CN109143030A - A kind of radio frequency DIP encapsulation socket, IC device test system and method - Google Patents
A kind of radio frequency DIP encapsulation socket, IC device test system and method Download PDFInfo
- Publication number
- CN109143030A CN109143030A CN201810866600.4A CN201810866600A CN109143030A CN 109143030 A CN109143030 A CN 109143030A CN 201810866600 A CN201810866600 A CN 201810866600A CN 109143030 A CN109143030 A CN 109143030A
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- Prior art keywords
- radio frequency
- holes
- socket
- test
- frequency dip
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- Withdrawn
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 105
- 238000000034 method Methods 0.000 title abstract description 7
- 238000005538 encapsulation Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 claims abstract description 41
- 239000004020 conductor Substances 0.000 claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 8
- 238000011056 performance test Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- VTLYHLREPCPDKX-UHFFFAOYSA-N 1,2-dichloro-3-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1Cl VTLYHLREPCPDKX-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to RFCO2 laser component technical fields, more particularly to a kind of radio frequency DIP encapsulation socket, IC device test system and method, it includes: metal shell that radio frequency DIP, which encapsulates socket, dielectric and inner conductor contact pin, wherein, multiple through-holes are respectively arranged on the first face and the second face of metal shell, wherein, first face and the second face are two opposite faces of metal shell, and the through-hole on two opposite faces is corresponding；Inner conductor contact pin is more, is respectively inserted in multiple through-holes in the first face of metal shell, and stretch out from multiple through-holes in the second face of metal shell, and extension is formed；Dielectric is filled in metal shell, and dielectric wraps up inner conductor contact pin.Radio frequency DIP encapsulation socket, IC device test system and method provided in an embodiment of the present invention, facilitate multi-channel rf IC component to realize automatic test, improve the testing efficiency of RFCO2 laser component.
Description
Technical Field
The invention relates to the technical field of radio frequency IC components, in particular to a radio frequency DIP packaging socket, an IC component testing system and a method.
Background
With the explosive development of the radio frequency IC industry, the yield of radio frequency IC products is increasing. The traditional manual test has low efficiency of testing radio frequency IC products, and the traditional manual test cannot meet the requirements.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides a radio frequency DIP packaging socket, an IC device testing system and a method.
The technical scheme for solving the technical problems is as follows: a radio frequency DIP package socket, comprising: a metal housing, an insulating medium and an inner conductor pin, wherein,
the first surface and the second surface of the metal shell are respectively provided with a plurality of through holes, wherein the first surface and the second surface are two opposite surfaces of the metal shell, and the through holes on the two opposite surfaces are corresponding to each other;
the inner conductor contact pins are inserted into the through holes on the first surface of the metal shell respectively and extend out of the through holes on the second surface of the metal shell to form an extending part;
the metal shell is filled with the insulating medium, and the insulating medium wraps the inner conductor contact pin.
The invention has the beneficial effects that: the radio frequency DIP packaging socket provided by the invention has the advantages of small volume, light weight and weldability, can meet 50-ohm characteristic impedance matching, can be used in a temperature range of-55 ℃ to +125 ℃, is convenient for realizing automatic testing of a plurality of radio frequency IC components, and improves the testing efficiency of the radio frequency IC components.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, the through holes on the first surface of the metal shell and the through holes on the second surface of the metal shell are respectively arranged in a straight shape or a two-straight shape.
The beneficial effect of adopting the further scheme is that: in order to better adapt the pin arrangement of the IC device to be measured.
Further, when the through holes are four through holes, the four through holes are arranged in a straight line shape, the two through holes on two opposite sides of the two opposite surfaces are used as signal holes for coaxially transmitting radio frequency signals, and the two through holes in the middle are grounding holes, so that good grounding in the process of coaxially transmitting the radio frequency signals is ensured.
The beneficial effect of adopting the further scheme is that: to realize the test of a radio frequency IC device and ensure the test effect.
Furthermore, the diameter of each inner conductor pin is 0.1-1 mm.
The beneficial effect of adopting the further scheme is that: for better adaptation of the pin diameter of the IC device to be measured.
Further, the metal casing is a cuboid structure, and the first surface and the second surface of the metal casing are an upper bottom surface and a lower bottom surface respectively.
Another technical solution of the present invention for solving the above technical problems is as follows: a test plate, comprising: a PCB board, a test plug, and a radio frequency DIP package socket as in any of the above embodiments, wherein,
the radio frequency DIP packaging socket is fixed on the PCB through the extending part of the inner conductor contact pin, and no solder mask layer is arranged on the PCB at the position for fixing the radio frequency DIP packaging socket;
and inner conductor contact pins in a signal hole of the radio frequency DIP packaging socket are taken as a signal input end and a signal output end and are welded with the test plug after being led out from the PCB.
The invention has the beneficial effects that: by welding the radio frequency DIP packaging socket in the embodiment 1 on the PCB, the electrical performance function of a multipath radio frequency IC device can be tested under the condition of no welding of components and parts and by means of additional radio frequency switch control, the problem of connection between an automatic test product of the radio frequency IC device and a clamp is solved, and the test efficiency is greatly improved.
On the basis of the technical scheme, the invention can be further improved as follows.
Furthermore, the radio frequency DIP packaging socket is inserted or welded on the PCB through the extending part of the inner conductor contact pin.
Another technical solution of the present invention for solving the above technical problems is as follows: an IC device test system, comprising: a tester and a test board as described in the above examples, wherein,
the IC device to be tested is inserted in a radio frequency DIP packaging socket of the test board;
and the test plug of the test board is connected with the tester so as to test the performance of the IC device to be tested.
The invention has the beneficial effects that: the IC device to be tested is inserted into the radio frequency DIP packaging socket of the test board, and the test plug of the test board is connected with the tester, so that the performance test of the IC device can be performed, the problem of connection between an automatic test product of the radio frequency IC device and the clamp is solved, and the test efficiency is improved.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, still include: and the pressing plate is positioned above the IC device to be tested and is fixed on the PCB of the testing board, so that the IC device to be tested is in good contact with the radio frequency DIP packaging socket.
The beneficial effect of adopting the further scheme is that: the pressing plate is arranged above the IC device to be tested, so that the IC device to be tested can be in better contact with the radio frequency DIP packaging socket, and the testing effect is better.
Another technical solution of the present invention for solving the above technical problems is as follows: an IC device testing method, comprising:
fixing the radio frequency DIP packaging socket on a PCB board through the extending part of the inner conductor contact pin, wherein the position for fixing the radio frequency DIP packaging socket on the PCB board is free of a solder mask layer;
leading out an inner conductor contact pin in a signal hole of the radio frequency DIP packaging socket from the PCB as a signal input end and a signal output end, and welding the test plug;
inserting an IC device to be tested on the radio frequency DIP packaging socket;
pressing the IC device to be tested and the radio frequency DIP packaging socket by using a pressing plate;
and connecting the test plug with a tester to test the performance of the IC device to be tested.
The invention has the beneficial effects that: the radio frequency DIP packaging socket is fixed at the position without a solder mask layer on a PCB board through the extension part of the inner conductor contact pin, the inner conductor contact pin in the signal hole of the radio frequency DIP packaging socket is taken as a signal input end and a signal output end to be led out from the PCB board and then a test plug is welded, an IC device to be tested is inserted on the radio frequency DIP packaging socket, the IC device to be tested is tightly pressed with the radio frequency DIP packaging socket by utilizing a pressing plate, the test plug is connected with a tester, the performance test is carried out on the IC device to be tested, the problem of connection between an automatic test product of the radio frequency IC device and a clamp is solved, and the test efficiency is improved.
Additional aspects of the invention and its advantages will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention or in the description of the prior art will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an rf DIP package socket according to an embodiment of the present invention;
fig. 2 is a top view of an rf DIP package socket according to another embodiment of the present invention;
FIG. 3 is a schematic view of a test board according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an IC device testing system according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an IC device testing system according to another embodiment of the present invention;
fig. 6 is a flowchart illustrating an IC device testing method according to an embodiment of the present invention.
Reference numerals:
100. radio frequency DIP packaging socket
10. Metal shell
11. First side of metal shell 10
12. Second surface of metal case 10
20. Insulating medium
30. Inner conductor contact pin
31. Extension part
200. Test board
40. PCB board
50. Test plug
51. Cable plug
52. Connecting cable
300. IC device test system
60. Test instrument
70. IC device to be tested
80. Pressing plate
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.
