CN109137021A - A kind of preparation method of hot plate liquid-sucking core - Google Patents
A kind of preparation method of hot plate liquid-sucking core Download PDFInfo
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- CN109137021A CN109137021A CN201811091073.0A CN201811091073A CN109137021A CN 109137021 A CN109137021 A CN 109137021A CN 201811091073 A CN201811091073 A CN 201811091073A CN 109137021 A CN109137021 A CN 109137021A
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- electroplated
- bath solution
- current density
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of preparation methods of hot plate liquid-sucking core, include the following steps；(1), bath solution is configured, bath solution includes copper sulphate 50--150g/L, 98% concentrated sulfuric acid 50-200ml/L, and 20-60 DEG C of temperature；(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 2-50A/dm for the first time2, electroplating time 1-15min；(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 0.5-10A/dm2, electroplating time 15-60min；Wherein, the current density of step (2) is greater than the current density of step (3).The present invention is electroplated only with an electroplating bath, and controls current density and current time, achievees the purpose that segmentation plating, the thick liquid-sucking core of preparation not only has capillary structure abundant, but also has good binding force, heat transfer property is good, long service life, high production efficiency.
Description
Technical field
The present invention relates to the manufactures of hot plate liquid-sucking core, and in particular to a kind of preparation method of hot plate liquid-sucking core.
Background technique
Hot plate is widely used as a kind of Thermal Conduction Equipment of electronic product, and wherein the liquid-sucking core inside hot plate contains abundant
Capillary structure plays heat-transfer effect highly important.The method for preparing liquid-sucking core at present mainly has: copper powder sintering, copper mesh
Attachment.Capillary structure abundant, this hot plate excellent heat transfer properties are formed after copper powder sintering, but this method production efficiency is low, at
This height, volume production is few at present.The liquid-sucking core of copper mesh adherence method preparation, capillary structure is not abundant enough, and the ultra-thin hot plate produced passes
Hot property is not ideal enough.It is a kind of new method that galvanoplastic, which prepare imbibition, mainly passes through dusting at present and reinforces two process realities
It is existing, need to configure two different concentration tank liquors.
Summary of the invention
In view of the deficiencies of the prior art, the present invention is intended to provide a kind of preparation method of hot plate liquid-sucking core, only with one
Electroplating bath is electroplated, and is controlled current density and current time, achievees the purpose that segmentation plating, the imbibition of preparation
Core not only has capillary structure abundant, but also has good binding force, and heat transfer property is good, long service life, production effect
Rate is high.
Of the invention is achieved through the following technical solutions.
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), bath solution is configured, bath solution includes copper sulphate 50--150g/L, 98% concentrated sulfuric acid 50-100ml/L,
20-60 DEG C of temperature；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 2-50A/ for the first time
dm2, electroplating time 1-15min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 0.5-
10A/dm2, electroplating time 10-60min；
Wherein, the current density of step (2) is greater than the current density of step (3).
Further, further include following steps:
(4), step (2) are repeated；
(5), step (3) are repeated；
……；
(2n), step (2) are repeated；
(2n+1), step (3) are repeated；
N is the positive integer greater than 1.
Preferably, the power supply that step (2) and step (3) use is that can carry out Discrete control by setting technological parameter
Power supply.
Compared with prior art, the invention has the advantages that the present invention is electroplated only with an electroplating bath, and to electricity
Current density and current time are controlled, and achieve the purpose that segmentation plating, and the liquid-sucking core of preparation not only has capillary knot abundant
Structure, and there is good binding force, heat transfer property is good, long service life, high production efficiency.
Specific embodiment
The present invention is further explained in the light of specific embodiments, but not as the limitation of the invention.
Embodiment 1
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), configure bath solution, bath solution be copper sulphate 50g/L, 98% concentrated sulfuric acid 100ml/L, 20-30 DEG C of temperature；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 5A/ for the first time
dm2, electroplating time 5min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 1A/
dm2, electroplating time 45min；
50 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
Embodiment 2
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), configure bath solution, bath solution be copper sulphate 100g/L, 98% concentrated sulfuric acid 75ml/L, 50-60 DEG C of temperature；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 10A/ for the first time
dm2, electroplating time 5min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 2A/
dm2, electroplating time 45min；
(4), step (2) are repeated；
(5), step (3) are repeated；
150 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
Embodiment 3
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), bath solution is configured, bath solution is copper sulphate 150g/L, 98% concentrated sulfuric acid 100ml/L, temperature 20-30
℃；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 15A/ for the first time
dm2, electroplating time 2min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 1.5A/
dm2, electroplating time 30min；
(4), step (2) are repeated；
(5), step (3) are repeated；
(6), step (2) are repeated；
(7), step (3) are repeated；
200 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
Embodiment 4
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), configure bath solution, bath solution be copper sulphate 50g/L, 98% concentrated sulfuric acid 50ml/L, 20-30 DEG C of temperature；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 4A/ for the first time
dm2, electroplating time 5min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 1A/
dm2, electroplating time 45min；
(4), step (2) are repeated；
(5), step (3) are repeated；
80 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
Embodiment 5
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), configure bath solution, bath solution be copper sulphate 75g/L, 98% concentrated sulfuric acid 75ml/L, 30-40 DEG C of temperature；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 3A/ for the first time
dm2, electroplating time 3min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 1A/
dm2, electroplating time 20min；
(4), step (2) are repeated；
(5), step (3) are repeated；
(6), step (2) are repeated；
(7), step (3) are repeated；
(8), step (2) are repeated；
(9), step (3) are repeated；
120 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
Embodiment 6
A kind of preparation method of hot plate liquid-sucking core, includes the following steps；
(1), bath solution is configured, bath solution is copper sulphate 120g/L, 98% concentrated sulfuric acid 100ml/L, temperature 50-60
℃；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 8A/ for the first time
dm2, electroplating time 10min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 3A/
dm2, electroplating time 60min；
(4), step (2) are repeated；
(5), step (3) are repeated；
(6), step (2) are repeated；
(7), step (3) are repeated；
(8), step (2) are repeated；
(9), step (3) are repeated；
350 microns of wick thickness of preparation, particle layers of copper capillary channel is abundant, and binding force is good.
The power supply that the various embodiments described above use is the power supply that Discrete control can be carried out by setting technological parameter, relative to
Substep electric plating method is carried out using multiple electroplating baths, it is more to eliminate replacement electroplating bath process, production efficiency in electroplating process
A electroplating bath carries out substep electric plating method and increases.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that and all replace with being equal made by present specification
It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.
Claims (3)
1. a kind of preparation method of hot plate liquid-sucking core, which is characterized in that include the following steps；
(1), bath solution is configured, bath solution includes copper sulphate 50--150g/L, 98% concentrated sulfuric acid 50-200ml/L, temperature
20-60℃；
(2), it is electroplated, is electroplated in the bath solution of step (1) preparation using high current, current density 2-50A/dm for the first time2,
Electroplating time 1-15min；
(3), it is electroplated for second, is electroplated in the bath solution of step (1) preparation using low current, current density 0.5-10A/
dm2, electroplating time 15-60min；
Wherein, the current density of step (2) is greater than the current density of step (3).
2. the preparation method of hot plate liquid-sucking core according to claim 1, which is characterized in that further include following steps:
(4), step (2) are repeated；
(5), step (3) are repeated；
……；
(2n), step (2) are repeated；
(2n+1), step (3) are repeated；
N is the positive integer greater than 1.
3. the preparation method of hot plate liquid-sucking core according to claim 1, which is characterized in that step (2) and step (3) use
Power supply be can pass through setting technological parameter carry out Discrete control power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811091073.0A CN109137021A (en) | 2018-09-19 | 2018-09-19 | A kind of preparation method of hot plate liquid-sucking core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811091073.0A CN109137021A (en) | 2018-09-19 | 2018-09-19 | A kind of preparation method of hot plate liquid-sucking core |
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| Publication Number | Publication Date |
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| CN109137021A true CN109137021A (en) | 2019-01-04 |
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| CN201811091073.0A Pending CN109137021A (en) | 2018-09-19 | 2018-09-19 | A kind of preparation method of hot plate liquid-sucking core |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106811778A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院大连化学物理研究所 | The preparation and palladium-copper alloy film and application of component and the controllable palladium-copper alloy film of thickness |
| CN107937943A (en) * | 2017-11-16 | 2018-04-20 | 中达电子(江苏)有限公司 | Porous wick structure and preparation method thereof |
-
2018
- 2018-09-19 CN CN201811091073.0A patent/CN109137021A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106811778A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院大连化学物理研究所 | The preparation and palladium-copper alloy film and application of component and the controllable palladium-copper alloy film of thickness |
| CN107937943A (en) * | 2017-11-16 | 2018-04-20 | 中达电子(江苏)有限公司 | Porous wick structure and preparation method thereof |
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Application publication date: 20190104 |
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