CN109140927A - Chip drying mechanism - Google Patents
Chip drying mechanism Download PDFInfo
- Publication number
- CN109140927A CN109140927A CN201810968852.8A CN201810968852A CN109140927A CN 109140927 A CN109140927 A CN 109140927A CN 201810968852 A CN201810968852 A CN 201810968852A CN 109140927 A CN109140927 A CN 109140927A
- Authority
- CN
- China
- Prior art keywords
- voussoir
- chip
- drying
- cavity
- partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
- F26B9/06—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in stationary drums or chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/005—Treatment of dryer exhaust gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/08—Parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The present invention relates to the drying equipment fields of chip, disclose chip drying mechanism, drying tank including upward opening, parallel and cross direction profiles at least two sides partitions are equipped in drying tank, there is gap between adjacent separator and form slot, it is equipped with cavity in partition, heat source is mounted in cavity, and the cavity wall of cavity is equipped with the louver communicated with slot；Partition is equipped with the fixed cell for keeping the distance between chip disk body and partition.It is able to solve the problem of vapor caused by existing stacked drying structure is not easy to distribute, influences processing efficiency and processing quality through the invention.
Description
Technical field
The present invention relates to the drying equipment fields of chip, and in particular to a kind of chip drying mechanism.
Background technique
When processing chip, since the usual volume specification of chip is smaller, chip loses in process in order to prevent, mesh
Before unified chip is fixed on one plus the biggish disk body of volume process, disk body serves as the carrier of chip, is chip
Movement and processing provide convenience.
During processing chip, after performing etching chip, need to clean the surface of chip, with
Impurity is avoided to be deposited in the processing quality on chip and influencing chip.After the completion of cleaning, need to dry chip, to avoid
Moisture remains on chip and causes the corrosion of chip structure.
It is existing usually stacked to the drying unit of chip, i.e., the disk body after etch cleaner is stacked and placed layer by layer
In being dried in drying box, although there are gaps between adjacent discs, during drying, vapor be from it is lower to
What upper movement distributed, thus the vapor that lower layer's disk body gives out is easy the blocking by upper layer disk body and the heap on the disk body of upper layer
It is stagnant to stay, to affect the speed that distributes of vapor, and influence is caused on the processing quality of the chip on the disk body of upper layer, both
Processing efficiency is reduced, and reduces processing quality.
Summary of the invention
The invention is intended to provide chip drying mechanism, it is not easy with solving vapor caused by existing stacked drying structure
The problem of distributing, influencing processing efficiency and processing quality.
In order to achieve the above objectives, the present invention adopts the following technical scheme: chip drying mechanism, the drying including upward opening
Slot, drying tank is interior to be equipped with parallel and cross direction profiles at least two sides partitions, has gap between adjacent separator and forms slot, every
It is equipped with cavity in plate, heat source is mounted in cavity, and the cavity wall of cavity is equipped with the louver communicated with slot；On partition
Equipped with for keeping the fixed cell of the distance between chip disk body and partition.
The principle of this programme is: when practical application, partition is separated to the chip disk body that will need to dry in order to support
Disk carries out drying processing respectively, and the vapor reduced between adjacent discs influences.Heat source is equipped in partition simultaneously, can be guaranteed pair
The drying effect of disk body in each slot.And fixed cell is additionally provided on partition, the disk body of processing can be fixed, with
It avoids pallet from enabling chip is heated to impact excessively and to the quality of chip on heat source, while keeping disk body and heat source
Distance promotes the chip on pallet to be able to preferably contact with hot-fluid and carry out uniformly drying comprehensively.
Using the invention has the advantages that
1, using horizontal and simultaneously column distribution slot, so that when disk body is oven-dried on different vertical directions, in this way,
The directly upper ease discharge of the vapor of evaporation, without being deposited on the disk body of upper layer, efficiently solve vapor be not easy to distribute and
The problem of being accumulated on the disk body of upper layer.
2, it will be separated between adjacent discs using partition, so that the vapor between reducing adjacent slots influences, guaranteed each
The independent effectively drying of a disk body.
3, disk body can be fixed in the fixing piece on partition, the distance between disk body and partition are kept, to avoid
Heat source in disk body and partition is closer and keeps the chip on disk body heated excessive and aging occurs, and there is protection to make chip
With guaranteeing the processing quality of chip.
Preferably, as an improvement, fixed cell includes sliding part and movable part, and sliding slot, sliding are equipped at the top of partition
Part sliding is set in sliding slot, and sliding part is equipped with fixed wedge surface；Movable part includes connecting plate, and sliding is equipped with first on connecting plate
Voussoir and the second voussoir, are connected with spring between the first voussoir and the second voussoir, the first voussoir is equipped with the first wedge surface, the second wedge
Block is equipped with the second wedge surface with the first wedge surface face, and the second wedge surface and the first wedge surface are distributed in "eight" shape, the top of partition
Portion is in the first wedge surface and the wedge shape of the second wedge surface cooperation and between the first voussoir and the second voussoir.Sliding part is in cunning
It slides and movable part is fixed, the fixed installation in order to movable part to disk body in slot.When fixed wedge surface squeezes first wedge
When block and the second voussoir, the wedge surface of the first voussoir and the second voussoir along partition upper end slides and the upper end of partition is made to be caught in first wedge
Between block and the second voussoir, while being caught in for partition squeezes the first voussoir and the second voussoir and is separated from each other, and make the first voussoir and
Second voussoir moves respectively to the slot of partition two sides, and is pushed against on the disk body in slot, and the two sides of disk body is by movable part
After abutting, the fixed clamp to disk body two sides is realized, so that disk body keeps upright state, on the one hand conducive to the comprehensive uniform of disk body
It is heated, on the other hand guarantee the access of the upward loss of vapor, evaporated upwards conducive to vapor, disk body is avoided to tilt and stop water
The loss of steam guarantees drying efficiency and dries quantity.
Preferably, as an improvement, sliding is equipped with negative tube on drying tank, and negative tube is connected with negative pressure mechanism.Negative pressure
The rapid evaporation for accelerating the flowing of hot-fluid in drying tank for absorption discharge vapor and promoting vapor is managed, with guarantee to disk
The drying effect of body, negative pressure mechanism are used to keep the vacuum effect of negative tube, guarantee to act on the continuous negative pressure of drying tank.
Preferably, as an improvement, the bottom of drying tank is movably equipped with bottom plate, connects between bottom plate and the cell wall of drying tank
It is connected to telescoping tube, and bottom plate is connected with reciprocating mechanism.Reciprocating mechanism to drive bottom plate to move back and forth, protect by telescoping tube
Bottom plate is held to the sealing effect of drying trench bottom, so that the volume of drying tank becomes larger and can contain more when bottom plate sinks
More hot gas accelerates the drying to disk body to enhance the drying effect to disk body, and when bottom plate rises, bottom plate pushes drying tank
It is inside mixed with a large amount of hot gas discharge of vapor, to avoid vapor from accumulating for a long time in drying tank and influence the baking to disk body
Dry efficiency.
Preferably, as an improvement, reciprocating mechanism includes rotating the lead screw being set on drying tank, fixed on lead screw
There is reel, drawstring is wound on reel, drawstring is fixed on bottom plate far from one end of reel；Cunning is installed on negative tube
Set, sliding sleeve are sheathed on lead screw and are threadedly engaged between lead screw.When negative tube reciprocatingly slides on drying tank, pass through sliding sleeve
Lead screw reciprocating rotary is driven, so that bottom plate movement is pulled by drawstring, so that bottom plate is under the pulling of drawstring when drawstring is received in short-term
Rise, when drawstring is released, bottom plate sinks under the gravity of itself, is achieved in the motion control to bottom plate, realizes
To the automatic control and adjustment of bottom plate.
Preferably, as an improvement, lead screw, reel and drawstring are equipped with corresponding two groups, and two groups of drawstrings connect respectively
It connects at the both ends of bottom plate.Two groups of lead screws and reel respectively pull the both ends of bottom plate, to be conducive to bottom plate held stationary
Ground is mobile, avoids bottom plate run-off the straight and causes the invalid exhaust to drying tank.
Preferably, as an improvement, the slot of negative tube and drying tank is connected with expansion plate between, is equipped in expansion plate
Cavity, cavity are communicated with hot body, and cavity is equipped with hot wind hole towards the position in drying tank.When negative tube is mobile, band
Expansion plate moving telescopic is led, so that the cavity interval in expansion plate inculcates hot wind into drying tank and by the vapor in drying tank
Interval is discharged.When bottom plate sinks, hot wind is rapidly entered in drying tank by expansion plate and is filled up drying tank, guarantees drying tank pair
The drying effect of disk body.When bottom plate rises, expansion plate shrinks and stops pouring into hot wind to drying tank, so that vapor is outside
Quick diffusing, to accelerate to improve processing efficiency to the drying rate of disk body.
Detailed description of the invention
Fig. 1 is the top view of the embodiment of the present invention.
Fig. 2 is sectional view along A-A in Fig. 1.
Fig. 3 is the enlarged drawing of part A0 in Fig. 2.
Fig. 4 is state diagram when expansion plate is unfolded.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail:
Appended drawing reference in Figure of description includes: drying tank 1, partition 2, slot 3, cavity 4, louver 5, sliding slot 6, slides
Moving part 7, the second voussoir 9, negative tube 10, sliding sleeve 11, bottom plate 12, telescoping tube 13, lead screw 14, reel 15, is drawn first voussoir 8
Rope 16, expansion plate 17, disk body 18, connecting plate 19.
Implementation such as Fig. 1 and Fig. 2 are jointly shown: chip drying mechanism, the drying tank 1 including upward opening, in drying tank 1
There is gap equipped with parallel and cross direction profiles seven face partition 2, between adjacent separator 2 and form slot 3, seven face partitions 2 are in total
Six slots 3 are formed, the disk body 18 for being equipped with chip for placing six faces of drying.It is equipped with cavity 4 in partition 2, in cavity 4
Heat source is installed, the heat source in the present embodiment uses heating wire, and the cavity wall of cavity 4 is equipped with the louver communicated with slot 3
5.Sliding slot 6 is equipped at the top of partition 2.Partition 2 is equipped with the fixed cell for keeping the distance between disk body 18 and partition 2.
Fixed cell includes sliding part 7 and movable part, and the sliding of sliding part 7 is set in sliding slot 6, and sliding part 7 is equipped with admittedly
Determine wedge surface.As shown in connection with fig. 3, movable part includes connecting plate 19, and sliding is equipped with the first voussoir 8 and the second voussoir 9 on connecting plate 19,
Be connected with spring between first voussoir 8 and the second voussoir 9, the first voussoir 8 is equipped with the first wedge surface, the second voussoir 9 be equipped with
Second wedge surface of the first wedge surface face, and the second wedge surface and the first wedge surface are distributed in "eight" shape.The top of partition 2 is in and first
Wedge surface and the second wedge surface cooperation wedge shape and between the first voussoir 8 and the second voussoir 9.
The notch of drying tank 1, which also slides, is equipped with negative tube 10, and negative tube 10 is connected with negative pressure mechanism, negative pressure in the present embodiment
Mechanism uses negative-pressure air fan, and negative tube 10 is connected with cylinder.As shown in connection with fig. 4, the slot of negative tube 10 and drying tank 1 is between
It is connected with expansion plate 17, expansion plate 17 includes the multi-panel plate body being successively slidably connected, the slip connection mode between adjacent plate body
It is identical as the slip connection mode of daily middle drawer, it is the prior art, this will not be repeated here.Cavity, cavity are equipped in expansion plate 17
It is communicated with hot body, the hot body in the present embodiment uses air-heater.Cavity is equipped with heat towards the position in drying tank 1
Air holes.As shown in Fig. 2, the bottom of drying tank 1 is movably equipped with bottom plate 12, it is connected with and stretches between bottom plate 12 and the cell wall of drying tank 1
The draw 13, the telescoping tube 13 in the present embodiment uses bellows, and bottom plate 12 is connected with reciprocating mechanism.
Reciprocating mechanism includes two lead screws 14 that 1 both ends of drying tank are set to by bearing rotation, equal spiral shell on lead screw 14
Bolt is fixed with reel 15, and drawstring 16 is wound on reel 15, and drawstring 16 is separately fixed at far from one end of reel 15
On the both ends of bottom plate 12.Sliding sleeve 11 is installed on negative tube 10, sliding sleeve 11 is sheathed on lead screw 14 and the screw thread between lead screw 14
Cooperation.
In the present embodiment, when practical application, the disk body 18 dried will be needed to be inserted vertically into slot 3 one by one, 6 groups along the chute
Dynamic sliding part 7, slides sliding part 7 to connecting plate 19, and the fixation wedge surface on sliding part 7 is against on connecting plate 19, to squeeze
Connecting plate 19 makes connecting plate 19 move close to partition 2 and partition 2 is enabled to be inserted between the first voussoir 8 and the second voussoir 9.Partition 2
When insertion, the wedge surface on 2 top of partition jacks up the first voussoir 8 and the second voussoir 9 outward, the first voussoir 8 and the second voussoir 9 difference
It is against on the disk body 18 of two sides, the one side of disk body 18 is fixed, another group of the first voussoir 8 and the second voussoir 9 are also according to above-mentioned
Principle course motion, and the another side of disk body 18 is fixed, being achieved in the abutting two-sided to disk body 18 fixes, and guarantees to disk body
18 fixed effect prevents disk body 18 from tilting and vapor is stopped upward and outward to distribute, conducive to the quick discharge of vapor.
Heating wire in partition 2 starts to generate heat, and hot-fluid is via right in the entrance slot 3 of louver 5 in the cavity wall of cavity 4
Disk body 18 is dried.Since disk body 18 is fixed there is gap between partition 2, had both prevented disk body 18 by louver 5
It blocks, conducive to flowing of the hot-fluid in drying tank 1, and prevents chip from closely being influenced that aging occurs by high temperature very much apart from partition 2,
Guarantee the drying effect of chip.
Start cylinder, cylinder drives negative tube 10 to move back and forth on drying tank 1, effect of the negative tube 10 in negative-pressure air fan
Under to drying tank 1 carry out vapor absorption avoid vapor from persistently accumulating in drying tank 1 so that vapor is quickly drained
And influence the drying efficiency of chip.Meanwhile referring to shown in Fig. 4, negative tube 10 drives expansion plate 17 to stretch, and expansion plate 17 will dry
The notch of slot 1 blocks, and avoids the excessive loss of hot-fluid and causes the waste of the energy, improves the utilization rate to hot-fluid.Air-heater simultaneously
Hot wind is inculcated into the cavity of expansion plate 17, air-flow is from top to bottom blown into drying tank 1 via the hot wind hole on expansion plate 17, with
Promote the flowing of gas in drying tank 1, the samming environment in drying tank 1 is kept, conducive to the uniform drying of disk body 18.
While negative tube 10 is mobile to stretch expansion plate 17, sliding sleeve 11 follows mobile and lead screw 14 is pushed to rotate, silk
Thick stick 14 is rotated and is discharged by reel 15 to drawstring 16, and bottom plate 12 sinks under the effect of gravity and enables drying tank 1 at this time
Volume increase, when guaranteeing expansion plate 17 into drying tank 1 into hot wind, the vapor of accumulation can be squeezed and be drained, guaranteed
The discharge effect of vapor.When negative tube 10 moves backward, lead screw 14 is pushed to reversely rotate and enable reel 15 to drawstring 16
Be wound, so that bottom plate 12 be promoted, bottom plate 12 is lifted and squeezes the air-flow in drying tank 1 so that gushed on air-flow is a large amount of and
Accelerate draining for vapor, thus solves the problems, such as that vapor is accumulated, improve the drying efficiency of disk body 18.
During bottom plate 12 is mobile, telescoping tube 13 is flexible and keeps the sealing between bottom plate 12 and the cell wall of drying tank 1
Connection, to guarantee the drying effect to disk body 18.
When practical application, for the ease of the placement of disk body 18, transverse slat is additionally provided in drying tank 1, transverse slat is equipped with multiple
Through-hole, when placing disk body 18, the lower end of disk body 18 contacts with transverse slat and is supported by transverse slat, while through-hole can be convenient for drying
The flowing of 1 interior air-flow of slot guarantees to dry the Quick uniform of disk body 18.
What has been described above is only an embodiment of the present invention, the common sense such as well known specific technical solution and/or characteristic in scheme
It does not describe excessively herein.It should be pointed out that for those skilled in the art, before not departing from technical solution of the present invention
It puts, several modifications and improvements can also be made, these also should be considered as protection scope of the present invention, these all will not influence this
Invent the effect and patent practicability implemented.The scope of protection required by this application should be based on the content of the claims,
The records such as the specific embodiment in specification can be used for explaining the content of claim.
Claims (7)
1. chip drying mechanism, it is characterised in that: the drying tank including upward opening, drying tank is interior to be equipped with parallel and cross direction profiles
At least two sides partition, there is between adjacent separator gap and form slot, cavity is equipped in partition, is mounted in cavity
Heat source, and the cavity wall of cavity is equipped with the louver communicated with slot；The partition be equipped with for keep chip disk body with every
The fixed cell of the distance between plate.
2. chip drying mechanism according to claim 1, it is characterised in that: the fixed cell includes sliding part and activity
Part, the partition top are equipped with sliding slot, and sliding part sliding is set in sliding slot, and sliding part is equipped with and fixes wedge surface；The activity
Part includes connecting plate, and sliding is equipped with the first voussoir and the second voussoir on connecting plate, is connected between the first voussoir and the second voussoir
Spring, the first voussoir are equipped with the first wedge surface, and the second voussoir is equipped with the second wedge surface with the first wedge surface face, and the second wedge surface
It is distributed with the first wedge surface in "eight" shape, the top of the partition is in the wedge shape cooperated with the first wedge surface and the second wedge surface and is located at
Between first voussoir and the second voussoir.
3. chip drying mechanism according to claim 1, it is characterised in that: sliding is equipped with negative tube on the drying tank,
Negative tube is connected with negative pressure mechanism.
4. chip drying mechanism according to claim 3, it is characterised in that: the bottom of the drying tank is movably equipped with bottom
Telescoping tube is connected between the cell wall of plate, bottom plate and drying tank, and bottom plate is connected with reciprocating mechanism.
5. chip drying mechanism according to claim 4, it is characterised in that: the reciprocating mechanism includes that rotation is set to
Lead screw on drying tank is installed with reel on lead screw, drawstring is wound on reel, drawstring is fixed far from one end of reel
On bottom plate；Sliding sleeve is installed on the negative tube, sliding sleeve is sheathed on lead screw and is threadedly engaged between lead screw.
6. chip drying mechanism according to claim 5, it is characterised in that: the lead screw, reel and drawstring are equipped with
Corresponding two groups, two groups of drawstrings are connected to the both ends of bottom plate.
7. chip drying mechanism according to claim 6, it is characterised in that: the slot of the negative tube and drying tank is between
It is connected with expansion plate, is equipped with cavity in expansion plate, cavity is communicated with hot body, and cavity is equipped with towards the position in drying tank
Hot wind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810968852.8A CN109140927B (en) | 2018-08-23 | 2018-08-23 | Chip drying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810968852.8A CN109140927B (en) | 2018-08-23 | 2018-08-23 | Chip drying mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109140927A true CN109140927A (en) | 2019-01-04 |
| CN109140927B CN109140927B (en) | 2020-05-12 |
Family
ID=64791311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810968852.8A Active CN109140927B (en) | 2018-08-23 | 2018-08-23 | Chip drying mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109140927B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110006226A (en) * | 2019-04-09 | 2019-07-12 | 北京七星华创集成电路装备有限公司 | Drying device |
| CN111701994A (en) * | 2020-06-22 | 2020-09-25 | 陆炯 | Circulating heavy metal soil repair system |
| CN111735280A (en) * | 2020-07-27 | 2020-10-02 | 清远市榕兴新型环保建材有限责任公司 | Drying device is used in production of environmental protection brick |
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| CN108332536A (en) * | 2017-09-22 | 2018-07-27 | 阜宁县华强纸品有限公司 | A kind of paper package box production drying unit |
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| US20170097150A1 (en) * | 2015-10-05 | 2017-04-06 | Sunlite Science & Technology, Inc. | Uv led systems and methods |
| CN207395342U (en) * | 2017-06-23 | 2018-05-22 | 遂宁市和聚科技有限公司 | A kind of integrated chip packing tube dryer |
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| CN111735280A (en) * | 2020-07-27 | 2020-10-02 | 清远市榕兴新型环保建材有限责任公司 | Drying device is used in production of environmental protection brick |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109140927B (en) | 2020-05-12 |
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Effective date of registration: 20230406 Address after: 646606 Building 12, Yingtian Intelligent Terminal Industrial Park, No. 9, Liangang Road, Shangzhuang Village, Luohan Street, South Sichuan Lingang District, Sichuan Free Trade Zone, Luzhou, Sichuan Patentee after: Luzhou Loongson Micro Technology Co.,Ltd. Address before: 401326 no.66-75, sendi Avenue, Xipeng Town, Jiulongpo District, Chongqing Patentee before: CHONGQING JIALINGXIN TECHNOLOGY CO.,LTD. |
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