CN109192068A - A kind of backlight module and electronic equipment - Google Patents
A kind of backlight module and electronic equipment Download PDFInfo
- Publication number
- CN109192068A CN109192068A CN201811301177.XA CN201811301177A CN109192068A CN 109192068 A CN109192068 A CN 109192068A CN 201811301177 A CN201811301177 A CN 201811301177A CN 109192068 A CN109192068 A CN 109192068A
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- CN
- China
- Prior art keywords
- side plate
- backlight module
- solder joint
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
Abstract
The present invention provides a kind of backlight module and electronic equipment, which includes: metal frame, flexible circuit board, light source and insulator.Wherein, metal frame includes bottom plate and the side plate that the bottom plate surrounding is arranged in, and the side plate and the bottom plate form accommodation space.The side that the bottom plate is located in the accommodation space is arranged in flexible circuit board.Light-source encapsulation is electrically connected on surface of the flexible circuit board far from the bottom plate, by solder joint with the flexible circuit board.Insulator is arranged between the solder joint and the side plate, so that the solder joint and the metal frame insulate.And then the solder joint squeezed on LED caused by light guide plate expanded by heating is avoided to contact with metal frame, and then there is a phenomenon where short circuits to burn LED.
Description
Technical field
The present invention relates to field of display technology, more specifically to a kind of backlight module and electronic equipment.
Background technique
In general, difference of the backlight module according to its structure, can be divided into positive group of formula and reverse group formula.
Wherein, positive group of formula is to be fitted in LED on flexible circuit board FPC by surface mounting technology SMT, then will be flexible
Circuit board FPC is fitted in light guide plate and glue frame, is realized and is fixed.And with the continuous diminution of display floater frame, mucilage glue surface
Product is also smaller and smaller, and then the structural reliability that will lead to the backlight module of positive group formula reduces, therefore, using the backlight of reverse group formula
Mould group can preferably fix flexible circuit board.
As shown in Figure 1, reverse group formula is after LED is passed through solder joint and Flexible Displays circuit board electrical connection, by flexible circuit board
It is set up directly on metal frame, i.e., the installation site of flexible circuit board is different.However current reverse group formula backlight module will appear
The phenomenon that LED is burnt, so that display screen is not shown locally.
Therefore, a kind of backlight module how is provided, can be avoided LED damage in reverse group formula backlight module is art technology
Personnel's big technical problem urgently to be resolved.
Summary of the invention
In view of this, can be avoided reverse group formula backlight module the present invention provides a kind of backlight module and electronic equipment
Middle LED is because of burnout problems caused by light guide plate expanded by heating.
To achieve the above object, the invention provides the following technical scheme:
A kind of backlight module, comprising:
Metal frame, the metal frame include bottom plate and the side plate that the bottom plate surrounding is arranged in, the side plate with it is described
Bottom plate forms accommodation space；
The side that the bottom plate is located in the accommodation space is arranged in flexible circuit board；
Light source is encapsulated in surface of the flexible circuit board far from the bottom plate, passes through solder joint and the flexible circuit board
Electrical connection；
Insulator is arranged between the solder joint and the side plate, so that the solder joint and the metal frame insulate.
Optionally, the insulator includes insulating cement,
Surface of the flexible circuit board far from the bottom plate is arranged in the insulating cement, covers the solder joint.
Optionally, along the first direction perpendicular to the side plate, there is gap between the insulating cement and the side plate.
Optionally, along the second direction perpendicular to the flexible circuit board, the height of the insulating cement of the solder joint is covered
Degree is less than or equal to the height of the light source.
It optionally, further include glue frame,
The glue frame includes first part, and one of the flexible circuit board far from the bottom plate is arranged in the first part
Side, between the light source and the side plate, and the first part offers at least one close to the side of the solder joint
Groove, along the first direction perpendicular to the side plate, projection of the groove on the side plate and the solder joint are in the side
Projection on plate overlaps each other, and the first part is multiplexed with the insulator.
Optionally, the glue frame is fixed on surface of the flexible circuit board far from the bottom plate by adhesive tape.
Optionally, the insulator includes insulating layer,
The side plate is arranged in close to the surface of the solder joint in the insulating layer.
Optionally, the insulating layer is additionally arranged at the bottom plate close to the surface of the flexible circuit board.
