-09 | 上海尚容电子科技有限公司 | Application of nickel as alkaline etching resistant layer materials |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111243965A (en) * | 2020-01-16 | 2020-06-05 | 深圳市志金电子有限公司 | Preparation method of packaging substrate |
| CN112074089A (en) * | 2020-08-31 | 2020-12-11 | 珠海智锐科技有限公司 | Method for manufacturing bonding pad |
| CN115023052A (en) * | 2022-06-29 | 2022-09-06 | 生益电子股份有限公司 | Printed circuit board, preparation method thereof and micro light-emitting display device |
| CN115023052B (en) * | 2022-06-29 | 2024-10-22 | 生益电子股份有限公司 | Printed circuit board, manufacturing method thereof and miniature luminous display device |
| CN117253805A (en) * | 2023-11-03 | 2023-12-19 | 浙江晶引电子科技有限公司 | Repeatable high-precision preparation method of flexible film packaging substrate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103026476B (en) | Method to form solder alloy deposits on substrates | |
| CN102362559B (en) | Copper foil for printed wiring board and method for producing same | |
| CN106304668B (en) | A kind of production method using enhanced semi-additive process production printed wiring board | |
| CN109195341A (en) | A kind of preparation method for the precise printed circuit board improving route copper layer thickness and width | |
| CN105408525A (en) | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method | |
| US20060070769A1 (en) | Printed circuit board and method of fabricating same | |
| KR900001089B1 (en) | Process for producing coppor through - hole printed circuit board | |
| JPH0251272B2 (en) | ||
| HUE028044T2 (en) | Method of forming a conductive image on a non-conductive surface | |
| US4144118A (en) | Method of providing printed circuits | |
| CN109673111B (en) | Method for manufacturing circuit board | |
| JP2008109111A (en) | To-resin adhesive layer and manufacturing method of laminate using it | |
| CN114928945A (en) | Manufacturing process of superfine circuit printed circuit board | |
| US5328561A (en) | Microetchant for copper surfaces and processes for using same | |
| CN109219259B (en) | Flexible circuit board and manufacturing method thereof | |
| JP3505135B2 (en) | Copper surface treatment method | |
| JP2013102021A (en) | Printed wiring board and manufacturing method therefor | |
| CN1542073A (en) | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | |
| TW200407057A (en) | Method for the manufacture of printed circuit boards with integral plated resistors | |
| JP2011166028A (en) | Method of manufacturing cof substrate | |
| US4968398A (en) | Process for the electrolytic removal of polyimide resins | |
| JP2005032901A (en) | Conductive sheet | |
| GB2038101A (en) | Printed circuits | |
| CN113242647A (en) | Method for manufacturing small-spacing pattern on thick copper PCB | |
| JPH0621157A (en) | Manufactured of copper polyimide substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190111 |
|
| RJ01 | Rejection of invention patent application after publication |