CN109166902A - Organic light emitting display - Google Patents
Organic light emitting display Download PDFInfo
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- CN109166902A CN109166902A CN201811033071.6A CN201811033071A CN109166902A CN 109166902 A CN109166902 A CN 109166902A CN 201811033071 A CN201811033071 A CN 201811033071A CN 109166902 A CN109166902 A CN 109166902A
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- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 72
- 239000011147 inorganic material Substances 0.000 claims abstract description 72
- 238000002161 passivation Methods 0.000 claims abstract description 67
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims description 568
- 239000010409 thin film Substances 0.000 claims description 104
- 239000010408 film Substances 0.000 claims description 58
- 238000012856 packing Methods 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 16
- 238000010586 diagram Methods 0.000 claims description 15
- 239000011229 interlayer Substances 0.000 claims description 11
- 230000003760 hair shine Effects 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 description 21
- -1 PI) Polymers 0.000 description 11
- 239000011368 organic material Substances 0.000 description 10
- 230000012447 hatching Effects 0.000 description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 description 8
- 239000004793 Polystyrene Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 4
- 238000009429 electrical wiring Methods 0.000 description 4
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- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 229920002396 Polyurea Polymers 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 229920005989 resin Polymers 0.000 description 2
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- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JHVMCBIVPBFKKS-UHFFFAOYSA-N trimethyl(trimethylsilyloxy)silane Chemical compound C[Si](C)(C)O[Si](C)(C)C.C[Si](C)(C)O[Si](C)(C)C JHVMCBIVPBFKKS-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/822—Cathodes characterised by their shape
Abstract
An organic light emitting display comprises a substrate, an active element array layer, an organic passivation layer, a pixel defining layer, a first electrode layer, a light emitting pattern layer and a second electrode layer. The active element array layer is arranged on the substrate and comprises a plurality of inorganic material layers. The organic passivation layer is positioned on the active component array layer. The first electrode layer is located on the organic passivation layer and penetrates through the organic passivation layer to be connected to the active element array layer. The pixel definition layer is located on the first electrode layer and has at least one sub-pixel opening. The light-emitting pattern layer is positioned in the sub-pixel opening and contacts the first electrode layer. The second electrode layer is made of inorganic material and covers the light-emitting pattern layer and the pixel defining layer, wherein the second electrode layer penetrates through the pixel defining layer to contact the first electrode layer, and extends downwards along the outer edge of the pixel defining layer and penetrates through the organic passivation layer to contact at least one of the plurality of inorganic material layers of the active element array layer. The invention can reduce the probability of water vapor or oxygen invading the element.
Description
Technical field
A kind of structure of the present invention about display, especially a kind of organic light emitting display.
Background technique
Organic light emitting display be laminated by multiple organic films, and by apply voltages to electrode (cathode and
Anode) so that electrons and holes are in organic light emitting material by the potential difference driving between cathode and anode and in combining, into
And it shines.The electrode of current organic light emitting display mostly uses metal material or metal oxide materials to make, institute
It is different with the material of organic thin film layer with the material of electrode, therefore the interfacial instability between electrode and organic thin film layer, it is easy
The situation peeled or exfoliate is generated, the case where electrode is separated with organic thin film layer is in turn resulted in.
With the increase for using the time, aqueous vapor or oxygen be easy by interface between electrode and organic thin film layer removing it
Inside place's intrusion to organic light emitting display, so that internal organic thin film layer generates cracking, anodizing, generates dim spot (dark
Spot) the defects of, causes undesirable influence to video display.
Summary of the invention
The main purpose of the present invention is to provide a kind of organic light emitting display, with overcome in the prior art electrode with it is organic
The segregative defect of film layer.
In one embodiment, a kind of organic light emitting display, the organic light emitting display include:
One substrate；
One active cell array layer, is set on the substrate, and wherein the active cell array layer includes multiple inorganic material
Layer；
One organic passivation layer is located on the active cell array layer；
One first electrode layer is located on the organic passivation layer, which is connected to through the organic passivation layer
The active cell array layer；
One pixel defining layer is located in the first electrode layer, and wherein the pixel defining layer is open with an at least sub-pixel；
One illuminated diagram pattern layer at least sub-pixel opening and contacts the first electrode layer；And
One the second electrode lay is inorganic material, which covers the illuminated diagram pattern layer and the pixel defining layer,
In the second electrode lay through the pixel defining layer to contact the first electrode layer, and the second electrode lay is fixed along the pixel
One lateral border of adopted layer extends downwardly and runs through the organic passivation layer to contact multiple inorganic material of the active cell array layer
At least one of bed of material.
In one embodiment, which further includes an at least active member, and multiple inorganic material layer
One of be covered on an at least active member, be spaced between an at least active member and the substrate, be spaced in
This at least between the multiple electrodes of an active member or be spaced in an at least active member an electrode and a channel layer it
Between.
In one embodiment, a thin-film packing structure is further included, which is located on the second electrode lay, should
Thin-film packing structure completely covers the second electrode lay.
In one embodiment, one first organic backstop layer is further included, which is located at the organic passivation layer
Above and the pixel defining layer being surrounded, first organic backstop layer and the lateral border of the pixel defining layer are separated by one first gap,
And the width in first gap is greater than or equal to the second electrode lay beyond the maximum width on the lateral border of the pixel defining layer
Degree.
