CN205488218U - LED lamp encapsulation equipment - Google Patents
LED lamp encapsulation equipment Download PDFInfo
- Publication number
- CN205488218U CN205488218U CN201521139339.6U CN201521139339U CN205488218U CN 205488218 U CN205488218 U CN 205488218U CN 201521139339 U CN201521139339 U CN 201521139339U CN 205488218 U CN205488218 U CN 205488218U
- Authority
- CN
- China
- Prior art keywords
- fixed plate
- die cavity
- mould
- crane
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model provides a LED lamp encapsulation equipment, a LED lamp encapsulation equipment, including mould, fixed plate, supporting seat, crane and encapsulating subassembly, be equipped with the die cavity of a plurality of array arrangement's undercut on the mould, be equipped with the intercommunication on the mould liquid stream groove between the adjacent die cavity, the transversal obtuse triangle who personally submits 95 -110 in liquid stream groove, the supporting seat is used for supporting the mould, the fixed plate sets up directly over the supporting seat, the crane with the fixed plate is connected, just the fixed plate can be followed the crane and slided from top to bottom, the LED lamp plate is fixed in the lower surface of fixed plate, the encapsulating subassembly be used for to the die cavity encapsulating. This LED lamp encapsulation equipment conveniently makes the casting glue in every die cavity keep at same liquid level position, the cross section in this liquid stream groove is obtuse triangle, can effectively improve the utilization ratio of encapsulating, makes things convenient for simultaneously to demolish from the LED lamp plate behind the moulded package.
Description
Technical field
This utility model relates to a kind of LED sealed in unit.
Background technology
LED (light emitting diode) encapsulation refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference.The encapsulation of LED does not require nothing more than can protect wick, but also want can printing opacity.
Common LED packaging technology includes a gum forming (potting), tuberculosis molding (Transfer Molding), moulding by casting (Casting Molding) and compression molding (Compression Molding), in die press technology for forming, the loss of encapsulating material is few, can be packaged accurate material and extensively be used by LED industry.But when using compression molding, resin material is easily built-up on mould and is difficult to come off or injecting glue and the problem such as cause die life short in pressing mold hole.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is that providing a kind of encapsulates uniform LED sealed in unit.
For solving the problems referred to above, the technical scheme that this utility model is used is as follows:
A kind of LED sealed in unit, including mould, fixed plate, support seat, crane and encapsulating assembly；
Described mould is provided with the die cavity of the concave downward of some array arrangements, and described mould is communicated with the spout between described adjacent die cavity, and the cross section of described spout is the obtuse triangle of 95-110 °；
Described support seat is used for supporting described mould；Described fixed plate is arranged at the surface supporting seat, and described crane is connected with described fixed plate, and described fixed plate can slide up and down along crane；LED lamp panel is fixed on the lower surface of described fixed plate；Described encapsulating assembly is for described die cavity encapsulating.
As preferably, the degree of depth of described spout is 1:5-10 with the ratio of the degree of depth of described die cavity.
As preferably, described crane is provided with the guide rail slided for fixed plate.
As preferably, also including a hydraulic telescopic arm, described telescopic arm one end is fixing with crane to be connected, and the other end is connected with the end face of described fixed plate, and described hydraulic telescopic arm is used for driving fixed plate upper and lower displacement.
As preferably, described siphunculus passes described support seat, and can rotate relative to described support seat.
As preferably, described support seat is provided with conveyer belt, and described conveyer belt is used for transmitting described mould.
Compared to existing technology, the beneficial effects of the utility model are:
The LED sealed in unit that this utility model provides, by arranging the die cavity of some depressions on a Die and mould plate, and is provided with spout between adjacent die cavity；Facilitate casting glue from dispersed to the adjacent die cavity of a die cavity so that the casting glue in each die cavity is maintained at same liquid level position；The cross section of this spout is obtuse triangle, removes after facilitating moulded package from LED lamp panel.
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment 1；
Fig. 2 is the structural representation of mould；
Fig. 3 is that Fig. 2 is along A-A ' line cross-sectional view；
Fig. 4 is that Fig. 2 is along B-B ' line cross-sectional view；
Fig. 5 is the partial structurtes schematic diagram of R-portion in Fig. 4；
In Fig. 1-5, each reference: 1, mould；11, die cavity；12, spout；2, seat is supported；21, through hole；3, fixed plate；4, crane；41, guide rail；5, hydraulic telescopic arm；6, the pump housing；61, siphunculus；62, Jiao Zui；7, LED lamp panel；8, conveyer belt.
