CN206744324U - Integrated radiator - Google Patents
Integrated radiator Download PDFInfo
- Publication number
- CN206744324U CN206744324U CN201720266241.XU CN201720266241U CN206744324U CN 206744324 U CN206744324 U CN 206744324U CN 201720266241 U CN201720266241 U CN 201720266241U CN 206744324 U CN206744324 U CN 206744324U
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- China
- Prior art keywords
- heat
- water tank
- transfer device
- cpu
- conducting plate
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Abstract
It the utility model is related to integrated radiator, including water tank and be arranged on the bottom of water tank or be arranged on the electronic unit casing of the outer periphery of water tank；Also include heat-transfer device and heat-conducting plate, heat-conducting plate is arranged on the bottom of water tank or is arranged in the outer periphery of water tank；The heat-transfer device is arranged in the electronic unit casing, and described heat-transfer device one end is fitted on the pyrotoxin of the electronic unit box house, and the other end of the heat-transfer device extends to the bottom of water tank or is arranged in the outer periphery of the water tank.The utility model changes heat transfer medium by expanding area of dissipation, solves the problems, such as that active heat removal produces noise and dust by passively radiating, realizes the recycling of heat.It is transferred to by heat caused by conducting-heat elements and the easy thermal conduction portions collective effect realization of water receptacle in water tank, to improve water temperature, realizes heat recycling, noiseless, easy maintenance.Traditional fish jar part heating function is saved, is combined into one.
Description
Technical field
It the utility model is related to the device of raising ornamental fish, and in particular to a kind of radiating dress of integral type ornamental fish
Put.
Background technology
Present common computer uses wind-cooling heat dissipating, is the rotation by fan, heat is sent away by the flowing of air, its
Shortcoming mainly includes two aspects：Firstth, the rotation of fan has sound during radiating；Secondth, fin is for a long time by empty
Flow of air can be attached to surface by dust, have a strong impact on radiating, generation vibrating noise is increasing, influences household working environment；
Two above shortcoming usage time is more long more serious.
Wind-cooling heat dissipating technology is used now, is dissipated by the fan in power supply, the fan on CPU and the fan combination on video card
Backing forces air flow radiating, in everyday environments in use, with 1-2 cabinet insides just with having substantial amounts of dust and fibre
Dimension, cause to radiate bad, produce vibrations, resonance, cause computer work unstable, or even fan stops passing, it is possible to cause computer
The damage of hardware.
Conventional art shortcoming, air-cooled due to there is mechanical rotation to have noise, lossy, the life-span is low, and caused dust needs fixed
Phase clears up the instrument, it is necessary to special.
On the other hand, to solve the problems, such as the concept for proposing water cooling above, typically now with high-end type, solve
Determine the problem of above, but in this way while cost improves, system can also become more complicated, add maintenance
Amount, it does not solve the problems, such as heat recycling really.
In the device of raising ornamental fish, particularly instantly for raising ornamental fish, water temperature is raising ornamental fish
Key, traditional fish jar needs to set independent heater block, and can therefore, propose a kind of new mode of heating, being exactly will be existing
There is heat caused by electronic unit box house to be transported in fish jar, solved by a kind of unique mode or structure existing general
Heat dissipation problem in logical electronic cabinets (such as computer), while also effectively transfer heat in fish jar, to improve water temperature,
Realizing heat and recycling turns into those skilled in the art's urgent problem to be solved.
Utility model content
In view of this, the purpose of this utility model is overcome the deficiencies in the prior art, there is provided a kind of integrated radiating dress
Put, to solve the deficiencies in the prior art, the integrated radiator effectively saves traditional fish jar part heating function, realizes
Heat recycles, noiseless, easy maintenance.
To realize object above, the utility model adopts the following technical scheme that：Integrated radiator, including water tank and
It is arranged on the bottom of the water tank or is arranged on the electronic unit casing of the outer periphery of the water tank；Filled in the water tank
There is heat-conducting medium；
Also include heat-transfer device and heat-conducting plate, the heat-conducting plate is arranged on the bottom of the water tank or is arranged on the water
In the outer periphery of case；The heat-transfer device is arranged in the electronic unit casing, and described heat-transfer device one end is fitted in institute
On the pyrotoxin for stating electronic unit box house, the other end of the heat-transfer device extends to the bottom of water tank or is arranged on institute
State in the outer periphery of water tank, and the other end of the heat-transfer device is fixedly connected with the heat-conducting plate.
Further, the electronic unit box house is provided with mainboard and video card, and the pyrotoxin includes being arranged on institute
State the GPU on video card, the CPU being arranged on the mainboard and be arranged on the rectifying tube of the electronic unit box house.
Further, the heat-transfer device is divided into the first heat-transfer device and the second heat-transfer device；First heat-transfer device
For the heat sent on the GPU heat to be passed to the heat-conducting plate of water tank；Second heat-transfer device is used for the CPU
The heat transfer sent is on the heat-conducting plate of water tank；
Further, in addition to the 3rd heat-transfer device, the 3rd heat-transfer device is used to send on the rectifying tube
Heat transfer is on the heat-conducting plate of water tank.
Further, first heat-transfer device includes video card fastener and the first heat pipe, and the video card fastener is divided into first
Two pieces of video card fastener and the second video card fastener, offer in each piece of video card fastener first recessed for accommodate the first heat pipe
Groove, first heat pipe be more than two, the quantity of first groove is adapted with the quantity of first heat pipe, two with
On the first heat pipe it is corresponding be arranged in first groove, wherein, the first video card fastener is attached to the video card
GPU on, the second video card fastener is attached on the heat-conducting plate.
Further, second heat-transfer device includes CPU fasteners and the second heat pipe, and the CPU fasteners are divided into the first CPU
Two pieces of fastener and the 2nd CPU fasteners, the second groove for accommodating the second heat pipe is offered in each piece of CPU fastener, it is described
Second heat pipe is more than two, and the quantity of second groove is adapted with the quantity of second heat pipe, the of more than two
Two heat pipes are corresponding to be arranged in second groove, wherein, the first CPU fasteners are attached on the GPU of the mainboard,
The 2nd CPU fasteners are attached on the heat-conducting plate.
Further, the 3rd heat-transfer device is heat conduction aluminum strip, and one end of the heat conduction aluminum strip is attached to the rectification
Guan Shang, the other end of the heat conduction aluminum strip are attached on the heat-conducting plate.
Further, in addition to elastic steel sheet, the both ends of the elastic steel sheet are resisted against the first CPU fasteners and the 2nd CPU
On fastener.
Further, heat-conducting medium water is filled with the water tank.
Further, the water tank is made of transparent material.
Further, the heat-conducting plate is made of aluminum material or copper material is made.
The utility model uses above technical scheme, and heat-conducting plate is arranged on into the bottom of water tank or is arranged on the outer of water tank
On side periphery；Heat-transfer device is arranged in electronic unit casing, heat-transfer device one end is fitted in electronic unit box house
On pyrotoxin, the other end of heat-transfer device extends to the bottom of water tank or is arranged in the outer periphery of the water tank, and institute
The other end for stating heat-transfer device is fixedly connected with the heat-conducting plate.
During utility model works, the heat that pyrotoxin (GPU, CPU and rectifying tube) is sent passes to water by heat pipe for thermal conductivity
The heat-conducting plate in bottom portion, in the water being delivered to by heat-conducting plate inside water tank, heat is dissipated by four walls of water tank and the aluminium of bottom
Hair.The utility model does not have machine driving, just, without the forced flow of air, reduces dust without mechanical loss yet.It is logical
Cross expansion area of dissipation and change heat transfer medium, solve the problems, such as that active heat removal produces noise and dust by passively radiating, realize
The recycling of heat.Water tank is transferred to by heat caused by conducting-heat elements and the easy thermal conduction portions collective effect realization of water receptacle
In, to improve water temperature, realize heat recycling, noiseless, easy maintenance.Traditional fish jar part heating function is saved, closes two
For one, appearance looks elegant, space is saved, coordinated with office, domestic environment, viewed and admired and practical mutually unification.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is one of the utility model integrated radiator structural representation；
Fig. 2 is the two of the utility model integrated radiator structural representation；
Fig. 3 is the utility model the second heat-transfer device structural representation.
In figure：1st, water tank；2nd, electronic unit casing；3rd, heat-conducting plate；4th, mainboard；5th, video card；6、GPU；7、CPU；8th, rectification
Pipe；9th, the first heat-transfer device；91st, the first video card fastener；92nd, the second video card fastener；93rd, the first heat pipe；10th, the second heat conduction fills
Put；101st, the first CPU fasteners；102nd, the 2nd CPU fasteners；103rd, the second heat pipe；104th, the second groove；11st, the 3rd heat-transfer device；
12nd, elastic steel sheet.
Embodiment
, below will be to technology of the present utility model to make the purpose of this utility model, technical scheme and advantage clearer
Scheme is described in detail.Obviously, described embodiment is only the utility model part of the embodiment, rather than all
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not before creative work is made
Resulting all other embodiment is put, belongs to the scope that the utility model is protected.
As depicted in figs. 1 and 2, the utility model provides a kind of integrated radiator, including water tank 1 and is arranged on institute
The bottom (as shown in Figure 1) for stating water tank 1 or the electronic component box for the outer periphery (as shown in Figure 2) for being arranged on the water tank 1
Body 2；Heat-conducting medium is filled with the water tank 1；Also include heat-transfer device and heat-conducting plate 3, the heat-conducting plate 3 is arranged on the water
The bottom of case 1 is arranged in the outer periphery of the water tank 1；The heat-transfer device is arranged on the electronic unit casing 2
In, described heat-transfer device one end is fitted on the pyrotoxin inside the electronic unit casing 2, the other end of the heat-transfer device
Extend to the bottom of water tank 1 or be arranged in the outer periphery of the water tank 1, and the other end of the heat-transfer device with it is described
Heat-conducting plate 3 is fixedly connected.
As shown in figure 1, electronic unit casing described in the present embodiment 2 is internally provided with mainboard 4 and video card 5, the heating
Source is including the GPU 6 being arranged on the video card 5, the CPU 7 being arranged on the mainboard 4 and is arranged on the electronic unit
Rectifying tube 8 inside casing 2.
As a preferred embodiment, the heat-transfer device is divided into the first heat-transfer device 9 and the second heat-transfer device 10；
First heat-transfer device 9 is used for the heat-conducting plate 3 that the heat heat sent on the GPU 6 is passed to water tank 1；Described second leads
Thermal 10 be used for will the heat transfer that be sent on the CPU 7 to water tank 1 heat-conducting plate 3；
The integrated radiator that this implementation provides, in addition to the 3rd heat-transfer device 11, the 3rd heat-transfer device 11 are used
In on the heat-conducting plate 3 of the heat transfer that will be sent on the rectifying tube 8 to water tank 1.
As a preferred embodiment, first heat-transfer device 9 includes the fastener of video card 5 and the first heat pipe 93, institute
State the fastener of video card 5 and be divided into 92 two pieces of the first video card fastener 91 and the second video card fastener, use is offered in each piece of fastener of video card 5
In the first groove (not shown) for accommodating the first heat pipe 93, first heat pipe 93 is more than two, first groove
Quantity be adapted with the quantity of first heat pipe 93, first heat pipe 93 of more than two it is corresponding be arranged on described first
In groove, wherein, the first video card fastener 91 is attached on the GPU 6 of the video card 5, and the second video card fastener 92 attaches
On the heat-conducting plate 3.
As shown in figure 3, as another preferred embodiment, second heat-transfer device 10 include the fasteners of CPU 7 and
Second heat pipe 103, the fasteners of CPU 7 are divided into 102 two pieces of the first CPU fasteners 101 and the 2nd CPU fasteners, and each piece of CPU 7 is detained
The second groove 104 (as shown in Figure 3) for accommodating the second heat pipe 103 is offered in tool, second heat pipe 103 is two
More than, the quantity of second groove 104 is adapted with the quantity of second heat pipe 103, second heat pipe 103 of more than two
Corresponding is arranged in second groove 104, wherein, the first CPU fasteners 101 are attached to the GPU 6 of the mainboard 4
On, the 2nd CPU fasteners 102 are attached on the heat-conducting plate 3.
3rd heat-transfer device 11 described in the present embodiment is heat conduction aluminum strip, and one end of the heat conduction aluminum strip is attached to described whole
In flow tube 8, the other end of the heat conduction aluminum strip is attached on the heat-conducting plate 3.
It should be added that also include elastic steel sheet 12 in the present embodiment, the both ends of the elastic steel sheet 12 against
On the first CPU fasteners 101 and the 2nd CPU fasteners 102.Elastic steel sheet 12 is provided primarily to providing one against dynamics,
First CPU fasteners 101 are close on CPU 7 so that the 2nd CPU fasteners 102 can be close on heat-conducting plate 3 so as to
The thermal efficiency is calculated in effective lifting, also can effectively be transferred heat in water tank 1.
On the other hand, heat-conducting medium water is filled with water tank 1 described in the present embodiment.The water tank 1 uses transparent material
It is made.
During utility model works, the heat that pyrotoxin (GPU 6, CPU 7 and rectifying tube 8) is sent is passed by heat pipe for thermal conductivity
To the heat-conducting plate 3 of the bottom of water tank 1, in the water being delivered to by heat-conducting plate 3 inside water tank 1, heat passes through four walls of water tank 1 and bottom
The aluminium in portion distributes.The utility model does not have machine driving, just, without the forced flow of air, is reduced without mechanical loss yet
Dust.Change heat transfer medium by expanding area of dissipation, solve active heat removal by passively radiating and produce noise and dust
Problem, realize the recycling of heat.Pass through heat caused by conducting-heat elements and the easy thermal conduction portions collective effect realization of water receptacle
It is transferred in water tank 1, to improve water temperature, realizes heat recycling, noiseless, easy maintenance.Traditional fish jar part is saved to add
Hot function, it is combined into one, appearance looks elegant, saves space, coordinate with office, domestic environment, views and admires and practical mutually unification.
(aluminium sheet) is made using aluminum material for heat-conducting plate 3 described in the utility model or copper material is made (copper coin).
Above-described embodiment, the purpose of this utility model, technical scheme and beneficial effect are entered
One step describes in detail, should be understood that and the foregoing is only specific embodiment of the present utility model, is not used to limit
Determine the scope of protection of the utility model, it is all within the spirit and principles of the utility model, any modification for being made, equally replace
Change, improve, should be included within the scope of protection of the utility model.
Claims (10)
1. integrated radiator, it is characterised in that：Including water tank and it is arranged on the bottom of the water tank or is arranged on institute
State the electronic unit casing of the outer periphery of water tank；Heat-conducting medium is filled with the water tank；
Also include heat-transfer device and heat-conducting plate, the heat-conducting plate is arranged on the bottom of the water tank or is arranged on the water tank
In outer periphery；The heat-transfer device is arranged in the electronic unit casing, and described heat-transfer device one end is fitted in the electricity
On the pyrotoxin of subassembly box house, the other end of the heat-transfer device extends to the bottom of water tank or is arranged on the water
In the outer periphery of case, and the other end of the heat-transfer device is fixedly connected with the heat-conducting plate.
2. integrated radiator according to claim 1, it is characterised in that：The electronic unit box house is provided with
Mainboard and video card, the pyrotoxin include the GPU being arranged on the video card, the CPU being arranged on the mainboard and setting
In the rectifying tube of the electronic unit box house.
3. integrated radiator according to claim 2, it is characterised in that：The heat-transfer device is divided into the first heat conduction dress
Put and the second heat-transfer device；
First heat-transfer device is used for the heat-conducting plate that the heat heat sent on the GPU is passed to water tank；
Second heat-transfer device be used for will the heat transfer that be sent on the CPU to water tank heat-conducting plate.
4. integrated radiator according to claim 3, it is characterised in that：Also include the 3rd heat-transfer device, described
Three heat-transfer devices be used for will the heat transfer that be sent on the rectifying tube to water tank heat-conducting plate.
5. integrated radiator according to claim 3, it is characterised in that：First heat-transfer device includes video card button
Tool and the first heat pipe, the video card fastener are divided into two pieces of the first video card fastener and the second video card fastener, in each piece of video card fastener
The first groove for accommodating the first heat pipe is offered, first heat pipe is more than two, the quantity of first groove
It is adapted with the quantity of first heat pipe, first heat pipe of more than two is corresponding to be arranged in first groove, its
In,
The first video card fastener is attached on the GPU of the video card, and the second video card fastener is attached on the heat-conducting plate.
6. integrated radiator according to claim 3, it is characterised in that：Second heat-transfer device is detained including CPU
Tool and the second heat pipe, the CPU fasteners are divided into two pieces of the first CPU fasteners and the 2nd CPU fasteners, opened in each piece of CPU fastener
Provided with the second groove for accommodating the second heat pipe, second heat pipe is more than two, the quantity of second groove and institute
The quantity for stating the second heat pipe is adapted, and second heat pipe of more than two is corresponding to be arranged in second groove, wherein,
The first CPU fasteners are attached on the GPU of the mainboard, and the 2nd CPU fasteners are attached on the heat-conducting plate.
7. integrated radiator according to claim 4, it is characterised in that：3rd heat-transfer device is heat conduction aluminum
Bar, one end of the heat conduction aluminum strip are attached on the rectifying tube, and the other end of the heat conduction aluminum strip is attached to the heat-conducting plate
On.
8. according to the integrated radiator described in any one of claim 1 to 7, it is characterised in that：Also include elastic steel sheet, institute
The both ends for stating elastic steel sheet are resisted against on the first CPU fasteners and the 2nd CPU fasteners.
9. according to the integrated radiator described in any one of claim 1 to 7, it is characterised in that：It is filled with the water tank
Heat-conducting medium water, the water tank are made of transparent material.
10. according to the integrated radiator described in any one of claim 1 to 7, it is characterised in that：The heat-conducting plate uses aluminium
Saw lumber matter is made or copper material is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720266241.XU CN206744324U (en) | 2017-03-17 | 2017-03-17 | Integrated radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720266241.XU CN206744324U (en) | 2017-03-17 | 2017-03-17 | Integrated radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206744324U true CN206744324U (en) | 2017-12-15 |
Family
ID=60609190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720266241.XU Expired - Fee Related CN206744324U (en) | 2017-03-17 | 2017-03-17 | Integrated radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206744324U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109189188A (en) * | 2018-09-07 | 2019-01-11 | 清华大学 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
-
2017
- 2017-03-17 CN CN201720266241.XU patent/CN206744324U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109189188A (en) * | 2018-09-07 | 2019-01-11 | 清华大学 | It is a kind of to improve device by the human thermal comfort of heat source of computer heat dissipation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171215 |