CN109105962B - Resistance material, heating sheet and preparation method of heating sheet - Google Patents
Resistance material, heating sheet and preparation method of heating sheet Download PDFInfo
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- CN109105962B CN109105962B CN201811192388.4A CN201811192388A CN109105962B CN 109105962 B CN109105962 B CN 109105962B CN 201811192388 A CN201811192388 A CN 201811192388A CN 109105962 B CN109105962 B CN 109105962B
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 85
- 238000002360 preparation method Methods 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 239000000919 ceramic Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000003571 electronic cigarette Substances 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims description 50
- 238000000498 ball milling Methods 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 43
- 238000000227 grinding Methods 0.000 claims description 42
- 238000002156 mixing Methods 0.000 claims description 32
- 238000007639 printing Methods 0.000 claims description 25
- 239000002002 slurry Substances 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 18
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 18
- 238000005245 sintering Methods 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 16
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 238000011049 filling Methods 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000001856 Ethyl cellulose Substances 0.000 claims description 9
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 9
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 9
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000292 calcium oxide Substances 0.000 claims description 9
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 9
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 229920001249 ethyl cellulose Polymers 0.000 claims description 9
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 9
- 239000011812 mixed powder Substances 0.000 claims description 9
- 239000012046 mixed solvent Substances 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 239000011733 molybdenum Substances 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 235000012239 silicon dioxide Nutrition 0.000 claims description 9
- 229940116411 terpineol Drugs 0.000 claims description 9
- 239000004408 titanium dioxide Substances 0.000 claims description 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 239000010937 tungsten Substances 0.000 claims description 9
- 238000009837 dry grinding Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 235000019504 cigarettes Nutrition 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 241000208125 Nicotiana Species 0.000 description 2
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- A24F47/008—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The invention relates to a heating sheet in an electronic cigarette, in particular to a resistance material, a heating sheet and a preparation method of the heating sheet, wherein the heating sheet comprises an internal ceramic substrate, the outer side of a heating section of the ceramic substrate is sequentially coated with a resistance layer, a heating film and a transparent glaze layer from inside to outside, the outer side of an electrode section of the ceramic substrate is coated with the resistance layer, and a copper-plated electrode is arranged on the outer side of the resistance layer of the electrode section, compared with the prior art, the invention has the beneficial effects that: air is isolated, oxidation and corrosion resistance are enhanced, a copper plating process is adopted for electrodes which do not need to generate heat, and the temperature of an electrode area is reduced.
Description
Technical Field
The invention relates to a heating sheet in an electronic cigarette, in particular to a resistance material, a heating sheet and a preparation method of the heating sheet.
Background
The existing electronic cigarette heating sheet is generally printed with a resistance layer on the surface of a ceramic sheet, and the surface of the resistance layer is not treated. Electronic cigarette products need a heating sheet to rapidly heat up to a high temperature, and a heating film is generally a metal mixture of W, WC, MO and the like, and is often in a high-temperature oxygen environment, so that metal oxidation is easily caused, the resistance is increased, and as a result, the heating is more and more slow.
The grease generated by the tobacco shreds or the tobacco tar in a high-temperature state accelerates the oxidation and the corrosion of the heating film, easily increases the resistance of the heating film and breaks the circuit, and greatly shortens the service life of the heating sheet.
Therefore, the development of a new resistance material, a heating sheet and a preparation method of the heating sheet not only have urgent research values, but also have good economic benefits and industrial application potentials, which are the basis of the power completed by the invention.
Disclosure of Invention
The present inventors have conducted intensive studies to overcome the above-identified drawbacks of the prior art, and as a result, have completed the present invention after having made a great deal of creative efforts.
Specifically, the technical problems to be solved by the present invention are: the resistor material, the heating sheet and the preparation method of the heating sheet are provided to solve the technical problems that the heating sheet is slower and slower in temperature rise and short in service life in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for preparing resistance slurry of heating film comprises mixing tungsten, molybdenum, manganese oxide and titanium dioxide, loading into ball milling tank, adding alcohol and grinding ball, ball milling, taking out, and oven drying to obtain powder A; putting calcium oxide, silicon dioxide and aluminum oxide into a ball milling tank, adding grinding balls, and performing ball milling, and taking out to prepare powder B; and mixing the powder A and the powder B, adding a mixed solvent of terpineol and ethyl cellulose into the mixed powder, filling the mixture into a grinding tank, adding grinding balls into the grinding tank, and pouring out slurry after ball milling to serve as resistance slurry of the heating film.