Detailed description of the invention
Embodiment
1
The present embodiment provides a kind of LED sealed in unit, for LED lamp panel 7 is entered moulded package, as it is shown in figure 1, a kind of LED sealed in unit, including mould 1, supports seat 2, fixed plate 3, crane 4 and encapsulating assembly；
Described mould is provided with the die cavity 11 of the concave downward of some array arrangements, and described mould is communicated with the spout 12 between described adjacent die cavity, and the cross section of described spout is the obtuse triangle of 95-110 °；
Described support seat is used for supporting described mould；Described fixed plate is arranged at the surface supporting seat, and described crane is connected with described fixed plate, and described fixed plate can slide up and down along crane；LED lamp panel is fixed on the lower surface of described fixed plate；Described encapsulating assembly is for described die cavity encapsulating.
In LED encapsulation process, first mould is sent on described support seat, by encapsulating assembly, casting glue is injected die cavity again, LED lamp panel is fixed on described fixed plate the most again, lamp bead in wherein said LED lamp panel and the die cavity one_to_one corresponding on described mould, fixed plate is made to drop frame slide downward along described major axis, LED lamp panel is pressed together with described mould, LED lamp bead immerses the die cavity filling casting glue, heating makes casting glue curing molding, complete encapsulation, then make fixed plate along described crane upward sliding so that LED lamp panel separates with described mould.
In encapsulation process, because need to remove from LED lamp panel after the casting glue curing molding in spout, during so the cross section of spout is obtuse triangle, the casting glue storage in spout is little, and the utilization rate of casting glue is higher；It is semicircle or semielliptical for spout, when cross section is obtuse triangle, the casting glue discontinuity in spout relative to cross section, low with the adhesion strength of LED lamp panel, it is easier to after solidification remove from LED lamp panel.And when spout inclination angle is excessive, the problem being difficult to from mould abjection after curing molding, may be there is.
In embodiment 1, LED lamp panel can be connected with fixed plate by modes such as clampings.
In embodiment 1, specifically, described encapsulating assembly includes the pump housing 6, siphunculus 61 and the glue mouth 62 being sequentially communicated.Casting glue by siphunculus transmission to Jiao Zui, pours into described die cavity by Jiao Zui under pump housing effect, and by dispersed to all of die cavity of spout in die cavity.Further, as it is shown in figure 1, described siphunculus is through described support seat, and can rotate relative to described support seat, rotate described siphunculus so that described Jiao Zui is directed at described die cavity or removes.Described support seat is provided with the through hole 21 passed for siphunculus.
In embodiment 1, it is preferable that the degree of depth of described spout is 1:5-10 with the ratio of the degree of depth of described die cavity.Under this depth ratio, the dispersion efficiency of casting glue is higher, casting glue utilization rate high and glue unnecessary after solidification is easily removed from LED lamp panel.
In embodiment 1, specifically, crane is provided with the guide rail 41 slided for fixed plate as described in Figure 1, so that described fixed plate smoothly slides up and down along described crane.
In embodiment 1, it is preferable that also include a hydraulic telescopic arm 5, described telescopic arm one end is fixing with crane to be connected, and the other end is connected with the end face of described fixed plate, and described hydraulic telescopic arm is used for driving fixed plate upper and lower displacement.
Described hydraulic telescopic arm is connected with the end face of described fixed plate, and described hydraulic telescopic arm is used for driving fixed plate upper and lower displacement.
In embodiment 1, it is preferable that described support seat is provided with conveyer belt 8, described conveyer belt is used for transmitting described mould.
In the present embodiment, described die cavity be shaped as dome-type, semielliptical type or half-cone one therein, described die cavity be preferably shaped to the shape that inwall is curved surface, to facilitate the LED being cured and packaged to deviate from from mould.
Above-mentioned embodiment is only preferred implementation of the present utility model; the scope that can not limit this utility model protection with this, the change of any unsubstantiality that those skilled in the art is done on the basis of this utility model and replacement belong to this utility model scope required for protection.
Claims (7)
1. a LED sealed in unit, including mould, fixed plate, support seat, crane and encapsulating group
Part；
Described mould is provided with the die cavity of the concave downward of some array arrangements, and described mould is communicated with institute
Stating the spout between adjacent die cavity, the cross section of described spout is the obtuse triangle of 95-110 °；
Described support seat is used for supporting described mould；Described fixed plate is arranged at the surface supporting seat, described
Crane is connected with described fixed plate, and described fixed plate can slide up and down along crane；LED lamp panel is fixed
Lower surface in described fixed plate；Described encapsulating assembly is for described die cavity encapsulating.
2. LED sealed in unit as claimed in claim 1, its feature in, the degree of depth of described spout with
The ratio of the degree of depth of described die cavity is 1:5-10.
3. LED sealed in unit as claimed in claim 1, its feature in, described crane is provided with confession
The guide rail that fixed plate is slided.
4. LED sealed in unit as claimed in claim 1, its feature in, also include a hydraulic telescopic arm,
Described telescopic arm one end is fixing with crane to be connected, and the other end is connected with the end face of described fixed plate, described
Hydraulic telescopic arm is used for driving fixed plate upper and lower displacement.
5. LED sealed in unit as claimed in claim 1, its feature in, described encapsulating assembly includes depending on
The pump housing of secondary connection, siphunculus and Jiao Zui.
6. LED sealed in unit as claimed in claim 5, it is characterised in that described siphunculus is through described
Support seat, and can rotate relative to described support seat.
7. LED sealed in unit as claimed in claim 1, it is characterised in that described support seat is provided with
Conveyer belt, described conveyer belt is used for transmitting described mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521139339.6U CN205488218U (en) | 2015-12-30 | 2015-12-30 | LED lamp encapsulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521139339.6U CN205488218U (en) | 2015-12-30 | 2015-12-30 | LED lamp encapsulation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488218U true CN205488218U (en) | 2016-08-17 |
Family
ID=56663230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521139339.6U Expired - Fee Related CN205488218U (en) | 2015-12-30 | 2015-12-30 | LED lamp encapsulation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488218U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112570213A (en) * | 2021-01-07 | 2021-03-30 | 南京寿陆顺服装有限公司 | LED encapsulation encapsulating device |
-
2015
- 2015-12-30 CN CN201521139339.6U patent/CN205488218U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112570213A (en) * | 2021-01-07 | 2021-03-30 | 南京寿陆顺服装有限公司 | LED encapsulation encapsulating device |
| CN112570213B (en) * | 2021-01-07 | 2022-04-12 | 台山鸿隆光电科技有限公司 | LED encapsulation encapsulating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105228805B (en) | Resin molding machine and resin molding method | |
| CN105751673A (en) | LED encapsulation printer and LED encapsulation method | |
| CN205488218U (en) | LED lamp encapsulation equipment | |
| CN212554924U (en) | Novel bottle lid production is with many injection molding mouth injection molding machine | |
| CN104014249B (en) | Glue injection method when hollow-fibre membrane tow termination encapsulates | |
| CN203895500U (en) | LED packaging mould | |
| CN207503966U (en) | Suitable for eight row lead frame of TO251 types of continuous filling technique | |
| CN204844714U (en) | Open hot runner system of MSC | |
| CN208906295U (en) | A kind of rotor molding die | |
| CN210061840U (en) | Zero runner mouth of a river mould of frame is glued to on-vehicle and industry control in a poor light | |
| CN209935104U (en) | Glue dispensing structure of die bonder capable of dispensing glue uniformly | |
| CN205326457U (en) | LED encapsulates printing machine | |
| CN207014641U (en) | A kind of plastic mould | |
| CN105576107B (en) | LED encapsulation structure and its method for packing | |
| CN218559411U (en) | Horizontal filling machine | |
| TWI739700B (en) | Mini led die sealing method with optical effect | |
| CN205914341U (en) | Cell -phone shell assembly rubber coating device | |
| CN103171071B (en) | Mould for casting moulding | |
| CN220482495U (en) | Mould for injection molding of sole surface | |
| CN212045755U (en) | Plastic glass-imitating mold | |
| CN205185220U (en) | Injection mold waters | |
| CN204936075U (en) | A kind of Fast Filling equivalance constant voltage runner pouring gate structure | |
| CN208826995U (en) | A kind of optical lens mold | |
| CN207901562U (en) | A kind of plastic cement injection pressure plate injection mold | |
| CN104157583B (en) | Chip plastic packaging method and mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170811 Address after: 114000 No. 16, spectral Road, hi tech Zone, Liaoning, Anshan Patentee after: Anshan keen Lighting Technology Co., Ltd. Address before: 510000 Guangdong city of Guangzhou province Luogang District Hing Road No. 62 Building 1 East cloud layer two Patentee before: GUANGZHOU YOSON-LIGHT INDUSTRIAL CO., LIMITED |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20181230 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |