CN109121470B - Electronic equipment - Google Patents
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- CN109121470B CN109121470B CN201780011027.2A CN201780011027A CN109121470B CN 109121470 B CN109121470 B CN 109121470B CN 201780011027 A CN201780011027 A CN 201780011027A CN 109121470 B CN109121470 B CN 109121470B
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- shell
- electronic circuit
- insulating properties
- lid
- resin layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Slave unit (51) includes the shell (1) of box-like, and top surface (1a) is open；Electronic circuit (2), has the substrate (5) for being equipped with electronic component (6), which is accommodated in shell (1)；Insulating properties liquid (3) covers electronic circuit (2) in filling to shell (1) with insulating properties and mobility；It covers (8), is placed on insulating properties liquid (3)；And resin layer (4), it is set to the gap between lid (8) and the side (1b) of shell (1), together blocks the top surface (1a) of shell (1) with lid (8).
Description
Technical field
The present invention relates to electronic circuit is contained in the intracorporal electronic equipment of shell.
Background technique
For electronic equipment as the slave unit acted with regard to receiving instruction from programmable logic controller (PLC), from
From the perspective of ensuring waterproof performance and heat dissipation performance, usually the electronic circuit for being contained in shell is covered by resin material
Resin material is solidified and is packaged by lid.However, be difficult to take out electronic circuit out of shell after resin material solidification,
Therefore, it is difficult to be parsed and carried out dismantling repairing to failure cause in the event of a failure.In order to realize failure cause
Parsing and dismantling are repaired, exist be not packaged by resin material but using the construction padded, but there are following problems,
That is, waterproof performance and heat dissipation performance reduce due to the aging of liner.
When the parsing and dismantling for implementing failure cause are repaired, the resin material after solidification is cut sometimes, is made
Internal electronic circuit exposes, it is likely that the accidentally damage electronic circuit in resin material cutting.It is new in damage electronic circuit
In the case where generating trouble location, failure cause originally can not be parsed.
Patent Document 1 discloses the electronic equipments of following constructions, that is, in the gel being packaged to electronic circuit
Hard resin layer is set on resin layer.
Patent document 1: Japanese Unexamined Patent Application 60-103649 bulletin
Summary of the invention
In invention disclosed in patent document 1, a part, that is, terminal of electronic circuit is from the hard resin layer after solidification
It stretches out.It therefore,, can not be right if having damaged the terminal stretched out from hard resin layer in invention disclosed in patent document 1
Failure cause is parsed.
The present invention is exactly to propose in view of the foregoing, and its object is to obtain capable of being easily contained in shell
The electronic equipment that electronic circuit takes out without damaging the electronic circuit.
In order to solve above-mentioned problem, it achieves the goal, the present invention includes shell, and top surface is open；Electronic circuit, quilt
It is contained in shell；And insulating properties liquid, with insulating properties and mobility, in filling to shell and by electronic circuit
Covering.The present invention includes lid, is placed on insulating properties liquid；And resin layer, it is set between lid and shell
Gap together blocks the top surface of shell with lid.
The effect of invention
Electronic equipment of the present invention, which is realized, easily to be taken out the electronic circuit for being contained in shell without damaging
Effect as the bad electronic circuit.
Detailed description of the invention
Fig. 1 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 1 are related to.
Fig. 2 is the oblique view for the electronic equipment that embodiment 1 is related to.
Fig. 3 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 4 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 5 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 6 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 7 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 8 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 1 is related to.
Fig. 9 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 1 is related to.
Figure 10 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 2 are related to.
Figure 11 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 2 is related to.
Figure 12 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 2 is related to.
Figure 13 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 2 is related to.
Figure 14 is the figure of the manufacturing step for the electronic equipment for indicating that embodiment 2 is related to.
Figure 15 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to.
Figure 16 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to.
Figure 17 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to.
Figure 18 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to.
Figure 19 is the figure of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to.
Figure 20 is figure the step of building again for the electronic equipment for indicating that embodiment 2 is related to.
Figure 21 is figure the step of building again for the electronic equipment for indicating that embodiment 2 is related to.
Figure 22 is figure the step of building again for the electronic equipment for indicating that embodiment 2 is related to.
Figure 23 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 3 are related to.
Specific embodiment
In the following, the electronic equipment that embodiments of the present invention are related to is described in detail based on attached drawing.In addition, of the invention
It is not limited to present embodiment.
Embodiment 1.
Fig. 1 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 1 are related to.
Fig. 2 is the oblique view for the electronic equipment that embodiment 1 is related to.The electronic equipment that embodiment 1 is related to i.e. subordinate fills
Setting 51 is the device for receiving instruction from programmable logic controller (PLC) and being acted.Slave unit 51 includes shell 1, top surface
1a is open；Electronic circuit 2 is contained in shell 1；Insulating properties liquid 3, filling cover electronic circuit 2 in shell 1
Lid；Lid 8 is placed on insulating properties liquid 3；And resin layer 4, the top surface 1a of shell 1 is blocked together with lid 8.
Lid 8 is less than the top surface 1a of shell 1.Resin layer 4 is arranged between lid 8 and the side 1b of shell 1.In the embodiment 1, shell 1
Shape for rectangular-shape, but shell 1 is not limited to cuboid.It, can be using modeling for the material of shell 1 and lid 8
Material.
Electronic circuit 2 has substrate 5 and multiple electronic components 6, and multiple electronic component 6 is installed on the front and back sides of substrate 5.
The water-proof connector 9 being electrically connected with electronic component 6 is installed with the face of 11 opposite side of bottom surface of shell 1 in substrate 5.Waterproof connects
It connects device 9 and is press-fit into the through-hole 12 formed in the bottom surface of shell 1 11, the gap between shell 1 and water-proof connector 9 keeps dampening
Close property.Water-proof connector 9 is protruding to except shell 1, therefore the connection energy for the electronic component 6 and external device (ED) installed in substrate 5
It is enough to be easy to carry out except shell 1.Insulating properties liquid 3 covers 2 integral gapless of electronic circuit.Substrate 5 is not by
The secure component of diagram is fixed on shell 1.For substrate 5 is fixed on the secure component of shell 1, can exemplify screw with
And pin, but not limited to this.It, can be using any one of colloidal sol, gel and liquid for insulating properties liquid 3.
In the case where using gel as insulating properties liquid 3, Silica hydrogel can be applied, but not limited to this.Below
In explanation, insulating properties liquid 3 is set as gel.Resin layer 4 is the layer of solid, prevents insulating properties liquid 3 from leaking out of shell 1
Out.Resin layer 4 can using being filled using state before curing to shell 1 not with the insulating properties liquid as gel
3 mixed resin materials.For it can be applied to the resin material of resin layer 4, thermosetting resin, thermoplasticity can be exemplified
Resin, uv curing resin and biliquid hybrid resin, but not limited to this.Thermosetting resin is being applied to resin
In the case where layer 4, selecting can be being less than or equal to the at a temperature of cured resin material of the heat resisting temperature of electronic circuit 2.Separately
Outside, in the case where thermoplastic resin is applied to resin layer 4, it is selected in the heat resisting temperature less than or equal to electronic circuit 2
At a temperature of plasticization resin material.For it can be applied to the concrete example of resin material of resin layer 4, epoxy can be enumerated
Resin and polyurethane resin.
Fig. 3, Fig. 4, Fig. 5 and Fig. 6 are the figures of the manufacturing step for the electronic equipment for indicating that embodiment 1 is related to.Firstly, such as
Shown in Fig. 3, electronic circuit 2 is configured from the top surface side 1a in shell 1, by the indentation of water-proof connector 9 to through-hole 12.Then, to shell
Insulating properties liquid 3 is filled from the top surface side 1a in body 1, as shown in figure 4, sealing by insulating properties liquid 3 to electronic circuit 2
Dress.Then, as shown in figure 5, loading lid 8 on insulating properties liquid 3.Then, as shown in fig. 6, in the side of lid 8 and shell 1
Configuration is applied to the resin material of resin layer 4 between the 1b of face, and the top surface 1a of shell 1 is blocked.Then, by keeping resin layer 4 solid
Change, to complete Fig. 1 and slave unit shown in Fig. 2 51.The entirety of electronic circuit 2 is covered by insulating properties liquid 3, and absolutely
Edge liquid 3 is encapsulated by lid 8 and resin layer 4.By above-mentioned construction, electronic circuit 2 will not expose to except resin layer 4,
Therefore prevent electronic circuit 2 damaged.
In addition it is also possible to be set as, it is pre-formed more than or equal to one exhaust through-hole in lid 8, is flowed to insulating properties
After loading lid 8 on body 3, resin layer 4 is also formed in the part of through-hole.By forming exhaust through-hole in lid 8, thus insulating
Property liquid 3 and lid 8 between be not easy residual air, yield rate when manufacturing slave unit 51 and finished product when being constructed again
Rate improves.
Fig. 7, Fig. 8 and Fig. 9 are the figures of the taking-up step of the electronic circuit for the electronic equipment for indicating that embodiment 1 is related to.
Firstly, as shown in fig. 7, resin layer 4 is removed and moving tool 7 along the periphery of lid 8.By the way that resin layer 4 is removed,
It is only to be placed on insulating properties liquid 3 and loose state to become lid 8.After removing resin layer 4, such as
Shown in Fig. 8, lift lid 8 and relative to insulating properties liquid, so that lid 8 be removed.After removing lid 8, such as Fig. 9 institute
Show, water-proof connector 9 is pulled out from through-hole 12 and takes out electronic circuit 2 from insulating properties liquid 3.Insulating properties liquid 3 has
There is mobility, therefore can be by electronic circuit 2 from insulation in the state that insulating properties liquid 3 is present in shell 1
Property liquid 3 take out.Also, for the insulating properties liquid 3 for being attached to the electronic circuit 2 taken out from insulating properties liquid 3, lead to
It crosses blowing or ethyl alcohol cleans such method and is removed.In addition, insulating properties liquid 3 is that liquid, colloidal sol or mobility are high
Gel, if water-proof connector 9 is pulled out from through-hole 12, insulating properties liquid 3 from through-hole 12 leak out in the case where, as long as
Insulating properties liquid 3 is removed before taking out electronic circuit 2.
When being constructed again to slave unit 51, as long as by 3 removal of insulating properties liquid remained in shell 1
Afterwards, the step identical as manufacturing step is carried out.The insulating properties liquid 3 remained in shell 1 can either be by being drawn into
Row removal, is also able to use tool and scrapes and remove.In addition, in the feelings that the resin material of no electric conductivity is applied to resin layer 4
Under condition, even if the fragment of generated resin layer 4 is attached to shell 1 or electronic circuit when removing resin layer 4 by tool 7
2, it will not be led to the problem of in the slave unit 51 constructed again.
For the slave unit 51 that embodiment 1 is related to, expose insulating properties liquid 3 and removing resin layer 4,
Therefore electronic circuit 2 can be taken out from insulating properties liquid 3.The insulating properties liquid 3 that electronic circuit 2 is covered has flowing
Property, therefore electronic circuit 2 will not be damaged when taking out electronic circuit 2 from insulating properties liquid 3.
For the slave unit 51 that embodiment 1 is related to, as long as resin layer 4 is removed, it will be able to easily from insulation
Property liquid 3 in take out electronic circuit 2.Therefore, even if having found the feelings of more 51 failures of slave unit because batch is bad
Under condition, it is also easy to whether all identical confirm failure cause.
The thermal conductivity ratio air of insulating properties liquid 3 is high.Therefore, embodiment 1 is related to slave unit 51 in shell 1
Inside be not filled with the slave unit of insulating properties liquid 3 and compare, heat dissipation performance is got higher.Therefore, embodiment 1 be related to from
Belong to device 51 compared with the slave unit for being not filled with insulating properties liquid 3 in the inside of shell 1, the temperature of electronic component 6 is not
Easily rise.Even if heat is also not easy stagnant as a result, under the hot environment for being not susceptible to the heat dissipation from shell 1 into ambiance
Stay the thermal runaway that electronic component 6 is not susceptible in electronic component 6.