In one embodiment, which further includes an organic film encapsulated layer, the encapsulation of one first inorganic thin film
Layer and one second inorganic thin film encapsulated layer, wherein the first inorganic thin film encapsulated layer is located at the second electrode lay and the organic film
Between encapsulated layer, which covers the organic film encapsulated layer, which is located in this
Between first inorganic thin film encapsulated layer and the second inorganic thin film encapsulated layer, the organic film encapsulated layer is by first organic backstop
Layer limit and do not cross first organic backstop layer back in one first lateral surface in first gap, and first inorganic thin film
Encapsulated layer and the second inorganic thin film encapsulated layer all exceed the edge of the organic film encapsulated layer and cover first organic backstop
One first top surface of layer and first lateral surface.
In one embodiment, the first inorganic thin film encapsulated layer along first organic backstop layer this first outside towards
Under extend through the organic passivation layer to contact the active cell array layer at least one of multiple inorganic material layer.
In one embodiment, one second organic backstop layer is further included, which is located at the organic passivation layer
Above and first organic backstop layer is surrounded, and second organic backstop layer and first organic backstop layer are back in first gap
One first lateral surface be separated by one second gap.
In one embodiment, which further includes an organic film encapsulated layer, the encapsulation of one first inorganic thin film
Layer and one second inorganic thin film encapsulated layer, wherein the first inorganic thin film encapsulated layer is located at the second electrode lay and the organic film
Between encapsulated layer, which covers the organic film encapsulated layer, which is located in this
Between first inorganic thin film encapsulated layer and the second inorganic thin film encapsulated layer, the organic film encapsulated layer cross this first it is organic only
Barrier and limited by the second organic backstop layer, the organic film encapsulated layer do not cross second organic backstop layer back in this
One second lateral surface in two gaps, and with the second inorganic thin film encapsulated layer all to exceed this organic for the first inorganic thin film encapsulated layer
The edge of thin-film encapsulation layer and one second top surface and second lateral surface for covering second organic backstop layer.
In one embodiment, the first inorganic thin film encapsulated layer along second organic backstop layer this second outside towards
Under extend through the organic passivation layer to contact the active cell array layer at least one of multiple inorganic material layer.
In one embodiment, one first organic backstop layer is further included, which is located at the organic passivation layer
Above and surround the second electrode lay.
In one embodiment, first organic backstop layer and the lateral border of the pixel defining layer are separated by one first gap,
The second electrode lay is not in contact with first organic backstop level for one first medial surface in first gap.
In one embodiment, which extends downwardly along the lateral border of the pixel defining layer and has through this
Machine passivation layer and through multiple inorganic material layer at least one, with contact by a perforative at least inorganic material layer
Lower section the inorganic material layer.
In one embodiment, multiple inorganic material layer is exhausted selected from passivation layer, boundary layer, interlayer dielectric layer, gate
In group composed by edge layer and buffer layer at least within two.
In one embodiment, which is flexible base plate.
In one embodiment, which completely covers the illuminated diagram pattern layer and the pixel defining layer.
In conclusion organic light emitting display according to an embodiment of the invention, the second electrode lay and active member battle array
At least inorganic material layer of column layer contacts, with by between the second electrode lay and the inorganic material layer of active cell array layer compared with
Strong bond power improves the second electrode lay and generates the situation peeled or exfoliate, and then reduces inside aqueous vapor or oxygen intrusion element
Probability.
Detailed description of the invention
Fig. 1 is the schematic top plan view of the organic light emitting display of one embodiment of the invention.
Fig. 2 is the schematic cross-section of the organic light emitting display of a demonstration example of the A-A hatching line corresponding to Fig. 1.
Fig. 3 is the schematic cross-section of the organic light emitting display of another demonstration example of the A-A hatching line corresponding to Fig. 1.
Fig. 4 is the schematic top plan view of the organic light emitting display of another embodiment of the present invention.
Fig. 5 is the schematic cross-section of the organic light emitting display of a demonstration example of the B-B hatching line corresponding to Fig. 4.
Fig. 6 is the schematic top plan view of the organic light emitting display of further embodiment of this invention.
Fig. 7 is the schematic cross-section of the organic light emitting display of a demonstration example of the C-C hatching line corresponding to Fig. 6.
Fig. 8 is the schematic top plan view of the organic light emitting display of further embodiment of this invention.
Fig. 9 is the schematic cross-section of the organic light emitting display of a demonstration example of the D-D hatching line corresponding to Fig. 8.
