CN109129870A - A kind of manufacturing method of ceramic clad plate - Google Patents
A kind of manufacturing method of ceramic clad plate Download PDFInfo
- Publication number
- CN109129870A CN109129870A CN201811042479.XA CN201811042479A CN109129870A CN 109129870 A CN109129870 A CN 109129870A CN 201811042479 A CN201811042479 A CN 201811042479A CN 109129870 A CN109129870 A CN 109129870A
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- plate
- ceramic
- thickness
- ceramic wafer
- carbon steel
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- 239000000919 ceramic Substances 0.000 title claims abstract description 114
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims abstract description 37
- 239000000835 fiber Substances 0.000 claims abstract description 24
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 claims abstract description 23
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 238000004073 vulcanization Methods 0.000 claims abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 10
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 229910052580 B4C Inorganic materials 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 229910052573 porcelain Inorganic materials 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B15/00—General arrangement or layout of plant ; Industrial outlines or plant installations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/02—Synthetic macromolecular fibres
- B32B2262/0253—Polyolefin fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/56—Damping, energy absorption
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of manufacturing method of ceramic clad plate, which includes low-carbon steel facing, ceramic wafer, ultra high molecular weight polyethylene fiber plate, low-carbon steel sole plate and rubber shock-absorbing plate；It is manufactured in the steps below: (1) in one piece of the low carbon steel plate lower end surface adhering with epoxy resin ceramic wafer with homalographic；(2) in one block of the adhering with epoxy resin ultra high molecular weight polyethylene fiber plate with homalographic in ceramic wafer lower end surface；(3) in one piece of the adhering with epoxy resin low-carbon steel sole plate with homalographic in ultra high molecular weight polyethylene fiber plate lower end surface；(4) one layer is crosslinked for absorbing the rubber shock-absorbing plate of impact energy with vulcanization in low-carbon steel sole plate lower end surface to form ceramic clad plate, when use directly vulcanizes ceramic clad plate onto equipment.Manufacturing process of the present invention is simple, reduces the production cost of ceramic clad plate, can large area use.
Description
Technical field
The present invention relates to ceramic clad plate technical field more particularly to a kind of manufacturing methods of ceramic clad plate.
Background technique
The features such as ceramic material is stablized with its high compression-strength, high rigidity, high-melting-point, low-density, chemical property, for big
Protecting factor with higher in type equipment, but the disadvantage is that manufacturing process is difficult, price is higher, can not large area use.
Summary of the invention
In view of this, a kind of system of the purpose of the present invention is to provide manufacturing process simple, low-cost ceramic clad plate
Method is made, the production cost of ceramic clad plate is reduced, it can large area use.
The present invention is achieved through the following technical solutions: the present invention provides a kind of manufacturing method of ceramic clad plate, the pottery
Porcelain composite plate includes low-carbon steel facing, ceramic wafer, ultra high molecular weight polyethylene fiber plate, low-carbon steel sole plate and rubber shock-absorbing plate；
It is manufactured in the steps below:
(1) in one piece of the adhering with epoxy resin ceramic wafer with homalographic in low carbon steel plate lower end surface；
(2) in one block of the adhering with epoxy resin ultra high molecular weight polyethylene fiber plate with homalographic in ceramic wafer lower end surface；
(3) at one piece of the adhering with epoxy resin mild steel bottom with homalographic in ultra high molecular weight polyethylene fiber plate lower end surface
Plate；
(4) low-carbon steel sole plate lower end surface with vulcanization be crosslinked one layer for absorb the rubber shock-absorbing plate of impact energy from
And ceramic clad plate is formed, when use, directly vulcanizes ceramic clad plate onto equipment.
In a preferred embodiment of the present invention, the ceramic wafer is alumina ceramic plate, silicon carbide ceramics plate, boron carbide
One of ceramic wafer and silicon nitride ceramic plate.
As it is above-mentioned preferably, the ceramic wafer is alumina ceramic plate, wherein alumina ceramic plate is by alumina content
99% ceramic material is made.
In a preferred embodiment of the present invention, the ceramic wafer is bonded to whole form by the splicing of fritter ceramics comprising
Layer of glass layer is arranged in upper ceramic wafer and lower ceramic wafer between the upper ceramic wafer and lower ceramic wafer.