In addition, being filled with insulating properties liquid in the inside of shell 1 for the slave unit 51 that embodiment 1 is related to
3, therefore when vibrating electronic component 6 together with substrate 5 by external force, it is applied to the joint portion of substrate 5 Yu electronic component 6
The stress divided is mitigated.Therefore, compared with shell 1 is hollow situation, the slave unit 51 that embodiment 1 is related to can be mentioned
High vibration resistance.
In addition, being filled with insulating properties liquid in the inside of shell 1 for the slave unit 51 that embodiment 1 is related to
3, therefore compared with shell 1 is hollow situation, it can be improved the dielectric strength between electronic component 6.
For the slave unit 51 that embodiment 1 is related to, as long as tree is only arranged between lid 8 and the side 1b of shell 1
Rouge layer 4, therefore the dosage of the resin material applied to resin layer 4 can be reduced.In addition, with regard to embodiment 1 be related to from
For belonging to device 52, when taking out electronic circuit 2, the resin layer 4 that removes of needs is only the part around lid 8, thus with pass through
Tool 7, which removes, compares the situation for 4 entirety of resin layer that the entire top surface 1a of shell 1 is covered, and can shorten the removal of resin layer 4
Time needed for operation.In addition, can be torn open to when taking out electronic circuit 2 for the slave unit 51 that embodiment 1 is related to
Under lid 8 recycled, therefore can reduce the amount of the waste generated in the parsing of failure cause.
In addition, for the slave unit 51 that embodiment 1 is related to, can also be formed by conductive material shell 1 with
And lid 8, and Markite is applied to resin layer 4.By utilizing conductive shell 1, lid 8 and resin layer 4
Electronic circuit 2 is surrounded, thus, it is possible to prevent except the noise leakage generated by electronic circuit 2 to slave unit 51.With regard to implementing
For the slave unit 51 that mode 1 is related to, only there are resin layers 4 between lid 8 and the side 1b of shell 1, thus with pass through work
The situation for 4 entirety of resin layer that the entire top surface 1a of shell 1 is covered is compared in 7 removal of tool, and resin layer 4 is being gone by tool 7
Except when the amount of the fragment of resin layer 4 that generates reduce.Therefore, it can reduce since the fragment of resin layer 4 is attached to shell 1 or electricity
Sub-circuit 2 and cause a possibility that the slave unit 51 constructed again is led to the problem of.
For the device used in the field in factory automation, in order to enable will not occur again by identical reason
Caused failure, user it is expected to parse failure cause strongly, and this desired tendentiousness is high.Embodiment 1 is related to
And slave unit 51, when taking out electronic circuit 2, a possibility that keeping electronic circuit 2 damaged, is low, therefore can prevent due to electricity
The breakage of sub-circuit 2 and can not determine failure cause.Therefore, the slave unit 51 that embodiment 1 is related to is able to respond user's
For the expectation of failure cause parsing.
Embodiment 2.
Figure 10 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 2 are related to.Embodiment 2 is related to
For electronic equipment, that is, slave unit 52, electronic circuit 21 and electronic circuit 22 are contained in shell 1.That is, being filled in subordinate
It sets in 52 shell 1 and contains multiple electronic circuits.Electronic circuit 21 and electronic circuit 22 by base mother daughter board connector 91,92 into
Row connection.In addition, be placed on the insulating properties liquid 3 for covering electronic circuit 21 and electronic circuit 22 lid 81 and
Lid 82, between lid 81 and the side 1b of shell 1, between lid 82 and the side 1b of shell 1 and between lid 81 and lid 82
It is provided with resin layer 4.In embodiment 2, insulating properties liquid 3 is colloidal sol or gel.Other aspects are related to embodiment 1
Slave unit 51 it is identical.In addition, lid 81 is configured at the top of electronic circuit 21, lid 82 is configured at the top of electronic circuit 22.
