CN109128570A - A kind of oxidation-resistant alloy solder and preparation method thereof - Google Patents
A kind of oxidation-resistant alloy solder and preparation method thereof Download PDFInfo
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- CN109128570A CN109128570A CN201811310392.6A CN201811310392A CN109128570A CN 109128570 A CN109128570 A CN 109128570A CN 201811310392 A CN201811310392 A CN 201811310392A CN 109128570 A CN109128570 A CN 109128570A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention discloses a kind of oxidation-resistant alloy solders and preparation method thereof, belong to technical field of mechanical processing.The oxidation-resistant alloy solder, including following raw material: Zn, Ag, Ga, Al, P, Sn, aluminium polychloride, silicone, nano silicate fiber；The preparation method of the oxidation-resistant alloy solder be by melting, stirring, impurity elimination, anneal, enter mould and etc. be made.The present invention is reinforcement system by using aluminium polychloride, silicone, nano silicate fiber, improves the weld strength and corrosion resistance of oxidation-resistant alloy solder.
Description
Technical field
The invention belongs to field of machining, and in particular to a kind of oxidation-resistant alloy solder and preparation method thereof.
Background technique
As electronics and electric equipment products constantly develop to miniaturization, lightweight, low energy consumption direction, it is desirable that used material
Should be more and more light, while requirement should have good comprehensive performance.Although copper has good electric conductivity, thermal conductivity, anti-corrosion
Property and excellent mechanical property, be widely used to various industrial circles and with economic rapid development and demand is more next
It is bigger, but it is few in the reserves of nature, and exploitation and processing cost are high.Therefore, for a long time, people wish always at certain
A little industrial circles are using similar performance and contain light metal substitution copper abundant.Aluminium and its alloy are with density is small, light weight, leads
Heat and electric conductivity good (being only second to Ag, Cu, Au), good corrosion resistance, it is at low cost the advantages that, undoubtedly become the best substitution of copper
Person.In industries such as automobile, naval vessel, aerospace, buildings, the application of aluminium and aluminium alloy widely with maturation.With copper
Price persistently rises, in Electronic Packaging field replacing copper with aluminium also more and more attention has been paid to.There is aluminum soft soldering technology in Electronic Packaging
Wide application prospect, but be also faced with many problems, such as: it is fine and close and stablize that aluminium surface how is effectively removed when soldering
Oxidation film, how to improve the corrosion resistance of the soldered fitting of solder and aluminium and how to solve aluminum soft soldering technique more complex etc.
Problem.
The existing solder applied to aluminum soft soldering mainly has: Sn-Pb, Sn-Ag-Cu, Sn-Zn etc. are solder.From Sn-Al phase
From the point of view of figure and Pb-Al phasor, Sn is substantially immiscible with Al, and can dissolve atomic percentage in β-Sn solid solution is about 1%
Al, and Pb and Al cannot almost dissolve each other.Therefore, Sn-Pb solder is fine with the wetting of aluminum substrate under brazing flux effect, but
Be soldered fitting bond strength it is very low (solid solubility of Sn and Pb and Al are extremely low, interface difficulty formed compound).Meanwhile Sn-
Pb solder alloy and the electrode potential of Al substrate differ greatly, and etching problem caused by electrochemical action is very serious, for example, soldering
Connector destroys after impregnating a couple of days in 3wt% salt water.In addition, it is worth noting that, with the increasing of global environmental consciousness
By force, various countries have made laws or have promulgated that regulation forbids the use of the solder containing toxicant Pb.Sn-Ag-Cu series lead-free solder is mesh
The first choice instead of conventional leaded solders that preceding whole world industry is generally accepted, is widely used in the solder of copper.In terms of aluminum soft soldering,
Sn-Ag-Cu solder is not added with Ag due to containing a certain amount of Ag, using the corrosion resistance ratio of solder soldering aluminum substrate rear joint
Solder alloy to improve very much.But this is that the mutual solubility of alloy and aluminium is small, and the intermetallic compound that Ag and Al is formed is inclined
Side from aluminum substrate, thus using this be solder soldering aluminum substrate rear joint intensity and toughness it is slightly worse, soldered fitting can
It also decreases by property.Although the soldered fitting being brazed after aluminum substrate using Sn-Zn solder has very high intensity, Sn-Zn
Due to the oxidizable characteristic of Zn in solder, so that the inoxidizability of the solder and it is excessively poor in the wetability of aluminum substrate, no
Conducive to the production and application of the solder.In addition, Sn-Zn solder is anticorrosive with the soldered fitting of aluminium also poor, under general room temperature
It impregnates in 3.0wt% salt water and was broken less than one week.