Example 1
A radio frequency DIP package socket 100 as shown in fig. 1, comprising: a metal shell 10, an insulating medium 20 and an inner conductor pin 30. Wherein,
the first surface 11 and the second surface 12 of the metal case 10 are provided with a plurality of through holes (not shown), respectively. The first surface 11 and the second surface 12 are two opposite surfaces of the metal shell, and the through holes on the two opposite surfaces correspond to each other. The plurality of inner conductor pins 30 are inserted into the plurality of through holes of the first surface 11 of the metal shell 10, and extend out of the plurality of through holes of the second surface 12 of the metal shell 10 to form extending portions 31. The metal shell 10 is filled with an insulating medium 20, and the insulating medium 20 wraps the inner conductor pin 30.
Specifically, in this embodiment, the metal housing 10 has a rectangular parallelepiped structure, for example: each face of the metal housing 10 may be a rounded rectangle. The first surface 11 and the second surface 12 of the metal case 10 are an upper bottom surface and a lower bottom surface, respectively. The number of the through holes on the upper bottom surface and the lower bottom surface is the same, and the through holes are corresponding in position. The number of vias on each side is the same as the number of inner conductor pins.
Optionally, the plurality of through holes on the first surface 11 of the metal shell 10 and the plurality of through holes on the second surface 12 of the metal shell 10 are respectively arranged in a straight line or a two-line shape. It should be noted that, in this embodiment, the number of the through holes is determined by the number of pins of the IC device to be tested; the distance between the through holes is determined by the distance between pins of the IC device to be tested; the diameter of the through hole is determined by the diameter of a pin of the IC device to be tested; the arrangement mode of the through holes is determined by the arrangement mode of pins of the IC device to be tested. Therefore, in this embodiment, the size of the rf DIP package socket is determined according to the package size of the IC device to be tested.
Specifically, in this embodiment, as shown in fig. 2, when the plurality of through holes are four through holes, the four through holes are arranged in a straight line, two through holes on two opposite sides of the two opposite surfaces are used as signal holes for coaxially transmitting radio frequency signals, and two through holes in the middle are ground holes, so as to ensure good grounding during the coaxial transmission of the radio frequency signals.
Alternatively, the diameter of each inner conductor pin 30 may take on the value of 0.1-1 mm. Preferably, in this embodiment, the diameter d1 of each inner conductor pin 30 is 0.5mm and the pitch d2 of the through holes is 2.54 mm. The dimensions (length, width, height) of the metal housing 10 are: 11mm 4.6mm 6.3.
It should be understood that the above data are merely exemplary embodiments of the present invention, i.e. a size of the rf DIP package socket according to the present invention, and do not limit the embodiments of the present invention in any way. That is, the radio frequency DIP package socket in the present invention may have other sizes as long as it can be adapted to the package size of the IC device to be tested.
The radio frequency DIP packaging socket provided in the embodiment has the advantages of small volume, light weight and weldability, can meet 50-ohm characteristic impedance matching, can be used within the temperature range of-55 ℃ to +125 ℃, is convenient for realizing automatic testing of multiple radio frequency IC components, and improves the testing efficiency of the radio frequency IC components.
Example 2
A test board 200 as shown in fig. 3, comprising: PCB board 40, test plug 50 and rf DIP package socket 100 in example 1. Wherein,
the radio frequency DIP package socket 100 is fixed on the PCB board 40 through the extension 31 of the inner conductor pin 30, and there is no solder mask layer at the position on the PCB board 40 where the radio frequency DIP package socket 100 is fixed.
The inner conductor pins 30 in the signal holes of the radio frequency DIP package socket 100 are taken as signal input ends and signal output ends and are led out from the PCB 40, and then the test plug 50 is welded.
Specifically, in this embodiment, the rf DIP package socket 100 may be plugged or soldered on the PCB board 40 through the extension 31 of the inner conductor pin 30. The radio frequency DIP packaging socket is welded on the position of the PCB without the solder mask layer, so that the bottom of the radio frequency DIP packaging can be fully grounded.
According to the test board provided by the embodiment, the radio frequency DIP packaging socket in the embodiment 1 is welded on the PCB, the radio frequency switch control is added under the condition that components are not welded, the electrical performance function of a multipath radio frequency IC device can be tested, the problem of connection between an automatic test product of the radio frequency IC device and a clamp is solved, and the test efficiency is greatly improved.
Example 3
An IC device testing system 300, as shown in fig. 4, includes: the tester 60 and the test board 200 in example 2. Wherein,
the IC device 70 to be tested is plugged into the rf DIP package socket 100 of the test board 200.
The test plug 50 of the test board 200 is connected to the tester 60 to perform a performance test on the IC device 70 to be tested.
Specifically, in this embodiment, the test plug 50 and the tester 60 may be connected by the connection cable 52 and the cable plug 51, and the test plug 50 and the cable plug 51 may be connected by a plug-in connection, but the embodiment of the present invention is not limited thereto.
In the IC device testing system provided in the above embodiment, the IC device to be tested is inserted into the radio frequency DIP package socket of the testing board, and the testing plug of the testing board is connected to the tester, so that the performance test of the IC device can be performed, the problem of connection between an automatic testing product of the radio frequency IC device and the clamp is solved, and the testing efficiency is improved.
Optionally, as shown in fig. 5, the IC device testing system 300 may further include: a pressure plate 80. The pressing plate 80 is positioned above the IC device to be tested 70 and fixed on the PCB board 40 of the testing board 200 such that the IC device to be tested 70 is in good contact with the rf DIP package socket 100.
Specifically, in this embodiment, the pressing plate 80 may be fixed to the PCB board 40 of the test board 200 by screws, but the embodiment of the present invention is not limited thereto. The platen 80 may cover only the IC device 70 to be tested. The pressing plate 80 can also be adapted to the PCB 40 to cover the IC device to be tested 70 and the test plug 50, and at this time, a through hole is formed at a position of the pressing plate 80 corresponding to the test plug 50 to allow the test plug, the cable plug and the test cable to pass through.
According to the IC device testing system provided by the embodiment, the pressing plate is arranged above the IC device to be tested, so that the IC device to be tested is in better contact with the radio frequency DIP packaging socket, and the testing effect is better.
Example 4
An IC device testing method 400 as shown in fig. 6, comprising:
100. the radio frequency DIP package socket in embodiment 1 is fixed on the PCB board through the extension of the inner conductor pin, and there is no solder mask layer at the position of fixing the radio frequency DIP package socket on the PCB board.
120. And leading out an inner conductor contact pin in a signal hole of the radio frequency DIP packaging socket from the PCB as a signal input end and a signal output end, and welding a test plug.
130. And plugging the IC device to be tested on a radio frequency DIP packaging socket.
140. And pressing the IC device to be tested and the radio frequency DIP packaging socket by using a pressing plate.
150. And connecting the test plug with a tester to test the performance of the IC device to be tested.
In the IC device testing method provided in the above embodiment, the radio frequency DIP package socket is fixed at a position without a solder mask layer on the PCB through the extension portion of the inner conductor pin, the inner conductor pin in the signal hole of the radio frequency DIP package socket is led out from the PCB as the signal input end and the signal output end, and then the test plug is welded, the IC device to be tested is plugged in the radio frequency DIP package socket, the IC device to be tested is pressed against the radio frequency DIP package socket by the pressing plate, and the test plug is connected with the tester to perform the performance test on the IC device to be tested, thereby solving the problem of connection between an automatic test product of the radio frequency IC device and the clamp, and improving the testing efficiency.
In addition, in step 110, the position on the PCB where the radio frequency DIP package socket is fixed is free of solder mask layer, so as to ensure sufficient grounding of the bottom of the radio frequency DIP package; in step 140, the IC device to be tested and the radio frequency DIP package socket are pressed tightly by the pressing plate, so that the IC device to be tested and the radio frequency DIP package socket are in better contact, and the testing effect is better.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A radio frequency DIP package socket, comprising: a metal housing, an insulating medium and an inner conductor pin, wherein,
the first surface and the second surface of the metal shell are respectively provided with a plurality of through holes, wherein the first surface and the second surface are two opposite surfaces of the metal shell, and the through holes on the two opposite surfaces are corresponding to each other;
the inner conductor contact pins are inserted into the through holes on the first surface of the metal shell respectively and extend out of the through holes on the second surface of the metal shell to form an extending part;
the metal shell is filled with the insulating medium, and the insulating medium wraps the inner conductor contact pin.
2. The radio frequency DIP package socket according to claim 1, wherein the through holes of the first surface of the metal shell and the through holes of the second surface of the metal shell are respectively arranged in a straight line shape or a two-line shape.
3. The rf DIP package socket according to claim 2, wherein when the plurality of through holes are four through holes, the four through holes are arranged in a straight line, two through holes on two sides of the two opposite surfaces are used as signal holes for coaxially transmitting rf signals, and two through holes in the middle are used as grounding holes to ensure good grounding during coaxial transmission of the rf signals.
4. The radio frequency DIP package socket according to any of claims 1 to 3, wherein each of the inner conductor pins has a diameter of 0.1-1 mm.
5. The radio frequency DIP package socket according to any of claims 1 to 3, wherein the metal housing has a rectangular parallelepiped shape, and the first and second surfaces of the metal housing are upper and lower bottom surfaces, respectively.
6. A test board, comprising: the PCB board, the test plug, and the RF DIP package socket of any of claims 1-5,
the radio frequency DIP packaging socket is fixed on the PCB through the extending part of the inner conductor contact pin, and no solder mask layer is arranged on the PCB at the position for fixing the radio frequency DIP packaging socket;
and inner conductor contact pins in a signal hole of the radio frequency DIP packaging socket are taken as a signal input end and a signal output end and are welded with the test plug after being led out from the PCB.
7. The test board of claim 6, wherein the RF DIP package socket is plugged or soldered onto the PCB board through the extension of the inner conductor pins.
8. An IC device test system, comprising: a tester and a test board according to claim 6 or 7,
the IC device to be tested is inserted in a radio frequency DIP packaging socket of the test board;
and the test plug of the test board is connected with the tester so as to test the performance of the IC device to be tested.
9. The IC device test system of claim 8, further comprising: and the pressing plate is positioned above the IC device to be tested and is fixed on the PCB of the testing board, so that the IC device to be tested is in good contact with the radio frequency DIP packaging socket.
10. An IC device testing method, comprising:
fixing the radio frequency DIP package socket of any one of claims 1-5 on a PCB board through the extension parts of the inner conductor pins, wherein no solder mask layer is arranged on the PCB board at the position for fixing the radio frequency DIP package socket;
leading out an inner conductor contact pin in a signal hole of the radio frequency DIP packaging socket from the PCB as a signal input end and a signal output end, and welding the test plug;
inserting an IC device to be tested on the radio frequency DIP packaging socket;
pressing the IC device to be tested and the radio frequency DIP packaging socket by using a pressing plate;
and connecting the test plug with a tester to test the performance of the IC device to be tested.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810866600.4A CN109143030A (en) | 2018-08-01 | 2018-08-01 | A kind of radio frequency DIP encapsulation socket, IC device test system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810866600.4A CN109143030A (en) | 2018-08-01 | 2018-08-01 | A kind of radio frequency DIP encapsulation socket, IC device test system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109143030A true CN109143030A (en) | 2019-01-04 |
Family
ID=64799506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810866600.4A Withdrawn CN109143030A (en) | 2018-08-01 | 2018-08-01 | A kind of radio frequency DIP encapsulation socket, IC device test system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109143030A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917301A (en) * | 2021-10-09 | 2022-01-11 | 中国电子科技集团公司第二十九研究所 | Automatic test method of radio frequency product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202126447U (en) * | 2011-06-30 | 2012-01-25 | 上海韬盛电子科技有限公司 | Testing socket controllable in impedance |
| CN106841997A (en) * | 2017-03-20 | 2017-06-13 | 上海与德科技有限公司 | Radio frequency testing encapsulating structure and radio frequency test method |
| CN107247163A (en) * | 2017-06-13 | 2017-10-13 | 睿力集成电路有限公司 | A kind of integrated circuit component test jack and test platform |
| US20180003754A1 (en) * | 2016-06-29 | 2018-01-04 | Infineon Technologies Ag | Device, system and method for automatic test of integrated antennas |
-
2018
- 2018-08-01 CN CN201810866600.4A patent/CN109143030A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202126447U (en) * | 2011-06-30 | 2012-01-25 | 上海韬盛电子科技有限公司 | Testing socket controllable in impedance |
| US20180003754A1 (en) * | 2016-06-29 | 2018-01-04 | Infineon Technologies Ag | Device, system and method for automatic test of integrated antennas |
| CN106841997A (en) * | 2017-03-20 | 2017-06-13 | 上海与德科技有限公司 | Radio frequency testing encapsulating structure and radio frequency test method |
| CN107247163A (en) * | 2017-06-13 | 2017-10-13 | 睿力集成电路有限公司 | A kind of integrated circuit component test jack and test platform |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917301A (en) * | 2021-10-09 | 2022-01-11 | 中国电子科技集团公司第二十九研究所 | Automatic test method of radio frequency product |
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Application publication date: 20190104 |