CN109186230A - A kind of drying device for microelectronic element frame - Google Patents
A kind of drying device for microelectronic element frame Download PDFInfo
- Publication number
- CN109186230A CN109186230A CN201811008642.0A CN201811008642A CN109186230A CN 109186230 A CN109186230 A CN 109186230A CN 201811008642 A CN201811008642 A CN 201811008642A CN 109186230 A CN109186230 A CN 109186230A
- Authority
- CN
- China
- Prior art keywords
- drier
- hothouse
- element frame
- microelectronic element
- drying device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
- F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
- F26B15/18—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined the objects or batches of materials being carried by endless belts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/16—Drying solid materials or objects by processes not involving the application of heat by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The invention discloses a kind of drying device for microelectronic element frame, including hothouse and the first drier and the second drier that are arranged in inside hothouse, first drier is located at the top of hothouse and the second drier is located at the bottom of hothouse, in the medium position of hothouse, there are openings simultaneously, conveyer belt is installed in opening, conveyer belt is fixed by the bracket on the ground, the top left of hothouse is provided with blower, one end of blower is connected to return pipe and the other end is connected to delivery pipe, the end of delivery pipe is air inlet pipe, and the end of return pipe is air inlet, air inlet is placed directly within inside hothouse, this kind of drying device for microelectronic element frame, first drier and the second drier are provided with blower and delivery pipe and return pipe, blower can blow air into inside drier, member is directly blowed to by heating Part frame, while hot-fluid can be refluxed pipe absorption, realize the recycling of heat, capacity usage ratio greatly improves.
Description
Technical field
The present invention relates to microelectronic device technical field, specially a kind of drying device for microelectronic element frame.
Background technique
In semicon industry, microelectronic element all concentrates on frame in process of production, needs in final finished
Electroplating processes are carried out to microelectronic element frame surface, the overall shape of microelectronic element frame is rectangular sheet shape,
Including aluminium base radiator, epoxy packages body and pin, epoxy packages body both ends are connected separately with aluminium base radiator and pin, make
With before, electroplating surface processing need to be carried out.And before plating, electronic component needs water knife machine equipment high pressure water before plating
The epoxy excessive glue on conductive pin is washed away, after the element after rinsing must be dried, then flows into electroplating work procedure.Common dry stream
Cheng Yici are as follows: multi-stage compression air air knife drying, multistage hot wind air knife drying, cooling.During actual use, dry effect
Rate is lower, while needing to consume a large amount of electric energy and being converted into thermal energy, and capacity usage ratio is lower.
So how to design a kind of drying device for microelectronic element frame, becoming us will currently be solved the problems, such as.
Summary of the invention
The purpose of the present invention is to provide a kind of drying device for microelectronic element frame, to solve to mention in above-mentioned background technique
Common drying process out is successively are as follows: multi-stage compression air air knife drying, multistage hot wind air knife drying, cooling.Actually make
During, drying efficiency is lower, while needing to consume a large amount of electric energy and being converted into thermal energy, the lower problem of capacity usage ratio.
To achieve the above object, the invention provides the following technical scheme: a kind of drying device for microelectronic element frame, including
Hothouse and the first drier and the second drier being arranged in inside hothouse, first drier are located at hothouse
Top and second drier are located at the bottom of hothouse, while in the medium position of the hothouse, there are openings, are opening
Conveyer belt is installed at mouthful, the conveyer belt is fixed by the bracket on the ground, is provided in the top left of the hothouse
Blower, one end of the blower is connected to return pipe and the other end is connected to delivery pipe, and the end of the delivery pipe is air inlet pipe,
Connection is connected with the first drier for the air inlet pipe, and the end of the return pipe is air inlet, and the air inlet is placed directly within
Inside hothouse.
Further, the inside two sides of first drier are provided with heating wire, while in the outer cup of heating wire
There is one layer of baffle.
Further, the bottom of first drier is provided with air outlet, while is provided with isolation at air outlet
Net.
Further, it is provided with several grooves on the conveyer belt, the groove spaced set, while described
The bottom of groove is covered with water absorption layer.
Further, the length of second drier unlike the first drier is the three of first drier
/ mono-.
Compared with prior art, the beneficial effects of the present invention are:
1. this kind of drying device for microelectronic element frame, be arranged in individual hothouse, hothouse only have middle part there are
For one opening in order to conveyer belt disengaging, heat is not easy to lose more energy saving.
2. this kind of drying device for microelectronic element frame is provided with two groups of independent driers, the first drier is to element
The front of frame is dried, and the back side of element frame is dried in the second drier, shares out the work and help one another more efficient.