That is, being directed to each of multiple electronic circuits 21,22, lid 81,82 is individually placed on insulating properties liquid 3.Between substrate
One in connector 91,92 is male connector, the other is female.Therefore, base mother daughter board connector 91,92 can be docked by end
It is attached.
Figure 11, Figure 12, Figure 13 and Figure 14 are the figures of the manufacturing step for the electronic equipment for indicating that embodiment 2 is related to.Firstly,
As shown in figure 11, electronic circuit 21 and electronic circuit 22 are configured from the top surface side 1a in shell 1 and is pressed into water-proof connector 9
It is attached to through-hole 12, and by electronic circuit 21 and electronic circuit 22 by base mother daughter board connector 91,92.In addition, can also
To configure electronics electricity into shell 1 after connecting electronic circuit 21 and electronic circuit 22 by base mother daughter board connector 91,92
Road 21 and electronic circuit 22.Then, into shell 1, from the top surface side 1a, filling insulating properties liquid 3 as shown in figure 12 will be electric
Sub-circuit 21 and electronic circuit 22 are packaged by insulating properties liquid 3.Electronic circuit 21,22 is being passed through into insulating properties stream
After kinetoplast 3 is packaged, as shown in figure 13, lid 81,82 is loaded on insulating properties liquid 3.Then, as shown in figure 14,
Between lid 81 and the side 1b of shell 1, configures and answer between lid 82 and the side 1b of shell 1 and between lid 81 and lid 82
For the resin material of resin layer 4, the top surface 1a of shell 1 is blocked.Then, by solidifying resin layer 4, to complete Figure 10
Shown in slave unit 52.
Figure 15, Figure 16, Figure 17, Figure 18 and Figure 19 are taking for the electronic circuit for the electronic equipment for indicating that embodiment 2 is related to
The figure of step out.Herein, it is illustrated to the step of only taking out electronic circuit 21.Firstly, as shown in figure 15, making tool 7
It is moved along the periphery of lid 81 and removes the resin layer 4 around lid 81.By the way that the resin layer 4 around lid 81 is removed,
It is only to be placed on insulating properties liquid 3 and loose state to become lid 81.By the resin around lid 81
After 4 removal of layer, as shown in figure 16, lid 81 is removed and lifting lid 81.After lid 81 is removed, as shown in figure 17,
The insulating properties liquid 3 for remaining on the region for being provided with electronic circuit 21 originally is removed.It is provided with originally if will remain on
The insulating properties liquid 3 in the region of electronic circuit 21 removes, then as shown in figure 18 removes base mother daughter board connector 91,92, make electricity
Sub-circuit 21 and electronic circuit 22 separate.After being separated electronic circuit 21,22, as shown in figure 19, waterproof is connected
Device 9 pulls out from through-hole 12 and takes out electronic circuit 21 from shell 1.For being attached to the insulating properties flowing of the electronic circuit 21 of taking-up
Body 3 cleans such method by blowing or ethyl alcohol and is removed.
Next, to electronic circuit 21 to be configured to the shell 1 for having been provided with electronic circuit 22 and the step constructed again
Suddenly it is illustrated.Figure 20, Figure 21 and Figure 22 are figures the step of building again for the electronic equipment for indicating that embodiment 2 is related to.
Firstly, the end of the base mother daughter board connector 92 of 22 side of electronic circuit is carried out ethyl alcohol cleaning, base mother daughter board connector 92 will be attached to
End insulating properties liquid 3 remove.In addition it is also possible to which the end of base mother daughter board connector 92 is blowed and by insulating properties
Liquid 3 removes.After the insulating properties liquid 3 that will be attached to the end of base mother daughter board connector 92 removes, in shell 1
Eliminate the region configuration electronic circuit 21 of insulating properties liquid 3.At the time of being configured with electronic circuit 21 into shell 1, from
Belonging to device 52 becomes the state shown in figure 18.Then, electronic circuit 21 and electronic circuit 22 are passed through into base mother daughter board connector 91,92
It is attached.At the time of electronic circuit 21 and electronic circuit 22 have been carried out connection by base mother daughter board connector 91,92, subordinate
Device 52 becomes state shown in Figure 17.Then, insulating properties stream is filled to the part configured with electronic circuit 21 from the top surface side 1a
Kinetoplast 3 is covered entire electronic circuit 21 by insulating properties liquid 3.By insulating properties liquid 3 by electronic circuit 21 into
Gone covering at the time of, slave unit 52 become Figure 20 shown in state.Then, lid 81 is configured on insulating properties liquid 3.
At the time of to lid 81 are configured on insulating properties liquid 3, slave unit 52 becomes state shown in Figure 21.Then, to lid
The resin material for being applied to resin layer 4 is configured between 81 and the side 1b of shell 1 and between lid 81 and lid 82, by shell 1
Top surface 1a is blocked.At the time of being configured with the resin material applied to resin layer 4, slave unit 52 becomes shape shown in Figure 22
State.Then, by solidifying resin layer 4, so that slave unit 52 shown in Fig. 10 be reconstructed.
In the above description, to simplify the explanation, it shows two electronic circuit arrangements in the intracorporal structure of shell, but
It also can be above or equal to three electronic circuit arrangements in shell.
The slave unit 52 that embodiment 2 is related to, which can be realized, only takes out a part in multiple electronic circuits and only
A part of electronic circuit is taken out to be constructed again later.It therefore, there is no need to take out electricity obviously unrelated with failure cause from shell
Sub-circuit can simplify the taking-up of electronic circuit and the operation constructed again to slave unit 52.In addition, can be only right
A part in multiple electronic circuits is replaced, therefore compared with not splitting into multiple situations with electronic circuit, can be reduced
The cost repaired by the replacement bring of electronic circuit.
In the same manner as the slave unit 51 that the slave unit 52 that embodiment 2 is related to and embodiment 1 are related to, can prevent from
Shell 1 keeps electronic circuit 21,22 damaged when taking out, and can be realized the raising of heat dissipation performance, the raising of vibration resistance and
The raising of dielectric strength.
Embodiment 3.
Figure 23 is the figure of the construction for the electronic equipment for indicating that embodiments of the present invention 3 are related to.It is related in embodiment 3
In electronic equipment, that is, slave unit 53, it is known that electronic circuit 22 is not the object of the parsing of failure cause, whole to be covered by resin layer 4
Lid.On the other hand, electronic circuit 21 is likely to become the object of the parsing of failure cause, whole to be covered by insulating properties liquid 3.In
Lid 81 is placed on insulating properties liquid 3, but the resin layer 4 on electronic circuit 22 is not placed with lid.Other and implementation
The slave unit 52 that mode 2 is related to is identical.
For the slave unit 53 that embodiment 3 is related to, it is only possible to the electronics of the object of the parsing as failure cause
Circuit 21 is covered by insulating properties liquid 3.That is, being only a part i.e. electronic circuit 21 in electronic circuit 21,22 by insulating properties
Liquid 3 covers.Therefore, the use of the insulating properties liquid 3 when the slave unit 53 that embodiment 3 is related to can reduce manufacture
Amount.
In the above description, to tool, there are two the constructions of electronic circuit 21,22 to be illustrated, but slave unit 53
It can be with the structure more than or equal to three electronic circuits.In addition, illustrating in the electronics covered by insulating properties liquid 3
The construction that resin layer 4 is set on circuit 21 and blocks the top surface 1a of shell 1, but can also be covered by insulating properties liquid 3
Lid is configured on the electronic circuit 21 of lid, in the gap setting resin layer 4 of lid and the side 1b of shell 1.It is flowed when in insulating properties
In the case that multiple lids are set on body 3, resin layer 4 is also provided with covering mutual gap location.
In the same manner as the slave unit 51 that the slave unit 53 that embodiment 3 is related to and embodiment 1 are related to, can prevent from
Shell 1 makes electronic circuit 21 when taking out damaged, and can be realized the raising of heat dissipation performance, the raising of vibration resistance and insulation
The raising of intensity.
The representation shown in the above-described embodiment be the contents of the present invention an example, also can be with other
Well-known technique combination, can also omit, change a part of structure in the range for not departing from purport of the invention.
The explanation of label
1 shell, the top surface 1a, the side 1b, 2,21,22 electronic circuits, 3 insulating properties liquids, 4 resin layers, 5 substrates, 6 electronics
Component, 7 tools, 8,81,82 cover, 9 water-proof connectors, 11 bottom surfaces, 12 through-holes, 51,52,53 slave units, connect between 91,92 substrates
Connect device.
Claims (2)
1. a kind of electronic equipment comprising:
Shell, top surface are open；
Multiple electronic circuits, they are accommodated in the shell；
Insulating properties liquid covers the electronic circuit in filling to the shell with insulating properties and mobility；
Multiple lids are directed to multiple electronic circuits each, are individually placed on the insulating properties liquid；And
Resin layer is set to the gap between the lid and the shell, together seals the top surface of the shell with the lid
It is stifled,
The resin layer blocks the part between the lid of the top surface of the shell.
2. electronic equipment according to claim 1, which is characterized in that
The electronic circuit has the substrate for being equipped with electronic component,
The substrate is equipped with water-proof connector in the face of the bottom surface opposite side with the shell,
The shell is formed with through-hole in bottom surface,
The water-proof connector is press-fit into the through-hole and is protruding to except the shell.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/016209 WO2018198169A1 (en) | 2017-04-24 | 2017-04-24 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109121470A CN109121470A (en) | 2019-01-01 |
| CN109121470B true CN109121470B (en) | 2019-12-03 |
Family
ID=61756591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780011027.2A Active CN109121470B (en) | 2017-04-24 | 2017-04-24 | Electronic equipment |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6301035B1 (en) |
| CN (1) | CN109121470B (en) |
| WO (1) | WO2018198169A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7324036B2 (en) * | 2019-04-17 | 2023-08-09 | アルプスアルパイン株式会社 | Electronics and manufacturing methods |
| CN112951808B (en) * | 2021-03-25 | 2022-12-30 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
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| JP2874720B2 (en) * | 1991-10-25 | 1999-03-24 | 日本電気株式会社 | Hybrid integrated circuit device |
| JPH0653662A (en) * | 1992-08-03 | 1994-02-25 | Nec Corp | Hybrid integrated circuit device |
| JP2014130875A (en) * | 2012-12-28 | 2014-07-10 | Mitsubishi Electric Corp | Semiconductor device and manufacturing method of the same |
-
2017
- 2017-04-24 CN CN201780011027.2A patent/CN109121470B/en active Active
- 2017-04-24 WO PCT/JP2017/016209 patent/WO2018198169A1/en active Application Filing
- 2017-04-24 JP JP2017559887A patent/JP6301035B1/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086764A (en) * | 2001-09-12 | 2003-03-20 | Toshiba Corp | Semiconductor device |
| JP2004064856A (en) * | 2002-07-26 | 2004-02-26 | Denso Corp | Electronic control device and its assembling method |
| CN101308161A (en) * | 2007-05-18 | 2008-11-19 | 株式会社电装 | Electronic device having molded resin case, and molding tool and method of manufacturing the same |
| CN101404862A (en) * | 2007-10-01 | 2009-04-08 | 株式会社电装 | Electronic circuit device and method of making the same |
| CN202274442U (en) * | 2011-10-22 | 2012-06-13 | 华南师范大学 | Light-emitting diode heat-dissipation base with good heat conduction |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6301035B1 (en) | 2018-03-28 |
| WO2018198169A1 (en) | 2018-11-01 |
| CN109121470A (en) | 2019-01-01 |
| JPWO2018198169A1 (en) | 2019-06-27 |
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