CN109119348B - Packaging method of mould pressing device of LED substrate - Google Patents
Packaging method of mould pressing device of LED substrate Download PDFInfo
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- CN109119348B CN109119348B CN201811047615.4A CN201811047615A CN109119348B CN 109119348 B CN109119348 B CN 109119348B CN 201811047615 A CN201811047615 A CN 201811047615A CN 109119348 B CN109119348 B CN 109119348B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses a die pressing device of an LED substrate and a packaging method thereof, and the die pressing device comprises an upper die and a lower die, wherein a cavity is arranged at the top of the lower die, the lower die is provided with a glue injection pipe, the glue injection pipe is communicated with the cavity, the glue injection pipe is provided with a pressure pump and a heating sleeve, two sides of the bottom of the cavity are respectively provided with a first top block, the first top blocks are connected with a first oil cylinder, a bottom fixing block is arranged between the two first top blocks, a first electric heating part is arranged in each first top block, and a second electric heating part is arranged in each bottom fixing block; the upper die is provided with a return pipe, the return pipe is communicated with the die cavity, the two sides of the upper die are respectively provided with a top fixing block, a second ejection block is arranged between the two top fixing blocks, the second ejection block is connected with a second oil cylinder, a third electric heating part is arranged in the top fixing block, and a fourth electric heating part is arranged in the second ejection block. The invention can solve the defects of the prior art, reduce the content of bubbles in the colloid and improve the compactness of the colloid.
Description
Technical Field
The invention relates to the technical field of LED lighting module production, in particular to an LED mould pressing device and a packaging method thereof.
Background
With the development of semiconductor technology, the LED lighting module is rapidly developed by virtue of its characteristics of high lighting brightness, low energy consumption and long service life. In the production process of the LED lighting module, the LED lamp beads in the LED lighting module need to be packaged, and the process is usually carried out by adopting a mould pressing method. The chinese patent CN104210064B discloses an LED molding sealing device and a sealing method thereof, which can well maintain the pressure of glue in a cavity, avoid volume shrinkage during the thermosetting process of the packaging glue, ensure complete glue of the sealing finished product, and increase the yield of the molded finished product. However, the molding device ensures the integrity of the colloid through a pressure maintaining structure, and the required pressure is high, so that air bubbles in the colloid are not easy to discharge.
Disclosure of Invention
The invention aims to provide an LED mould pressing device and a packaging method thereof, which can overcome the defects of the prior art, reduce the content of bubbles in a colloid and improve the compactness of the colloid.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows.
An LED die pressing device comprises an upper die and a lower die, wherein a cavity is formed in the top of the lower die, the lower die is provided with a glue injection pipe, the glue injection pipe is communicated with the cavity, a pressure pump and a heating sleeve are arranged on the glue injection pipe, two sides of the bottom of the cavity are respectively provided with a first ejector block, the first ejector blocks are connected with a first oil cylinder, a bottom fixing block is arranged between the two first ejector blocks, a first sealing strip is arranged on the contact surface of the bottom fixing block and the first ejector blocks, a first electric heating part is arranged in each first ejector block, and a second electric heating part is arranged in each bottom fixing block; the upper die is provided with a return pipe, the return pipe is communicated with the die cavity, the two sides of the upper die are respectively provided with a top fixing block, a second ejection block is arranged between the two top fixing blocks, the second ejection block is connected with a second oil cylinder, a second sealing strip is arranged on the contact surface of the top fixing block and the second ejection block, a third electric heating part is arranged in the top fixing block, and a fourth electric heating part is arranged in the second ejection block.
As preferred, first electric heating portion includes first cavity, is provided with the heating member in the first cavity, cavity and heating member clearance fit, the internal fixed first electric heating wire that is provided with a plurality of that is provided with between the first electric heating wire that faces mutually, and the cavity top is provided with the heat conductor, and the heating member bottom is connected to first hydro-cylinder through heat insulating mattress and first spring body, when first hydro-cylinder upwards promoted first electric heating portion, makes heating member and heat conductor contact through compressing first spring body.
Preferably, a plurality of second electric heating wires are fixedly arranged in the second electric heating part, a second heat insulation filling layer is arranged between every two adjacent second electric heating wires, and a circulating water pipe is arranged outside the second electric heating wires.