Chinese patent application document " a kind of aluminum soft soldering with anticorrosive and oxidation resistant lead-free solder alloy (publication number:
CN101880792A a kind of aluminum soft soldering anticorrosive and oxidation resistant lead-free solder alloy and its production method) " are disclosed, by weight
Percentages are measured, the leadless welding alloy is composed of the following components: Zn 0.5~5.0%, Ag0.05-2.8%, Ga 0.05-
0.8%, Al 0.01-0.5%, P 0.002-0.020%, Sn are surplus.The leadless welding alloy melting region of the invention is
198-225 DEG C, there is better corrosion resistance compared with existing Sn-Zn solder and Sn-Ag-Cu solder, while having good
Inoxidizability, wetability, the soldering joint strength that obtains is high after being brazed aluminium using the solder, but to there are weld strengths, resistance to
The problem of corrosivity deficiency.
Summary of the invention
The object of the present invention is to provide a kind of oxidation-resistant alloy solders and preparation method thereof, to solve in Patent Application Publication
Welding material disclosed in " a kind of aluminum soft soldering with anticorrosive and oxidation resistant lead-free solder alloy (publication number: CN101880792A) "
On the basis of, how to optimize component, dosage, method etc., solves the problems, such as that weld strength, corrosion resistance are insufficient.
In order to solve the above technical problems, the invention adopts the following technical scheme:
A kind of oxidation-resistant alloy solder, including following raw material: Zn, Ag, Ga, Al, P, Sn, aluminium polychloride, silicone are received
Rice silicate fiber；
The ratio of the aluminium polychloride, silicone, nano silicate fiber is (0.02-0.04): (0.06-0.08):
(0.01-0.03)。
Further, the aluminium polychloride, silicone, the ratio of nano silicate fiber are 0.03:0.07:0.02.
Further, the oxidation-resistant alloy solder is as unit of parts by weight, including following raw material: 0.5-2.0 parts of Zn,
Ag1.2-2.8 parts, 0.05-0.08 parts of Ga, 0.1-0.5 parts of Al, 0.01-0.02 parts of P, Sn95-98 parts, aluminium polychloride
0.02-0.04 parts, 0.06-0.08 parts of silicone, 0.01-0.03 parts of nano silicate fiber.
Further, the oxidation-resistant alloy solder is as unit of parts by weight, including following raw material: 1.0 parts of Zn, Ag2.0
Part, 0.06 part of Ga, 0.3 part of Al, 0.015 part of P, Sn96 parts, 0.03 part of aluminium polychloride, 0.07 part of silicone, nanometer silicic acid
0.02 part of salt fiber.
Further, the oxidation-resistant alloy solder is processed into solder wire, solder paillon or solder powder.
Further, nano silicate fiber is partial size 20-50nm, and length is the natural nano grade silicic acid of 500-1000nm
Salt mineral fibres.
Further, the form that the Al, Ga, P element are all made of Zn-Al, Sn-Ga and Sn-P intermediate alloy is added.
A kind of preparation method according to above-mentioned oxidation-resistant alloy solder, comprising the following steps: (1) by Zn, Ag, Ga, Al,
P, Sn are placed in melting crucible, along with above-mentioned metal is warming up to 380-390 DEG C with starvation by suitable charcoal powder,
It after above-mentioned metal melts, is sufficiently stirred, maintains 15-20 minutes；(2) aluminium polychloride, silicone, nano silicate fiber is added
It stirs evenly, then maintains temperature 15 minutes to 1 hour, take out the impurity for melting alloy surface；(3) enter molding and make welding rod.
The invention has the following advantages:
(1) as the data of embodiment 1-3 and comparative example 5 as it can be seen that the welding of oxidation-resistant alloy solder made from embodiment 1-3
Intensity and corrosion resistance are significantly higher than weld strength made from comparative example 5 and corrosion resistance；It simultaneously can by the data of embodiment 1-3
See, embodiment 1 is optimum embodiment.
