CN109148311A - Die-bonding device - Google Patents

Die-bonding device Download PDF

Info

Publication number
CN109148311A
CN109148311A CN201810960784.0A CN201810960784A CN109148311A CN 109148311 A CN109148311 A CN 109148311A CN 201810960784 A CN201810960784 A CN 201810960784A CN 109148311 A CN109148311 A CN 109148311A
Authority
CN
China
Prior art keywords
rack
drive shaft
frame
gripper frame
driving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810960784.0A
Other languages
Chinese (zh)
Other versions
CN109148311B (en
Inventor
黄晓波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luzhou Loongson Micro Technology Co ltd
Original Assignee
Chongqing Jialing New Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Jialing New Technology Co Ltd filed Critical Chongqing Jialing New Technology Co Ltd
Priority to CN201810960784.0A priority Critical patent/CN109148311B/en
Publication of CN109148311A publication Critical patent/CN109148311A/en
Application granted granted Critical
Publication of CN109148311B publication Critical patent/CN109148311B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/85051Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections

Abstract

The present invention relates to chip manufacture fields, die-bonding device, including rack, clamping device and sweeping through the material mechanism are disclosed, clamping device includes the gripper frame slid laterally Lian Jie on the rack, the first support spring is connected between one end and rack of gripper frame, the other end of gripper frame is equipped with driving mechanism;Driving mechanism includes the drive shaft of vertical rotating connection on the rack, drive shaft is coaxially connected with the cam that interval offsets with gripper frame, gap is arranged with the actuator for driving sweeping through the material mechanism in drive shaft above cam, actuator and sweeping through the material mechanism are affixed, and the lower section of actuator is equipped with affixed supporting block on the driving shaft.The present invention solves the problems, such as that the uniformity of existing scaling powder distribution of particles after scaling powder spreading in the prior art is poor.

Description

Die-bonding device
Technical field
The present invention relates to chip manufacture fields, and in particular to die-bonding device.
Background technique
Chip is the important component of semiconductor devices, and semiconductor is needed in process by semiconductor chip and load Body forms stable connection by welding.Lead is the output end of semiconductor chip information, and semiconductor chip after welding, needs Two leads of semiconductor are welded.
Existing lead welding method is that by lead, queueing discipline, lead frame are equipped with several recessed on lead frame first The stub end of slot, lead is fastened in groove, for the firmness for guaranteeing lead welding, needs to sprinkle in groove before welding to help Solder flux.The existing method for spreading scaling powder is that manually scaling powder particle is placed on lead frame, then by manually shaking lead Frame makes scaling powder distribution of particles in each groove, but this method be easy to cause scaling powder particle to fail to be placed in groove The uniformity of problem, scaling powder distribution of particles is poor.
Summary of the invention
The invention is intended to provide die-bonding device, to solve existing scaling powder after scaling powder spreading in the prior art The problem of the uniformity difference of grain distribution.
In order to achieve the above objectives, technical scheme is as follows: die-bonding device, including rack, clamping device and Sweeping through the material mechanism, clamping device includes the gripper frame slid laterally Lian Jie on the rack, affixed between one end and rack of gripper frame There is the first elastic component, the other end of gripper frame is equipped with driving mechanism;Driving mechanism includes the drive of vertical rotating connection on the rack Moving axis, drive shaft are coaxially connected with the cam that interval offsets with gripper frame, and gap, which is arranged with, in the drive shaft above cam is used for The actuator of sweeping through the material mechanism is driven, actuator and sweeping through the material mechanism are affixed, and the lower section of actuator is equipped with affixed branch on the driving shaft Bracer.
The principle and beneficial effect of the technical program are: rack plays the role of support and connects with stabilizing equipment, clamping Mechanism is used to treat the lead frame for spreading scaling powder particle and is gripped, on the one hand driving mechanism passes through cam driven gripper frame Along rack laterally shake, make the scaling powder distribution of particles on gripper frame in the groove of lead frame, compared to the prior art in Artificial shake saves artificial investment, and the shake frequency for driving lead frame shake that can make lead frame that offseted by cam and gripper frame Rate determines, so that scaling powder distribution of particles is more uniform;On the other hand, driving mechanism drives sweeping through the material mechanism pair by actuator Scaling powder particle on lead frame is further swept even, and the scaling powder particle on lead frame is further uniformly divided It is dispersed in the groove of lead frame, increases the uniformity of scaling powder distribution of particles.
Further, actuator includes the driving frame slid laterally Lian Jie on the rack, drives in frame and is connected with adjusting air bag, Be connected with the push rod to offset with air bag in drive shaft, push rod is equipped with round and smooth portion far from one end of drive shaft, the protruding end of cam with One end that push rod is equipped with round and smooth portion is located at the both ends of same diameter in shaft, and the side of drive shaft is equipped with the gas of fixed setting The piston rod interval of cylinder, cylinder offsets with cam, is communicated with conduit between cylinder and adjusting air bag.
Drive shaft turns will drive the push rod rotation of connection fixed thereto, and push rod will push adjusting air bag during rotation And driving frame, make that frame is driven to move radially along drive shaft, i.e. driving frame drives sweeping through the material mechanism lateral along rack transverse shifting It is mobile, the scaling powder particle on lead frame sweep it is even, since the protruding end and push rod of cam are equipped with the one end point in round and smooth portion Not Wei Yu in shaft same diameter both ends, i.e., when cam pushes gripper frame mobile, push rod will push driving frame, so that driving Frame is mobile to the mobile opposite direction of gripper frame, so that sweeping through the material mechanism and the direction of motion of lead frame are on the contrary, more conducively sweeping through the material mechanism Granular scaling powder is swept even;Cam during rotation can also it is intermittent squeeze cylinder piston rod, work as cam extrusion When piston rod, the pressure in cylinder be will increase, and the gas in cylinder can be blasted along conduit to be adjusted in air bag, under original state, Air bag and drive shaft clearance fit are adjusted, when adjusting the gas in air bag and being increasing, air bag volume can constantly increase, when sweeping After material process, air bag is close to drive shaft at this time, and drive shaft turns will drive driving frame rotation, so that driving frame drive is swept Expect mechanism rotation, scaling powder particle extra on lead frame is swept and drops back into receipts, avoids the waste problem of scaling powder.
Further, the side wall of gripper frame is threaded with abutting bolt, and the lower rotation of gripper frame is connected with multiple rollings The lower section of wheel, idler wheel is equipped with the affixed support plate to offset on the rack and with idler wheel.
It pushes against bolt to play the role of pushing against anchor leg frame, pushing against bolt by rotation can make abutting bolt is opposite to clamp It frames shift dynamic, pushes against moving distance of the bolt with respect to gripper frame by changing, gripper frame can be made to carry out various sizes of lead frame Clamping, use scope are wide;Support plate plays the role of supporting gripper frame, so that gripper frame when along rack transverse shifting, clamps The idler wheel of frame bottom can be rolled in the upper surface of support plate, reduce the frictional force between gripper frame and support plate, increase gripper frame Mobile fluency.
Further, sweeping through the material mechanism includes the support rod being fixed on driving outer frame wall, is axially connected on support rod multiple Brush holder support, the bottom end of brush holder support are removably connected with hairbrush, and the brush head of hairbrush is arranged towards gripper frame.