Preferably, the third electric heating part comprises a plurality of annular electric heating wires which are coaxially arranged, the annular electric heating wires are vertically and vertically arranged in sequence, the diameter of each annular electric heating wire is gradually increased from top to bottom, each annular electric heating wire is connected with an independent power switch, a heat conducting rod is movably inserted in the center of each annular electric heating wire, and the heat conducting rod is driven by a third oil cylinder to move up and down.
Preferably, the fourth electric heating part comprises a second cavity, a plurality of third electric heating wires are movably arranged in the second cavity, a third heat insulation filling layer is arranged between every two adjacent third electric heating wires, the third electric heating wires and the second electric heating wires are arranged in a staggered mode, and the third electric heating wires are connected with a third oil cylinder through connecting rods.
The packaging method of the LED mold pressing device comprises the following steps:
A. placing the LED substrate into a cavity, and closing and sealing an upper die and a lower die;
B. starting a pressure pump (5) to inject glue into the cavity (3) through a glue injection pipe (4), wherein the injection pressure is 2.8bar, and when glue overflows from a return pipe (13), a heating sleeve (6), a first electric heating part, a second electric heating part, a third electric heating part and a fourth electric heating part start to heat; the heating temperature of the first electric heating part is 85 ℃, the heating temperature of the second electric heating part is 85 ℃, the heating temperature of the third electric heating part is 105 ℃, and the heating temperature of the fourth electric heating part is 105 ℃;
C. keeping the overflow rate of the return pipe to be 0.35g/s, gradually solidifying the glue in the cavity, closing the pressure pump when the injection pressure is increased to 4.1bar, starting the first oil cylinder and the second oil cylinder, and driving the first ejector block and the second ejector block to move towards the interior of the cavity;
D. the moving distance of the first ejector block is 0.15mm, and the moving distance of the second ejector block is 0.12 mm; the heating temperature of the first electric heating part is 95 ℃, the heating temperature of the second electric heating part is 120 ℃, the heating temperature of the third electric heating part is 130 ℃, and the heating temperature of the fourth electric heating part is 125 ℃;
E. and after the glue is completely cured, opening the die and taking out the LED substrate, and polishing the packaging edge.
Preferably, the heating temperature of the heating jacket is 10 ℃ lower than a weighted average value of the heating temperatures of the first electric heating unit, the second electric heating unit, the third electric heating unit and the fourth electric heating unit, and a weighting rate of the heating temperatures of the first electric heating unit, the second electric heating unit, the third electric heating unit and the fourth electric heating unit is proportional to the heating power of the first electric heating unit, the second electric heating unit, the third electric heating unit and the fourth electric heating unit.
Adopt the beneficial effect that above-mentioned technical scheme brought to lie in: according to the invention, the circulating glue injection pipeline is arranged, the existing pressure maintaining packaging process is abandoned, and the glue is gradually cured in circulation. The packaging process of the invention has low demand pressure and good glue circulation effect, and the air bubbles in the glue can be gradually diffused and discharged outwards in the circulation process. In the middle and rear sections of the package, the filling integrity of the colloid in the cavity can be enhanced through the extrusion molding of the first top block and the second top block, and the curing strength of the colloid can be improved. According to the glue circulating curing characteristic, the heating parts are optimally designed, the first electric heating part and the second electric heating part at the bottom have lower heating power than the third electric heating part and the fourth electric heating part at the top, the situation that glue cured in advance at the bottom is excessively heated can be avoided, the linear degree of temperature gradient distribution in the whole cavity can be optimized through the matching of the upper group of heating mechanisms and the lower group of heating mechanisms, and therefore the uniformity of the glue curing process is improved.
Drawings
FIG. 1 is a block diagram of one embodiment of the present invention.
Fig. 2 is a structural view of a first electric heating portion in an embodiment of the present invention.
Fig. 3 is a structural view of a second electric heating portion in an embodiment of the present invention.
Fig. 4 is a structural view of a third electric heating portion in one embodiment of the present invention.
Fig. 5 is a structural view of a fourth electric heating portion in one embodiment of the present invention.
FIG. 6 is a block diagram of the interface between the injection tube and the cavity in accordance with one embodiment of the present invention.
In the figure: 1. an upper die; 2. a lower die; 3. a cavity; 4. a glue injection pipe; 5. a pressure pump; 6. heating the sleeve; 7. a first top block; 8. a first cylinder; 9. a bottom fixing block; 10. a first seal strip; 11. a first electric heating section; 12. a second electric heating section; 13. a return pipe; 14. a top fixing block; 15. a second top block; 16. a second cylinder; 17. a second seal strip; 18. a third electric heating section; 19. a fourth electric heating section; 20. a first cavity; 21. a heating body; 22. a first electric heating wire; 23. a first insulating filling layer; 24. a heat conductor; 25. a heat insulating pad; 26. a first spring body; 27. a second electric heating wire; 28. a second insulating filling layer; 29. a circulating water pipe; 30. an annular electric heating wire; 31. a heat conducting rod; 32. a third oil cylinder; 33. a second cavity; 34. a third electric heating wire; 35. a third insulating filling layer; 36. a connecting rod; 37. an inclined plane part; 38. elastic flow deflector.
Detailed Description
The standard parts used in the invention can be purchased from the market, the special-shaped parts can be customized according to the description and the description of the attached drawings, and the specific connection mode of each part adopts the conventional means of mature bolts, rivets, welding, sticking and the like in the prior art, and the detailed description is not repeated.
Referring to fig. 1-6, a specific embodiment of the present invention includes an upper mold 1 and a lower mold 2, a cavity 3 is disposed at the top of the lower mold 2, the lower mold 2 is provided with a glue injection pipe 4, the glue injection pipe 4 is communicated with the cavity 3, the glue injection pipe 4 is provided with a pressure pump 5 and a heating sleeve 6, two sides of the bottom of the cavity 3 are respectively provided with a first top block 7, the first top block 7 is connected with a first oil cylinder 8, a bottom fixing block 9 is disposed between the two first top blocks 7, a first sealing strip 10 is disposed on a contact surface between the bottom fixing block 9 and the first top block 7, a first electric heating portion 11 is disposed in the first top block 7, and a second electric heating portion 12 is disposed in the bottom fixing block 9; the upper die 1 is provided with a return pipe 13, the return pipe 13 is communicated with the die cavity 3, top fixing blocks 14 are respectively arranged on two sides of the upper die 1, a second ejector block 15 is arranged between the two top fixing blocks 14, the second ejector block 15 is connected with a second oil cylinder 16, a second sealing strip 17 is arranged on the contact surface of the top fixing blocks 14 and the second ejector block 15, a third electric heating part 18 is arranged in the top fixing blocks 14, and a fourth electric heating part 19 is arranged in the second ejector block 15. First electric heating portion 11 includes first cavity 20, be provided with heating body 21 in the first cavity 20, first cavity 20 and heating body 21 clearance fit, heating body 21 internal fixation is provided with the first electric heating wire 22 of a plurality of, be provided with first thermal-insulated filling layer 23 between the first electric heating wire 22 that faces mutually, first cavity 20 top is provided with heat conductor 24, heating body 21 bottom is connected to first hydro-cylinder 8 through heat insulating mattress 25 and first spring body 26, when first hydro-cylinder 8 upwards promotes first electric heating portion 11, make heating body 21 and heat conductor 24 contact through compressing first spring body 26. A plurality of second electric heating wires 27 are fixedly arranged in the second electric heating part 12, a second heat insulation filling layer 28 is arranged between the adjacent second electric heating wires 27, and a circulating water pipe 29 is arranged outside the second electric heating wires 27. The third electric heating part 18 comprises a plurality of annular electric heating wires 30 which are coaxially arranged, the annular electric heating wires 30 are vertically and vertically arranged in sequence, the diameter of each annular electric heating wire 30 is gradually increased from top to bottom, each annular electric heating wire 30 is connected with an independent power switch (not shown in the figure), a heat conducting rod 31 is movably inserted in the center of each annular electric heating wire 30, and the heat conducting rod 31 is driven to move up and down through a third oil cylinder 32. The fourth electric heating part 19 comprises a second cavity 33, a plurality of third electric heating wires 34 are movably arranged in the second cavity 33, a third heat insulation filling layer 35 is arranged between the adjacent third electric heating wires 34, the third electric heating wires 34 and the second electric heating wires 27 are arranged in a staggered mode, and the third electric heating wires 34 are connected with a third oil cylinder 32 through connecting rods 36. The third electric heating wire 34 and the second cavity 33 move independently, the fourth electric heating part 19 including the second cavity 33 is driven by the second oil cylinder 16, and the third electric heating wire 34 is driven by the third oil cylinder 32 through the connecting rod 36.
In addition, the interface between the glue injection pipe 4 and the cavity 3 is symmetrically provided with two inclined plane parts 37 inclined to two sides of the cavity 3, the inclined plane parts 37 are provided with a plurality of elastic flow deflectors 38, and under the condition of no stress, the included angle between the elastic flow deflectors 38 and the inclined plane parts 37 is 20 °. When first kicking block 7 and second kicking block 15 extrude the colloid, elasticity water conservancy diversion piece 38 produces the reverse deformation opposite with feeding direction under the effect of colloid elastic deformation to effectively reduce the colloid atress unbalance because the extrusion brings.
The packaging method of the LED mold pressing device comprises the following steps:
A. placing the LED substrate into the cavity 3, and closing the upper die 1 and the lower die 2 for sealing;
B. starting a pressure pump (5) to inject glue into the cavity (3) through a glue injection pipe (4), wherein the injection pressure is 2.8bar, and when glue overflows from a return pipe (13), heating the sleeve pipe (6), the first electric heating part 11, the second electric heating part 12, the third electric heating part 18 and the fourth electric heating part 19; the heating temperature of the first electric-heating part 11 is 85 ℃, the heating temperature of the second electric-heating part 12 is 85 ℃, the heating temperature of the third electric-heating part 18 is 105 ℃, and the heating temperature of the fourth electric-heating part 19 is 105 ℃;
C. keeping the overflow rate of the return pipe 13 at 0.35g/s, gradually solidifying the glue in the cavity 3, closing the pressure pump 5 when the injection pressure is increased to 4.1bar, starting the first oil cylinder 8 and the second oil cylinder 16, and driving the first top block 7 and the second top block 15 to move towards the interior of the cavity 3;
D. the moving distance of the first ejector block 7 is 0.15mm, and the moving distance of the second ejector block 15 is 0.12 mm; the heating temperature of the first electric heating part 11 is 95 ℃, the heating temperature of the second electric heating part 12 is 120 ℃, the heating temperature of the third electric heating part 18 is 130 ℃, and the heating temperature of the fourth electric heating part 19 is 125 ℃;
E. and after the glue is completely cured, opening the die and taking out the LED substrate, and polishing the packaging edge.
The heating temperature of the heating jacket 6 is 10 ℃ lower than the weighted average value of the heating temperatures of the first electric heating part 11, the second electric heating part 12, the third electric heating part 18 and the fourth electric heating part 19, and the weighting rate of the heating temperatures of the first electric heating part 11, the second electric heating part 12, the third electric heating part 18 and the fourth electric heating part 19 is proportional to the heating power of the first electric heating part 11, the second electric heating part 12, the third electric heating part 18 and the fourth electric heating part 19.
The flow rate of the water in the circulating water pipe 29 is proportional to the distance between the second electric heating wire 27 and the third electric heating wire 34.
When the heating temperature of the third electric heating part 18 fluctuates, the third oil cylinder 32 is started to telescopically adjust the heat conducting rod 31 while the heating power is adjusted, so as to achieve the effect of quickly stabilizing the heating temperature. When the heating temperature is higher than the set temperature, the heat conducting rod 31 moves upwards, the change rate of the heating temperature is positive, the acceleration direction and the speed direction of the heat conducting rod 31 are the same, the change rate of the heating temperature is negative, and the acceleration direction and the speed direction of the heat conducting rod 31 are opposite; when the heating temperature is lower than the set temperature, the heat conducting rod 31 moves downwards; at this time, the rate of change of the heating temperature is positive, the acceleration direction of the heat conduction rod 31 is opposite to the speed direction, the rate of change of the heating temperature is negative, and the acceleration direction and the speed direction of the heat conduction rod 31 are the same. The individual power switches of each of the looped electric heating wires 30 are individually controlled according to the temperature variation in the lateral direction of the third electric heating portion 18.