Optionally, along perpendicular to the side plate first direction, the insulating layer with a thickness of 0.01mm.
Optionally, the insulator includes at least one insulation limited block,
The insulation limited block is fixed on the side plate, and the insulation limited block is in the first party perpendicular to the side plate
Upwards, the insulation surface of the limited block far from the side plate side is greater than the solder joint in institute to the distance between the side plate
State the length on first direction.
Optionally, open up fluted on the side plate, the insulation limited block is provided with card close to the side of the side plate
Block,
The fixture block is assemblied in the groove of the side plate.
Optionally, along being parallel to the side plate and being parallel to the third direction of the bottom plate, the adjacent insulation is limited
There is gap between block.
A kind of electronic equipment, comprising: display panel and the above-mentioned backlight module of any one.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
A kind of backlight module provided by the present invention, comprising: metal frame, flexible circuit board, light source and insulator.Its
In, metal frame includes bottom plate and the side plate that the bottom plate surrounding is arranged in, and the side plate and the bottom plate form accommodation space.
The side that the bottom plate is located in the accommodation space is arranged in flexible circuit board.Light-source encapsulation is separate in the flexible circuit board
The surface of the bottom plate is electrically connected by solder joint with the flexible circuit board.Insulator is arranged in the solder joint and the side plate
Between, so that the solder joint and the metal frame insulate.And then it avoids squeezing the solder joint on LED caused by light guide plate expanded by heating
It is contacted with metal frame, and then there is a phenomenon where short circuits to burn LED.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of backlight module in the prior art；
Fig. 2 is a kind of structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 3-Fig. 4 is a kind of production flow diagram of backlight module provided in an embodiment of the present invention；
Fig. 5 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 6 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 7 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 8 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 9 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Figure 10 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Figure 11 is a kind of another structural schematic diagram of backlight module provided in an embodiment of the present invention；
Figure 12 is the structural schematic diagram of a kind of electronic equipment provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, reverse group formula be placed on the inside of metal frame after being electrically connected LED with flexible circuit board, in general,
LED can be using surface mounting technology SMT, so that LED is electrically connected by solder joint and flexible circuit with being electrically connected for flexible circuit board
It connects.
Inventors have found that current reverse group formula backlight module is when the temperature rises, the meeting expanded by heating of light guide plate 10 at this time can
LED11 is squeezed along first direction X, so that LED11 is mobile to metal-back 12, so that solder joint 13 and metal-back on LED11
12 contacts, cause short circuit, to burn LED11.
Based on this, this programme embodiment provides a kind of backlight module, as shown in Figure 2, comprising: metal frame 21, flexible electrical
Road plate 22, light source 23 and insulator 24.
Wherein, metal frame 21 includes bottom plate 211 and the side plate 212 of 211 surrounding of bottom plate is arranged in, and, the side
Plate 212 and the bottom plate 211 form accommodation space 213.The setting of flexible circuit board 22 is located at the receiving sky in the bottom plate 211
Interior side.Wherein, bottom plate 211 has two sides, side pointing direction Y1, other side pointing direction Y2.In the present embodiment,
Flexible circuit board 22 is positioned close to the side for the accommodation space 213 that bottom plate 211 and side plate 212 are formed, i.e. pointing direction Y1's
Side.
Except this, light source 23 is encapsulated in surface of the flexible circuit board 22 far from the bottom plate 211, passes through solder joint 25 and institute
State the electrical connection of flexible circuit board 22.Wherein, flexible circuit board 22 has first surface 221 and second surface 222, wherein the
One surface 221 is located at the side that second surface 222 leans on close to sources 23.In the present embodiment, first surface 221 and second surface
222 can be plane.
It is noted that in backlight module provided in this embodiment, the setting of insulator 24 the solder joint 25 with it is described
Between side plate 212, so that the solder joint 25 and the metal frame 21 insulate.
As it can be seen that the present embodiment by between solder joint 25 and metal frame 21 be arranged insulator 24 so that the backlight module exists
When temperature increases, even if 10 expanded by heating of light guide plate, and squeeze light source 23 along first direction and light source 23 is moved to metal frame 21
When dynamic, solder joint 25 is insulated by insulator 24 and metal frame 21, so that solder joint 25 will not be contacted with metal frame 21, is kept away from the root
Exempt from the Short-Circuit High Current due to generating when solder joint 25 is contacted with metal frame 21, and then protects light source 23.
It should be noted that in the present embodiment, insulator 24 is the structure with insulation performance, for by solder joint 25 with
Metal frame 21 insulate.It specifically, insulator can there are many presentation forms in this example, such as can be solid insulation, also
It can be insulating film layer or insulated paint etc..
Except this, insulator 24 can select high-temperature insulation heat-barrier material, such as ceramic fibre, can using wet process at
Type technique is made, and has high temperature resistant, resistant to chemical etching, heat shock resistance, low thermal conductivity, high electric insulation intensity and high elastic modulus
Etc. performances.Alternatively, insulator 24 is selected in Thermocurable polyimide (thermoset polyimide) resin and polyimides
One or more materials formed.
On the basis of the above embodiments, the specific implementation structure of several insulators 24 is present embodiments provided, for example, institute
Stating insulator 24 can be insulating cement 241.The flexible circuit board 22 is arranged in far from the bottom plate 211 in the insulating cement 241
Surface covers the solder joint 25.
Wherein, when insulator 24 is insulating cement 241, as Figure 3-Figure 4, the encapsulation process of insulating cement 241 is as follows:
1. light source 23 such as LED, is fitted on flexible circuit board 22 using surface mounting technology SMT.At this point, after fitting
Flexible circuit board 22 and light source 23 between have solder joint 25.
2. sealing is carried out close to the side of metal frame in light source 23, so that insulating cement 241 covers solder joint 25.At this point, solder joint
25 projection on flexible circuit board 22 is located at insulating cement 241 in the projection on flexible circuit board 22.
3. carrying out backlight assembling.
Wherein, backlight assembling includes at least the semiconductor middleware that the insulating cement 241 for 2. forming step covers solder joint 25
Setting is formed in accommodation space 213 in metal frame latus inframedium 212 and the bottom plate 211.
Except this, the insulating cement in the present embodiment can be a kind of compound adhesive with good insulating performance, such as be electrically insulated
Glue.Specifically, electric insulating cement is the room temperature two-component silicone rubber using post-cure, being noteworthy characterized by vulcanizing agent addition ratio is
5 percent.With good electric insulating quality, anti creepage trace and electric erosion resistance, hydrophobicity, anti-flammability etc..
It should be noted that in the present embodiment, do not limit insulating cement specific form and specific installation site, example
Such as, insulating cement the molding blob of viscose can be arranged between light source and metal frame side plate for solid molding blob of viscose is presented, so that
The connecting portion and metal frame for obtaining light source and flexible circuit insulate.For another example, it in the installation process of backlight module, can install
After semiconductor middleware, it is mounted directly molding blob of viscose, it can also after being mounted with semiconductor middleware, using liquid glue in light
Dispensing is carried out between source and metal frame, and then liquid glue is solidified.
Or insulating cement 241 can cover all exposed positions of solder joint 25, so that solder joint 25 and other devices are exhausted
Edge, or, insulating cement 241 is only covered at the part solder joint of each solder joint 25 of proximal panel 212, need to only ensure solder joint 25
It insulate with metal frame 21.
In conjunction with Fig. 2, in backlight module provided in this embodiment, along the first direction X perpendicular to the side plate, the insulation
There is gap 26 between glue 241 and the side plate 212.It should be noted that gap 26 can in 10 expanded by heating of light guide plate,
Certain anti-extrusion space is reserved, in a first direction for light source 23 to prevent light source 23 simultaneously by light guide plate 10 and side plate
212 extruding.I.e. there are gaps with insulating cement 241 for side plate 212, in 10 expanded by heating of 241 expanded by heating of insulating cement or light guide plate
When, reduce the extruding force to LED.
It wherein at least include along first direction specifically, the power of multiple directions can be generated when 10 expanded by heating of light guide plate
The extruding force of X, at this point, light source 23 can be moved by under the action of the extruding force of the X of first direction along first direction X, i.e., it is past
It is mobile by the side of proximal panel 212.Assuming that insulating cement 241 is filled between light source 23 and side plate 212, at this point, due to light source 23
It is mobile to side plate 212, and side plate 212 is motionless, this certainly will will lead to light source 23 and side plate 212 extruding insulation glue 241 simultaneously, and exhausted
Edge glue can generate a reaction force, be applied on side plate 212 and light source 23, squeeze side plate 212 and light source 23.
And in the present embodiment, by there are prepsetting gaps between insulating cement 241 and side plate 212, then, when due to light source 23
When mobile to side plate 212, due to gap, when the distance on light source 23 in a first direction X is less than the X in a first direction of gap 26
On apart from when, insulating cement 241 and light source 23 can first be moved to gap portion, will not directly be contacted with side plate 212, at this point,
Side plate 212 will not generate extruding to insulating cement, and then insulating cement can will not generate a reaction force, and light source 23 will not be by
Side plate squeezes.Only when bigger displacement occurs for light source 23, side plate 212 just can generate extruding to light source.
It should be noted that in the present embodiment, when there is gap 26 between insulating cement 241 and side plate 212, needing to protect
It demonstrate,proves projection of the solder joint 25 on flexible circuit board 22 and is located at insulating cement 241 in the projection on flexible circuit board 22.That is, at this time absolutely
Edge glue 241 can directly cover solder joint 25, can not also directly cover solder joint 25, for example, having between insulating cement 241 and solder joint 25
Gap 27, as shown in Figure 5.Due to 241 part covering solder joints of insulating cement, the usage amount of insulating cement can be reduced, and then reduce
Cost.Except this, insulating cement 241 can select elastic material to be made, and when light source extruding insulation glue, insulating cement has elasticity, energy
Insulating cement is further buffered to the reaction force of light source, and then weakens extruding of the insulating cement to light source.
On the basis of the above embodiments, in backlight module provided in this embodiment, as shown in Fig. 2, along perpendicular to described
The second direction of flexible circuit board, the height for covering the insulating cement of the solder joint are less than or equal to the height of the light source.
That is, the height of insulating cement 241 is less than the height of light source 23 along the second direction Y perpendicular to flexible circuit board.Its
In, the height for limiting insulating cement can further avoid influence of the insulating cement to the thickness of entire backlight module, that is, this programme exists
After insulating cement, the thickness in second direction of backlight module not will increase.
On the basis of the above embodiments, the specific implementation structure of another insulator 24, such as Fig. 6 are present embodiments provided
Shown, backlight module provided in this embodiment further includes glue frame 61.
Wherein, the glue frame 61 includes first part 611, and the setting of first part 611 is remote in the flexible circuit board
Side from the bottom plate, between the light source and the side plate, and the first part 611 is close to the solder joint 25
Side offers at least one groove 612, and along the first direction perpendicular to the side plate, the groove 612 is on the side plate
Projection overlap each other with projection of the solder joint on the side plate, the first part 611 is multiplexed with the insulator.
In the present embodiment, a groove 612 of glue frame 61 can correspond to multiple solder joints 25, certainly, one of glue frame 61
Recessed poor 612 can also only correspond to a solder joint 25, that is, at least one projection of the solder joint on the side plate is located at described recessed
Slot 612 is in the projection on the side plate.
It is not difficult to find out that, when light source is squeezed, there is glue frame 61 between solder joint 25 and side plate 212, glue frame is from Fig. 6
Insulator, so that solder joint 25 and side plate 212 insulate, and then it is existing to generate short circuit caused by solder joint 25 is electrically connected with side plate 212
As avoiding burning for light source.
And the backlight module for having glue frame, only need to glue frame aperture not had to dispensing, can simplify backlight mould
The preparation process of group.
Specifically, in the present embodiment, the glue frame 61 can be fixed on the flexible circuit board far from institute by adhesive tape
State the surface of bottom plate.Except this, can also be fixed by the position that the modes such as setting fixing piece carry out glue frame and flexible circuit board.
On the basis of the above embodiments, the specific implementation structure for present embodiments providing another insulator, such as Fig. 7 institute
Show, in backlight module provided in this embodiment, the insulator includes insulating layer 71.
Wherein, the side plate 212 is arranged in close to the surface of the solder joint 25 in the insulating layer 71.Specifically, along vertical
In the first direction of the side plate, projection of the solder joint on the side plate is located at the throwing of the insulating layer 71 on the side plate
Shadow has glue frame insulating layer 71 when light source is squeezed between solder joint 25 and side plate 212, since insulating layer 71 is insulator,
So that solder joint 25 and side plate 212 insulate, and then solder joint 25 will not be generated and be electrically connected caused short circuit phenomenon with side plate 212, avoided
The burning of light source.
Except this, on the basis of the above embodiments, as shown in figure 8, in backlight module provided in this embodiment, the insulation
Layer 71 can also include the first insulating sublayer layer 711 and the second insulating sublayer layer 712, which is arranged described
Bottom plate 211 is close to the surface of the flexible circuit board.That is, the second insulating sublayer layer 712 be located at flexible circuit board and bottom plate 211 it
Between.And second insulating sublayer layer 712 connect with the first insulating sublayer layer 711, make solder joint and side plate 212 and bottom plate 211 exhausted jointly
Edge avoids solder joint and is electrically connected with metal frame 21, and then avoids the problem of light source caused by short circuit is burnt.
Specifically, in backlight module provided in this embodiment, along the first direction perpendicular to the side plate, the insulation
Layer 71 with a thickness of 0.01mm.The insulating materials such as insulating tape can be selected, are attached to side plate 212 close to the surface of solder joint 25.
On the basis of the above embodiments, the specific implementation structure for present embodiments providing another insulator, such as Fig. 9 institute
Show, in backlight module provided in this embodiment, the insulator includes at least one insulation limited block 91.
Wherein, the insulation limited block 91 is fixed on the side plate 212, and the insulation limited block is perpendicular to the side
On the first direction of plate, the insulation surface of the limited block far from the side plate side is greater than to the distance between side plate d1
The length d2 of the solder joint 25 in said first direction.
It should be noted that in the present embodiment, insulation limited block 91 is for keeping apart solder joint and side plate 212, when exhausted
When surface of the edge limited block far from 212 side of side plate is greater than the length of solder joint in a first direction to the distance between side plate 212,
Even if light guide plate expanded by heating, and along first direction squeeze light source light source is moved to metal frame when, insulation limited block 91 will
Light source is limited, so that solder joint 25 is not enough to contact with metal frame, avoids connect due to solder joint 25 with metal frame from the root
The Short-Circuit High Current generated when touching, and then protect light source 23.
Specifically, the limited block 91 that insulate in Fig. 9 can be pasted on side plate 212, this is removed, can also be other fixation sides
Formula.For example, a kind of specific implementation structure of limited block 91 that insulate is present embodiments provided, as shown in Figure 10, the present embodiment provides
Backlight module in, fluted 901 are opened up on the side plate, the insulation limited block 91 is provided with close to the side of the side plate
Fixture block 902, the fixture block 902 are assemblied in the groove 901 of the side plate 212.
It should be noted that as shown in figure 11, in backlight module provided in this embodiment, along be parallel to the side plate and
It is parallel to the third direction Z of the bottom plate, there is gap 111 between the adjacent insulation limited block.
Certainly, which can also be whole collets, i.e., only have one in this backlight module along third direction
A insulation limited block.
And either one insulation limited block or multiple insulation limited blocks, in the present embodiment, pass through insulation limited block
Light source is limited, so that the corresponding solder joint of light source is not contacted with side plate.
On the basis of the above embodiments, as shown in figure 12, the present embodiment additionally provides a kind of electronic equipment, comprising: aobvious
Show panel and the above-mentioned backlight module of any one.The working principle of the electronic equipment refers to the work of above-mentioned backlight module
Principle, herein not repeated description.
In conclusion the present invention provides a kind of backlight module and electronic equipment, the backlight module include: metal frame,
Flexible circuit board, light source and insulator.Wherein, metal frame includes bottom plate and the side plate that the bottom plate surrounding is arranged in, institute
It states side plate and the bottom plate forms accommodation space.One that the bottom plate is located in the accommodation space is arranged in flexible circuit board
Side.Light-source encapsulation is electrically connected on surface of the flexible circuit board far from the bottom plate, by solder joint with the flexible circuit board.
Insulator is arranged between the solder joint and the side plate, so that the solder joint and the metal frame insulate.And then avoid leaded light
The solder joint squeezed on LED caused by plate expanded by heating is contacted with metal frame, and then there is a phenomenon where short circuits to burn LED.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.To the upper of the disclosed embodiments
It states bright, enables those skilled in the art to implement or use the present invention.Various modifications to these embodiments are to ability
Will be apparent for the professional technician in domain, the general principles defined herein can not depart from it is of the invention
In the case where spirit or scope, realize in other embodiments.Therefore, the present invention be not intended to be limited to it is shown in this article these
Embodiment, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (13)
1. a kind of backlight module characterized by comprising
Metal frame, the metal frame include bottom plate and the side plate that the bottom plate surrounding is arranged in, the side plate and the bottom plate
Form accommodation space；
The side that the bottom plate is located in the accommodation space is arranged in flexible circuit board；
Light source is encapsulated in surface of the flexible circuit board far from the bottom plate, is electrically connected by solder joint and the flexible circuit board
It connects；
Insulator is arranged between the solder joint and the side plate, so that the solder joint and the metal frame insulate.
2. backlight module according to claim 1, which is characterized in that the insulator includes insulating cement,
Surface of the flexible circuit board far from the bottom plate is arranged in the insulating cement, covers the solder joint.
3. backlight module according to claim 2, which is characterized in that described along the first direction perpendicular to the side plate
There is gap between insulating cement and the side plate.
4. backlight module according to claim 2, which is characterized in that along the second party perpendicular to the flexible circuit board
To the height for covering the insulating cement of the solder joint is less than or equal to the height of the light source.
5. backlight module according to claim 1, which is characterized in that it further include glue frame,
The glue frame includes first part, and side of the flexible circuit board far from the bottom plate is arranged in the first part,
Between the light source and the side plate, and close to the side of the solder joint to offer at least one recessed for the first part
Slot, along the first direction perpendicular to the side plate, projection of the groove on the side plate and the solder joint are in the side plate
On projection overlap each other, the first part is multiplexed with the insulator.
6. backlight module according to claim 5, which is characterized in that the glue frame is fixed on the flexible electrical by adhesive tape
Surface of the road plate far from the bottom plate.
7. backlight module according to claim 1, which is characterized in that the insulator includes insulating layer,
The side plate is arranged in close to the surface of the solder joint in the insulating layer.
8. backlight module according to claim 7, which is characterized in that the insulating layer is additionally arranged at the bottom plate close to institute
State the surface of flexible circuit board.
9. backlight module according to claim 7, which is characterized in that described along the first direction perpendicular to the side plate
Insulating layer with a thickness of 0.01mm.
10. backlight module according to claim 1, which is characterized in that the insulator includes at least one insulation limit
Block,
The insulation limited block is fixed on the side plate, and the insulation limited block is in the first direction perpendicular to the side plate
On, the distance between the described insulation surface of limited block far from the side plate side to the side plate is greater than the solder joint described
Length on first direction.
11. backlight module according to claim 10, which is characterized in that open up fluted, the insulation on the side plate
Limited block is provided with fixture block close to the side of the side plate,
The fixture block is assemblied in the groove of the side plate.
12. backlight module according to claim 10, which is characterized in that edge is parallel to the side plate and is parallel to the bottom
The third direction of plate has gap between the adjacent insulation limited block.
13. a kind of electronic equipment characterized by comprising display panel and as described in any one of claim 1-12
Backlight module.
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|---|---|---|---|
| CN201811301177.XA CN109192068A (en) | 2018-11-02 | 2018-11-02 | A kind of backlight module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811301177.XA CN109192068A (en) | 2018-11-02 | 2018-11-02 | A kind of backlight module and electronic equipment |
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| CN109192068A true CN109192068A (en) | 2019-01-11 |
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| CN201811301177.XA Pending CN109192068A (en) | 2018-11-02 | 2018-11-02 | A kind of backlight module and electronic equipment |
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| CN110262126A (en) * | 2019-06-12 | 2019-09-20 | 厦门天马微电子有限公司 | A kind of backlight module and display device |
| CN110297356A (en) * | 2019-06-25 | 2019-10-01 | 厦门天马微电子有限公司 | A kind of lamp plate, backlight module and curved-surface display device |
| WO2022062066A1 (en) * | 2020-09-23 | 2022-03-31 | 武汉华星光电技术有限公司 | Backlight module and display apparatus |
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Application publication date: 20190111 |