Support rod is used to support sweeping through the material mechanism, and driving frame slides laterally along rack drives support rod transverse shifting, and then band Dynamic vertical bar and hairbrush the scaling powder particle of lead top of support on gripper frame sweep it is even, it is easy to operate.
Further, the top of support rod is equipped with spreading mechanism, and spreading mechanism includes coaxially be fixed in drive shaft top the One bevel gear, the first bevel gear are engaged with the second bevel gear, and the second bevel gear is coaxially connected with the threaded rod being laterally arranged, screw thread Bar is threaded with spreading case far from one end rotation connection of the second bevel gear on the rack, on threaded rod, and the sliding of spreading case connects It connects on the rack, the bottom of spreading case is equipped with multiple feed spreading mouths.
For carrying out spreading scaling powder particle on lead frame, drive shaft turns drive co-axial affixed for spreading mechanism One bevel-gear rotating, and then the second bevel-gear rotating engaged with the first bevel gear is driven, the second bevel gear drives threaded rod to turn Dynamic, threaded rod drives the spreading case being threadedly coupled therewith during rotation, and threadingly bar moves axially, so that in spreading case Scaling powder particle is uniformly sprinkled upon on lead frame, and scaling powder particle is avoided to accumulate in leadframe surface.
Further, the lower section of gripper frame is equipped with collecting mechanism, and collecting mechanism includes friction plate, and the surface of friction plate is detachable Be connected with trichocutis, slidably connect the rubber collecting case of upper opening on trichocutis, one end of rubber collecting case and rack it Between be connected with the second support spring, the other end interval of rubber collecting case offsets with cam.
Collecting mechanism is for being collected scaling powder particle extra on lead frame, between cam is also understood during rotation The promotion rubber collecting case having a rest, so that rubber collecting case is slided along trichocutis, when cam no longer pushes rubber collecting case, rubber Collecting box reverse slide under the elastic force effect of the second support spring resets, repeatedly, so that rubber collecting case and trichocutis Friction repeatedly, so that rubber collecting case is negatively charged, the negative electricity of generation can will have hairbrush to sweep the scaling powder particle to get off to inhale Attached collection avoids scaling powder particle from being arbitrarily scattered.
Further, spring cylinder is arranged with outside the first elastic component and the second support spring.
Spring cylinder can avoid the first elastic component and the second support spring generates coiling phenomenon in telescopic process, guarantee first Effective use of support spring and the second support spring.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of die-bonding device in the embodiment of the present invention;
Fig. 2 is the top view of actuator in Fig. 1.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description include: rack 1, gripper frame 2, the first support spring 3, drive shaft 4, cam 5, Supporting block 6, driving frame 7 adjust air bag 8, push rod 9, round end 10, cylinder 11, conduit 12, push against bolt 13, idler wheel 14, support plate 15, support rod 16, brush holder support 17, hairbrush 18, the first bevel gear 19, the second bevel gear 20, threaded rod 21, spreading case 22, friction plate 23, trichocutis 24, rubber collecting case 25, the second support spring 26, lead frame 27.
Embodiment is substantially as shown in Fig. 1: die-bonding device, including rack 1, clamping device, driving mechanism, spreader Structure, sweeping through the material mechanism and collecting mechanism.
Clamping device is used to treat the lead frame 27 for spreading scaling powder particle and is clamped, and clamping device includes the company of sliding laterally The gripper frame 2 in rack 1 is connect, the side wall of gripper frame 2, which is threaded with, pushes against bolt 13, and the lower rotation of gripper frame 2 connects Seven idler wheels 14 are connected to, the lower section of idler wheel 14 is equipped with the support plate 15 that transverse weld offsets in rack 1 and with idler wheel 14, clamping It is welded with the first support spring 3 between the right end and rack 1 of frame 2, is arranged with spring cylinder outside the first support spring 3, gripper frame 2 Left side is equipped with driving mechanism.
Driving mechanism is for driving 18 relative jitter of gripper frame 2 and hairbrush, so that scaling powder particle is evenly distributed on lead In the groove of frame 27.Driving mechanism includes the drive shaft 4 that vertical rotating is connected in rack 1, and drive shaft 4 is connected with driving electricity Machine, 4 coaxial welding of drive shaft have the cam 5 intermittently to offset with gripper frame 2, and gap is arranged useful in the drive shaft 4 of 5 top of cam In the actuator of driving sweeping through the material mechanism, actuator includes sliding laterally the driving frame 7 being connected in rack 1, drives the lower section of frame 7 Equipped with the supporting block 6 being welded in drive shaft 4, supporting block 6 is used to support driving frame 7, as shown in connection with fig. 2, bonding in driving frame 7 Have and adjust air bag 8, the push rod 9 to offset with air bag is welded in drive shaft 4, push rod 9 is equipped with round end far from one end of drive shaft 4 10, round end 10 can avoid push rod and poke adjusting air bag 8, and one end that the protruding end of cam 5 is equipped with round end 10 with push rod 9 is located at The round end 10 of the both ends of same diameter in shaft, the i.e. protruding end of cam 5 and push rod 9 towards on the contrary, the left side of drive shaft 4 machine Cylinder 11 is connected on frame 1, the piston rod interval of cylinder 11 offsets with cam 5, is communicated with and leads between cylinder 11 and adjusting air bag 8 Pipe 12.