Wherein, appended drawing reference:
100 organic light emitting display, 110 active cell array layer
112 active member, 1121 channel layer
1122 gate electrode, 1123 source electrode
1124 drain electrodes, 114 inorganic material layer
1141 passivation layer, 1142 boundary layer
1143 interlayer dielectric layer, 1144 gate insulation layer
1145 buffer layer, 120 organic passivation layer
121 maximum width of the side 120s
130 picture element definition layer 130s lateral borders
132 140 first electrode layers of sub- picture elements opening
The electrical wiring of 142 electrode 144
150 illuminated diagram pattern layer, 160 the second electrode lay
170 thin-film packing structure, 172 organic film encapsulated layer
174 first inorganic thin film encapsulated layer, 176 second inorganic thin film encapsulated layer
The 180 first organic backstop layers of organic backstop layer 190 second
182 first medial surface, 184 first lateral surface
186 first top surface, 192 second medial surface
194 second lateral surface, 196 second top surface
The first gap D1 upright projection direction P1
The second gap P2 S1 substrate
V1 the first contact hole the second contact hole of V2
V3 third contact hole W1 first runs through slot
W2 second runs through slot through slot W3 third
Specific embodiment
Fig. 1 is the schematic top plan view of the organic light emitting display of one embodiment of the invention.Fig. 2 cuts open for the A-A corresponding to Fig. 1
The schematic cross-section of the organic light emitting display of one demonstration example of line.Fig. 1 and Fig. 2 is please referred to, organic light emitting display 100 includes
Substrate S1, active cell array layer 110, organic passivation layer 120, pixel defining layer 130, first electrode layer 140, illuminated diagram pattern layer
150 and the second electrode lay 160.Active cell array layer 110 is set on substrate S1.Organic passivation layer 120 is located at active element
On part array layer 110.First electrode layer 140 is located on organic passivation layer 120 and first electrode layer 140 is through organic passivation layer
120 and be connected to active cell array layer 110.Pixel defining layer 130 is located in first electrode layer 140 and pixel defining layer 130
With at least sub-pixel opening 132.Illuminated diagram pattern layer 150 is located in the sub-pixel opening 132 of pixel defining layer 130, and
Pass through 132 contact first electrode layer 140 of sub-pixel opening.The second electrode lay 160 is located at pixel defining layer 130 and illuminated diagram pattern layer
On 150.It should be noted that being shown for the ease of clear explanation in the pixel defining layer 130 of Fig. 1 with shading, so this does not represent picture
Plain definition layer 130 is the material of top layer.
Active cell array layer 110 includes multiple inorganic material layers 114, and the second electrode lay 160 is inorganic material (example
Such as it is but not limited to metal material).The second electrode lay 160 runs through pixel defining layer 130 to contact first electrode layer 140, and
It is extended downwardly along the lateral border 130s of pixel defining layer 130 and runs through organic passivation layer 120 to contact active cell array layer
One of 110 this multiple inorganic material layer 114.In this, possess between the second electrode lay 160 and inorganic material layer 114
Stronger bond power can make to be not easily stripped between the second electrode lay 160 and inorganic material layer 114, achieve the effect that interface is stable.
In an embodiment, the second electrode lay 160 can completely cover illuminated diagram pattern layer 150 and pixel defining layer 130, be more conducive to improve
The second electrode lay 160 it is easily peelable or peel off situation.
In an embodiment, the lateral border 130s of pixel defining layer 130 can be at least one side of pixel defining layer 130
Or whole sides.That is, the second electrode lay 160 can only cover one of side (figure is not painted) or complete covering
Each side (showing as depicted in FIG. 1) of pixel defining layer 130.In addition, when the second electrode lay 160 is in covering pixel defining layer 130
Each side when, the removing situation between the second electrode lay 160 and pixel defining layer 130 can be reduced.
In an embodiment, the second electrode lay 160 can be by opening through organic passivation layer 120 in organic passivation layer 120
If first realizes through slot W1, as illustrated in Figure 2.At this point, the second electrode lay 160 is more organic in slot W1 along first
The side 120s of passivation layer 120 extends downwardly and contacts the inorganic material layer 114 of active cell array layer 110.In this embodiment
In, as illustrated in Figure 2, the second electrode lay 160 can contact the inorganic material layer 114 of the top layer of active cell array layer 110.In
In one embodiment, show as depicted in FIG. 1, first can be in the form of annular groove and realize through slot W1.
Fig. 3 is the schematic cross-section of the organic light emitting display of another demonstration example of the A-A hatching line corresponding to Fig. 1.In another
In one embodiment, Fig. 1 and Fig. 3 is please referred to, the second electrode lay 160 extends downwardly along the lateral border 130s of pixel defining layer 130,
And run through an at least film layer (e.g., the passivation layer 1141, boundary layer of organic passivation layer 120 and active cell array layer 110
1142, at least one of the film layers such as interlayer dielectric layer 1143, gate insulating layer 1144), and then contact active cell array
The inorganic material layer 114 of 110 internal layer of layer.
In an embodiment, the second electrode lay 160 can be only through organic passivation layer 120 to contact active cell array layer
The inorganic material layer 114 of 110 top layer.In this, the second electrode lay 160 can be by running through the first of organic passivation layer 120
The inorganic material layer 114 of the top layer of active cell array layer 110 is contacted through slot W1, as shown in Figure 2.
Referring to FIG. 3, the second electrode lay 160 can also run through organic passivation layer 120 and run through in another embodiment
This multiple inorganic material layer 114 at least one, with contact be located at by the perforative at least lower section of an inorganic material layer 114
Inorganic material layer 114.In this, the second electrode lay 160 can be by running through slot W1 through the first of organic passivation layer 120 and passing through
It contacts and is located at by perforative inorganic material layer through slot W2 through this multiple inorganic material layer 114 at least one of second
The inorganic material layer 114 of 114 lower section.In other words, second it can be the inorganic material through one layer or multilayer through slot W2
Layer 114.That is, the second electrode lay 160 visual second through slot W2 depth and with inside active cell array layer 110
Any inorganic material layer 114 contacts.In an embodiment, second can be in the form of annular groove and realize through slot W2.
In this, can by organic passivation layer 120 open up first through slot W1 (as illustrated in Figure 2) either can be more
Further second is opened up through slot W2 in active cell array layer 110 to realize and (show as depicted in fig. 3), to make the second electrode lay
160 either further run through an at least film layer for active cell array layer 110 through organic passivation layer 120.