In the invention, as an improvement, the method comprises the following steps:
(1) preparation of powder A
Uniformly mixing 30-60% of tungsten, 10-20% of molybdenum, 15-55% of manganese oxide and 1-5% of titanium dioxide in percentage by weight, filling the mixture into a ball milling tank, adding alcohol and grinding balls in a certain proportion, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 20-40 wt% of calcium oxide, 30-40 wt% of silicon dioxide and 20-50 wt% of aluminum oxide, putting the mixture into a ball milling tank, adding grinding balls, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 40-70 wt% of powder A and 30-60 wt% of powder B, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an amount which is equal to 40 wt% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling grinding balls into the ball milling tank, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
In the invention, as an improvement, a plurality of grinding balls with different diameters are respectively added in the step (1), the step (2) and the step (3) for grinding.
A preparation method for preparing a heating sheet by using the resistance paste prepared in the previous step comprises the following steps:
s1, adopting a ceramic substrate containing 96% of alumina in the mixture ratio as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance slurry on a ceramic substrate through a steel wire screen to form a slurry layer, drying, keeping the temperature at 1450 ℃ in the atmosphere at 1400 ℃ for 30-60 minutes, and sintering to form the resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1300-1350 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
In the invention, as an improvement, the method comprises the following steps:
s1, adopting a ceramic substrate containing 96% of aluminum nitride in proportion as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance slurry on a ceramic substrate through a steel wire screen to form a slurry layer, drying, keeping the temperature at 1450 ℃ in the atmosphere at 1400 ℃ for 30-60 minutes, and sintering to form the resistance layer;
s3, attaching a heating film outside the heating section resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1300-1350 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the electrode segment resistance layer to form a copper-plated electrode.
In the present invention, as an improvement, the steel wire mesh screen in step S2 is a 300-mesh steel wire mesh screen.
In the present invention, as a modification, the atmosphere in the step S2 uses a mixed gas of hydrogen and nitrogen.
The heating sheet comprises an internal ceramic substrate, the heating section of the ceramic substrate is sequentially provided with a resistance layer, a heating film and a transparent glaze layer, the electrode section of the ceramic substrate is also provided with the resistance layer, and the resistance layer of the electrode section is arranged on the lower side of the copper-plated electrode.
The left part of the ceramic substrate is an electrode section, and the right part of the ceramic substrate is a heating section.
Compared with the prior art, the invention has the beneficial effects that:
(1) aiming at the problems of high-temperature oxidation and corrosion, the invention prepares oxidation-resistant high-temperature heating slurry, forms a heating film by hydrogen reduction and high-temperature sintering, prints a 1300-DEG C medium-temperature glaze material on the heating film area, forms a glass glaze layer by sintering at 1200-1300 ℃ in a reducing atmosphere, isolates air, strengthens the functions of oxidation resistance and corrosion resistance, adopts a copper plating process on an electrode which does not need heating, reduces the temperature of the electrode area, and protects a connecting electrode element from being damaged by high temperature.
Drawings
In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
FIG. 1 is a schematic structural view of the present invention;
in the figure: 1. ceramic substrate, 2, resistance layer, 3, heating film, 4, transparent glaze layer, 5, copper-plated electrode.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
The first embodiment is as follows: as shown in fig. 1, a heating sheet includes an internal ceramic substrate 1, the left side part of the ceramic substrate 1 is an electrode segment, the right side part of the ceramic substrate 1 is a heating segment, the electrode segment and the heating segment are integrated, the heating segment of the ceramic substrate 1 is printed with a resistive layer 2, a heating film 3 and a transparent glaze layer 4 from inside to outside in sequence, the resistive layer 2 and the transparent glaze layer 4 are respectively printed on the ceramic substrate 1 through screen printing, the resistive layer 2 is formed by printing resistance paste, the electrode segment outside of the ceramic substrate 1 is provided with a resistive layer 2, the resistive layer 2 of the electrode segment and the resistive layer 2 of the heating segment are printed and processed simultaneously, the resistive layer 2 of the electrode segment is installed on the lower side of a copper-plated electrode 5, the resistive layer 2 reduces the temperature of the electrode region, and protects the connected electrode elements from high temperature.
The preparation method of the heating sheet comprises the following steps:
s1, adopting a ceramic substrate containing 96% of alumina in the mixture ratio as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature at 1400 ℃ for 30 minutes, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1300 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
The steel wire mesh plate in the step S2 is a 300-mesh steel wire mesh plate.
The atmosphere in step S2 uses a mixed gas of hydrogen and nitrogen.
The parameters of the prepared heating sheet are as follows: the resistance value is 0.5 omega +/-10%, the temperature coefficient is 1800 to 3000 ppm/DEG C, and the working temperature is 300 ℃ within 10 seconds.
The preparation method of the resistance paste required in the preparation of the heating sheet comprises the following steps:
(1) preparation of powder A
Uniformly mixing 60% of tungsten, 20% of molybdenum, 15% of manganese oxide and 5% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding 20 vol% of alcohol and a plurality of grinding balls with different diameters, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 20% of calcium oxide, 30% of silicon dioxide and 50% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding a plurality of grinding balls with different diameters, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 40% of powder A and 60% of powder B in percentage by weight, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an equal weight according to 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling a plurality of grinding balls with different diameters, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
Example two:
the second embodiment is substantially the same as the first embodiment, except that:
the preparation method of the heating sheet comprises the following steps:
s1, adopting a ceramic substrate containing 96% of alumina in the mixture ratio as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature at 1450 ℃ for 60 minutes in the atmosphere, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering at 1350 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
The preparation method of the resistance paste required in the preparation of the heating sheet comprises the following steps:
(1) preparation of powder A
Uniformly mixing 30% of tungsten, 10% of molybdenum, 55% of manganese oxide and 5% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding 25 vol% of alcohol and a plurality of grinding balls with different diameters, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 40% of calcium oxide, 40% of silicon dioxide and 20% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding a plurality of grinding balls with different diameters, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 70% of powder A and 30% of powder B in percentage by weight, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an equal weight according to 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling a plurality of grinding balls with different diameters, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
Example three:
the third embodiment is substantially the same as the first embodiment, except that:
the preparation method of the heating sheet comprises the following steps:
s1, adopting a ceramic substrate containing 96% of aluminum nitride in proportion as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature for 45 minutes in the atmosphere at the temperature of 1425 ℃, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1325 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
The preparation method of the resistance paste required in the preparation of the heating sheet comprises the following steps:
(1) preparation of powder A
Uniformly mixing 60% of tungsten, 20% of molybdenum, 19% of manganese oxide and 1% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding 25 vol% of alcohol and a plurality of grinding balls with different diameters, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 40% of calcium oxide, 40% of silicon dioxide and 20% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding a plurality of grinding balls with different diameters, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 40% of powder A and 60% of powder B in percentage by weight, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an equal weight according to 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling a plurality of grinding balls with different diameters, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
Example four
The fourth embodiment is substantially the same as the first embodiment, except that:
the preparation method of the heating sheet comprises the following steps:
s1, adopting a ceramic substrate containing 96% of aluminum nitride in proportion as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature for 45 minutes in the atmosphere at the temperature of 1425 ℃, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1325 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
The preparation method of the resistance paste required in the preparation of the heating sheet comprises the following steps:
(1) preparation of powder A
Uniformly mixing 45% of tungsten, 15% of molybdenum, 35% of manganese oxide and 5% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding 22 vol% of alcohol and a plurality of grinding balls with different diameters, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 30% of calcium oxide, 35% of silicon dioxide and 35% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding a plurality of grinding balls with different diameters, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 55 wt% of powder A and 45 wt% of powder B, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an amount which is 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling a plurality of grinding balls with different diameters, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