The packaging glue used in the prior art mainly comprises polyurethane modified epoxy resin, methyl hexahydrophthalic anhydride, vinyl silane coupling agent, bisphenol A, organosilicon type defoaming agent and dibutyl tin dilaurate. In order to better improve the bonding integrity of the glue under pressure, the invention adopts the following formula (the following parts are in parts by weight):
300 parts of polyurethane-modified epoxy resin, 200 parts of methylhexahydrophthalic anhydride, 15 parts of a vinyl silane coupling agent, 40 parts of bisphenol A, 3 parts of a silicone-type antifoaming agent, 10 parts of dibutyltin dilaurate, 70 parts of polyethylene glycol oleate, 20 parts of 2, 3-dimethyl-2, 3-diphenylbutane and 35 parts of dibutyl phthalate. The 2, 3-dimethyl-2, 3-diphenyl butane can promote dibutyl phthalate and methyl hexahydrophthalic anhydride to form a three-dimensional network cross-linking structure, and the polyethylene glycol oleate is used for improving the distribution uniformity of the polyurethane modified epoxy resin in the cross-linking structure.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (1)
1. The utility model provides a method for encapsulating of LED mold pressing device, LED mold pressing device includes cope match-die set (1) and bed die (2), and bed die (2) top is provided with die cavity (3), its characterized in that: the lower die (2) is provided with a glue injection pipe (4), the glue injection pipe (4) is communicated with the cavity (3), the glue injection pipe (4) is provided with a pressure pump (5) and a heating sleeve (6), two sides of the bottom of the cavity (3) are respectively provided with a first ejector block (7), the first ejector blocks (7) are connected with first oil cylinders (8), a bottom fixing block (9) is arranged between the two first ejector blocks (7), a first sealing strip (10) is arranged on the contact surface of the bottom fixing block (9) and the first ejector blocks (7), a first electric heating part (11) is arranged in each first ejector block (7), and a second electric heating part (12) is arranged in each bottom fixing block (9); the upper die (1) is provided with a return pipe (13), the return pipe (13) is communicated with the die cavity (3), two sides of the upper die (1) are respectively provided with a top fixing block (14), a second ejector block (15) is arranged between the two top fixing blocks (14), the second ejector block (15) is connected with a second oil cylinder (16), a second sealing strip (17) is arranged on the contact surface of the top fixing block (14) and the second ejector block (15), a third electric heating part (18) is arranged in the top fixing block (14), and a fourth electric heating part (19) is arranged in the second ejector block (15);
a plurality of second electric heating wires (27) are fixedly arranged in the second electric heating part (12), and a circulating water pipe (29) is arranged on the outer side of each second electric heating wire (27);
the fourth electric heating part (19) comprises a second cavity (33), a plurality of third electric heating wires (34) are movably arranged in the second cavity (33), and the third electric heating wires (34) and the second electric heating wires (27) are arranged in a staggered mode;
the packaging method comprises the following steps:
A. placing the LED substrate into the cavity (3), and closing and sealing the upper die (1) and the lower die (2);
B. starting a pressure pump (5) to inject glue into the cavity (3) through a glue injection pipe (4), wherein the injection pressure is 2.8bar, and when glue overflows from a return pipe (13), heating the sleeve (6), the first electric heating part (11), the second electric heating part (12), the third electric heating part (18) and the fourth electric heating part (19); the heating temperature of the first electric heating part (11) is 85 ℃, the heating temperature of the second electric heating part (12) is 85 ℃, the heating temperature of the third electric heating part (18) is 105 ℃, and the heating temperature of the fourth electric heating part (19) is 105 ℃;
C. keeping the overflow rate of the return pipe (13) to be 0.35g/s, gradually solidifying the glue in the cavity (3), closing the pressure pump (5) when the injection pressure is increased to 4.1bar, starting the first oil cylinder (8) and the second oil cylinder (16) and driving the first ejector block (7) and the second ejector block (15) to move towards the interior of the cavity (3);
D. the moving distance of the first ejector block (7) is 0.15mm, and the moving distance of the second ejector block (15) is 0.12 mm; the heating temperature of the first electric heating part (11) is 95 ℃, the heating temperature of the second electric heating part (12) is 120 ℃, the heating temperature of the third electric heating part (18) is 130 ℃, and the heating temperature of the fourth electric heating part (19) is 125 ℃;