In one embodiment, on the upright projection direction D1 of substrate S1, what organic passivation layer 120 was opened up first runs through
The second upright projection range for running through slot W2 that the upright projection range and inorganic material layer 114 of slot W1 is opened up at least locally weighs
It is folded.In this, first through slot W1 and second through slot W2 be interconnected and can by least one or repeatedly exposure hole technique come
It realizes.In this, the first width for running through slot W1 that organic passivation layer 120 is opened up can for example be opened with inorganic material layer 114
If second through slot W2 width it is substantially the same.
In an embodiment, substrate S1 is, for example, flexible base plate, but not limited to this, also can for silicon substrate, glass substrate,
Or quartz base plate.In an embodiment, the material of pixel defining layer 130 can be photosensitive organic material, such as be but not limited to
Polyimides (Polyimide, PI), polystyrene (Polystyrene, PS), polytetrafluoroethylene (PTFE)
(Polytetrafluoroethylene, PTFE), phenolic resin (phenol-formaldehyde resin), epoxy resin
(epoxy resin), acryl resin (acrylic resin) etc..In an embodiment, the material of first electrode layer 140 and
The material of the second electrode lay 160 can be transparent conductive material or metal material etc..Wherein, transparent conductive material can be for example but
It is not limited to indium tin oxide (Indium-Tin Oxide, ITO), indium-zinc oxide (Indium-Zinc Oxide, IZO) or aluminium
Zinc oxide (aluminum doped zinc oxide, AZO) or combinations thereof.Metal material can be for example but be not limited to aluminium,
Aluminium, silver, almag, magnesium silver alloy or combinations thereof.In an embodiment, illuminated diagram pattern layer 150 may include different organic
Luminescent material, such as it is but not limited to red luminous organic material, blue organic luminous material or green luminous organic material
Deng.
Fig. 2 and Fig. 3 are please referred to, in some embodiments, active cell array layer 110 can further include an at least active member
112.Active member 112 is between first electrode layer 140 and substrate S1.At least an active member 112 corresponds respectively at least
One sub-pixel opening 132.Each active member 112 may include channel layer 1121, gate electrode 1122, source electrode 1123 and leakage
Pole electrode 1124.The drain electrode 1124 of each active member 112 is electrically connected to first electrode layer 140, to apply driving voltage
To the illuminated diagram pattern layer 150 being located in corresponding sub-pixel opening 132.
In one embodiment, inorganic material layer 114 can be the flatness layer being covered on an at least active member 112, so that
Film surface planarization.Flatness layer can be such as but not limited to passivation layer 1141 (Passivation layer, PL) or interface
1142 (Interfacial layer, IL) of layer etc..In another embodiment, inorganic material layer 114 can be to be spaced in active member
Buffer layer 1145 (Buffer layer) between 112 and substrate S1.In another embodiment, between inorganic material layer 114 can be
Be interposed between the gate electrode 1122 of active member 112 and its source electrode 1123 and active member 112 gate electrode
Interlayer dielectric layer 1143 between 1122 and its drain electrode 1124.In still another embodiment, inorganic material layer 114 can be interval
(the Gate insulator of gate insulating layer 1144 between the gate electrode 1122 and its channel layer 1121 of active member 112
Layer, GI).
In other words, this multiple inorganic material layer 114 may be, for example, passivation layer 1141, interface layer 1142, interlayer dielectric layer
1143, gate insulating layer 1144 or at least the two therein of buffer layer 1145.
In an embodiment, the type of active member 112 can be selected according to design or engineering demand is electrically connected, such as
It is but not limited to top grid film transistor (as illustrated in Figure 2) or bottom gate polar form thin film transistor (TFT) (figure is not painted) etc..
Fig. 2 and Fig. 3 are please referred to, in an embodiment, first electrode layer 140 includes an at least electrode 142.An at least electrode
142 correspond respectively at least sub-pixel opening 132, and the coupling of each electrode 142 is located in corresponding sub-pixel opening 132
Illuminated diagram pattern layer 150.An at least electrode 142 also corresponds respectively to an at least active member 112.Each electrode 142 connects via first
Contact hole V1 is through film layer (e.g., organic passivation layer 120, passivation layer 1141 or the interface layer between corresponding active member 112
1142 etc.), to be electrically connected the drain electrode 1124 of active member 112.In other words, illuminated diagram pattern layer 150 may include at least one
Organic illuminating element, and an at least organic illuminating element respectively corresponds an at least active member 112.Each active member 112 passes through
Corresponding organic illuminating element is electrically connected to by corresponding electrode 142, to apply driving voltage to corresponding organic light emission member
Part causes the electrons and holes in organic illuminating element can be by the current potential between corresponding electrode 142 and the second electrode lay 160
Difference drives and combines in illuminated diagram pattern layer 150, and then shines.In an embodiment, the electrode 142 of first electrode layer 140 can
For anode, and the second electrode lay 160 can be cathode.
In an embodiment, first electrode layer 140 can further include an electrical wiring 144.Electrical wiring 144 can be via
Two contact hole V2 come run through between wiring layer (not shown) film layer (such as be but not limited to organic passivation layer 120, passivation
Layer 1141 etc.), with the wiring layer being electrically connected in active cell array layer 110.
In an embodiment, pixel defining layer 130 can have more third contact hole V3.The second electrode lay 160 is via third
Contact hole V3 runs through pixel defining layer 130, and is electrically connected to the electrical wiring 144 of first electrode layer 140.
In an embodiment, organic light emitting display 100 can further include 170 (Thin Film of a thin-film packing structure
Encapsulation, TFE).Thin-film packing structure 170 is located on the second electrode lay 160, and thin-film packing structure 170 can completely cover
Lid the second electrode lay 160.As illustrated in Figure 2, thin-film packing structure 170 runs through organic passivation layer 120 through slot W1 by first
And it is for example contacted with an at least inorganic material layer 114 for active cell array layer 110.In this, thin-film packing structure 170 can be single
One film layer or multilayer.
In an embodiment, thin-film packing structure 170 is single film layer, as depicted in Fig. 2 and Fig. 3.Thin-film packing structure
170 are covered on the second electrode lay 160 and the upper surface of the active cell array layer 110 of covering part.In this, thin-film package knot
Structure 170 can by first through slot W1 through organic passivation layer 120 contact active cell array layer 110 upper surface (such as
The surface of the inorganic material layer 114 of top layer).But, in other embodiments (figure is not painted), thin-film packing structure 170
Can by first through slot W1 arrange in pairs or groups other through active cell array layer 110 partial interior film layer second through slot W2
And further contact the other inorganic material layers 114 of active cell array layer 110.
In another embodiment, thin-film packing structure 170 be multiple film layers and may include organic film encapsulated layer 172,
First inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176, and organic film encapsulated layer 172 is located in the first nothing
Between machine thin-film encapsulation layer 174 and the second inorganic thin film encapsulated layer 176.Fig. 4 and Fig. 5 is please referred to, Fig. 4 is another implementation of the present invention
The schematic top plan view of the organic light emitting display of example.Fig. 5 is that the organic light emission of a demonstration example of the B-B hatching line corresponding to Fig. 4 is aobvious
Show the schematic cross-section of device.First inorganic thin film encapsulated layer 174 covers the second electrode lay 160 and is located at 160 He of the second electrode lay
Between organic film encapsulated layer 172.Second inorganic thin film encapsulated layer 176 covers organic thin-film encapsulation layer 172.It should be noted that
It for the ease of clear explanation, is shown in the pixel defining layer 130 of Fig. 4 and first organic backstop layer 180 with shading, so this is not represented
Pixel defining layer 130 and first organic backstop layer 180 are the material of top layer.
In an embodiment, the material of organic film encapsulated layer 172 is organic material, such as is but not limited to poly- to diformazan
Benzene (parylene) or polyureas (polyurea) or hexamethyldisiloxane (Hexamethyldisiloxane) or other be suitble to
Organic packages packing material.In an embodiment, the first inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176
Material be inorganic material, such as, but not limited to metal oxide, silica, silicon nitride etc..
In an embodiment, organic light emitting display 100 can further include a first organic backstop layer 180.It please refers to
Fig. 4, Fig. 5, Fig. 6 and Fig. 7, Fig. 6 are the schematic top plan view of the organic light emitting display of further embodiment of this invention.Fig. 7 is to correspond to
In the schematic cross-section of the organic light emitting display of a demonstration example of the C-C hatching line of Fig. 6.First organic backstop layer 180, which is located at, to be had
On machine passivation layer 120 and pixel defining layer 130 is surrounded, one the is separated by between first organic backstop layer 180 and pixel defining layer 130
One gap P1, in more detail, first organic backstop layer 180 and the lateral border 130S of pixel defining layer 130 are separated by the first gap
P1.Wherein, lateral border of the first gap P1 between the first medial surface 182 and pixel defining layer 130 of first organic backstop layer 180
Between 130s.As depicted in Fig. 4 and Fig. 6, first organic backstop layer 180 for example can be complete around pixel defining layer 130
Portion.The second electrode lay 160 is extended downwardly along the lateral border 130s of the pixel defining layer 130 in the first gap P1, Jin Erjing
Passing through organic passivation layer 120 through slot W1 by first (also can pass through active cell array layer 110 through slot W2 in collocation second
An at least film layer) and contact the inorganic material layer 114 of active cell array layer 110.It should be noted that for the ease of clear theory
It is bright, it is shown in the pixel defining layer 130 of Fig. 6 and first organic backstop layer 180 with shading, so this does not represent pixel defining layer 130
And first organic backstop layer 180 be top layer material.
In one embodiment, as depicted in Fig. 5 and Fig. 7, on the upright projection direction D1 of substrate S1, the first gap P1's
Upright projection range, organic passivation layer 120 opened up first run through slot W1 114 institute of upright projection range and inorganic material layer
Second opened up is least partially overlapped through the upright projection range of slot W2.In this, the first gap P1, first are through slot W1 and the
Two can be by least one through slot W2 or repeatedly exposing hole technique realizes.In this, the width of the first gap P1 can with have
Machine passivation layer 120 opened up first through slot W1 width, inorganic material layer 114 opened up second run through slot W2 width
It is substantially the same.In an embodiment, as depicted in Fig. 4 and Fig. 6, the first gap P1, first run through slot W2 through slot W1, second
It can be in the form of annular groove and realize.
In an embodiment, the second electrode lay 160 can be located within the first gap P1 and not in contact with first organic backstop layer
180 face the first medial surface 182 of the first gap P1, and therefore, the end that can avoid the second electrode lay 160 touches organic material
Expect and causes the problem of being easily peeled off or peeling off.That is, first organic backstop layer 180 can around the second electrode lay 160 and
It is not contacted with the second electrode lay 160.In an embodiment, referring to Fig. 5, the width of the first gap P1 is greater than or equal to the second electricity
Pole layer 160 beyond pixel defining layer 130 lateral border 130s on maximum width 121, to avoid the second electrode lay 160 seek connections in
First medial surface 182 of first organic backstop layer 180.In this, avoid the second electrode lay 160 and first organic backstop layer 180 it
Between contact, the removing situation of the second electrode lay 160 can be made to reduce.
In an embodiment, Fig. 6 and Fig. 7 is please referred to, thin-film packing structure 170 is located on the second electrode lay 160.Film envelope
What assembling structure 170 can be opened up by organic passivation layer 120 first is opened up through slot W1 and this multiple inorganic material layer 114
At least one second runs through slot W2.First organic backstop layer 180 can be used to prevent 170 overflow of thin-film packing structure, seal in this film
Assembling structure 170 does not cross first organic backstop layer 180 back in the first lateral surface 184 of the first gap P1.
In another embodiment, show as shown graphically in fig 5, when thin-film packing structure 170 is multiple film layers and may include organic
When thin-film encapsulation layer 172, the first inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176, organic film encapsulated layer
172, which extend only to the first gap P1, first, does not cross within the slot W2 and first organic backstop layer 180 through slot W1 and second
Back in the first lateral surface 184 of the first gap P1, that is to say, that organic film encapsulated layer 172 is by first organic backstop layer 180
It limits and does not cross first organic backstop layer 180 back in the first lateral surface 184 of the first gap P1.The encapsulation of first inorganic thin film
Layer 174, which covers the lateral border 130s of pixel defining layers 130 and extends to the first gap P1, first, to be run through through slot W1 and second
Slot W2, and extend to first organic backstop layer 180 the first medial surface 182, the first top surface 186 and the first lateral surface 184 and can
Third is extended to through slot W3 with contact an at least inorganic material layer 114 (in this first inorganic thin film encapsulated layer 174 for example through
Organic passivation layer 120 and passivation layer 1141, interface layer 1142 and interlayer dielectric layer 1143 are contacted through slot W3 via third).
Second inorganic thin film encapsulated layer 176 covers the outer surface of organic thin-film encapsulation layer 172 and extends to first organic backstop layer 180
The first top surface 186 and the first lateral surface 184 and extend to third through slot W3 with can contact an at least inorganic material layer 114
(for example contacting interlayer dielectric layer 1143 through slot W3 via third in this second inorganic thin film encapsulated layer 176).In other words,
One inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176 all edge beyond organic film encapsulated layer 172 and covering
First top surface 186 of first organic backstop layer 180 and the first lateral surface 184.First inorganic thin film encapsulated layer 174 and second is inorganic
Thin-film encapsulation layer 176 cover first organic backstop layer 180 and along the first lateral surface 184 of first organic backstop layer 180 downwards
It is at least one of to contact this multiple inorganic material layer 114 of active cell array layer 110 to extend through organic passivation layer 120
Person.In this embodiment, the first inorganic thin film encapsulated layer 174 can contact through slot W1 collocation third through slot W3 via first
Interlayer dielectric layer 1143.In this, pass through the first inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176 and inorganic material
Contact between the bed of material 114 can make the first inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176 and inorganic material
Removing situation between layer 114 reduces.In an embodiment, second can be through slot W3 through one layer through slot W2 and third
Or the inorganic material layer 114 of multilayer.In another embodiment, organic film encapsulated layer 172 is for example formed by spraying method,
It is easy outside overflow, can be used to stop 172 overflow of organic film encapsulated layer by first organic backstop layer 180.In an embodiment
In, as depicted in Fig. 4, second can be in the form of annular groove through slot W3 through slot W2 and third and realize.
In an embodiment, show as shown graphically in fig 5, the first inorganic thin film encapsulated layer 174 and the second inorganic thin film encapsulated layer 176
Can cover first organic backstop layer 180 back in the first lateral surface 184 of the first gap P1.
In some embodiments, organic light emitting display 100 can further include one second organic backstop layer 190.It please refers to
Fig. 8 to Fig. 9, Fig. 8 are the schematic top plan view of the organic light emitting display of further embodiment of this invention.Fig. 9 is the D- corresponding to Fig. 8
The schematic cross-section of the organic light emitting display of one demonstration example of D hatching line.First organic backstop layer 180 is located at organic passivation layer
On 120 and surround pixel defining layer 130, second organic backstop layer 190 be located on organic passivation layer 120 and around first it is organic stop
Barrier 180, and second organic backstop layer 190 and first organic backstop layer 180 are back in the first lateral surface 184 of the first gap P1
It is separated by the second gap P2, specifically, the outside of the first medial surface 182 and pixel defining layer 130 of first organic backstop layer 180
Edge 130s is separated by the first gap P1, and the second medial surface 192 of second organic backstop layer 190 and first organic backstop layer 180
First lateral surface 184 is separated by the second gap P2.First lateral surface 184 of first organic backstop layer 180 is opposite with the first gap P1
It is right.It should be noted that having for the ease of clear explanation in the pixel defining layer 130 of Fig. 8, first organic backstop layer 180 and second
Machine backstop layer 190 shows that so this does not represent pixel defining layer 130, first organic backstop layer 180 and second organic backstop with shading
Layer 190 is the material of top layer.
When thin-film packing structure 170 is multiple film layers and may include organic film encapsulated layer 172, the first inorganic thin film envelope
Fill layer 174 and the second inorganic thin film encapsulated layer 176.In order to avoid first organic backstop layer 180 cannot completely limit it is organic thin
The overflow of film encapsulated layer 172 can have second organic backstop layer 190, part organic film encapsulated layer 172 in an embodiment
The second gap P2 between first organic backstop layer 180 and second organic backstop layer 190 can be extended to, that is to say, that organic thin
Film encapsulated layer 172 can cross first organic backstop layer 180 and be limited by second organic backstop layer 190, organic film encapsulated layer 172
Second organic backstop layer 190 is not crossed back in the second lateral surface 194 of the second gap P2.First inorganic thin film encapsulated layer 174
May extend to the first gap P1, first through slot W1 and second through slot W2 with contact an at least inorganic material layer 114 (in this,
First inorganic thin film encapsulated layer 174 contact interface layer 1142 through slot W2 via second), and extend to first organic backstop layer
180 the first medial surface 182, the first top surface 186 and the first lateral surface 184 simultaneously extend to the second gap P2, re-extend to second
The first medial surface 192, the second top surface 196 and the second lateral surface 194 of organic backstop layer 190 simultaneously extend to third through slot W3
To contact an at least inorganic material layer 114, (in this, 174 system of the first inorganic thin film encapsulated layer can through slot W3 via third
Contact interlayer dielectric layer 1143).That is, the first inorganic thin film encapsulated layer 174 is along with first organic backstop layer 180 and
Organic passivation layer 120 is simultaneously run through to contact actively in the outer surface (including medial surface, top surface and lateral surface) of two organic backstop layers 190
At least one of this multiple inorganic material layer 114 of element arrays layer 110.Second inorganic thin film encapsulated layer 176 covers organic thin
The outer surface of film encapsulated layer 172 and the second top surface 196 and the second lateral surface 194, simultaneously for extending to second organic backstop layer 190
Third is extended to through slot W3 to contact an at least inorganic material layer 114 (in this second inorganic thin film encapsulated layer 176 via third
Through the accessible interlayer dielectric layer 1143 of slot W3).That is, the second inorganic thin film encapsulated layer 176 is along with organic film
The second top surface 196 and the second lateral surface 194 of the outer surface of encapsulated layer 172 and second organic backstop layer 190 are simultaneously run through organic blunt
Change this multiple inorganic material layers 114 at least one of of the layer 120 to contact active cell array layer 110.In other words, first is inorganic
Thin-film encapsulation layer 174 is with the second inorganic thin film encapsulated layer 176 all edges beyond organic film encapsulated layer 172 and covering second has
Second top surface 196 of machine backstop layer 190 and the second lateral surface 194.In this, double-deck organic backstop layer is arranged, and (that is, first has
Machine backstop layer 180 and second organic backstop layer 190), can more preferably prevent 172 overflow of organic film encapsulated layer go out second it is organic only
Barrier 190.In an embodiment, show as depicted in figure 8, third can be in the form of annular groove through slot W3 and realize.
In one embodiment, first organic backstop of the first of Fig. 4 to Fig. 7 organic backstop layer 180 and/or Fig. 8 to Fig. 9
Layer 180 and/or second organic backstop layer 190 can belong to the organic material layer of same layer with pixel defining layer 130.In other words, have
Machine backstop layer (first organic backstop layer 180 and/or second organic backstop layer 190) it is identical as the material of pixel defining layer 130 and
It can be collectively formed by same technique.For example, in the organic material layer for forming flood on organic passivation layer 120, then
The first gap P1 (and/or second gap P2) is formed in organic material layer, to form rectangular organic material pattern (as picture
Plain definition layer 130) and frame-shaped organic material pattern (as organic backstop layer).In an embodiment, first organic backstop layer
180 or second organic backstop layer 190 material be organic photosensitive material, such as be but not limited to polyimides (Polyimide,
PI), polystyrene (Polystyrene, PS), polytetrafluoroethylene (PTFE) (Polytetrafluoroethylene, PTFE), phenolic aldehyde tree
Rouge (phenol-formaldehyde resin), epoxy resin (epoxy resin), acryl resin (acrylic resin)
Deng.
It should be noted that above-listed schema is only simple signal, the edge of film layer is possible may not be as straight may in schema
It can be slightly slanted or in cambered surface, corner perhaps can be more rounded or has the gradient, without should be with the shape of schema as the present invention
The limitation of embodiment.
In conclusion organic light emitting display according to an embodiment of the present invention, the second electrode lay and active cell array
The inorganic material layer contact of layer, to pass through stronger bond between the second electrode lay and the inorganic material layer of active cell array layer
Power improves the second electrode lay and generates the situation peeled or exfoliate, and then reduces inside aqueous vapor or oxygen intrusion element.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding changes and modifications, but these corresponding changes and modifications can be made according to the present invention by knowing those skilled in the art
It all should belong to the protection scope of the claims in the present invention.
Claims (15)
1. a kind of organic light emitting display, which is characterized in that the organic light emitting display includes:
One substrate；
One active cell array layer, is set on the substrate, and wherein the active cell array layer includes multiple inorganic material layers；
One organic passivation layer is located on the active cell array layer；
One first electrode layer is located on the organic passivation layer, which is connected to the master through the organic passivation layer
Dynamic element arrays layer；
One pixel defining layer is located in the first electrode layer, and wherein the pixel defining layer is open with an at least sub-pixel；
One illuminated diagram pattern layer at least sub-pixel opening and contacts the first electrode layer；And
One the second electrode lay is inorganic material, which covers the illuminated diagram pattern layer and the pixel defining layer, wherein should
The second electrode lay runs through the pixel defining layer to contact the first electrode layer, and the second electrode lay is along the pixel defining layer
A lateral border extend downwardly and run through the organic passivation layer to contact multiple inorganic material layer of the active cell array layer
At least one of.
2. organic light emitting display as described in claim 1, which is characterized in that the active cell array layer further includes at least one
Active member, and one of multiple inorganic material layer be covered on an at least active member, be spaced in this at least one
Between active member and the substrate, this is spaced at least between the multiple electrodes of an active member or to be spaced in this at least one main
Between the electrode and a channel layer of dynamic element.
3. organic light emitting display as described in claim 1, which is characterized in that further include a thin-film packing structure, the film
Encapsulating structure is located on the second electrode lay, which completely covers the second electrode lay.
4. organic light emitting display as claimed in claim 3, which is characterized in that further include one first organic backstop layer, this
One organic backstop layer is located on the organic passivation layer and around the pixel defining layer, first organic backstop layer and the pixel definition
The lateral border of layer is separated by one first gap, and the width in first gap is greater than or equal to the second electrode lay and exceeds the pixel
Maximum width on the lateral border of definition layer.
5. organic light emitting display as claimed in claim 4, which is characterized in that it is organic thin that the thin-film packing structure further includes one
Film encapsulated layer, one first inorganic thin film encapsulated layer and one second inorganic thin film encapsulated layer, wherein the first inorganic thin film encapsulated layer
Between the second electrode lay and the organic film encapsulated layer, which covers organic film encapsulation
Layer, the organic film encapsulated layer are located between the first inorganic thin film encapsulated layer and the second inorganic thin film encapsulated layer, this has
Machine thin-film encapsulation layer is limited by first organic backstop layer and is not crossed first organic backstop layer back in first gap
One first lateral surface, and the first inorganic thin film encapsulated layer and the second inorganic thin film encapsulated layer all exceed organic film encapsulation
The edge of layer and one first top surface and first lateral surface for covering first organic backstop layer.
6. organic light emitting display as claimed in claim 5, which is characterized in that the first inorganic thin film encapsulated layer along this
First lateral surface of one organic backstop layer extends downwardly and runs through the organic passivation layer to contact the active cell array layer
At least one of multiple inorganic material layer.
7. organic light emitting display as claimed in claim 4, which is characterized in that further include one second organic backstop layer, this
Two organic backstop layers are located on the organic passivation layer and around first organic backstop layers, and second organic backstop layer and this
One organic backstop layer is separated by one second gap back to one first lateral surface in first gap.
8. organic light emitting display as claimed in claim 7, which is characterized in that it is organic thin that the thin-film packing structure further includes one
Film encapsulated layer, one first inorganic thin film encapsulated layer and one second inorganic thin film encapsulated layer, wherein the first inorganic thin film encapsulated layer
Between the second electrode lay and the organic film encapsulated layer, which covers organic film encapsulation
Layer, the organic film encapsulated layer are located between the first inorganic thin film encapsulated layer and the second inorganic thin film encapsulated layer, this has
Machine thin-film encapsulation layer is crossed first organic backstop layer and is limited by second organic backstop layer, which does not get over
Second organic backstop layer is crossed back in one second lateral surface in second gap, and the first inorganic thin film encapsulated layer and this
Two inorganic thin film encapsulated layers all exceed the edge of the organic film encapsulated layer and cover one second top of second organic backstop layer
Face and second lateral surface.
9. organic light emitting display as claimed in claim 8, which is characterized in that the first inorganic thin film encapsulated layer along this
Second lateral surface of two organic backstop layers extends downwardly and runs through the organic passivation layer to contact the active cell array layer
At least one of multiple inorganic material layer.
10. organic light emitting display as described in claim 1, which is characterized in that further include one first organic backstop layer, this
One organic backstop layer is located on the organic passivation layer and around the second electrode lay.
11. organic light emitting display as claimed in claim 10, which is characterized in that first organic backstop layer and the pixel are fixed
The lateral border of adopted layer is separated by one first gap, and the second electrode lay is not in contact with first organic backstop level for this between first
One first medial surface of gap.
12. organic light emitting display as described in claim 1, which is characterized in that the second electrode lay is along the pixel definition
Layer the lateral border extend downwardly and run through the organic passivation layer and run through multiple inorganic material layer at least one, with
Contact is by the inorganic material layer of the perforative at least lower section of an inorganic material layer.
13. organic light emitting display as described in claim 1, which is characterized in that multiple inorganic material layer is selected from blunt
Change layer, boundary layer, interlayer dielectric layer, in group composed by gate insulation layer and buffer layer at least within two.
14. organic light emitting display as described in claim 1, which is characterized in that the substrate is flexible base plate.
15. organic light emitting display as described in claim 1, which is characterized in that the second electrode lay completely covers this and shines
Pattern layer and the pixel defining layer.
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| TW107121604 | 2018-06-22 | ||
| TW107121604 | 2018-06-22 |
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| CN109768183A (en) * | 2019-01-25 | 2019-05-17 | 固安翌光科技有限公司 | A kind of organic electro-optic device |
| CN110136574A (en) * | 2019-05-13 | 2019-08-16 | 友达光电（昆山）有限公司 | Display panel |
| CN110688004A (en) * | 2019-09-10 | 2020-01-14 | 武汉华星光电半导体显示技术有限公司 | Display panel, electronic device and operation method of electronic device |
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| CN112002823A (en) * | 2020-08-11 | 2020-11-27 | 深圳市华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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| TW202002357A (en) | 2020-01-01 |
| TWI699024B (en) | 2020-07-11 |
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Application publication date: 20190108 |