CN109167897B - High-parallelism mounting method of large-target-surface sensor and camera - Google Patents
High-parallelism mounting method of large-target-surface sensor and camera Download PDFInfo
- Publication number
- CN109167897B CN109167897B CN201811091869.6A CN201811091869A CN109167897B CN 109167897 B CN109167897 B CN 109167897B CN 201811091869 A CN201811091869 A CN 201811091869A CN 109167897 B CN109167897 B CN 109167897B
- Authority
- CN
- China
- Prior art keywords
- plane
- lens flange
- sensor
- front shell
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The application discloses a high-parallelism installation method of a large target surface sensor and a camera, wherein the installation method comprises the following steps: step 1, fixing a front shell and a lens flange on a processing platform respectively, and processing parallelism of the front shell and the lens flange, wherein the processing plane of the front shell comprises a third plane and a fourth plane, and the processing plane of the lens flange comprises a first plane and a second plane; step 2, assembling the processed front shell and the processed lens flange according to the first positioning hole and the first positioning column, and recording the assembled body as a mark; step 3, fixing the assembly body on the processing platform by taking the first plane of the lens flange as a reference; and 4, carrying out parallelism processing on the sensor assembling surface of the front shell, wherein the processed sensor assembling surface is parallel to the first plane of the lens flange. Through the technical scheme in this application, be favorable to reducing the accumulative total error of depth of parallelism between sensor assembly face and the camera lens, and then improved image sensor's imaging.
Description
Technical Field
The application relates to the technical field of camera sensors, in particular to a high-parallelism mounting method of a large target surface sensor and a camera.
Background
In the imaging process of the camera, the image sensor is required to be parallel to the lens, namely, the sensor assembling surface is parallel to the lens flange plane, so that the good imaging effect of the camera is ensured, wherein the sensor assembling surface is arranged on the rear side of the front shell, and the lens flange is arranged on the front side of the front shell. Generally, a lens flange and a front shell are respectively machined through a high-precision positioning tool, and then are bonded together through an adhesion method, so that the parallelism between the lens flange and a sensor assembling surface is ensured.
In the prior art, on one hand, the positioning tool is high in cost and cannot be detached after being glued, so that the camera component is not repaired conveniently, and on the other hand, although the high-precision positioning tool is adopted, accumulated errors exist among the plane of the lens flange, the front side of the front shell and the rear side of the front shell, and the possibility that the parallelism error of the lens and the sensor is too large exists.
Disclosure of Invention
The purpose of this application lies in: the accumulated error of the parallelism between the image sensor and the lens is reduced, and the imaging effect of the camera image sensor is improved.
The technical scheme of the first aspect of the application is as follows: there is provided a camera including: a camera, characterized in that the camera comprises: a front housing, an image sensor assembly and a lens flange; the lens flange is provided with a first plane, a second plane and a first positioning hole, the first plane is arranged on the outer side of the lens flange, the second plane is arranged on the inner side of the lens flange, and the first positioning hole is arranged on the second plane; the front shell is provided with a third plane, a fourth plane, a sensor assembling face and a first positioning column, the first positioning column is arranged on the third plane, when the lens flange is assembled with the front shell, the third plane is in contact with the second plane, the first positioning column is inserted into the first positioning hole, the sensor assembling face is processed to be parallel to the first plane after the lens flange and the front shell are assembled, and the sensor assembling face is used for assembling the image sensor assembly.
In any one of the above technical solutions, further, the method further includes: a mounting mat; the mounting pad is disposed between the image sensor assembly and the sensor mounting face.
In any of the above embodiments, further, the mounting mat is a rubber mat.
In any one of the above technical solutions, further, a second plane of the lens flange is provided with a first assembly hole, and the first assembly hole is a through hole; the third plane of preceding shell is provided with the second pilot hole, and the second pilot hole is provided with the internal thread, and the second pilot hole corresponds the setting with first pilot hole.
In any of the above technical solutions, further, at least one image acquisition auxiliary device is disposed between the front housing and the lens flange, a second positioning post is disposed on a first auxiliary surface of the image acquisition auxiliary device, the first auxiliary surface contacts with the second plane when the second positioning post is inserted into the first positioning hole, a second positioning hole is disposed on the second auxiliary surface of the image acquisition auxiliary device, and the second auxiliary surface contacts with the third plane when the first positioning post is inserted into the second positioning hole; the sensor mounting surface is processed to be parallel to a first plane after the lens flange, the image acquisition aid, and the front case are mounted.
