CN109164947B - Preparation method of touch sensor and touch sensor - Google Patents
Preparation method of touch sensor and touch sensor Download PDFInfo
- Publication number
- CN109164947B CN109164947B CN201811060260.2A CN201811060260A CN109164947B CN 109164947 B CN109164947 B CN 109164947B CN 201811060260 A CN201811060260 A CN 201811060260A CN 109164947 B CN109164947 B CN 109164947B
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- CN
- China
- Prior art keywords
- conductive
- ink
- conductive ink
- deionized water
- touch sensor
- Prior art date
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 49
- 238000007641 inkjet printing Methods 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 7
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 54
- 239000000243 solution Substances 0.000 claims description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 50
- 239000008367 deionised water Substances 0.000 claims description 45
- 229910021641 deionized water Inorganic materials 0.000 claims description 45
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 42
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 36
- 239000004094 surface-active agent Substances 0.000 claims description 33
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 30
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- 229920004890 Triton X-100 Polymers 0.000 claims description 29
- 239000002518 antifoaming agent Substances 0.000 claims description 27
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 claims description 19
- 238000002156 mixing Methods 0.000 claims description 19
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- 239000003638 chemical reducing agent Substances 0.000 claims description 14
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- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 claims description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 8
- VCJMYUPGQJHHFU-UHFFFAOYSA-N iron(3+);trinitrate Chemical compound [Fe+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O VCJMYUPGQJHHFU-UHFFFAOYSA-N 0.000 claims description 8
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- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 8
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 claims description 8
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- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
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- 239000008139 complexing agent Substances 0.000 claims description 6
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- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- 239000005708 Sodium hypochlorite Substances 0.000 claims description 4
- DPXJVFZANSGRMM-UHFFFAOYSA-N acetic acid;2,3,4,5,6-pentahydroxyhexanal;sodium Chemical compound [Na].CC(O)=O.OCC(O)C(O)C(O)C(O)C=O DPXJVFZANSGRMM-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 239000001768 carboxy methyl cellulose Substances 0.000 claims description 4
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- 235000019812 sodium carboxymethyl cellulose Nutrition 0.000 claims description 4
- 229920001027 sodium carboxymethylcellulose Polymers 0.000 claims description 4
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 claims description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims description 4
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- 239000007788 liquid Substances 0.000 abstract description 7
- 235000011187 glycerol Nutrition 0.000 description 16
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- -1 amine compound Chemical class 0.000 description 13
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- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 229940049920 malate Drugs 0.000 description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-L malate(2-) Chemical compound [O-]C(=O)C(O)CC([O-])=O BJEPYKJPYRNKOW-UHFFFAOYSA-L 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910001961 silver nitrate Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- ZUVOYUDQAUHLLG-OLXYHTOASA-L disilver;(2r,3r)-2,3-dihydroxybutanedioate Chemical compound [Ag+].[Ag+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O ZUVOYUDQAUHLLG-OLXYHTOASA-L 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- XNGYKPINNDWGGF-UHFFFAOYSA-L silver oxalate Chemical compound [Ag+].[Ag+].[O-]C(=O)C([O-])=O XNGYKPINNDWGGF-UHFFFAOYSA-L 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
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- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 2
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 2
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 2
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- JHWIEAWILPSRMU-UHFFFAOYSA-N 2-methyl-3-pyrimidin-4-ylpropanoic acid Chemical compound OC(=O)C(C)CC1=CC=NC=N1 JHWIEAWILPSRMU-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical group O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZKQDCIXGCQPQNV-UHFFFAOYSA-N Calcium hypochlorite Chemical compound [Ca+2].Cl[O-].Cl[O-] ZKQDCIXGCQPQNV-UHFFFAOYSA-N 0.000 description 1
- 239000004343 Calcium peroxide Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- HSHXDCVZWHOWCS-UHFFFAOYSA-N N'-hexadecylthiophene-2-carbohydrazide Chemical compound CCCCCCCCCCCCCCCCNNC(=O)c1cccs1 HSHXDCVZWHOWCS-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- LHJQIRIGXXHNLA-UHFFFAOYSA-N calcium peroxide Chemical compound [Ca+2].[O-][O-] LHJQIRIGXXHNLA-UHFFFAOYSA-N 0.000 description 1
- 235000019402 calcium peroxide Nutrition 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 229940076286 cupric acetate Drugs 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical class [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- AXZAYXJCENRGIM-UHFFFAOYSA-J dipotassium;tetrabromoplatinum(2-) Chemical compound [K+].[K+].[Br-].[Br-].[Br-].[Br-].[Pt+2] AXZAYXJCENRGIM-UHFFFAOYSA-J 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- RUTXIHLAWFEWGM-UHFFFAOYSA-H iron(3+) sulfate Chemical compound [Fe+3].[Fe+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RUTXIHLAWFEWGM-UHFFFAOYSA-H 0.000 description 1
- 229910000360 iron(III) sulfate Inorganic materials 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000008116 organic polysulfides Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- SATVIFGJTRRDQU-UHFFFAOYSA-N potassium hypochlorite Chemical compound [K+].Cl[O-] SATVIFGJTRRDQU-UHFFFAOYSA-N 0.000 description 1
- 229910001487 potassium perchlorate Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FTNNQMMAOFBTNJ-UHFFFAOYSA-M silver;formate Chemical compound [Ag+].[O-]C=O FTNNQMMAOFBTNJ-UHFFFAOYSA-M 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical compound [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract
The invention provides a preparation method of a touch sensor, which comprises the following steps: ink-jet printing etching liquid on the conductive film substrate to form a conductive pattern area and a conductive channel area; and ink-jet printing conductive ink on the edges of the conductive pattern area and the conductive channel area to form a conductive circuit. According to the preparation method of the touch sensor, the conductive pattern area and the conductive channel area are formed on the conductive film through an ink-jet printing process, and the conductive circuit is formed at the edges of the conductive pattern area and the conductive channel area; two key processes of conductive channel etching and edge wiring preparation can be realized by only one ink-jet printing device, and dozens of original processes are greatly compressed, so that the production cost can be greatly reduced, and the production efficiency can be improved.
Description
Technical Field
The present disclosure relates to a method for manufacturing a touch sensor, and more particularly, to a method for manufacturing a touch sensor with simple processes.
Background
The touch screen is a transparent absolute positioning system, and can detect external touch actions and position the touch position. Taking a GFF capacitive touch screen as an example, the basic structure of the GFF capacitive touch screen is an emission layer, an OCA, a reception layer, an OCA, and a cover glass. The transmitting layer and the receiving layer are both patterned transparent conductive films, and the preparation process of the patterned transparent conductive films comprises the following steps: and removing the conductive components in the patterned area on the transparent conductive film by yellow light, screen printing and other processes, thereby forming a specific conductive pattern and a conductive path. Among them, yellow etching is the most widely used process at present, and the basic processes of the process include: pre-cleaning, coating photoresist, exposing, developing, etching, removing photoresist, post-cleaning, drying and the like. After the patterned conductive film is prepared by yellow light etching, a silver paste conductive circuit is printed by a screen printing process, and then the complete touch screen sensor assembly is obtained by the working procedures of attaching, binding and the like.
The yellow light process involves more and expensive equipment, uses more liquid medicine, has complex working procedures, can generate a plurality of harmful substances in the production process, and can cause damage or destruction to operators and the environment.
In addition, laser etching is also a common process for preparing patterned conductive films, silver paste conductive circuits are prepared by adopting screen printing, and then the silver paste conductive circuits are attached and bound to obtain a complete touch screen sensor assembly.
The laser etching machine used in the laser etching process is expensive, and the silver paste conductive circuit can be prepared only by matching with screen printing. In addition, laser etching can only be used for patterning single-sided conductive films, and cannot be used for preparing patterned double-sided conductive films. Therefore, a touch screen sensor with a GF2 structure cannot be prepared by using a laser etching process.
In view of the above, there is a need to improve the existing method for manufacturing a touch sensor and the touch sensor thereof, so as to solve the above problems.
Disclosure of Invention
The invention aims to provide a touch sensor preparation method with simple working procedures and a touch sensor prepared by adopting the process.
In order to achieve the above object, the present invention provides a method for manufacturing a touch sensor, comprising the following steps:
ink-jet printing etching liquid on the conductive film substrate to form a conductive pattern area and a conductive channel area; the etching agent accounts for 0.1-50%, the solvent accounts for 50-99%, and the additive accounts for 0-10% of the etching solution;
printing conductive ink on the edges of the conductive pattern area and the conductive channel area in an ink-jet manner to form conductive circuits; the conductive ink is particle type conductive ink, and the particle type conductive ink comprises 1-50% of conductive particles, 40-90% of solvent and 0-10% of additive; or the conductive ink is non-particle conductive ink, and the non-particle conductive ink comprises 1-40% of metal salt, 1-40% of complexing agent or chelating agent, 50-99% of solvent, 0-1% of surfactant, 0-1% of defoaming agent, 0-10% of pH regulator and 0-5% of soluble resin.
As a further improvement of the invention, the etching solution is obtained by dissolving 1g of sodium hypochlorite into 60g of deionized water, then adding 10g of ethanol, 10g of ethylene glycol, 15g of propylene glycol propyl ether and 4g of glycerol, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m.
As a further improvement of the invention, the etching solution is prepared by dissolving 2g of copper chloride in 50g of deionized water, then adding 30g of diethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinyl alcohol, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering with a 0.45-micron filter element.
As a further improvement of the invention, the etching solution is obtained by dissolving 2g of ferric nitrate into 50g of deionized water, then adding 10g of ethylene glycol ethyl ether, 30g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinylpyrrolidone, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m.
As a further improvement of the invention, the particle type conductive ink is obtained by dispersing 10g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method into a mixed solution consisting of 60g of deionized water, 10g of isopropanol, 17g of ethylene glycol, 2g of triethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025.
As a further improvement of the invention, the particle type conductive ink is obtained by dispersing 20g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method into a mixed solution consisting of 40g of deionized water, 27g of n-propanol, 10g of ethylene glycol, 2g of polyvinylpyrrolidone, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025.
As a further improvement of the invention, the particle type conductive ink is obtained by dispersing 10g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method into a mixed solution consisting of 50g of deionized water, 27g of isobutanol, 10g of ethylene glycol, 2g of sodium carboxymethyl cellulose, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025.
As a further improvement of the invention, the particle-free conductive ink is obtained by adding 10g of silver acetate into a mixed solvent consisting of 20g of ammonia water, 30g of ethanol, 20g of ethylene glycol ethyl ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver acetate.
As a further improvement of the invention, the particle-free conductive ink is obtained by adding 10g of silver citrate into a mixed solvent consisting of 10g of sec-butylamine, 30g of isopropanol, 20g of propylene glycol methyl ether, 10g of propylene glycol and 20g of deionized water, and stirring in an ice-water bath to fully dissolve the silver citrate.
In order to achieve the purpose, the invention further provides a touch sensor prepared by the preparation method of the touch sensor.
Compared with the prior art, the invention has the beneficial effects that: according to the preparation method of the touch sensor, the conductive pattern area and the conductive channel area are formed on the conductive film through an ink-jet printing process, and the conductive circuit is formed at the edges of the conductive pattern area and the conductive channel area; two key processes of conductive channel etching and edge wiring preparation can be realized by only one inkjet printing device, and original dozens of procedures are greatly compressed, so that the production cost can be greatly reduced, and the production efficiency can be improved.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in detail below with reference to specific embodiments.
The invention provides a preparation method of a touch sensor, which comprises the following steps: printing etching liquid on the conductive film substrate in an ink jet mode, wherein the etching liquid reacts with conductive substances on the conductive film to generate non-conductive substances, so that the conductive film forms a preset conductive pattern area and a conductive channel area; and ink-jet printing conductive ink on the edges of the conductive pattern area and the conductive channel area to form a conductive circuit.
The touch sensor obtained by the preparation method is provided with a window area for user interaction and a peripheral area surrounding the window area; the conductive pattern area and the conductive channel area form the window area, and the power-to-power line is arranged in the peripheral area to transmit electric signals.
The two procedures of the preparation method of the touch sensor are not arranged in sequence, and can be changed according to different conditions. Specifically, firstly, etching solution can be printed on the conductive film substrate in an ink-jet mode, after the etching solution reacts with the conductive film, the conductive film substrate is washed by deionized water, an air gun is dried to form a conductive pattern area and a conductive channel area, then conductive ink is printed in an ink-jet mode, and drying is carried out to form a conductive circuit; or firstly, ink-jet printing conductive ink, drying to form a conductive circuit, then ink-jet printing etching liquid, after the etching liquid reacts with the conductive film, cleaning with deionized water, and drying with an air gun to form a conductive pattern area and a conductive channel area; or simultaneously carrying out ink-jet printing on the etching solution and the conductive ink, drying to form a conductive circuit after the etching solution reacts with the conductive film, washing with deionized water, and drying with an air gun. The above air gun drying is preferably carried out using an inert protective gas such as nitrogen gas or the like.
The etching solution includes an etchant that reacts with the conductive film to generate a non-conductive substance, a solvent for dissolving or dispersing the etchant, and an additive for improving performance of the etching solution. The etching agent accounts for 0.1-50%, the solvent accounts for 50-99%, and the additive accounts for 0-10% of the etching solution.
The conductive film is a metal conductive film formed by metal, metal nanowires, metal nanoparticles and metal nanosheets, or a conductive film formed by other semiconductor conductive films or organic conductive materials. In recent years, nano silver conductive films are widely used due to their many advantages.
A nano silver conductive film formed of nano silver is taken as an example. The etchant includes but is not limited to hypochlorous acid and hypochlorite salts thereof such as sodium hypochlorite, potassium hypochlorite, calcium hypochlorite and the like; permanganates such as permanganic acid and potassium permanganate thereof; perchloric acid and perchlorates such as potassium perchlorate and sodium perchlorate; dichromate salts such as dichromic acid and potassium dichromate thereof; cupric salts such as cupric chloride, cupric nitrate, cupric sulfate and cupric acetate; ferric salts such as ferric chloride, ferric sulfate, and ferric nitrate; peroxides such as hydrogen peroxide, organic peroxides, sodium peroxide, potassium peroxide, and calcium peroxide; the peroxide and acid mixture, the acid is inorganic acid such as hydrochloric acid, sulfuric acid, phosphoric acid, etc., and organic acid such as formic acid, acetic acid, oxalic acid, tartaric acid, etc.; the peroxide and complexing agent mixture, the complexing agent is ammonia, ammonium salt, organic amine compound, EDTA and its salt; elemental sulfur, including nanoscale sulfur dispersion and sulfur solution; polysulfides, including inorganic and organic polysulfides.
The solvent may be water; monohydric alcohols such as methanol, ethanol, and isopropanol; glycols such as ethylene glycol and propylene glycol; polyhydric alcohols such as glycerin; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether, diethylene glycol ethyl ether and the like; an ether compound; a ketone compound; aldehyde compounds, and the like.
The additive comprises a surfactant for adjusting the surface tension of the etching solution, a defoaming agent for eliminating or inhibiting the generation of foam in the etching solution, a pH regulator for adjusting the pH value of the etching solution, a viscosity regulator for adjusting the viscosity of the etching solution and soluble resin capable of adjusting the viscosity of the etching solution and film forming property.
The etchants, solvents and additives may be synthesized as desired or commercially available. Uniformly mixing an etching agent, a solvent and an additive, and removing particle impurities through a filter to obtain the etching solution for ink-jet printing, wherein the etching solution comprises the following components:
etching solution 1: dissolving 1g of sodium hypochlorite into 60g of deionized water, then adding 10g of ethanol, 10g of ethylene glycol, 15g of propylene glycol propyl ether and 4g of glycerol, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 2: dissolving 2g of potassium permanganate into 60g of deionized water, then adding 30g of propylene glycol ethyl ether, 5g of glycerol, 2g of polyethylene glycol, 1g of acetic acid, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 3: dissolving 2g of sodium perchlorate into 30g of deionized water, then adding 60g of ethylene glycol ethyl ether, 5g of glycerol, 2g of polyethylene glycol, 1g of acetic acid, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 4: dissolving 1g of sodium dichromate into 40g of deionized water, then adding 50g of propylene glycol propyl ether, 5g of glycerol, 2g of polyethylene glycol, 1g of acetic acid, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 5: dissolving 2g of copper chloride into 50g of deionized water, then adding 30g of diethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinyl alcohol, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 6: dissolving 2g of ferric nitrate into 50g of deionized water, then adding 10g of ethylene glycol ethyl ether, 30g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinylpyrrolidone, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 7: adding 1g of EDTA-disodium salt into 20g of 30% hydrogen peroxide by mass, then adding 30g of deionized water, 30g of ethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 9g of diethylene glycol oil, 0.5g of Triton X-100 and 0.5g of BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 8: adding 1g of acetic acid into 10g of hydrogen peroxide with the mass fraction of 30%, then adding 40g of deionized water, 30g of ethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 9g of diethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 9: adding 1g of ammonium carbonate into 10g of hydrogen peroxide with the mass fraction of 30%, then adding 30g of deionized water, 30g of ethylene glycol ethyl ether, 20g of propylene glycol propyl ether, 9g of triethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 10: adding 1g of ammonium sulfate into 20g of hydrogen peroxide with the mass fraction of 30%, then adding 30g of deionized water, 30g of ethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 9g of glycerol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 11: dispersing 2g of nano-scale sulfur into 50g of water, then adding 10g of ethanol, 20g of propylene glycol methyl ether, 10g of ethylene glycol, 5g of glycerol, 2g of polyvinyl alcohol and 1g of surfactant Triton X-100, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
Etching solution 12: adding 3g of sodium thiosulfate into 50g of water, then adding 20g of isopropanol, 10g of ethylene glycol ethyl ether, 10g of propylene glycol, 5g of diethylene glycol, 2g of polyethylene glycol and 1g of surfactant Triton X-100, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
The conductive ink includes a particle type conductive ink and a particle-free type conductive ink.
Wherein the particle type conductive ink comprises 1-50% of conductive particles, 40-90% of solvent and 0-10% of additive.
The conductive particles include, but are not limited to, one or more of nano gold, nano silver and nano copper, and the particle size of the conductive particles is between 1nm and 1000nm, preferably between 1nm and 100nm, and more preferably between 1nm and 20 nm.
The solvent may be water; monohydric alcohols such as methanol, ethanol, and isopropanol; glycols such as ethylene glycol and propylene glycol; polyhydric alcohols such as glycerin; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether, diethylene glycol ethyl ether and the like; ether compounds; a ketone compound; aldehyde compounds, and the like. The additive comprises a surfactant for adjusting the surface tension of the etching solution, a defoaming agent for eliminating or inhibiting the generation of foam in the etching solution, a pH regulator for adjusting the pH value of the etching solution, a soluble resin for adjusting the viscosity and the film-forming property of the etching solution and the like.
Particle-type conductive ink 1: synthesizing nano silver particles with the average particle size of 2nm by adopting a chemical reduction method, and dispersing 10g of the nano silver particles into a mixed solution consisting of 50g of deionized water, 27g of isopropanol, 10g of ethylene glycol, 2g of glycerol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 2: the method comprises the steps of synthesizing nano silver particles with the average particle size of 10nm by adopting a chemical reduction method, and dispersing 20g of the nano silver particles into a mixed solution consisting of 40g of deionized water, 27g of ethanol, 10g of propylene glycol, 2g of diethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 3: synthesizing nano silver particles with the average particle size of 50nm by adopting a chemical reduction method, and dispersing 10g of the nano silver particles into a mixed solution consisting of 60g of deionized water, 10g of isopropanol, 17g of ethylene glycol, 2g of triethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 4: synthesizing nano silver particles with the average particle size of 100nm by adopting a chemical reduction method, and dispersing 15g of the nano silver particles into a mixed solution consisting of 45g of deionized water, 27g of ethanol, 10g of propylene glycol, 2g of glycerol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 5: the method comprises the steps of synthesizing nano silver particles with the average particle size of 50nm by adopting a chemical reduction method, and dispersing 20g of the nano silver particles into a mixed solution consisting of 30g of deionized water, 37g of isopropanol, 10g of ethylene glycol, 2g of polyvinyl alcohol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 6: the method comprises the steps of synthesizing nano silver particles with the average particle size of 50nm by adopting a chemical reduction method, and dispersing 20g of the nano silver particles into a mixed solution consisting of 40g of deionized water, 27g of n-propanol, 10g of ethylene glycol, 2g of polyvinylpyrrolidone, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 7: the method comprises the steps of synthesizing nano silver particles with the average particle size of 50nm by adopting a chemical reduction method, and dispersing 10g of the nano silver particles into a mixed solution consisting of 50g of deionized water, 27g of isobutanol, 10g of ethylene glycol, 2g of sodium carboxymethylcellulose, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
Particle-type conductive ink 8: synthesizing nano silver particles with the average particle size of 50nm by adopting a chemical reduction method, and dispersing 10g of the nano silver particles into a mixed solution consisting of 30g of deionized water, 47g of isopropanol, 10g of ethylene glycol, 2g of hydroxypropyl methyl cellulose, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025 to obtain the granular nano silver conductive ink.
The particle-free conductive ink comprises 1-40% of metal salt, 1-40% of complexing agent or chelating agent, 50-99% of solvent, 0-1% of surfactant, 0-1% of defoaming agent, 0-10% of pH regulator and 0-5% of soluble resin.
The metal salt is gold salt, silver salt, copper salt or aluminum salt; the metal salt and the chelate thereof form a conductive layer after heating.
Taking silver salt as an example, the metal salt is silver nitrate, silver formate, silver acetate, silver oxalate, silver tartrate or silver citrate; the complexing agent or chelating agent comprises ammonia water, ammonium salt, fatty amine, alcohol amine and amide. The solvent may be water; monohydric alcohols such as methanol, ethanol, and isopropanol; glycols such as ethylene glycol and propylene glycol; polyhydric alcohols such as glycerin; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol propyl ether, diethylene glycol ethyl ether and the like; an ether compound; a ketone compound; aldehyde compounds, and the like. The soluble resin can be polyvinylpyrrolidone, polyethylene glycol, polyvinyl alcohol, polyurethane, epoxy resin, phenolic resin, sodium carboxymethylcellulose and the like.
Particle-free conductive ink 1: adding 10g of silver acetate into a mixed solvent consisting of 20g of ammonia water, 30g of ethanol, 20g of ethylene glycol ethyl ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver acetate, thereby obtaining the particle-free conductive ink.
Particle-free conductive ink 2: adding 20g of silver malate into a mixed solvent consisting of 10g of ethylenediamine, 30g of isopropanol, 20g of propylene glycol ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver malate to obtain the particle-free conductive ink.
Particle-free conductive ink 3: adding 10g of silver citrate into a mixed solvent consisting of 10g of sec-butylamine, 30g of isopropanol, 20g of propylene glycol methyl ether, 10g of propylene glycol and 20g of deionized water, and stirring in an ice water bath to fully dissolve the silver citrate to obtain the particle-free conductive ink.
Particle-free conductive ink 4: adding 20g of silver tartrate into a mixed solvent consisting of 10g of propylenediamine, 30g of isopropanol, 20g of ethylene glycol monomethyl ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver tartrate, thereby obtaining the particle-free conductive ink.
Particle-free conductive ink 5: adding 20g of silver oxalate into a mixed solvent consisting of 10g of ethylenediamine, 30g of isopropanol, 20g of diethylene glycol ethyl ether, 10g of propylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver oxalate, thereby obtaining the front non-particle conductive ink.
Particle-free conductive ink 6: adding 10g of silver malate and 10g of silver citrate into a mixed solvent consisting of 10g of ethylenediamine, 30g of ethanol, 20g of propylene glycol propyl ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver malate and the silver citrate to obtain the particle-free conductive ink.
Particle-free conductive ink 7: adding 20g of silver nitrate into a mixed solution consisting of 15g of propylene diamine, 35g of isopropanol, 20g of ethylene glycol ethyl ether, 28g of deionized water and 2g of polyvinyl alcohol, and stirring in an ice-water bath to fully dissolve the silver nitrate to obtain the particle-free conductive ink.
Particle-free conductive ink 8: adding 10g of silver nitrate and 10g of silver acetate into a mixed solution consisting of 20g of ethanolamine, 30g of isopropanol, 20g of propylene glycol propyl ether, 28g of deionized water and 2g of polyvinylpyrrolidone, and stirring in an ice-water bath to fully dissolve the mixture to obtain the particle-free conductive ink.
The invention also provides a touch sensor prepared by the preparation method of the touch sensor.
The invention has the beneficial effects that: according to the preparation method of the touch sensor, the conductive pattern area and the conductive channel area are formed on the conductive film substrate through an ink-jet printing process, and the conductive circuit is formed at the edges of the conductive pattern area and the conductive channel area; two key processes of conductive channel etching and edge wiring preparation can be realized by only one inkjet printing device, and original dozens of procedures are greatly compressed, so that the production cost can be greatly reduced, and the production efficiency can be improved.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (5)
1. A preparation method of a touch sensor is characterized by comprising the following steps: the method comprises the following steps:
ink-jet printing etching solution on the conductive film substrate to form a conductive pattern area and a conductive channel area to form a window area for user interaction; the etching agent in the etching solution accounts for 0.1-50%, the solvent accounts for 50-99%, and the additive accounts for 0-10%;
printing conductive ink on the edges of the conductive pattern area and the conductive channel area in an ink-jet mode to form a conductive circuit, wherein the conductive circuit is located in a peripheral area surrounding the window area; the conductive ink is particle type conductive ink, and the particle type conductive ink comprises 1-50% of conductive particles, 40-90% of solvent and 0-10% of additive; or the conductive ink is non-particle conductive ink, the non-particle conductive ink comprises 1-40% of metal salt, 1-40% of complexing agent or chelating agent, 50-99% of solvent, 0-1% of surfactant, 0-1% of defoaming agent, 0-10% of pH regulator and 0-5% of soluble resin; wherein,
the particle type conductive ink is obtained by dispersing 10g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method into a mixed solution consisting of 60g of deionized water, 10g of isopropanol, 17g of ethylene glycol, 2g of triethylene glycol, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025;
or 20g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method are dispersed in a mixed solution consisting of 40g of deionized water, 27g of n-propanol, 10g of ethylene glycol, 2g of polyvinylpyrrolidone, 0.5g of surfactant Triton X-100 and 0.5g of defoamer BYK-025 to obtain the granular conductive ink;
or, the particle type conductive ink is obtained by dispersing 10g of nano silver particles with the average particle size of 50nm synthesized by a chemical reduction method into a mixed solution consisting of 50g of deionized water, 27g of isobutanol, 10g of ethylene glycol, 2g of sodium carboxymethyl cellulose, 0.5g of surfactant Triton X-100 and 0.5g of defoaming agent BYK-025;
or, the particle-free conductive ink is obtained by adding 10g of silver acetate into a mixed solvent consisting of 20g of ammonia water, 30g of ethanol, 20g of ethylene glycol ethyl ether, 10g of ethylene glycol and 10g of deionized water, and stirring in an ice-water bath to fully dissolve the silver acetate;
or, the particle-free conductive ink is obtained by adding 10g of silver citrate into a mixed solvent consisting of 10g of sec-butylamine, 30g of isopropanol, 20g of propylene glycol methyl ether, 10g of propylene glycol and 20g of deionized water, and stirring in an ice-water bath to fully dissolve the silver citrate.
2. The method for manufacturing a touch sensor according to claim 1, wherein: the etching solution is obtained by dissolving 1g of sodium hypochlorite into 60g of deionized water, then adding 10g of ethanol, 10g of ethylene glycol, 15g of propylene glycol propyl ether and 4g of glycerol, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m.
3. The method for manufacturing a touch sensor according to claim 1, wherein: the etching solution is prepared by dissolving 2g of copper chloride in 50g of deionized water, then adding 30g of diethylene glycol ethyl ether, 10g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinyl alcohol, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025 as a defoaming agent, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m to obtain the etching solution for ink-jet printing.
4. The method for manufacturing a touch sensor according to claim 1, wherein: the etching solution is prepared by dissolving 2g of ferric nitrate into 50g of deionized water, then adding 10g of ethylene glycol ethyl ether, 30g of propylene glycol propyl ether, 7g of glycerol, 2g of polyvinylpyrrolidone, 0.5g of Triton X-100 as a surfactant and 0.5g of BYK-025, uniformly mixing, and filtering by using a filter element with the diameter of 0.45 mu m.
5. A touch sensor, comprising: the touch sensor is prepared by the preparation method of the touch sensor as set forth in any one of claims 1 to 4.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201811060260.2A CN109164947B (en) | 2016-01-26 | 2016-01-26 | Preparation method of touch sensor and touch sensor |
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CN103419499A (en) * | 2012-05-21 | 2013-12-04 | 精工爱普生株式会社 | Printing material holding container |
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KR20120111607A (en) * | 2011-04-01 | 2012-10-10 | 광주과학기술원 | Graphene touch sensor using piezoelectric effect |
KR101812606B1 (en) * | 2011-04-26 | 2017-12-27 | 니폰 메크트론 가부시키가이샤 | Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel |
CN102207792B (en) * | 2011-06-07 | 2012-10-03 | 南京福莱克斯光电科技有限公司 | Manufacturing method of touch sensor structure based on charge transfer |
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CN103135866A (en) * | 2011-12-02 | 2013-06-05 | 上海晨兴希姆通电子科技有限公司 | Manufacture method for capacitance type touch screen |
US20140002112A1 (en) * | 2011-12-29 | 2014-01-02 | Cypress Semiconductor Corporation | Devices and methods having capacitance sense structure formed over housing surface |
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