3. this kind of drying device for microelectronic element frame, in the groove that is internally provided with of conveyer belt, and the bottom of groove is covered
It is stamped water absorption layer, the water at the element frame back side can be absorbed, drying effect is more preferable.
4. this kind of drying device for microelectronic element frame, the first drier and the second drier be provided with blower and
Delivery pipe and return pipe, blower can blow air into inside drier, directly blow to element frame, while hot-fluid by heating
It can be refluxed pipe absorption, the recycling of heat is realized, reduce heat loss, capacity usage ratio greatly improves.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention;
Fig. 2 is the structural schematic diagram of the first drier of the invention;
Fig. 3 is the structural schematic diagram of conveyer belt of the present invention;
In figure: 1- hothouse;The air inlet 2-;3- air inlet pipe;4- return pipe;5- delivery pipe;6- blower;7- second is dry
Device;8- bracket;9- conveyer belt;The first drier of 10-;11- heating wire;12- baffle;13- separation net;14- air outlet;15- inhales
Water layer;16- groove.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " on ", "lower", "inner", "outside" " end ", " front end ",
The orientation or positional relationship of the instructions such as " rear end ", " both ends ", " one end ", " other end " is orientation based on the figure or position
Relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " the
One ", " second " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Set/offer ", " connection ", etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to detachably connect
It connects, or is integrally connected;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of drying device for microelectronic element frame, including it is dry
Dry room 1 and the first drier 10 and the second drier 7 being arranged in inside hothouse 1, first drier 10 are located at dry
The top of dry room 1 and second drier 7 are located at the bottom of hothouse 1, at the same the medium position of the hothouse 1 there are
Opening is equipped with conveyer belt 9 in opening, and the conveyer belt 9 is fixed on the ground by bracket 8, on the top of the hothouse 1
Portion left end is provided with blower 6, and one end of the blower 6 is connected to return pipe 4 and the other end is connected to delivery pipe 5, the conveying
The end of pipe 5 is air inlet pipe 3, and the air inlet pipe 3 and the conducting of the first drier 10 connect, and the end of the return pipe 4 is to inhale
Air port 2, the air inlet 2 are placed directly within inside hothouse 1.Basic structure of the invention is constituted above.
Further, the inside two sides of first drier 10 are provided with heating wire 11, while in heating wire 11
Outside be covered with one layer of baffle 12.The bottom of first drier 10 is provided with air outlet 14, while at air outlet 14
It is provided with separation net 13.
In the present embodiment, the separation net 13 at air outlet 14 can effectively prevent foreign matter by entering by conveyer belt 9
In first drier 10 or the second drier 7, and the baffle 12 outside heating wire 11, which is arranged in, also can prevent foreign matter and fever
Silk 11 contacts, in order to avoid the excessively high generation fire of temperature.
Further, it is provided with several grooves 16 on the conveyer belt 9,16 spaced set of groove, together
When in the bottom of the groove 16 be covered with water absorption layer 15.The length of second drier 7 unlike the first drier 10
Degree is the one third of first drier 10.
In the present embodiment, the first drier 10 directly dries the surface of element frame, and the second drying machine 7 is only
The back side of element frame need to be dried, while the back side of element frame absorbs a large amount of moisture by water absorption layer 15, therefore
11 quantity of heating wire inside second drier 7 is without excessive.
Working principle: firstly, this kind of drying device for microelectronic element frame, is arranged in individual hothouse 1, hothouse
1 only there are an openings at middle part in order to the disengaging of conveyer belt 9, and heat is not easy to lose more energy saving.It is provided with two groups of independences
Drier, the front of element frame is dried in the first drier 10, and the second drier 7 to the back side of element frame into
Row drying is shared out the work and help one another more efficient.It is internally provided with groove 16 in conveyer belt 6, and the bottom of groove 16 is covered with water suction
Layer 15, can absorb the water at the element frame back side, drying effect is more preferable, and the first drier 10 and the second drier 7 are respectively provided with
There are blower 6 and delivery pipe 5 and return pipe 4, blower 6 can blow air into inside drier, directly blow to member by heating
Part frame, while hot-fluid can be refluxed the absorption of pipe 4, realize the recycling of heat, reduce heat loss, energy utilization
Rate greatly improves, and in actual use, first preheats to the first drier 10 and the second drier 7, will need later dry
Dry element frame is placed on conveyer belt 9, and element frame sequentially enters inside hothouse 1, so that operation be dried.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of drying device for microelectronic element frame, including hothouse (1) and setting in internal first dry of hothouse (1)
Dry device (10) and the second drier (7), it is characterised in that: first drier (10) is located at the top of hothouse (1) and institute
The bottom that the second drier (7) is located at hothouse (1) is stated, while there are openings in the medium position of the hothouse (1), are opening
It is equipped with conveyer belt (9) at mouthful, the conveyer belt (9) is fixed on the ground by bracket (8), on the top of the hothouse (1)
Portion left end is provided with blower (6), and one end of the blower (6) is connected to return pipe (4) and the other end is connected to delivery pipe (5),
The end of the delivery pipe (5) is air inlet pipe (3), and the air inlet pipe (3) and the first drier (10) conducting connect, and described time
The end of flow tube (4) is air inlet (2), and it is internal that the air inlet (2) is placed directly within hothouse (1).
2. a kind of drying device for microelectronic element frame according to claim 1, it is characterised in that: dry described first
The inside two sides of device (10) are provided with heating wire (11), while being covered with one layer of baffle (12) in the outside of heating wire (11).
3. a kind of drying device for microelectronic element frame according to claim 1, it is characterised in that: dry described first
The bottom of device (10) is provided with air outlet (14), while separation net (13) are provided at air outlet (14).
4. a kind of drying device for microelectronic element frame according to claim 1, it is characterised in that: in the conveyer belt
(9) it is provided with several grooves (16), groove (16) spaced set on, while being covered in the bottom of the groove (16)
There are water absorption layer (15).
5. a kind of drying device for microelectronic element frame according to claim 1, it is characterised in that: with the first drier
(10) length of second drier (7) unlike is the one third of first drier (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811008642.0A CN109186230A (en) | 2018-08-29 | 2018-08-29 | A kind of drying device for microelectronic element frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811008642.0A CN109186230A (en) | 2018-08-29 | 2018-08-29 | A kind of drying device for microelectronic element frame |
Publications (1)
Publication Number | Publication Date |
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CN109186230A true CN109186230A (en) | 2019-01-11 |
Family
ID=64917654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201811008642.0A Withdrawn CN109186230A (en) | 2018-08-29 | 2018-08-29 | A kind of drying device for microelectronic element frame |
Country Status (1)
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CN (1) | CN109186230A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111998653A (en) * | 2020-08-18 | 2020-11-27 | 涌明科技(上海)有限公司 | Semiconductor chip dehumidification method |
CN117443839A (en) * | 2023-12-21 | 2024-01-26 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201731730U (en) * | 2010-07-19 | 2011-02-02 | 佛山市摩德娜机械有限公司 | Semiconductor condensing dryer |
CN202371974U (en) * | 2011-12-02 | 2012-08-08 | 深圳市凯尔迪光电科技有限公司 | PCBA (Printed Circuit Board Assembly) constant temperature hot air drying device |
CN203942708U (en) * | 2014-07-03 | 2014-11-12 | 昆山鸿汉电子有限公司 | The two-sided blowing device of circuit board |
CN106643084A (en) * | 2016-12-26 | 2017-05-10 | 通富微电子股份有限公司 | Drying device and cleaner with drying device |
CN207674845U (en) * | 2017-12-18 | 2018-07-31 | 杭州印校印务有限公司 | A kind of drying device of printing plate |
-
2018
- 2018-08-29 CN CN201811008642.0A patent/CN109186230A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201731730U (en) * | 2010-07-19 | 2011-02-02 | 佛山市摩德娜机械有限公司 | Semiconductor condensing dryer |
CN202371974U (en) * | 2011-12-02 | 2012-08-08 | 深圳市凯尔迪光电科技有限公司 | PCBA (Printed Circuit Board Assembly) constant temperature hot air drying device |
CN203942708U (en) * | 2014-07-03 | 2014-11-12 | 昆山鸿汉电子有限公司 | The two-sided blowing device of circuit board |
CN106643084A (en) * | 2016-12-26 | 2017-05-10 | 通富微电子股份有限公司 | Drying device and cleaner with drying device |
CN207674845U (en) * | 2017-12-18 | 2018-07-31 | 杭州印校印务有限公司 | A kind of drying device of printing plate |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111998653A (en) * | 2020-08-18 | 2020-11-27 | 涌明科技(上海)有限公司 | Semiconductor chip dehumidification method |
CN117443839A (en) * | 2023-12-21 | 2024-01-26 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
CN117443839B (en) * | 2023-12-21 | 2024-03-19 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190111 |
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WW01 | Invention patent application withdrawn after publication |