In a preferred embodiment of the present invention, the low-carbon steel facing with a thickness of 1-3mm, the thickness of the ceramic wafer
For 5-9mm, the ultra high molecular weight polyethylene fiber plate with a thickness of 3-5mm, the low-carbon steel sole plate with a thickness of 1-3mm,
The rubber shock-absorbing plate with a thickness of 2-4mm.
Further, wherein the upper ceramic wafer with a thickness of 2-4mm, the glass layer with a thickness of 2mm, institute
State lower ceramic wafer with a thickness of 1-3mm.
As it is above-mentioned preferably, the low-carbon steel facing with a thickness of 2mm, the ceramic wafer with a thickness of 7mm, the superelevation
Molecular weight polyethylene fiberboard with a thickness of 4mm, the low-carbon steel sole plate with a thickness of 2mm, the thickness of the rubber shock-absorbing plate
For 3mm.
As it is above-mentioned preferably, the upper ceramic wafer with a thickness of 3mm, the glass layer with a thickness of 2mm, under described
Ceramic wafer with a thickness of 2mm.
Compared with prior art, the invention has the following beneficial effects:
(1) manufacturing process of the present invention is simple, reduces the production cost of ceramic clad plate, can large area use.
(2) by subtracting to low-carbon steel facing, ceramic wafer, ultra high molecular weight polyethylene fiber plate, low-carbon steel sole plate and rubber
Its performance is studied in the variation of shake plate laying sequence, thickness, obtains the optimum structure of ceramic clad plate are as follows: 2mm mild steel
Panel+7mm ceramic wafer+4mm ultra high molecular weight polyethylene fiber plate+2mm low-carbon steel sole plate+3mm rubber shock-absorbing plate, wherein on
Ceramic wafer is with a thickness of 3mm, and glass layer is with a thickness of 2mm, and lower ceramic wafer is with a thickness of 2mm, and ceramic clad plate is to equipment at this time
Protecting factor is best.
(3) ultra high molecular weight polyethylene fiber plate must be placed at after ceramic wafer, when there is two-layer ceramic plate (i.e. upper ceramics
Plate and lower ceramic wafer) when, ultra high molecular weight polyethylene fiber plate need to be placed on after two-layer ceramic plate, and ceramic clad plate is being used for
Protecting factor with higher in large scale equipment, protects large scale equipment not by damage.
Detailed description of the invention
It, below will be to required in embodiment or description of the prior art in order to illustrate more clearly of technical solution of the present invention
The attached drawing used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, right
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Its attached drawing.
Fig. 1 is the structural schematic diagram of ceramic clad plate provided by the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
As shown in Figure 1, the manufacturing method of ceramic clad plate of the invention, which includes low-carbon steel facing, pottery
Porcelain plate, ultra high molecular weight polyethylene fiber plate, low-carbon steel sole plate and rubber shock-absorbing plate；It is manufactured in the steps below:
(1) in 10 lower end surface of low carbon steel plate, one piece of the adhering with epoxy resin ceramic wafer with homalographic；
(2) in one block of the adhering with epoxy resin ultra high molecular weight polyethylene fiber plate with homalographic in ceramic wafer lower end surface
50；
(3) in 50 lower end surface of ultra high molecular weight polyethylene fiber plate, one block of the adhering with epoxy resin mild steel with homalographic
Bottom plate 60；
(4) one layer is crosslinked for absorbing the rubber shock-absorbing plate of impact energy with vulcanization in 60 lower end surface of low-carbon steel sole plate
70 so that form ceramic clad plate, and when use directly vulcanizes ceramic clad plate onto equipment.
In one embodiment of this invention, the ceramic wafer is alumina ceramic plate, silicon carbide ceramics plate, boron carbide ceramics
One of plate and silicon nitride ceramic plate.Specifically, the ceramic wafer be alumina ceramic plate, wherein alumina ceramic plate by
Alumina content is made of 99% ceramic material.Ceramic material is main are as follows: aluminium oxide ceramics, silicon carbide ceramics, boron carbide pottery
Porcelain and silicon nitride ceramics, aluminium oxide ceramics manufacture craft is mature, and price advantage is obvious, therefore it is preferred that the pottery that alumina content is 99%
Alumina ceramic plate is made in ceramic material.
In one embodiment of this invention, the ceramic wafer is bonded to whole form by the splicing of fritter ceramics comprising upper pottery
Layer of glass layer 30 is arranged in porcelain plate 20 and lower ceramic wafer 40 between the upper ceramic wafer 20 and lower ceramic wafer 40.
1 ply stacking-sequence of table tests large scale equipment damage
Wherein, as shown in table 1, ultra high molecular weight polyethylene fiber plate must be placed at after ceramic wafer, when there is two layers of pottery
When porcelain plate (i.e. upper ceramic wafer and lower ceramic wafer), ultra high molecular weight polyethylene fiber plate need to be placed on after two-layer ceramic plate, pottery
Porcelain composite plate protects equipment not by damage for protecting factor with higher in large scale equipment.
In one embodiment of this invention, the low-carbon steel facing 10 with a thickness of 1-3mm, the ceramic wafer with a thickness of
5-9mm, the 50 of the ultra high molecular weight polyethylene fiber plate with a thickness of 3-5mm, the low-carbon steel sole plate 60 with a thickness of 1-
3mm, the rubber shock-absorbing plate 70 with a thickness of 2-4mm；Wherein the upper ceramic wafer 20 with a thickness of 2-4mm, the glass fibers
Tie up layer 30 with a thickness of 2mm, the lower ceramic wafer 40 with a thickness of 1-3mm.
Specifically, the low-carbon steel facing 10 with a thickness of 2mm, the ceramic wafer with a thickness of 7mm, the supra polymer
Weight polyethylene fiber plate 50 with a thickness of 4mm, the low-carbon steel sole plate 60 with a thickness of 2mm, the thickness of the rubber shock-absorbing plate 70
Degree is 3mm；Wherein, the upper ceramic wafer 20 with a thickness of 3mm, the glass layer 30 with a thickness of 2mm, the lower ceramics
Plate 40 with a thickness of 2mm, ceramic clad plate is best to the protecting factor of equipment at this time.
It is 7.85g/cm that low carbon steel plate density is taken in the present invention3, ceramic wafer density is 3.8g/cm3, superhigh molecular weight polyethylene
Alkene plate density is 0.97g/cm3, ultra high molecular weight polyethylene fiber plate density is 2.55g/cm3。
The above is a preferred embodiment of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, it is noted that for those skilled in the art, without departing from the principle of the present invention, may be used also
To make several improvement and variation, these, which improve and change, is also considered as protection scope of the present invention.
Claims (8)
1. a kind of manufacturing method of ceramic clad plate, which is characterized in that the ceramic clad plate include low-carbon steel facing, ceramic wafer,
Ultra high molecular weight polyethylene fiber plate, low-carbon steel sole plate and rubber shock-absorbing plate；It is manufactured in the steps below:
(1) in one piece of the adhering with epoxy resin ceramic wafer with homalographic in low carbon steel plate lower end surface；
(2) in one block of the adhering with epoxy resin ultra high molecular weight polyethylene fiber plate with homalographic in ceramic wafer lower end surface；
(3) in one piece of the adhering with epoxy resin low-carbon steel sole plate with homalographic in ultra high molecular weight polyethylene fiber plate lower end surface；
(4) one layer is crosslinked for absorbing the rubber shock-absorbing plate of impact energy to shape with vulcanization in low-carbon steel sole plate lower end surface
At ceramic clad plate, when use, directly vulcanizes ceramic clad plate onto equipment.
2. the manufacturing method of ceramic clad plate as described in claim 1, which is characterized in that the ceramic wafer is aluminium oxide ceramics
One of plate, silicon carbide ceramics plate, boron carbide ceramics plate and silicon nitride ceramic plate.
3. the manufacturing method of ceramic clad plate as claimed in claim 2, which is characterized in that the ceramic wafer is aluminium oxide ceramics
Plate, wherein alumina ceramic plate is made of alumina content of 99% ceramic material.
4. the manufacturing method of ceramic clad plate as claimed in claim 3, which is characterized in that the ceramic wafer is spelled by fritter ceramics
It connects and is bonded to whole form comprising one layer of glass is arranged in upper ceramic wafer and lower ceramic wafer between the upper ceramic wafer and lower ceramic wafer
Glass fibrous layer.