Sweeping through the material mechanism includes the support rod 16 being welded on driving 7 outer wall of frame, is axially welded with 13 on support rod 16 Brush holder support 17, the bottom end of brush holder support 17 are threaded with hairbrush 18, and the brush head of hairbrush 18 is arranged towards gripper frame 2.Support rod 16 Top is equipped with spreading mechanism, and spreading mechanism includes first bevel gear 19 of the coaxial welding on 4 top of drive shaft, the first bevel gear 19 It is engaged with the second bevel gear 20,20 coaxial welding of the second bevel gear has the threaded rod 21 being laterally arranged, and threaded rod 21 is far from second One end of bevel gear 20 is rotatably connected in rack 1 by bearing, and spreading case 22, spreading case 22 are threaded on threaded rod 21 It is slidably connected in rack 1, the bottom of spreading case 22 is equipped with multiple feed spreading mouths.
The lower section of gripper frame 2 is equipped with collecting mechanism, and collecting mechanism includes friction plate 23, and the surface of friction plate 23 is bonded hairiness Cortex 24, slidably connects the rubber collecting case 25 of upper opening on trichocutis 24, the right end and rack 1 of rubber collecting case 25 it Between be welded with the second support spring 26, spring cylinder, the left end interval of rubber collecting case 25 are also arranged with outside the second support spring 26 It offsets with cam 5.
Specific implementation process is as follows: under original state, spreading case 22 is located at the left end of threaded rod 21, adjusts in air bag 8 not It is filled with gas, 8 gap of air bag is adjusted and is set in outside drive shaft 4, support rod 16 is located at the surface of gripper frame 2.Weldering will be helped first Agent particle is placed in spreading case 22, while being rotated and being pushed against bolt 13, so that the side wall for pushing against bolt 13 relative to gripper frame 2 is mobile simultaneously Lead frame 27 is pushed against in gripper frame 2.Driving motor is then opened, drive shaft 4 rotates under the drive of driving motor, driving The rotation of axis 4 drives the first bevel gear 19 rotation affixed therewith, and the first bevel gear 19 drives the second bevel gear 20 being engaged with Rotation, and then threaded rod 21 is driven to rotate, since spreading case 22 is slidably connected in rack 1, so that threaded rod 21 was rotating Will drive spreading case 22 in journey, threadingly bar 21 moves axially, that is, moves from left to right, spreading case 22 was moving from left to right It will be on the evengranular top surface for being sprinkled upon lead frame 27 of scaling powder in journey.
Drive shaft 4, which rotates clockwise, also will drive cam 5 and rotates clockwise, and cam 5 during rotation can be intermittent Gripper frame 2 is squeezed and pushed to the right, so that gripper frame 2 moves right along rack 1, idler wheel 14 rolls to the right along support plate 15 at this time Dynamic, when cam 5, which turns to, no longer pushes against gripper frame 2, gripper frame 2 is moved to the left under the elastic force effect of the first support spring 3, Repeatedly, the left and right shake of gripper frame 2 is realized, so that the left and right shake of lead frame 27 in gripper frame 2, lead frame 27 exist The scaling powder particle on 27 surface of lead frame can be shaken in the groove of a lead frame 27 in left and right dither process, so that scaling powder Particle is preliminary to be evenly distributed in groove.
Drive shaft 4, which rotates clockwise, also will drive the rotation of push rod 9 affixed therewith, and push rod 9 will push during rotation Air bag and gripper frame 2 move gripper frame 2 along rack 1 is left and right, and the left and right movement of gripper frame 2 will drive support affixed therewith The left and right movement of bar 16, so that brush holder support 17 and the left and right movement of hairbrush 18, hairbrush 18 can be by lead in left and right moving process The scaling powder particle on 27 surface of frame carries out brush, further makes scaling powder is evengranular to be distributed in groove.Due to cam 5 One end that protruding end and push rod 9 are equipped with round end 10 is located at the both ends of same diameter in shaft, i.e., pushes gripper frame in cam 5 When 2 movement, push rod 9 will push driving frame 7, so that driving frame 7 is mobile to the mobile opposite direction of gripper frame 2, so that sweeping through the material mechanism With the direction of motion of lead frame 27 on the contrary, more conducively hairbrush 18 scaling powder particle is swept it is even.
Cam 5 when being rotated clockwise with drive shaft 4, can also it is intermittent squeeze cylinder 11 piston rod, when cam 5 squeeze When pressing piston rod, the pressure in cylinder 11 be will increase, and the gas in cylinder 11 can be blasted along conduit 12 to be adjusted in air bag 8, be made The gas that must be adjusted in air bag 8 gradually increases, and the volume for adjusting air bag 8 is gradually increased.After the completion of 18 sweeping through the material of hairbrush, adjust at this time Solar term capsule 8 no longer with 4 clearance fit of drive shaft, but is tightly attached to the surface of drive shaft 4, and the rotation of drive shaft 4, which drives, adjusts air bag 8 And driving frame 7 rotates, driving frame 7 drives support rod 16 to rotate, and then brush holder support 17 and hairbrush 18 is driven to rotate, and hairbrush 18 is rotating In the process can will be extra on lead frame 27 scaling powder particle sweep and fall.
Scaling powder particle can be fallen on down in the rubber collecting case 25 of upper opening, and cam 5 during rotation can also interval Promotion rubber collecting case 25 so that rubber collecting case 25 along trichocutis 24 slide, when cam 5 no longer pushes rubber collecting case 25 When, the reverse slide under the elastic force effect of the second support spring 26 of rubber collecting case 25 resets, repeatedly, so that rubber collecting Case 25 and the friction of trichocutis 24 repeatedly, so that rubber collecting case 25 is negatively charged, the negative electricity of generation can will have hairbrush 18 to sweep Scaling powder particle be adsorbed and collected, avoid scaling powder particle from being arbitrarily scattered.
What has been described above is only an embodiment of the present invention, the common sense such as well known specific technical solution and/or characteristic in scheme It does not describe excessively herein.It should be pointed out that for those skilled in the art, before not departing from technical solution of the present invention It puts, several modifications and improvements can also be made, these also should be considered as protection scope of the present invention, these all will not influence this Invent the effect and patent practicability implemented.The scope of protection required by this application should be based on the content of the claims, The records such as the specific embodiment in specification can be used for explaining the content of claim.