(2) by embodiment 1 and the data of comparative example 1-4 as it can be seen that aluminium polychloride, silicone, nano silicate fiber exist
It prepares and plays synergistic effect in oxidation-resistant alloy solder, collaboration improves the weld strength of oxidation-resistant alloy solder and corrosion-resistant
Property；This is:
The inoxidizability of the solder alloy containing Zn is poor, in order to improve the antioxygenic property of solder alloy, ingredient of the invention
When design, the antioxidant of micro surface active element P, Ga and Al as solder is added in solder alloy.Element P conduct
Antioxidant has been widely used in solder alloy, oxidation resistant main cause be element P liquid solder surface enrichment simultaneously
Generation dense oxidation film isolation Sn, Zn is preferentially reacted with oxygen to contact with the direct of oxygen.Ga is low with fusing point, boiling point is high and density
Low feature, after adding micro Ga element in solder, isolated solder is played on Ga covering fusion welding surface when solder fusing
The effect contacted with oxygen in air improves the antioxidative purpose of solder to reach.Al is when solder alloy is brazed prior to Zn
Initial oxidation, and fine and close oxidation film is formed in solder surface, hinder the further oxidation of solder to improve solder alloy
Inoxidizability, but the excessively high wetability that will affect solder of Al content.But by comparative example 1 it is found that only adding above-mentioned component not
It is able to achieve satisfactory weld strength and corrosion resistance effect, therefore applicant, by repetition test, discovery is added to polymerization
Aluminium chloride, silicone, nano silicate fiber play synergistic effect in preparing oxidation-resistant alloy solder.
Speculate that its possible mechanism be aluminium polychloride is polyhydroxy, the cationic inorganic polymer material of body is complexed in multicore
Material, the coefficient of expansion of solder can effectively be reduced by being dispersed in solder, enhance the integral strength of solder, chloride ion and work
Property hydroxyl can further be reacted with Zn, prevent Zn to be oxidized, and since its chemical stability is good, can be in solder use process
It is remelted during be enriched on solder surface, enhance anticorrosion effect；Silicone has organic material and inorganic material double
Square characteristic can promote weatherability, the mechanical strength of solder, while utilize its high molecular crosslink and emulsifying capacity, can be in solder
Aluminium polychloride and nano silicate fiber can be promoted to disperse in preparation process, and its active silicon atom can be made after decomposition
To form a large amount of heterogeneous nuclei, play the role of modifying-refining major alloy phase, so that it is strong to enhance corrosion-resistant and welding
Degree；What nano silicate fiber can intermesh is dispersed in solder, improves the integral strength of solder, and aluminium polychloride
Hydroxyl can be reacted with the basic group on its surface, thus filling wherein, silicone decompose after be used as crosslinking agent, realize three
It is crosslinked mutually between molecule, forms stable crystal packed structures, greatly improve the mechanical property and globality of solder, it is not easy to is broken
It is broken, weld strength is improved, avoids performance caused by the reunion of aluminium polychloride and silicone from declining, when it disperses in surface layer
When, energy effective protection matrix and body structure surface improve corrosion resistance not by the erosion of etchant gas and wet gas.
(3) by the data of comparative example 6-8 as it can be seen that aluminium polychloride, the weight ratio of silicone, nano silicate fiber do not exist
(0.02-0.04): (0.06-0.08): when in (0.01-0.03) range, the weld strength and corrosion resistance of sheet metal component obtained
The numerical value of numerical value and embodiment 1-3 is very different, the numerical value much smaller than the numerical value of embodiment 1-3, with the prior art (comparative example 5)
Quite.Aluminium polychloride of the present invention, silicone, nano silicate fiber prepare antioxygen as reinforcement system, embodiment 1-3 control
By addition aluminium polychloride when chemical combination gold solder, the weight ratio of silicone, nano silicate fiber is (0.02-0.04):
(0.06-0.08): (0.01-0.03), realizing enhances anticorrosion effect using aluminium polychloride in reinforcement system；Silicone tool
Aluminium polychloride and nano silicate fiber can be promoted to disperse, and activated silica can refine major alloy phase after decomposition；It receives
What rice silicate fiber can intermesh is dispersed in solder, improves intensity, and using silicone as crosslinking agent, realizes three
It is crosslinked mutually between person's molecule, forms stable crystal packed structures, so that the welding for playing raising oxidation-resistant alloy solder is strong
The features such as degree and corrosion resistance, so that aluminium polychloride, silicone, the reinforcement system that nano silicate fiber is constituted is in the present invention
Oxidation-resistant alloy solder in, collaboration improve oxidation-resistant alloy solder weld strength and corrosion resistance.
Specific embodiment
To facilitate a better understanding of the present invention, it is illustrated by the following examples, these examples belong to protection of the invention
Range, but do not limit the scope of the invention.
In embodiment, a kind of oxidation-resistant alloy solder, the oxidation-resistant alloy solder as unit of parts by weight, including with
Lower raw material: 0.5-2.0 parts of Zn, Ag1.2-2.8 parts, 0.05-0.08 parts of Ga, 0.1-0.5 parts of Al, 0.01-0.02 parts of P,
Sn95-98 parts, 0.02-0.04 parts of aluminium polychloride, 0.06-0.08 parts of silicone, 0.01-0.03 parts of nano silicate fiber.
The oxidation-resistant alloy solder is processed into solder wire, solder paillon or solder powder.
Nano silicate fiber is partial size 20-50nm, and the natural nano grade silicate mineral that length is 500-1000nm is fine
Dimension.
The form that the Al, Ga, P element are all made of Zn-Al, Sn-Ga and Sn-P intermediate alloy is added.
A kind of preparation method according to above-mentioned oxidation-resistant alloy solder, comprising the following steps: (1) by Zn, Ag, Ga, Al,
P, Sn are placed in melting crucible, along with above-mentioned metal is warming up to 380-390 DEG C with starvation by suitable charcoal powder,
It after above-mentioned metal melts, is sufficiently stirred, maintains 15-20 minutes；(2) aluminium polychloride, silicone, nano silicate fiber is added
It stirs evenly, then maintains temperature 15 minutes to 1 hour, take out the impurity for melting alloy surface；(3) enter molding and make welding rod.
Embodiment 1
A kind of oxidation-resistant alloy solder, the oxidation-resistant alloy solder is as unit of parts by weight, including following raw material:: Zn
1.0 parts, Ag2.0 parts, 0.06 part of Ga, 0.3 part of Al, 0.015 part of P, Sn96 parts, 0.03 part of aluminium polychloride, silicone 0.07
Part, 0.02 part of nano silicate fiber.
The oxidation-resistant alloy solder is processed into solder wire, solder paillon or solder powder.
Nano silicate fiber is partial size 20-50nm, and the natural nano grade silicate mineral that length is 500-1000nm is fine
Dimension.
The form that the Al, Ga, P element are all made of Zn-Al, Sn-Ga and Sn-P intermediate alloy is added.
A kind of preparation method according to above-mentioned oxidation-resistant alloy solder, comprising the following steps: (1) by Zn, Ag, Ga, Al,
P, Sn are placed in melting crucible, add suitable charcoal powder, and with starvation, above-mentioned metal is warming up to 385 DEG C, above-mentioned
It after metal melts, is sufficiently stirred, maintains 17.5 minutes；(2) aluminium polychloride, silicone, nano silicate fiber stirring is added
Uniformly, it then maintains temperature 30 minutes, takes out the impurity for melting alloy surface；(3) enter molding and make welding rod.
Embodiment 2
A kind of oxidation-resistant alloy solder, the oxidation-resistant alloy solder is as unit of parts by weight, including following raw material: Zn
0.5 part, Ag2.8 parts, 0.05 part of Ga, 0.5 part of Al, 0.01 part of P, Sn98 parts, 0.02 part of aluminium polychloride, silicone 0.08
Part, 0.01 part of nano silicate fiber.
The oxidation-resistant alloy solder is processed into solder wire.
Nano silicate fiber is partial size 20-50nm, and the natural nano grade silicate mineral that length is 500-1000nm is fine
Dimension.
The form that the Al, Ga, P element are all made of Zn-Al, Sn-Ga and Sn-P intermediate alloy is added.
A kind of preparation method according to above-mentioned oxidation-resistant alloy solder, comprising the following steps: (1) by Zn, Ag, Ga, Al,
P, Sn are placed in melting crucible, add suitable charcoal powder, and with starvation, above-mentioned metal is warming up to 390 DEG C, above-mentioned
It after metal melts, is sufficiently stirred, maintains 15 minutes；(2) aluminium polychloride is added, silicone, nano silicate fiber stirring is
It is even, it then maintains temperature 15 minutes, takes out the impurity for melting alloy surface；(3) enter molding and make welding rod.