E. after the glue is completely cured, opening the die and taking out the LED substrate, and polishing the packaging edge;
the heating temperature of the heating sleeve (6) is 10 ℃ lower than the weighted average value of the heating temperatures of the first electric heating part (11), the second electric heating part (12), the third electric heating part (18) and the fourth electric heating part (19), and the weighting rate of the heating temperatures of the first electric heating part (11), the second electric heating part (12), the third electric heating part (18) and the fourth electric heating part (19) is in direct proportion to the heating power of the first electric heating part (11), the second electric heating part (12), the third electric heating part (18) and the fourth electric heating part (19);
the flow rate of water flow in the circulating water pipe (29) is in direct proportion to the distance between the second electric heating wire (27) and the third electric heating wire (34);
when the heating temperature of the third electric heating part (18) fluctuates, the third oil cylinder (32) is started to perform telescopic adjustment on the heat conducting rod (31) while the heating power is adjusted; when the heating temperature is higher than the set temperature, the heat conducting rod (31) moves upwards, the acceleration direction and the speed direction of the heat conducting rod (31) are the same when the change rate of the heating temperature is positive, and the acceleration direction and the speed direction of the heat conducting rod (31) are opposite when the change rate of the heating temperature is negative; when the heating temperature is lower than the set temperature, the heat conducting rod (31) moves downwards; when the change rate of the heating temperature is positive, the acceleration direction of the heat conduction rod (31) is opposite to the speed direction, and when the change rate of the heating temperature is negative, the acceleration direction of the heat conduction rod (31) is the same as the speed direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047615.4A CN109119348B (en) | 2017-04-06 | 2017-04-06 | Packaging method of mould pressing device of LED substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710221736.5A CN106848044B (en) | 2017-04-06 | 2017-04-06 | A kind of LED molding device and its packaging method |
| CN201811047615.4A CN109119348B (en) | 2017-04-06 | 2017-04-06 | Packaging method of mould pressing device of LED substrate |
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| CN201710221736.5A Division CN106848044B (en) | 2017-04-06 | 2017-04-06 | A kind of LED molding device and its packaging method |
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| CN109119348A CN109119348A (en) | 2019-01-01 |
| CN109119348B true CN109119348B (en) | 2020-02-25 |
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| CN201710221736.5A Active CN106848044B (en) | 2017-04-06 | 2017-04-06 | A kind of LED molding device and its packaging method |
| CN201811047630.9A Withdrawn CN109192845A (en) | 2017-04-06 | 2017-04-06 | LED molding device and its packaging method for LED substrate |
| CN201811047628.1A Active CN108807651B (en) | 2017-04-06 | 2017-04-06 | Die pressing device of LED substrate and packaging method thereof |
| CN201811047629.6A Withdrawn CN109065694A (en) | 2017-04-06 | 2017-04-06 | The packaging method of LED molding device for LED substrate |
| CN201811047615.4A Active CN109119348B (en) | 2017-04-06 | 2017-04-06 | Packaging method of mould pressing device of LED substrate |
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| CN201811047630.9A Withdrawn CN109192845A (en) | 2017-04-06 | 2017-04-06 | LED molding device and its packaging method for LED substrate |
| CN201811047628.1A Active CN108807651B (en) | 2017-04-06 | 2017-04-06 | Die pressing device of LED substrate and packaging method thereof |
| CN201811047629.6A Withdrawn CN109065694A (en) | 2017-04-06 | 2017-04-06 | The packaging method of LED molding device for LED substrate |
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|---|---|---|---|---|
| CN108257896B (en) * | 2018-01-31 | 2020-04-21 | 吴克足 | Automatic heating device for integrated circuit packaging equipment |
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| CN101572287A (en) * | 2009-06-02 | 2009-11-04 | 中山大学 | Method for actively packaging blue light LED chip based white light LED |
| CN106449513A (en) * | 2016-11-11 | 2017-02-22 | 华南理工大学 | Anti-overheating CSP (chip scale package) fluorescent diaphragm mould pressing device and anti-overheating CSP fluorescent diaphragm mould pressing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108807651B (en) | 2019-12-17 |
| CN109065694A (en) | 2018-12-21 |
| CN106848044A (en) | 2017-06-13 |
| CN106848044B (en) | 2019-01-29 |
| CN109119348A (en) | 2019-01-01 |
| CN108807651A (en) | 2018-11-13 |
| CN109192845A (en) | 2019-01-11 |
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