Claims (7)

1. die-bonding device, it is characterised in that: including rack, clamping device and sweeping through the material mechanism, clamping device includes laterally sliding The gripper frame of dynamic connection on the rack, is connected with the first elastic component, the other end of gripper frame between one end and rack of gripper frame Equipped with driving mechanism;Driving mechanism includes vertical rotating connection drive shaft on the rack, drive shaft be coaxially connected with interval with The cam that gripper frame offsets, gap is arranged with the actuator for driving sweeping through the material mechanism, actuator in the drive shaft above cam Mechanism is affixed with sweeping through the material, and the lower section of actuator is equipped with affixed supporting block on the driving shaft.
2. die-bonding device according to claim 1, it is characterised in that: the actuator includes sliding laterally to be connected to Driving frame in rack drives in frame and is connected with adjusting air bag, the push rod to offset with air bag is connected in drive shaft, push rod is separate One end of drive shaft is equipped with round and smooth portion, and one end that the protruding end and push rod of cam are equipped with round end is located at same diameter in shaft Both ends, the side of drive shaft is equipped with the cylinder of fixed setting, and the piston rod interval of cylinder offsets with cam, cylinder and adjusts gas Conduit is communicated between capsule.
3. die-bonding device according to claim 2, it is characterised in that: the side wall of the gripper frame is threaded with Push against bolt, the lower rotation of gripper frame is connected with multiple idler wheels, the lower section of idler wheel be equipped with it is affixed on the rack and with idler wheel phase The support plate supported.
4. die-bonding device according to claim 3, it is characterised in that: the sweeping through the material mechanism includes being fixed in driving frame Support rod on outer wall is axially connected with multiple brush holder supports on support rod, and the bottom end of brush holder support is removably connected with hairbrush, hairbrush Brush head is arranged towards gripper frame.
5. die-bonding device according to claim 4, it is characterised in that: the top of the support rod is equipped with spreader Structure, spreading mechanism include the first bevel gear for being coaxially fixed in drive shaft top, and the first bevel gear is engaged with the second bevel gear, the Two bevel gears are coaxially connected with the threaded rod being laterally arranged, and threaded rod is rotatably connected on rack far from one end of the second bevel gear On, spreading case is threaded on threaded rod, spreading case is slidably connected on the rack, and material is spilt equipped with multiple in the bottom of spreading case Mouthful.
6. -5 any die-bonding device according to claim 1, it is characterised in that: the lower section of the gripper frame, which is equipped with, receives Collecting mechanism, collecting mechanism include friction plate, and the surface of friction plate is removably connected with trichocutis, slidably connects on trichocutis The rubber collecting case of portion's opening, is connected with the second support spring between one end and rack of rubber collecting case, rubber collecting case Other end interval offsets with cam.
7. die-bonding device according to claim 6, it is characterised in that: first elastic component and the second support spring It is arranged with spring cylinder outside.
CN201810960784.0A 2018-08-22 2018-08-22 Chip welding device Active CN109148311B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810960784.0A CN109148311B (en) 2018-08-22 2018-08-22 Chip welding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810960784.0A CN109148311B (en) 2018-08-22 2018-08-22 Chip welding device