Embodiment 3
A kind of oxidation-resistant alloy solder, the oxidation-resistant alloy solder is as unit of parts by weight, including following raw material: Zn
2.0 parts, Ag1.2 parts, 0.08 part of Ga, 0.1 part of Al, 0.02 part of P, Sn95 parts, 0.04 part of aluminium polychloride, silicone 0.06
Part, 0.03 part of nano silicate fiber.
The oxidation-resistant alloy solder is processed into solder paillon.
Nano silicate fiber is partial size 20-50nm, and the natural nano grade silicate mineral that length is 500-1000nm is fine
Dimension.
The form that the Al, Ga, P element are all made of Zn-Al, Sn-Ga and Sn-P intermediate alloy is added.
A kind of preparation method according to above-mentioned oxidation-resistant alloy solder, comprising the following steps: (1) by Zn, Ag, Ga, Al,
P, Sn are placed in melting crucible, add suitable charcoal powder, and with starvation, above-mentioned metal is warming up to 380 DEG C, above-mentioned
It after metal melts, is sufficiently stirred, maintains 20 minutes；(2) aluminium polychloride is added, silicone, nano silicate fiber stirring is
It is even, it then maintains temperature 1 hour, takes out the impurity for melting alloy surface；(3) enter molding and make welding rod.
Comparative example 1
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and lacks
Few aluminium polychloride, silicone, nano silicate fiber.
Comparative example 2
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and lacks
Few aluminium polychloride.
Comparative example 3
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and lacks
Few silicone.
Comparative example 4
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and lacks
Few nano silicate fiber.
Comparative example 5
Using Chinese patent application document " a kind of aluminum soft soldering with anticorrosive and oxidation resistant lead-free solder alloy (publication number:
CN101880792A method described in specific embodiment 1 prepares welding material in) ".
Comparative example 6
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and gathers
Conjunction aluminium chloride is 0.01 part, silicone is 0.1 part, nano silicate fiber is 0.04 part.
Comparative example 7
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and gathers
Conjunction aluminium chloride is 0.05 part, silicone is 0.04 part, nano silicate fiber is 0.05 part.
Comparative example 8
It is essentially identical with the preparation process of embodiment 1, it has only the difference is that preparing in the raw material of oxidation-resistant alloy solder and gathers
Conjunction aluminium chloride is 0.05 part, silicone is 0.1 part, nano silicate fiber is 0.005 part.
To product made from embodiment 1-3 and comparative example 1-8, the fracture at the welding of sheet metal parts after test welding is strong
Degree.According to 10125-1997 standard of GB T, after testing 6h under acid salt fog to the sheet metal component after welding, test fracture is strong
Degree calculates breaking strength and declines degree, be calculated as percentage, as a result as shown in the table compared with uncorroded.
As seen from the above table: (1) as the data of embodiment 1-3 and comparative example 5 as it can be seen that antioxygen chemical combination made from embodiment 1-3
The weld strength and corrosion resistance of gold solder are significantly higher than weld strength made from comparative example 5 and corrosion resistance；Simultaneously by implementing
The data of example 1-3 are as it can be seen that embodiment 1 is optimum embodiment.
(2) by embodiment 1 and the data of comparative example 1-4 as it can be seen that aluminium polychloride, silicone, nano silicate fiber exist
It prepares and plays synergistic effect in oxidation-resistant alloy solder, collaboration improves the weld strength of oxidation-resistant alloy solder and corrosion-resistant
Property；This is:
The inoxidizability of the solder alloy containing Zn is poor, in order to improve the antioxygenic property of solder alloy, ingredient of the invention
When design, the antioxidant of micro surface active element P, Ga and Al as solder is added in solder alloy.Element P conduct
Antioxidant has been widely used in solder alloy, oxidation resistant main cause be element P liquid solder surface enrichment simultaneously
Generation dense oxidation film isolation Sn, Zn is preferentially reacted with oxygen to contact with the direct of oxygen.Ga is low with fusing point, boiling point is high and density
Low feature, after adding micro Ga element in solder, isolated solder is played on Ga covering fusion welding surface when solder fusing
The effect contacted with oxygen in air improves the antioxidative purpose of solder to reach.Al is when solder alloy is brazed prior to Zn
Phase oxidation, and fine and close oxidation film is formed in solder surface, hinder the further oxidation of solder to improve solder alloy
Inoxidizability, but the excessively high wetability that will affect solder of Al content.But by comparative example 1 it is found that only adding above-mentioned component not
It is able to achieve satisfactory weld strength and corrosion resistance effect, therefore applicant, by repetition test, discovery is added to polymerization
Aluminium chloride, silicone, nano silicate fiber play synergistic effect in preparing oxidation-resistant alloy solder.
Speculate that its possible mechanism be aluminium polychloride is polyhydroxy, the cationic inorganic polymer material of body is complexed in multicore
Material, the coefficient of expansion of solder can effectively be reduced by being dispersed in solder, enhance the integral strength of solder, chloride ion and work
Property hydroxyl can further be reacted with Zn, prevent Zn to be oxidized, and since its chemical stability is good, can be in solder use process
It is remelted during be enriched on solder surface, enhance anticorrosion effect；Silicone has organic material and inorganic material double
Square characteristic can promote weatherability, the mechanical strength of solder, while utilize its high molecular crosslink and emulsifying capacity, can be in solder
Aluminium polychloride and nano silicate fiber can be promoted to disperse in preparation process, and its active silicon atom can be made after decomposition
To form a large amount of heterogeneous nuclei, play the role of modifying-refining major alloy phase, so that it is strong to enhance corrosion-resistant and welding
Degree；What nano silicate fiber can intermesh is dispersed in solder, improves the integral strength of solder, and aluminium polychloride
Hydroxyl can be reacted with the basic group on its surface, thus filling wherein, silicone decompose after be used as crosslinking agent, realize three
It is crosslinked mutually between molecule, forms stable crystal packed structures, greatly improve the mechanical property and globality of solder, it is not easy to is broken
It is broken, weld strength is improved, avoids performance caused by the reunion of aluminium polychloride and silicone from declining, when it disperses in surface layer
When, energy effective protection matrix and body structure surface improve corrosion resistance not by the erosion of etchant gas and wet gas.
(3) by the data of comparative example 6-8 as it can be seen that aluminium polychloride, the weight ratio of silicone, nano silicate fiber do not exist
(0.02-0.04): (0.06-0.08): when in (0.01-0.03) range, the weld strength and corrosion resistance of sheet metal component obtained
The numerical value of numerical value and embodiment 1-3 is very different, the numerical value much smaller than the numerical value of embodiment 1-3, with the prior art (comparative example 5)
Quite.Aluminium polychloride of the present invention, silicone, nano silicate fiber prepare antioxygen as reinforcement system, embodiment 1-3 control
By addition aluminium polychloride when chemical combination gold solder, the weight ratio of silicone, nano silicate fiber is (0.02-0.04):
(0.06-0.08): (0.01-0.03), realizing enhances anticorrosion effect using aluminium polychloride in reinforcement system；Silicone tool
Aluminium polychloride and nano silicate fiber can be promoted to disperse, and activated silica can refine major alloy phase after decomposition；It receives
What rice silicate fiber can intermesh is dispersed in solder, improves intensity, and using silicone as crosslinking agent, realizes three
It is crosslinked mutually between person's molecule, forms stable crystal packed structures, so that the welding for playing raising oxidation-resistant alloy solder is strong
The features such as degree and corrosion resistance, so that aluminium polychloride, silicone, the reinforcement system that nano silicate fiber is constituted is in the present invention
Oxidation-resistant alloy solder in, collaboration improve oxidation-resistant alloy solder weld strength and corrosion resistance.
The above content is it cannot be assumed that present invention specific implementation is only limited to these instructions, for the technical field of the invention
Those of ordinary skill for, under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all answers
When being considered as belonging to present invention scope of patent protection determined by the appended claims.
Claims (8)
1. a kind of oxidation-resistant alloy solder, which is characterized in that including following raw material: Zn, Ag, Ga, Al, P, Sn, aluminium polychloride,
Silicone, nano silicate fiber；
The ratio of the aluminium polychloride, silicone, nano silicate fiber is (0.02-0.04): (0.06-0.08):
(0.01-0.03)。
2. oxidation-resistant alloy solder according to claim 1, which is characterized in that the aluminium polychloride, silicone, nanometer
The ratio of silicate fiber is 0.03:0.07:0.02.
3. oxidation-resistant alloy solder according to claim 1, which is characterized in that the oxidation-resistant alloy solder is with parts by weight
For unit, including following raw material: 0.5-2.0 parts of Zn, 1.2-2.8 parts of Ag, 0.05-0.08 parts of Ga, 0.1-0.5 parts of Al, P
0.01-0.02 parts, 95-98 parts of Sn, 0.02-0.04 parts of aluminium polychloride, 0.06-0.08 parts of silicone, nano silicate fiber
0.01-0.03 parts.
4. oxidation-resistant alloy solder according to claim 1, which is characterized in that the oxidation-resistant alloy solder is with parts by weight
For unit, including following raw material: 1.0 parts of Zn, Ag2.0 parts, 0.06 part of Ga, 0.3 part of Al, 0.015 part of P, Sn96 parts, polymerizeing
0.03 part of aluminium chloride, 0.07 part of silicone, 0.02 part of nano silicate fiber.
5. oxidation-resistant alloy solder according to claim 1, which is characterized in that the oxidation-resistant alloy solder is processed into pricker
Expect silk, solder paillon or solder powder.
6. oxidation-resistant alloy solder according to claim 1, which is characterized in that nano silicate fiber is partial size 20-
50nm, length are the natural nano grade silicate mineral fiber of 500-1000nm.
7. oxidation-resistant alloy solder according to claim 1, which is characterized in that the Al, Ga, P element are all made of Zn-
The form of Al, Sn-Ga and Sn-P intermediate alloy is added.
8. a kind of preparation method of oxidation-resistant alloy solder according to claim 1-7, which is characterized in that including
Following steps: (1) by Zn, Ag, Ga, Al, P, Sn, being placed in melting crucible, add suitable charcoal powder, with starvation,
Above-mentioned metal is warming up to 380-390 DEG C, after above-mentioned metal melts, is sufficiently stirred, maintains 15-20 minutes；(2) polymerization chlorine is added
Change aluminium, silicone, nano silicate fiber stirs evenly, and then maintains temperature 15 minutes to 1 hour, takes out and melts alloy surface
Impurity；(3) enter molding and make welding rod.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811310392.6A CN109128570A (en) | 2018-11-06 | 2018-11-06 | A kind of oxidation-resistant alloy solder and preparation method thereof |
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| CN201811310392.6A CN109128570A (en) | 2018-11-06 | 2018-11-06 | A kind of oxidation-resistant alloy solder and preparation method thereof |
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| CN109128570A true CN109128570A (en) | 2019-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811310392.6A Withdrawn CN109128570A (en) | 2018-11-06 | 2018-11-06 | A kind of oxidation-resistant alloy solder and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN109128570A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560766A (en) * | 2021-09-08 | 2021-10-29 | 烟台艾邦电子材料有限公司 | Special soldering paste for weldable stainless steel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313293A (en) * | 1989-06-09 | 1991-01-22 | Yuho Chem Kk | Solder paste |
| JP2006088205A (en) * | 2004-09-24 | 2006-04-06 | Toshiba Corp | Manufacturing method of jointing material, and jointing material obtained by the method |
| CN101880792A (en) * | 2010-06-07 | 2010-11-10 | 深圳市亿铖达工业有限公司 | Anti-corrosive anti-oxidation Pb-free solder alloy for aluminum soldering |
| CN108620765A (en) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | A kind of automobile metal plate work welding material and welding procedure |
-
2018
- 2018-11-06 CN CN201811310392.6A patent/CN109128570A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313293A (en) * | 1989-06-09 | 1991-01-22 | Yuho Chem Kk | Solder paste |
| JP2006088205A (en) * | 2004-09-24 | 2006-04-06 | Toshiba Corp | Manufacturing method of jointing material, and jointing material obtained by the method |
| CN101880792A (en) * | 2010-06-07 | 2010-11-10 | 深圳市亿铖达工业有限公司 | Anti-corrosive anti-oxidation Pb-free solder alloy for aluminum soldering |
| CN108620765A (en) * | 2018-05-09 | 2018-10-09 | 长沙小如信息科技有限公司 | A kind of automobile metal plate work welding material and welding procedure |
Non-Patent Citations (1)
| Title |
|---|
| 李昭昭等: "国外软钎焊助焊剂综述", 《电子工艺技术》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560766A (en) * | 2021-09-08 | 2021-10-29 | 烟台艾邦电子材料有限公司 | Special soldering paste for weldable stainless steel |
| CN113560766B (en) * | 2021-09-08 | 2024-01-30 | 烟台艾邦电子材料有限公司 | Solder paste special for weldable stainless steel |
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