5. the manufacturing method of ceramic clad plate as claimed in claim 4, which is characterized in that the low-carbon steel facing with a thickness of
1-3mm, the ceramic wafer with a thickness of 5-9mm, the ultra high molecular weight polyethylene fiber plate with a thickness of 3-5mm, it is described low
Carbon steel bottom plate with a thickness of 1-3mm, the rubber shock-absorbing plate with a thickness of 2-4mm.
6. the manufacturing method of ceramic clad plate as claimed in claim 5, which is characterized in that the wherein thickness of the upper ceramic wafer
For 2-4mm, the glass layer with a thickness of 2mm, the lower ceramic wafer with a thickness of 1-3mm.
7. the manufacturing method of ceramic clad plate as claimed in claim 6, which is characterized in that the low-carbon steel facing with a thickness of
2mm, the ceramic wafer with a thickness of 7mm, the plate thickness of the ultra high molecular weight polyethylene fiber is 4mm, the mild steel bottom
Plate with a thickness of 2mm, the rubber shock-absorbing plate with a thickness of 3mm.
8. the manufacturing method of ceramic clad plate as claimed in claim 7, which is characterized in that the upper ceramic wafer with a thickness of
3mm, the glass layer with a thickness of 2mm, the lower ceramic wafer with a thickness of 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042479.XA CN109129870A (en) | 2018-09-05 | 2018-09-05 | A kind of manufacturing method of ceramic clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811042479.XA CN109129870A (en) | 2018-09-05 | 2018-09-05 | A kind of manufacturing method of ceramic clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109129870A true CN109129870A (en) | 2019-01-04 |
Family
ID=64827637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811042479.XA Pending CN109129870A (en) | 2018-09-05 | 2018-09-05 | A kind of manufacturing method of ceramic clad plate |
Country Status (1)
| Country | Link |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1669511A1 (en) * | 2004-12-08 | 2006-06-14 | Bernhard Büngeler GmbH | Lightweight construction element and manufacturing method |
| CN102514310A (en) * | 2011-12-07 | 2012-06-27 | 常熟市东涛金属复合材料有限公司 | Clad metal sheet |
| CN103950238A (en) * | 2014-04-22 | 2014-07-30 | 安徽经天金属表面处理科技有限公司 | Impact resistant ceramic composite board and preparation method thereof |
| CN105333772A (en) * | 2015-11-16 | 2016-02-17 | 山东大学 | Composite structure bullet and riot shielding board and preparing method thereof |
| CN105865267A (en) * | 2016-05-20 | 2016-08-17 | 北京理工大学 | Composite armor embedded with specially-shaped ceramic wafers |
| CN106881920A (en) * | 2015-12-15 | 2017-06-23 | 宝钢建筑系统集成有限公司 | A kind of Sandwich steel sheet plate and its processing method |
| CN108312661A (en) * | 2018-02-01 | 2018-07-24 | 贵州优拓新材料有限公司 | A kind of honeycomb ceramics composite liner and its manufacturing method |
-
2018
- 2018-09-05 CN CN201811042479.XA patent/CN109129870A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1669511A1 (en) * | 2004-12-08 | 2006-06-14 | Bernhard Büngeler GmbH | Lightweight construction element and manufacturing method |
| CN102514310A (en) * | 2011-12-07 | 2012-06-27 | 常熟市东涛金属复合材料有限公司 | Clad metal sheet |
| CN103950238A (en) * | 2014-04-22 | 2014-07-30 | 安徽经天金属表面处理科技有限公司 | Impact resistant ceramic composite board and preparation method thereof |
| CN105333772A (en) * | 2015-11-16 | 2016-02-17 | 山东大学 | Composite structure bullet and riot shielding board and preparing method thereof |
| CN106881920A (en) * | 2015-12-15 | 2017-06-23 | 宝钢建筑系统集成有限公司 | A kind of Sandwich steel sheet plate and its processing method |
| CN105865267A (en) * | 2016-05-20 | 2016-08-17 | 北京理工大学 | Composite armor embedded with specially-shaped ceramic wafers |
| CN108312661A (en) * | 2018-02-01 | 2018-07-24 | 贵州优拓新材料有限公司 | A kind of honeycomb ceramics composite liner and its manufacturing method |
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Application publication date: 20190104 |