Publications (2)

Publication Number Publication Date
CN109148311A true CN109148311A (en) 2019-01-04
CN109148311B CN109148311B (en) 2020-05-12

Family

ID=64790745

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810960784.0A Active CN109148311B (en) 2018-08-22 2018-08-22 Chip welding device

Country Status (1)

Country Link
CN (1) CN109148311B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110143045A (en) * 2019-06-11 2019-08-20 淮南巧天机械设备技术有限公司 A kind of plain net face screen process press
CN110498221A (en) * 2019-09-23 2019-11-26 深圳市汉匠自动化科技有限公司 Particulate material positions feed mechanism
CN115673626A (en) * 2023-01-03 2023-02-03 深圳市盈通恒翼科技有限公司 Welding machine for processing electronic products

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209893A (en) * 1978-10-24 1980-07-01 The Bendix Corporation Solder pack and method of manufacture thereof
EP0042977A1 (en) * 1980-06-27 1982-01-06 International Business Machines Corporation Batch placement system for electronic components or chips
JPH04302461A (en) * 1991-03-29 1992-10-26 Tanaka Kikinzoku Kogyo Kk Manufacture of lead pin with solder and carbonaceous jig therefor
JPH06344132A (en) * 1993-06-10 1994-12-20 Hitachi Ltd Method and device for positioning minute soldering ball
JP2000332043A (en) * 1999-05-20 2000-11-30 Hitachi Via Mechanics Ltd Supplying apparatus of conductive balls in conductive ball mounting apparatus
JP2002110724A (en) * 2000-09-27 2002-04-12 Fuji Mach Mfg Co Ltd Apparatus and method for supplying solder ball
CN101564782A (en) * 2009-06-02 2009-10-28 武汉万邦激光金刚石工具有限公司 Automatic distributing device for brazed diamond tool
CN102105254A (en) * 2008-06-24 2011-06-22 洛科企业有限公司 Method and apparatus for solder ball placement
CN107335959A (en) * 2017-08-18 2017-11-10 重庆盛学科技有限公司 A kind of jig
CN207289120U (en) * 2017-10-11 2018-05-01 浙江宁远塔桅制造有限公司 A kind of bonding machine
CN108381102A (en) * 2018-05-21 2018-08-10 重庆市嘉凌新科技有限公司 Semiconductor welding tooling

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209893A (en) * 1978-10-24 1980-07-01 The Bendix Corporation Solder pack and method of manufacture thereof
EP0042977A1 (en) * 1980-06-27 1982-01-06 International Business Machines Corporation Batch placement system for electronic components or chips
JPH04302461A (en) * 1991-03-29 1992-10-26 Tanaka Kikinzoku Kogyo Kk Manufacture of lead pin with solder and carbonaceous jig therefor
JPH06344132A (en) * 1993-06-10 1994-12-20 Hitachi Ltd Method and device for positioning minute soldering ball
JP2000332043A (en) * 1999-05-20 2000-11-30 Hitachi Via Mechanics Ltd Supplying apparatus of conductive balls in conductive ball mounting apparatus
JP2002110724A (en) * 2000-09-27 2002-04-12 Fuji Mach Mfg Co Ltd Apparatus and method for supplying solder ball
CN102105254A (en) * 2008-06-24 2011-06-22 洛科企业有限公司 Method and apparatus for solder ball placement
CN101564782A (en) * 2009-06-02 2009-10-28 武汉万邦激光金刚石工具有限公司 Automatic distributing device for brazed diamond tool
CN107335959A (en) * 2017-08-18 2017-11-10 重庆盛学科技有限公司 A kind of jig
CN207289120U (en) * 2017-10-11 2018-05-01 浙江宁远塔桅制造有限公司 A kind of bonding machine
CN108381102A (en) * 2018-05-21 2018-08-10 重庆市嘉凌新科技有限公司 Semiconductor welding tooling

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110143045A (en) * 2019-06-11 2019-08-20 淮南巧天机械设备技术有限公司 A kind of plain net face screen process press
CN110498221A (en) * 2019-09-23 2019-11-26 深圳市汉匠自动化科技有限公司 Particulate material positions feed mechanism
CN115673626A (en) * 2023-01-03 2023-02-03 深圳市盈通恒翼科技有限公司 Welding machine for processing electronic products

Also Published As

Publication number Publication date
CN109148311B (en) 2020-05-12

Similar Documents

Publication Publication Date Title
CN109148311A (en) Die-bonding device
CN206437593U (en) A kind of automatic feed mechanism
CN206952697U (en) A kind of full-automatic double-ended steel brush flash trimmer for headrest tube
CN105151367A (en) Automatic strapping device and apparatus for sewing shoulder girdle head passing lingerie buckles
CN207143580U (en) A kind of textile process synthetic fibers cloth surface attachments cleaning plant
CN108909026A (en) Waste fluid bag automatic assembling
CN209382374U (en) Discharge bucket
CN206577321U (en) A kind of vollyball piece glue spreader and its glue spreading assembly
CN107053502A (en) A kind of processing of sapphire is with being accurately positioned cutter device
CN105883019A (en) Automatic bagging machine
CN206464172U (en) A kind of speaker frame point glue equipment
CN108500514B (en) A kind of welding fixture
CN205274478U (en) Bitter buckwheat conveying mechanism of iron of multi -disc upset magnet clearance iron fillings
CN210309249U (en) Positioning mechanism of bottom sealing plastic bag organ edge inserting machine
CN208528248U (en) A kind of horizontal equidistant nut tapping machine
CN207872238U (en) A kind of Multifunctional test tube rack
CN110548595B (en) Metal collection device among building rubbish
CN209097862U (en) A kind of plating line material-guiding wheel material conveying structure
CN211195113U (en) Adjustable rubber coating device for wrapping paper
CN210619737U (en) A sealing-tape machine deviation correcting device for production of waterproof pencil
CN211195111U (en) Rubber coating device for wrapping paper
CN205120453U (en) Coal sample distributing device
CN210501650U (en) Paper tape lubricating device for packaging paper tube production
CN207735192U (en) A kind of film bidirectional processing device
CN207174146U (en) A kind of feeder apparatus for dried beef packing machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221101

Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan

Patentee after: Luzhou Loongson Micro Technology Co.,Ltd.

Address before: 401326 no.66-75, sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing

Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD.

TR01 Transfer of patent right