The technical scheme of the second aspect of the application is as follows: a high-parallelism mounting method of a large target surface sensor is provided, and comprises the following steps: step 1, fixing a front shell and a lens flange on a processing platform respectively, and processing parallelism of the front shell and the lens flange; step 2, assembling the processed front shell and the processed lens flange according to the first positioning hole and the first positioning column, and recording the assembled body as a mark; step 3, fixing the assembly body on the processing platform by taking the first plane of the lens flange as a reference; and 4, carrying out parallelism processing on the sensor assembling surface of the front shell, wherein the processed sensor assembling surface is parallel to the first plane of the lens flange.
In any one of the above technical solutions, further, before step 1, the method further includes: and carrying out shaping treatment on the front shell and the lens flange.
In any one of the above technical solutions, further, in the step 2, specifically including: aligning the first positioning hole of the lens flange with the first positioning column of the front shell, enabling the second plane of the lens flange to be in contact with the third plane of the front shell, penetrating the fixing bolt through the first assembling hole of the lens flange, and screwing the fixing bolt into the second assembling hole of the front shell by preset torque.
In any one of the above technical solutions, further, in step 2, specifically, the method further includes: when at least one image acquisition auxiliary device is arranged, the first auxiliary surface and the second auxiliary surface of the image acquisition auxiliary device are processed in a parallel mode, the processed image acquisition auxiliary device is installed between the lens flange and the front shell, and then the fixing bolt is screwed into the second assembling hole of the front shell at a preset moment.
In any one of the above technical solutions, further, the method further includes: step 5, disassembling the assembly body after parallelism processing; step 6, mounting the color filter bracket and the color filter on a fourth plane of the front shell; step 7, assembling the front shell and the lens flange; and 8, assembling the image sensor assembly and the mounting pad on the sensor assembling surface.
The beneficial effect of this application is: through setting up locating hole and reference column, improved the installation accuracy between camera lens flange and the preceding shell, reduced the depth of parallelism course of working, the possibility that takes place relative displacement between preceding shell and the camera lens flange to and improved the accuracy of dismantling the back and installing once more. The lens flange and the front shell are assembled firstly, and the sensor assembling surface used for installing the image sensor assembly in the assembled front shell is processed, so that the sensor assembling surface is parallel to the first plane of the assembled lens flange, the improvement of the parallelism between the plane where the image sensor is located and the lens installing plane is facilitated, the reduction of the accumulated error of the parallelism between the sensor assembling surface and the lens is facilitated, the image obtaining effect of the image sensor is optimized, and the improvement of the definition of an image shot by a camera is facilitated.
Drawings
The advantages of the above and/or additional aspects of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is an exploded isometric view of an assembly according to an embodiment of the present application;
FIG. 2 is a rear view of a lens flange according to one embodiment of the present application;
FIG. 3 is a perspective view of an assembly according to one embodiment of the present application;
FIG. 4 is a perspective view of the positioning of an assembly corresponding to a high parallelism mounting method for a large target surface sensor according to one embodiment of the present application;
FIG. 5 is an assembly schematic of an image sensor assembly according to one embodiment of the present application;
fig. 6 is a schematic diagram of a heat sink 503 according to an embodiment of the present application.
Detailed Description
In order that the above objects, features and advantages of the present application can be more clearly understood, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.
The first embodiment is as follows:
embodiments of the present application will be described below with reference to fig. 1 to 3.
As shown in fig. 1, the first embodiment provides a camera, including: a front case 04, an image sensor assembly 05 and a lens flange 01; the lens flange 01 is provided with a first plane 11, a second plane 12 and a first positioning hole 13, the first plane 11 is arranged on the outer side of the lens flange 01, the second plane 12 is arranged on the inner side of the lens flange 01, and the first positioning hole 13 is arranged on the second plane 12;
specifically, as shown in fig. 2, in order to prevent the lens flange 01 and the front housing 04 from generating relative displacement during the processing, a first positioning hole is formed in the second plane 12 of the lens flange 01 so as to perform first positioning assembly with the first positioning post 44 of the front housing 04, and by providing three first positioning holes, on one hand, the accuracy of the first positioning is improved, and on the other hand, the mounting angle of the lens flange 01 and the front housing 04 is identified, so that the mounting angle of the lens flange 01 is prevented from deviating during the reassembling process after the disassembling, and if the lens flange 01 is integrally assembled into the front housing 04 after rotating 90 ° to the left, the consistency of the parallelism between the first plane 11 and the sensor assembling surface 43 before and after the lens flange 01 is assembled is ensured.
Further, the number of the first positioning holes 13 is equal to the number of the first positioning posts 44, and the number of the first positioning holes 13 is at least 2.
Preferably, the first positioning hole 13 is arranged close to the vertex of the second plane 12.
Preferably, when the number of the first positioning holes 13 is an even number, the first positioning holes 13 are symmetrical to the center point of the second plane 12.
Specifically, as shown in fig. 2, when the number of the first positioning holes 13 is two, two first positioning holes 13 may be respectively disposed at the upper right corner and the lower left corner of the second plane 12 of the lens flange 01, and the centers of the two first positioning holes 13 are symmetrical to the central point O of the second plane 12. When the number of the first positioning holes 13 is set to be three, two of the first positioning holes 13 are arranged at the upper right corner and the lower left corner of the second plane 12 with the centers thereof symmetrical to the center point O, respectively, the remaining one of the first positioning holes 13 can be arranged at the lower right corner of the second plane 12, and the distances between the vertexes of the first positioning holes 13 and the second plane 12 are equal.
The front case 04 is provided with a third plane 41, a fourth plane 42, a sensor mounting plane 43 and a first positioning post 44, the third plane 41 is provided with the first positioning post 44, when the lens flange 01 is assembled with the front case 04, the third plane 41 is in contact with the second plane 12, the first positioning post 44 is inserted into the first positioning hole 13, the sensor mounting plane 43 is processed to be parallel to the first plane 11 after the lens flange 01 and the front case 04 are assembled, and the sensor mounting plane 43 is used for mounting the image sensor assembly 05.
Specifically, three first positioning posts 44 are provided on the third plane 41 of the front housing 04 at positions corresponding to the first positioning holes 13, and the first positioning posts 44 are aligned and inserted into the first positioning holes 13 when the lens flange 01 is mounted, so as to prevent relative displacement between the lens flange 01 and the front housing 04.
Further, the camera further includes: a mounting mat; the mounting pad is disposed between the image sensor package 05 and the sensor mounting face 43.
Preferably, the mounting pad is a rubber pad.
Specifically, in order to guarantee that the image sensor can closely be attached to the sensor mounting surface 43, a rubber pad is arranged between the image sensor assembly 05 and the sensor mounting surface 43, on one hand, the image sensor can be guaranteed not to be damaged by extrusion in the assembling process, and on the other hand, fine adjustment of parallelism between the image sensor and the lens flange 01 can be achieved through compressibility of the rubber pad.
Further, a second plane 12 of the lens flange 01 is provided with a first assembly hole 14, and the first assembly hole 14 is a through hole; the third plane 41 of the front housing 04 is provided with a second fitting hole 45, the second fitting hole 45 is provided with an internal thread, and the second fitting hole 45 is provided corresponding to the first fitting hole 14.
Specifically, in the process of assembling the lens flange 01 and the front housing 04, as shown in fig. 3, first, the first positioning hole 13 and the first positioning post 44 are aligned, and after the second plane 12 of the lens flange 01 is attached to the third plane of the front housing, the fixing bolt is inserted through the first assembling hole 14, and is screwed into the second assembling hole 45 of the front housing 04 with a preset torque.
Further, the camera further includes: a color filter holder 02 and a color filter 03; the color filter bracket 02 is arranged inside the front shell 04, the color filter bracket 02 is contacted with the fourth plane 42 of the front shell 04, and the color filter bracket 02 is used for installing the color filter 03; the color filter 03 is used for the filtering process.
Specifically, the filter holder 02 is provided with a support ring and a fixing hole, and the filter 03 is mounted inside the support ring, mounted on the fourth plane 42 of the front housing 04, and then fixed to the front housing 04 through the fixing hole.
Further, the camera further includes: an image acquisition assistance device; at least one image acquisition auxiliary device is arranged between the front shell 04 and the lens flange 01, a first auxiliary surface of the image acquisition auxiliary device is provided with a second positioning column, when the second positioning column is inserted into the first positioning hole 13, the first auxiliary surface is contacted with the second plane 12, the second auxiliary surface of the image acquisition auxiliary device is provided with a second positioning hole, and when the first positioning column 44 is inserted into the second positioning hole, the second auxiliary surface is contacted with the third plane 41;
the sensor mount surface 43 is formed parallel to the first plane 11 after the lens flange 01, the image acquisition aid, and the front case 04 are mounted.
Example two:
an embodiment of the present application will be described below with reference to fig. 4.
In order to simplify the description of the second embodiment, taking the camera in the first embodiment as an example, the mounting method includes the following steps:
step 1, fixing a front shell 04 and a lens flange 01 on a processing platform 06 respectively, and processing parallelism of the front shell 04 and the lens flange 01;
the processing plane of the front shell 04 comprises a third plane 41 and a fourth plane 42, the processing plane of the lens flange 01 comprises a first plane 11 and a second plane 12, the sensor assembling surface 43 of the front shell 04 is not processed in a parallelism mode, and the flatness processing is carried out after the front shell 04 and the lens flange 01 are assembled.
Preferably, before step 1, the method further comprises: the front shell 04 and the lens flange 01 are shaped.
Specifically, in order to prevent the front housing 04 and the lens flange 01 from deforming due to stress during the parallelism processing, the front housing 04 and the lens flange 01 may be shaped before the parallelism processing, so as to improve the hardness of the front housing 04 and the lens flange 01 and reduce errors during the parallelism processing.
Step 2, assembling the processed front shell 04 and the processed lens flange 01 according to the first positioning hole 13 and the first positioning column 44, and recording the assembled body as an assembly body 30;
further, in step 2, the method specifically includes: the first positioning hole 13 of the lens flange 01 is aligned with the first positioning post 44 of the front housing 04 such that the second plane 12 of the lens flange 01 and the third plane 41 of the front housing 04 are brought into contact, and the fixing bolt is inserted through the first fitting hole 14 of the lens flange 01 to be screwed into the second fitting hole 45 of the front housing 04 with a predetermined moment.
Specifically, in the process of assembling the lens flange 01 and the front housing 04, first, the first positioning hole 13 and the first positioning post 44 are aligned, and after the second plane 12 of the lens flange 01 is attached to the third plane of the front housing, the fixing bolt is inserted through the first assembling hole 14 to be screwed into the second assembling hole 45 of the front housing 04 with a preset torque.
Preferably, when at least one image acquisition aid is provided in the camera, parallelism processing is performed on a first aid surface and a second aid surface of the image acquisition aid, the processed image acquisition aid is mounted between the lens flange 01 and the front case 04, and the fixing bolt is screwed into the second fitting hole 45 of the front case 04 with a preset torque.
Specifically, when the image acquisition auxiliary device is installed, assuming that there are two image acquisition auxiliary devices a and B, the first auxiliary surface and the second auxiliary surface of the image acquisition auxiliary device a and the image acquisition auxiliary device B are processed in parallel, the processed image acquisition auxiliary device a and the processed image acquisition auxiliary device B are assembled, that is, the second positioning hole on the second auxiliary surface of the image acquisition auxiliary device a is matched with the second positioning column on the first auxiliary surface of the image acquisition auxiliary device B, so that the second auxiliary surface of the image acquisition auxiliary device a is in contact with the first auxiliary surface of the image acquisition auxiliary device B, and then the assembled image acquisition auxiliary devices a and B are assembled with the lens flange 01 and the front shell 04, the second positioning hole on the first auxiliary surface of the image acquisition auxiliary device a is matched with the first positioning hole 13 of the lens flange 01, the second positioning hole on the second auxiliary surface of the image acquisition auxiliary device B is matched with the first positioning hole 44 of the front shell 04, and then the fixing bolt is screwed into the second assembling hole 45 of the front shell 04 with a preset torque, so that the assembly among the lens flange 01, the image acquisition auxiliary device a, the image acquisition auxiliary device B and the front shell 04 is completed, and the assembly body 30 is formed.
Step 3, fixing the assembly body 30 on the processing platform 06 by taking the first plane 11 of the lens flange 01 as a reference;
and 4, carrying out parallelism processing on the sensor assembling surface 43 of the front shell 04, wherein the processed sensor assembling surface 43 is parallel to the first plane 11 of the lens flange 01.
Specifically, as shown in fig. 4, after the assembly body 30 is fixed on the processing platform 06, the sensor mounting surface 43 is a to-be-processed plane, and since the first plane 11 of the lens flange 01 has already finished the flatness processing, the first plane 11 can be used as a reference plane, so that the parallelism error between the second plane 12 of the lens flange 01 and the third plane of the front shell 04 does not affect the processing of the sensor mounting surface 43, and the flatness error of the sensor mounting surface 43 is determined only by the processing equipment, the first plane 11 and the processing platform 06.
Further, the installation method further comprises the following steps:
step 5, disassembling the assembly body 30 after parallelism processing;
step 6, mounting the color filter bracket 02 and the color filter 03 on the fourth plane 42 of the front shell 04;
step 7, aligning the first positioning hole 13 with the first positioning column 44, and assembling the front shell 04 and the lens flange 01 through a preset torque and a fixing bolt;
step 8, the image sensor module 05 and the mounting pad are mounted to the sensor mounting face 43.
Through a large amount of test data, adopting the installation method of this application, the depth of parallelism error between image sensor subassembly 05 and first plane 11 can be controlled within 40um, and current installation method, the depth of parallelism error between image sensor subassembly 05 and first plane 11 is within 70 um.
Example three:
embodiments of the present application will be described below with reference to fig. 5 to 6.
The camera according to the present embodiment has the same components as those in the first embodiment, and the camera according to the present embodiment has the same mounting method as that in the second embodiment, and the present embodiment describes the image sensor assembly 05, and as shown in fig. 5, the image sensor assembly 05 according to the present embodiment includes: an image sensor circuit board 501, an image sensor slot 502, a heat dissipation plate 503, a thermal conductive silicone pad 504 and an image sensor 505.
Image sensor circuit board 501 can be a PCB board, and its periphery is provided with leaks copper region, and four angles are equipped with the metallization mounting hole respectively, can use it to fasten image sensor circuit board 501 to protecgulum 04 on, and the bolt that metallization mounting hole and use still can realize ground connection setting with it when conducting heat. Countersunk through holes may also be provided adjacent the metallized mounting holes for receiving and securing fasteners used to mount the heat sink 503 to the bezel 04. The image sensor slot 502 is welded on the image sensor circuit board 501, the image sensor slot 502 is provided with a jack matched with the image sensor 505, and pin pins of the image sensor 505 are inserted into the jack of the image sensor slot 502 to be connected with the jack, so that the image sensor can be conveniently and repeatedly disassembled, assembled and replaced through the plug-in connection.
As shown in fig. 6, fixing through holes C are provided at four corners of the heat dissipation plate 503, respectively, and the fixing through holes C are located opposite to the sink through holes on the image sensor circuit board 501, and fastening screws fix the heat dissipation plate 503 to the front cover 04 through the sink through holes and the fixing through holes C. The heat dissipation plate 503 has two rectangular through holes a in the middle, a cross beam is arranged between the two rectangular through holes a, and the heat conductive silicone pad 504 is adhered to a middle area B of the cross beam on the front end surface of the heat dissipation plate 503, sandwiched between the image sensor 505 and the heat dissipation plate 503, and is in contact with the image sensor 505. Grooves are formed in two sides of the upper beam of the rear end face of the heat dissipation plate 503, when the heat dissipation plate 503 is erected on the image sensor slot 502, the image sensor slot 502 is clamped in the grooves, the insertion holes in the image sensor slot 502 are located in the rectangular through hole A, and the end face of the insertion hole area of the image sensor slot 502 is basically in the same plane with the front end face of the heat dissipation plate 503. In the rectangular through hole a, the pin pins of the image sensor 505 are inserted into the insertion holes of the image sensor slot 502, so that they are connected. The structure and thickness of the heat dissipation plate 503 are not limited to those described in this embodiment, and may be adjusted according to the layout of components in the image sensor, so that other components may be disposed on the image sensor slot 502 besides the image sensor 505, and the problem of tight layout in the circuit is solved while heat dissipation is not affected, for example, the space where the middle beam of the heat dissipation plate 503 is located, and by reducing the thickness of the beam, components may be disposed on the image sensor circuit board 501, and through experiments, the surface area of the area occupying the whole image sensor circuit board 501 may reach 15.62%, so that the layout space is improved.
The upper end surface of the front cover 04 is recessed inwards, an upper plane, a middle plane and a bottom plane are sequentially formed from outside to inside, the mounted image sensor board 501 and the heat dissipation plate 503 are fixed on the front cover 04 together, the bottom plane is matched with the image sensor 505, the front end surface of the heat dissipation plate 503 is tightly attached to the middle plane of the front cover 04, and the copper leakage area of the image sensor board 501 is tightly attached to the upper plane of the front cover 04. Other structures of the front cover 04 can be designed adaptively according to the design requirements of the image sensor, and the heat dissipation structure of the chassis in the prior art can also be used for heat dissipation.
The image sensor 505 generates heat during normal operation, and the heat dissipation structure of this embodiment transfers the heat to the heat dissipation plate 503 and then to the front cover 04 through the heat conductive silicone pad 504; on the other hand, the image sensor board 501 is provided with two complete GND (ground or 0 line) layers, the GND pin of the image sensor 505 is connected to the GND layers, and heat of the image sensor 505 is transferred to the front cover 04 through the GND layers and the copper leakage region 105, and finally dissipated through the front cover 04.
Therefore, in the embodiment, the heat dissipation structure is realized through the PCB (image sensor circuit board 501), the heat dissipation plate 503 and the image sensor slot 502, and the heat dissipation purpose of the large-target-surface image sensor can be effectively realized because the heat dissipation structure is not affected by the size of the target surface. Experiments show that the contact area of the heat dissipation plate 503 and the front cover 04 can account for 34.23% of the surface area of the heat dissipation plate 503; the copper leaking region 105 around the front end surface 103 of the circuit board may occupy 15.21% of the surface area of the circuit board 501 of the image sensor, and in addition, the heat conductive silica gel pad 504 may occupy 23.91% of the surface area of the image sensor 505 and 20.77% of the surface area of the heat dissipation plate 503.
The technical scheme of the application is described in detail in the above with reference to the accompanying drawings, and the application provides a high-parallelism mounting method of a large target surface sensor and a camera, wherein the mounting method comprises the following steps: step 1, fixing a front shell and a lens flange on a processing platform respectively, and processing parallelism of the front shell and the lens flange, wherein the processing plane of the front shell comprises a third plane and a fourth plane, and the processing plane of the lens flange comprises a first plane and a second plane; step 2, assembling the processed front shell and the processed lens flange according to the first positioning hole and the first positioning column, and recording the assembled body as a mark; step 3, fixing the assembly body on the processing platform by taking the first plane of the lens flange as a reference; and 4, carrying out parallelism processing on the sensor assembling surface of the front shell, wherein the processed sensor assembling surface is parallel to the first plane of the lens flange. Through the technical scheme in this application, be favorable to reducing the accumulative total error of depth of parallelism between sensor assembly face and the camera lens, and then improved image sensor's imaging.
The steps in the present application may be sequentially adjusted, combined, and subtracted according to actual requirements.
The units in the device can be merged, divided and deleted according to actual requirements.
Although the present application has been disclosed in detail with reference to the accompanying drawings, it is to be understood that such description is merely illustrative and not restrictive of the application of the present application. The scope of the present application is defined by the appended claims and may include various modifications, adaptations, and equivalents of the invention without departing from the scope and spirit of the application.
Claims (9)
1. A camera, characterized in that the camera comprises: a front shell (04), an image sensor assembly (05), an image acquisition auxiliary device and a lens flange (01);
the lens flange (01) is provided with a first plane (11), a second plane (12) and a first positioning hole (13), the first plane (11) is arranged on the outer side of the lens flange (01), the second plane (12) is arranged on the inner side of the lens flange (01), and the first positioning hole (13) is arranged on the second plane (12);
the front shell (04) is provided with a third plane (41), a fourth plane (42), a sensor assembling surface (43) and a first positioning column (44), the third plane (41) is provided with the first positioning column (44), when the lens flange (01) is assembled with the front shell (04), the third plane (41) is contacted with the second plane (12), and the first positioning column (44) is inserted into the first positioning hole (13);
at least one image acquisition auxiliary device is arranged between the front shell (04) and the lens flange (01), a first auxiliary surface of the image acquisition auxiliary device is provided with a second positioning column, when the second positioning column is inserted into the first positioning hole (13), the first auxiliary surface is contacted with the second plane (12), the second auxiliary surface of the image acquisition auxiliary device is provided with a second positioning hole, when the first positioning column (44) is inserted into the second positioning hole, the second auxiliary surface is contacted with the third plane (41);
the sensor mounting face (43) is processed to be parallel to the first plane (11) after the lens flange (01), the image acquisition auxiliary device and the front case (04) are mounted, and the sensor mounting face (43) is used for mounting the image sensor assembly (05).
2. The camera of claim 1, further comprising: a mounting mat;
the mounting pad is disposed between the image sensor assembly (05) and the sensor mounting face (43).
3. The camera of claim 2,
the mounting pad is a rubber pad.
4. The camera of claim 1,
the second plane (12) of the lens flange (01) is provided with a first assembling hole (14), and the first assembling hole (14) is a through hole;
preceding shell (04) third plane (41) are provided with second pilot hole (45), second pilot hole (45) are provided with the internal thread, second pilot hole (45) with first pilot hole (14) correspond the setting.
5. A high parallelism mounting method for a large target surface sensor, suitable for mounting a camera according to any one of claims 1 to 4, comprising:
step 1, fixing the front shell (04) and the lens flange (01) on a processing platform (06) respectively, and processing parallelism of the front shell (04) and the lens flange (01);
step 2, assembling the processed front shell (04) and the processed lens flange (01) according to the first positioning hole (13) and the first positioning column (44) and recording the assembled body (30);
step 3, fixing the assembly body (30) on the processing platform (06) by taking the first plane (11) of the lens flange (01) as a reference;
and 4, carrying out parallelism processing on the sensor assembling surface (43) of the front shell (04), wherein the processed sensor assembling surface (43) is parallel to the first plane (11) of the lens flange (01).
6. The method for mounting a large target surface sensor in high parallelism according to claim 5, characterized in that, before step 1, it further comprises:
and carrying out shaping treatment on the front shell (04) and the lens flange (01).
7. The method for mounting a large target surface sensor in high parallelism according to claim 5, characterized in that in step 2, it comprises:
aligning the first positioning hole (13) of the lens flange (01) with the first positioning post (44) of the front case (04), contacting the second plane (12) of the lens flange (01) with the third plane (41) of the front case (04), passing a fixing bolt through the first assembly hole (14) of the lens flange (01), and screwing the fixing bolt into the second assembly hole (45) of the front case (04) with a preset torque.
8. The method for mounting a large target surface sensor in high parallelism according to claim 7, characterized in that in step 2, it further comprises:
when at least one image acquisition auxiliary device is arranged, a first auxiliary surface and a second auxiliary surface of the image acquisition auxiliary device are processed in a parallel mode, the processed image acquisition auxiliary device is installed between the lens flange (01) and the front shell (04), and then the fixing bolt is screwed into the second assembling hole (45) of the front shell (04) through the preset moment.
9. The method of claim 5 for high parallelism in mounting a large target surface sensor, further comprising:
step 5, disassembling the assembly body (30) after parallelism processing;
step 6, installing a color filter bracket (02) and a color filter (03) on the fourth plane (42) of the front shell (04);
step 7, assembling the front shell (04) and the lens flange (01);
and 8, assembling the image sensor assembly (05) and the mounting pad on the sensor assembling surface (43).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811091869.6A CN109167897B (en) | 2018-09-19 | 2018-09-19 | High-parallelism mounting method of large-target-surface sensor and camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811091869.6A CN109167897B (en) | 2018-09-19 | 2018-09-19 | High-parallelism mounting method of large-target-surface sensor and camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109167897A CN109167897A (en) | 2019-01-08 |
| CN109167897B true CN109167897B (en) | 2020-08-21 |
Family
ID=64879847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811091869.6A Active CN109167897B (en) | 2018-09-19 | 2018-09-19 | High-parallelism mounting method of large-target-surface sensor and camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109167897B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020144255A (en) | 2019-03-07 | 2020-09-10 | キヤノン株式会社 | Camera mount, imaging apparatus, and manufacturing method of camera mount |
| CN111770256A (en) * | 2020-07-20 | 2020-10-13 | 福州鑫图光电有限公司 | Parallelism adjusting structure for scientific grade CMOS camera |
| CN115023085B (en) * | 2022-07-22 | 2024-03-15 | 中国大恒(集团)有限公司北京图像视觉技术分公司 | Condensation preventing structure for high-resolution camera |
| CN115415833B (en) * | 2022-09-02 | 2023-06-20 | 深圳市中图仪器股份有限公司 | Processing method and system of lens multiplying power converter |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7974023B1 (en) * | 2010-03-11 | 2011-07-05 | Himax Semiconductor, Inc. | Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof |
| CN102419471A (en) * | 2010-09-27 | 2012-04-18 | 南京芒冠光电科技股份有限公司 | Short-focus lens |
| CN202975575U (en) * | 2012-11-06 | 2013-06-05 | 福建网讯科技有限公司 | Projector capable of changing lens |
| CN105223672A (en) * | 2015-10-16 | 2016-01-06 | 烟台艾睿光电科技有限公司 | A kind of flange arrangement being applicable to infrared thermal imaging module |
-
2018
- 2018-09-19 CN CN201811091869.6A patent/CN109167897B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7974023B1 (en) * | 2010-03-11 | 2011-07-05 | Himax Semiconductor, Inc. | Wafer level optical lens substrate, wafer level optical lens module and fabrication method thereof |
| CN102419471A (en) * | 2010-09-27 | 2012-04-18 | 南京芒冠光电科技股份有限公司 | Short-focus lens |
| CN202975575U (en) * | 2012-11-06 | 2013-06-05 | 福建网讯科技有限公司 | Projector capable of changing lens |
| CN105223672A (en) * | 2015-10-16 | 2016-01-06 | 烟台艾睿光电科技有限公司 | A kind of flange arrangement being applicable to infrared thermal imaging module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109167897A (en) | 2019-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109167897B (en) | High-parallelism mounting method of large-target-surface sensor and camera | |
| US11493605B2 (en) | Depth information camera module and base assembly, projection assembly, electronic device and manufacturing method thereof | |
| US6359652B1 (en) | Mounting structure for the photographic element of a camera | |
| JP4405062B2 (en) | Solid-state imaging device | |
| TWI558200B (en) | Image capturing module and image capturing device | |
| CN100409668C (en) | Image pickup unit and image pickup apparatus | |
| EP2866535A1 (en) | Substrate, imaging unit, and imaging device | |
| US6430052B1 (en) | Techniques for cooling a circuit board component | |
| US20100027215A1 (en) | Fan module | |
| EP3816723B1 (en) | Motor vehicle camera assembly | |
| JP2002261476A (en) | Structure and method for grounding cooling module and electronic apparatus having that structure | |
| KR101859423B1 (en) | Aligning unit for dual camera module and aligning method using the same | |
| US9274304B2 (en) | Camera lens assembly | |
| US20120218449A1 (en) | Autofocus camera module packaging with circuitry-integrated actuator system | |
| CN102879979B (en) | A kind of video camera | |
| CN210327748U (en) | Cloud platform camera and cloud platform camera thereof | |
| KR20170082931A (en) | Printed circuit board and camera module having the same | |
| JP3773732B2 (en) | Liquid crystal display device and electric / electronic device using the same | |
| CN113873121A (en) | Camera module, assembling method thereof and electronic equipment | |
| CN210143052U (en) | Structure for enhancing falling performance of binocular stereoscopic vision device | |
| US6178095B1 (en) | Structure for fixing an element to a printed wiring board, and electronic equipment having the structure | |
| US11054729B2 (en) | Projector and laser module thereof | |
| CN219999486U (en) | Optical device | |
| CN214540188U (en) | Lens module and electronic equipment | |
| KR101750751B1 (en) | Structure of dual camera |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |