CN109189188A - It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation - Google Patents
It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation Download PDFInfo
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- CN109189188A CN109189188A CN201811042533.0A CN201811042533A CN109189188A CN 109189188 A CN109189188 A CN 109189188A CN 201811042533 A CN201811042533 A CN 201811042533A CN 109189188 A CN109189188 A CN 109189188A
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- heat
- water
- cooling
- computer
- exchange unit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims abstract description 28
- 230000005855 radiation Effects 0.000 claims abstract description 25
- 238000005057 refrigeration Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000005030 aluminium foil Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 230000006872 improvement Effects 0.000 abstract description 2
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 101100298225 Caenorhabditis elegans pot-2 gene Proteins 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 210000003414 extremity Anatomy 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 210000002414 leg Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D15/00—Other domestic- or space-heating systems
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It is proposed by the present invention a kind of using computer heat dissipation as the human thermal comfort of heat source improvement device, including water-cooling unit, convection current or heat radiation heat exchange unit, at least one contact heat exchange unit；Water-cooling unit includes level pressure water pot, multiple made of metal water-cooling heads and thin conduit equipped with micro pump；Each contact heat exchange unit respectively includes semiconductor chilling plate and heating pad, and radiating end and the heating pad of semiconductor chilling plate fit closely；Level pressure water pot and each made of metal water-cooling head are sequentially connected in series to form circulation water passage by thin conduit, and the refrigeration end of thermal component, convection current or heat radiation heat exchange unit and each semiconductor chilling plate in computer cabinet is fitted closely with a corresponding made of metal water-cooling head.The heat that the present apparatus for the first time distributes computer is used to heat the acras such as human body trick position, using the thermoelectric cooling characteristic of semiconductor chilling plate, can improve the radiating efficiency of thermal comfort level and computer cabinet of the human body under colder environment.
Description
Technical field
It is the invention belongs to human body temperature raising device technical field, in particular to a kind of using computer heat dissipation as the Studies of Human Body Heat of heat source
It is comfortable to improve device.
Background technique
The room of heating in winter is easy to appear hot-air and is concentrated on the upper of room due to the difference of hot and cold air density
Portion space, and the situation relatively low positioned at the occupied zone temperature of room lower space, i.e., can exist vertical in room
The temperature difference.The problem is widely used especially prominent in the building that wall air conditioner carries out heating in China In Middle And Lower Reaches of Changjiang River.
Just because of this, even if there is air-conditioning heating in room in winter, indoor occupant also often feels that trick is ice-cold, and generation is not relaxed significantly
Suitable sense.Due to the presence of the problem, indoor occupant usually requires additional area heating installation to guarantee human thermal comfort.
Some human thermal comfort fields studies have shown that the acras positions such as the hand, foot, leg of human body carry out local heating can
Horizontal with the thermal comfort for effectively improving human body, this reduction just for indoor heating temperature provides possibility.Reduce indoor heating
Temperature can reduce indoor and outdoor heat transfer temperature difference, and then reduce the heating energy consumption of winter building.There is scholar to pass through energy simulation
Every 1 DEG C of the decline of indoor heating temperature is calculated, heating energy consumption can about decline 10%, and energy-saving potential is very considerable.Another party
Face, the reduction of heating energy consumption mean that the quantity combusted of fossil energy is reduced, this will be helpful to alleviate the mist for perplexing China in recent years
Haze problem.
Desktop computer is used for a long time, it is larger especially with power consumption such as numerical value calculating, graphical modeling, video playings
Function when, need to cool down computer-internal element such as CPU, video card etc., to prevent these elements from occurring
The problem of cause thermal damage.The heat-removal modalities that major part desktop chassis uses at present are still air-cooled, but with the day of computer performance
It gradually improves, also higher and higher for radiating requirements, wind-cooling heat dissipating, which has gradually exposed that radiating efficiency is low, noise is big, etc. asks
Topic, therefore gradually occur more and more water-cooling cabinets on the market.The essence of water-cooling is (usual with coolant liquid
For water) it is medium, the calorific value of the elements such as CPU, video card is carried out, with bigger heat exchange area and more good heat exchange ring
These heats are discharged into the environment of surrounding by border.
During computer is run, the final almost all of the electric energy of consumption can be converted into thermal energy, therefore consumption when host operation
Electrical power and heat radiation power size are essentially identical.Computer dissipating under the operating conditions such as office, data calculating, game, broadcasting video
Thermal power is in 100W or more.It can be calculated by relevant human thermal comfort adjusting model to meet thermal comfort demand, people
Both hands, the heat of supplement is respectively 10.0W and 15.6W needed for both feet, much smaller than the heat radiation power of computer.So if energy
The heat dissipation for enough effectively utilizing computer is used for the local body position heating to human body, rather than is directly discharged
Into environment, then the heating energy consumption of building can be not only reduced, but also the thermal comfort of human body can be improved.
Summary of the invention
The purpose of the invention is to overcome the shortcoming of prior art, provide a kind of using computer heat dissipation as heat source
Human thermal comfort improves device.The heat that the device for the first time distributes computer is used to heat the acras such as human body trick position, benefit
With the thermoelectric cooling characteristic of semiconductor chilling plate, it is horizontal to improve thermal comfort of the human body under colder environment, and can be into
The radiating efficiency of one step raising computer cabinet.
To achieve the goals above, the present invention adopts the following technical scheme:
It is proposed by the present invention a kind of using computer heat dissipation as the human thermal comfort of heat source improvement device, which is characterized in that packet
Include water-cooling unit, convection current or heat radiation heat exchange unit, at least one contact heat exchange unit；The water-cooling unit packet
Level pressure water pot, multiple made of metal water-cooling heads and thin conduit equipped with micro pump are included, is opened respectively on each made of metal water-cooling head
Equipped with circulation water entrance；Each contact heat exchange unit respectively includes semiconductor chilling plate and heating pad, the semiconductor system
Cold radiating end is fitted closely with the heating pad；Wherein, the level pressure water pot and each made of metal water-cooling head pass through described thin
Water pipe is sequentially connected in series to form circulation water passage, thermal component, the convection current or heat radiation heat exchange unit in computer cabinet and
The refrigeration end of each semiconductor chilling plate is fitted closely with the corresponding one made of metal water-cooling head.
Further, the convection current or heat radiation heat exchange unit include fan, metal water conservancy diversion heat pipe and miniature finned change
Hot device；Wherein, the bottom end of the miniature finned heat exchanger and metal water conservancy diversion heat pipe are fixed, the metal water conservancy diversion heat pipe bottom with
The upper surface of corresponding water-cooling head fits closely, and the fan is installed on side of the miniature finned heat exchanger towards human body.
Further, the convection current or heat radiation heat exchange unit are a metal plate heat pipe, the flat-plate heat pipe and corresponding water
Cold head upper surface fits closely.
Feature of the present invention and the utility model has the advantages that
1, the feature good using metallic copper thermal conductivity, using copper water-cooling head, water conservancy diversion heat pipe respectively with case radiation portion
Part, semiconductor chilling plate hot end carry out sufficient heat exchange, and heat is uniformly dispersed in conjunction with end fin, increase and air
Heat exchange area, can be realized the efficient utilization of heat.
2, the return water temperature due to recirculated water after semiconductor chilling plate, fan coolling is lower than common water cooling plant,
Therefore the present apparatus improves the heat dissipation performance of water cooling cabinet, the performance of computer components is given full play to, not by high temperature shadow
It rings.
3, on the basis of strengthening computer heat dissipation performance, computer heat dissipation is directly used in the acras such as heating human body trick
Position is to improve the overall thermal comfort level of human body.Help to reduce heating temperature in winter room, reduces indoor and outdoor heat transfer temperature
Difference and then reduction heating energy consumption, reach energy-efficient effect, while can also reduce carbon emission, alleviate problem of environmental pollution.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the device of that embodiment of the invention.
Fig. 2 is partial enlarged view at A in Fig. 1.
Fig. 3 is partial enlarged view at B in Fig. 1.
Fig. 4 is partial enlarged view at C in Fig. 1.
Specific embodiment
Technical solution of the present invention is further described with reference to the accompanying drawings and embodiments as follows:
It is that a kind of of the embodiment of the present invention improves device by the human thermal comfort of heat source of computer heat dissipation referring to Fig. 1
Overall structure diagram, which heats for body local, including water-cooling unit I, convection current or heat radiation heat exchange unit
II, at least one contact heat exchange unit III；Water-cooling unit I includes level pressure water pot 2, Duo Gejin equipped with micro pump 3
Belong to water-cooling head 1 and thin conduit 4 processed, offers circulation water entrance respectively on each made of metal water-cooling head 1；Each contact heat exchange
Unit III respectively includes semiconductor chilling plate 5 and heating pad 6, and the radiating end and heating pad 6 of semiconductor chilling plate 5 closely paste
It closes；Wherein, level pressure water pot 2 and each made of metal water-cooling head 1 are sequentially connected in series to form circulation water passage by thin conduit 4, computer machine
Thermal component (the biggish component of heat dissipation capacity in cabinet, such as CPU, north bridge, video card may be selected when use), convection current or heat in case
Radiation heat transfer unit II and the refrigeration end of each semiconductor chilling plate 5 are fitted closely with a corresponding made of metal water-cooling head 1.
The specific implementation of each building block and function declaration are as follows in the embodiment of the present invention:
The water-cooling unit I of the present embodiment include be equipped with micro pump 3 (power: 3W~5W, flow: 300L/h~
500L/h) and the level pressure water pot 2 of venthole, multiple water-cooling heads 1 (the present embodiment is equipped with 5 water-cooling heads altogether, is respectively and computer
In cabinet CPU and north bridge fitting 2 water-cooling heads, and with convection current or heat radiation heat exchange unit II, for heating connecing for hand
3 water-cooling heads that touch heat exchange unit and contact heat exchange unit for heating foot fit；In addition, can also be according to human body
The position for needing to heat, such as further include knee, other numbers are arranged in the quantity of thermal component in waist and computer cabinet
Water-cooling head) and thin conduit 4 matched with each water-cooling head.Wherein, each water-cooling head of the present embodiment is a closed copper
Rectangular box processed has the inlet and outlet being connected with thin conduit 4 on the cabinet, at one of each water-cooling head 1
Surface is fitted closely by the thermal grease layer smeared with corresponding heat dissipation or heat exchanger components.In water-cooling head 1 and computer cabinet
The connection signal of heat dissipation capacity larger part (such as CPU, north bridge, video card) (illustrates water flow side with arrow in figure referring to fig. 2
To remaining figure is same), the entery and delivery port at 1 back side of water-cooling head to fit with computer thermal component is connected with thin conduit 4, utilizes
Miniature immersible pump 3 realizes water circulating in thin conduit 4, takes away the heat dissipation of chassis components when flowing through water-cooling head 1, and with
The flowing of water will be at heat transmission to other water-cooling heads 1 being connected with thin conduit 4.Level pressure water pot 2 is connected by venthole and the external world
It is logical, become the pressurization point of the water passage circulation system, is alternatively arranged as accommodating the container of recirculated water, when preventing installation, removing the present apparatus
Water leaks in thin conduit 4, while periodic replacement being facilitated to manage interior recirculated water.
The convection current of the present embodiment or heat radiation heat exchange unit II use heat convection mode, including fan 7, fine copper water conservancy diversion heat
Pipe 8 and miniature finned heat exchanger 9, can be placed on desk.Wherein, the bottom end of miniature finned heat exchanger 9 and fine copper water conservancy diversion
Heat pipe 8 is fixed (fine copper water conservancy diversion heat pipe is interspersed between the fin of miniature finned heat exchanger), 8 bottom of fine copper water conservancy diversion heat pipe and phase
The upper surface of water-cooling head 1 is answered to fit closely by heat-conducting silicone grease (referring to Fig. 3), fan 7 is installed on miniature 9 face of finned heat exchanger
To the side of human body.Fine copper water conservancy diversion heat pipe 8 exchanges heat with the water-cooling head 1 fitted closely below, absorbs water institute in thin conduit 4
The heat of carrying, and (this implements the entirety of miniature finned heat exchanger by the heat transfer of absorption to miniature finned heat exchanger 9
Having a size of 120*120*50mm) so that heat is quickly and evenly distributed on fin.Fan 7 drives cold air stream through fin, quilt
Hot wind blowout is formed after heating.It is conventional products that all parts of heat convection unit II are formed in the present embodiment.Convection current or
Heat radiation heat exchange unit is used to undertake the heat for removing in case radiation and carrying out local heating to human body by contact heat-conducting mode
Amount exchange, if without the module, only by contact heat exchange equipment III can only heat caused by discharge part cabinet, can not be effective
Return water temperature is reduced, causes case radiation ineffective (be equivalent to case radiation be not finished and sent go back).
In another embodiment, convection current or heat radiation heat exchange equipment II transfer heat to people by the way of heat radiation
Body is mainly made of fine copper flat-plate heat pipe.Flat-plate heat pipe is fitted closely with corresponding 1 upper surface of water-cooling head and is exchanged heat, and is absorbed thin
Heat entrained by water in water pipe 4, and heat Quick uniform is dispersed to flat-plate heat pipe surface.Temperature liter after flat-plate heat pipe heat absorption
Height, to human-body emitting radiation energy.
The contact heat exchange equipment III of the present embodiment is made of semiconductor chilling plate 5 and heating pad 6；Heating pad 6 is by aluminium foil
Layer and layer of silica gel are formed by stacking from the bottom to top.Wherein, the refrigeration end of semiconductor chilling plate 5 is fitted closely with corresponding water-cooling head 1
(referring to fig. 4), realize that semiconductor chilling plate 5 is exchanged with the heat of recirculated water, the radiating end and heating pad 6 of semiconductor chilling plate 5
Aluminium foil layer fit closely, heat is quickly and evenly dispersed in the layer of silica gel of heating pad, is sent in the form of thermally conductive to human body limb
End position (such as hand and foot).Adjusting model by existing related body's thermal comfort can calculate to meet thermal comfort demand,
The heat of supplement needed for the both hands of people, both feet is respectively 10.0W and 15.6W, it is assumed that the refrigerating efficiency of semiconductor chilling plate 5 is
0.6, by QHeat=QIt is cold+W(QHeat--- semiconductor chilling plate heating end heat dissipation capacity；QIt is cold--- semiconductor chilling plate refrigeration end caloric receptivity；
W --- the electrical power of input semiconductor chilling plate) refrigeration work consumption of required semiconductor chilling plate can be calculated as 10W or so
(semiconductor chilling plate of the present embodiment selection model TEC1-12703).
The working principle of the present apparatus are as follows:
The present apparatus absorbs heat using (CPU, north bridge, video card) from the biggish component of water-cooling pattern heat dissipation capacity out of cabinet,
Using water as carrier, heat is transported at the water-cooling head for being connected with semiconductor chilling plate.The cold end of semiconductor chilling plate absorbs water
Entrained heat, water is cooled down, and the water after cooling, which is transmitted back to, to be continued to take heat in cabinet.Meanwhile the heat of semiconductor chilling plate
End releases heat, and heat is sent to the acras such as human body trick position with heat-conducting mode, is added with meeting body local by heating service pad
Heat demand is obviously improved human thermal comfort.Its excess heat is transported at fine copper water conservancy diversion heat pipe, via finned heat exchanger point
After dissipating uniformly, the air in human peripheral's microenvironment is heated in the form of convection current, is blown out by the fan of device end.
When carrying out the specific installation of apparatus of the present invention, it can be subjected to integrative design with desk, guarantee each component
Reasonable Arrangement.Such as the wire casing for laying thin conduit is opened up in desk corresponding position；Contact for heating hand is changed
Hot equipment III and made of metal water-cooling head matched with its, it is contemplated that by the contact heat exchange equipment III and made of metal matched with its
In water-cooling head insertion desk heating pad upper surface is flushed with desk upper surface, guarantees the smooth of heating pad, or consider
On desk place one it is same with made of metal water-cooling head highly and with an equal amount of shell of heating pad come guarantee heating pad put down
It is whole；For the metal water cold head to match with convection current or heat radiation convertor unit II, can also be embedded into desk.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (7)
1. a kind of improve device by the human thermal comfort of heat source of computer heat dissipation, which is characterized in that including water-cooling unit
(I), convection current or heat radiation heat exchange unit (II), at least one contact heat exchange unit (III)；Water-cooling unit (I) packet
Include level pressure water pot (2), multiple made of metal water-cooling heads (1) and thin conduit (4) equipped with micro pump (3), each made of metal water cooling
Circulation water entrance is offered respectively on head (1)；Each contact heat exchange unit (III) respectively includes semiconductor chilling plate (5)
With heating pad (6), radiating end and the heating pad (6) of the semiconductor chilling plate (5) are fitted closely；Wherein, the level pressure
Water pot (2) and each made of metal water-cooling head (1) are sequentially connected in series to form circulation water passage, computer cabinet by the thin conduit (4)
The refrigeration end and phase of interior thermal component, the convection current or heat radiation heat exchange unit (II) and each semiconductor chilling plate (5)
One answered the made of metal water-cooling head (1) fits closely.
2. according to claim 1 improve device by the human thermal comfort of heat source of computer heat dissipation, which is characterized in that institute
Stating the thermal component in computer cabinet includes CPU, north bridge, video card.
3. according to claim 1 or 2 improve device by the human thermal comfort of heat source of computer heat dissipation, feature exists
In the made of metal water-cooling head (1) is copper water-cooling head.
4. according to any one of claims 1 to 3 improve device by the human thermal comfort of heat source of computer heat dissipation,
It is characterized in that, the surface of the made of metal water-cooling head (1) is coated with thermal grease layer.
5. improve device by the human thermal comfort of heat source of computer heat dissipation described according to claim 1~any one of 4,
It is characterized in that, the convection current or heat radiation heat exchange unit (II) include fan (7), metal water conservancy diversion heat pipe (8) and miniature fin
Formula heat exchanger (9)；Wherein, the bottom end of the miniature finned heat exchanger (9) and metal water conservancy diversion heat pipe (8) are fixed, the metal
Water conservancy diversion heat pipe (8) bottom and the upper surface of corresponding water-cooling head (1) fit closely, and the fan (7) is installed on miniature finned change
Hot side of the device (9) towards human body.
6. improve device by the human thermal comfort of heat source of computer heat dissipation described according to claim 1~any one of 4,
It is characterized in that, the convection current or heat radiation heat exchange unit (II) are a metal plate heat pipe, the flat-plate heat pipe and corresponding water cooling
Head (1) upper surface fits closely.
7. improve device by the human thermal comfort of heat source of computer heat dissipation described according to claim 1~any one of 6,
It is characterized in that, the heating pad (6) is formed by stacking from the bottom to top by aluminium foil layer and layer of silica gel；The aluminium foil layer is partly led with described
The radiating end of body cooling piece (5) fits closely.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042533.0A CN109189188A (en) | 2018-09-07 | 2018-09-07 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042533.0A CN109189188A (en) | 2018-09-07 | 2018-09-07 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109189188A true CN109189188A (en) | 2019-01-11 |
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ID=64915228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811042533.0A Pending CN109189188A (en) | 2018-09-07 | 2018-09-07 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
Country Status (1)
| Country | Link |
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| CN (1) | CN109189188A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857288A (en) * | 2020-07-13 | 2020-10-30 | 西安高达智能仪器仪表有限公司 | Computer waste heat utilization and dual-purpose water cooling system of heat dissipation |
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| US6445580B1 (en) * | 2000-06-09 | 2002-09-03 | International Business Machines Corporation | Adaptable heat dissipation device for a personal computer |
| EP1895387A1 (en) * | 2006-08-28 | 2008-03-05 | Silver-Stone Technology Co., Ltd. | Heat dissipating apparatus of a computer system |
| CN203217461U (en) * | 2013-04-15 | 2013-09-25 | 柴惠超 | Multifunctional computer radiating seat |
| CN206441111U (en) * | 2017-02-21 | 2017-08-25 | 龙敏敏 | A kind of heat radiator of computer CPU |
| CN206744324U (en) * | 2017-03-17 | 2017-12-15 | 沧州易广网络设备销售有限公司 | Integrated radiator |
| CN208888746U (en) * | 2018-09-07 | 2019-05-21 | 清华大学 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
-
2018
- 2018-09-07 CN CN201811042533.0A patent/CN109189188A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6445580B1 (en) * | 2000-06-09 | 2002-09-03 | International Business Machines Corporation | Adaptable heat dissipation device for a personal computer |
| EP1895387A1 (en) * | 2006-08-28 | 2008-03-05 | Silver-Stone Technology Co., Ltd. | Heat dissipating apparatus of a computer system |
| CN203217461U (en) * | 2013-04-15 | 2013-09-25 | 柴惠超 | Multifunctional computer radiating seat |
| CN206441111U (en) * | 2017-02-21 | 2017-08-25 | 龙敏敏 | A kind of heat radiator of computer CPU |
| CN206744324U (en) * | 2017-03-17 | 2017-12-15 | 沧州易广网络设备销售有限公司 | Integrated radiator |
| CN208888746U (en) * | 2018-09-07 | 2019-05-21 | 清华大学 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111857288A (en) * | 2020-07-13 | 2020-10-30 | 西安高达智能仪器仪表有限公司 | Computer waste heat utilization and dual-purpose water cooling system of heat dissipation |
| CN111857288B (en) * | 2020-07-13 | 2022-11-11 | 北京环渤高科能源技术有限公司 | Computer waste heat utilization and dual-purpose water cooling system of heat dissipation |
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