Example five:
the fifth embodiment is substantially the same as the first embodiment, except that:
the preparation method of the heating sheet comprises the following steps:
s1, adopting a ceramic substrate containing 96% of aluminum nitride in proportion as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature for 45 minutes in the atmosphere at the temperature of 1425 ℃, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1325 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
The preparation method of the resistance paste required in the preparation of the heating sheet comprises the following steps:
(1) preparation of powder A
Uniformly mixing 47% of tungsten, 15% of molybdenum, 35% of manganese oxide and 3% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding 20 vol% of alcohol and a plurality of grinding balls with different diameters, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 30% of calcium oxide, 35% of silicon dioxide and 35% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding a plurality of grinding balls with different diameters, carrying out dry milling on the grinding balls for 72 hours, and taking out the prepared powder B;
(3) resistor paste
Mixing 55 wt% of powder A and 45 wt% of powder B, adding a mixed solvent composed of terpineol, ethyl cellulose and the like in an amount which is 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling a plurality of grinding balls with different diameters, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (7)
1. The utility model provides a resistance thick liquids for preparing electron cigarette heating plate which characterized in that: the resistance paste is prepared by the following method: mixing 60% of tungsten, 20% of molybdenum, 15% of manganese oxide and 5% of titanium dioxide in percentage by weight, filling the mixture into a ball milling tank, adding alcohol and grinding balls, carrying out ball milling, taking out, and drying into powder A for later use; putting 20% of calcium oxide, 30% of silicon dioxide and 50% of aluminum oxide into a ball milling tank, adding grinding balls, carrying out ball milling, and taking out to prepare powder B; mixing 40% of powder A and 60% of powder B, adding a terpineol and ethyl cellulose mixed solvent with the same weight according to 40% of the total weight of the mixed powder, filling the mixture into a grinding tank, adding grinding balls into the grinding tank, and pouring out slurry after ball milling to be used as resistance slurry of a heating film;
the method for preparing the electronic cigarette heating sheet by applying the resistance paste comprises the following steps:
s1, adopting a ceramic substrate containing 96% of alumina in the mixture ratio as a printing substrate, wherein the thickness of the ceramic substrate is 0.4 mm;
s2, printing the prepared resistance paste on a ceramic substrate through a steel wire screen to form a paste layer, drying, keeping the temperature at 1400 ℃ for 30 minutes, and sintering to form a resistance layer;
s3, attaching a heating film outside the one resistance layer;
s4, printing a medium-temperature glass glaze layer on the heating film, and sintering the glass glaze layer at 1300 ℃ to form a transparent glaze layer;
and S5, plating copper on the outer side of the other resistance layer to form a copper-plated electrode.
2. The resistor paste according to claim 1, wherein: the preparation process comprises the following steps:
(1) preparation of powder A
Uniformly mixing 60% of tungsten, 20% of molybdenum, 15% of manganese oxide and 5% of titanium dioxide in percentage by weight, putting the mixture into a ball milling tank, adding a certain proportion of alcohol grinding balls, carrying out ball milling for 78 hours, taking out the mixture, and drying the mixture to prepare powder A;
(2) powder preparation B
Uniformly mixing 20% of calcium oxide, 30% of silicon dioxide and 50% of aluminum oxide in percentage by weight, putting the mixture into a ball milling tank, adding grinding balls, carrying out dry milling on the grinding balls for 72 hours, and taking out the powder B;
(3) resistor paste
Mixing 40% of powder A and 60% of powder B in percentage by weight, adding a mixed solvent consisting of terpineol and ethyl cellulose in an equal weight according to 40% of the total weight of the mixed powder, mixing, putting the mixture into a ball milling tank, filling grinding balls into the ball milling tank, carrying out ball milling for 48 hours, and pouring out slurry to prepare the resistance slurry of the heating film.
3. The electrical resistance paste of claim 2, wherein: and (3) adding a plurality of grinding balls with different diameters respectively in the step (1), the step (2) and the step (3) for grinding.
4. The resistor paste according to claim 1, wherein: the steel wire mesh plate in the step S2 is a 300-mesh steel wire mesh plate.
5. The resistor paste according to claim 1, wherein: the atmosphere in step S2 uses a mixed gas of hydrogen and nitrogen.
6. The resistor paste according to claim 1, wherein: the heating sheet comprises an internal ceramic substrate (1), the heating section of the ceramic substrate (1) is sequentially provided with a resistance layer (2), a heating film (3) and a transparent glaze layer (4), the electrode section of the ceramic substrate (1) is also provided with the resistance layer (2), and the resistance layer (2) of the electrode section is installed on the lower side of a copper-plated electrode (5).
7. The resistor paste according to claim 6, wherein: the left side part of the ceramic substrate (1) is an electrode section, and the right side part of the ceramic substrate (1) is a heating section.
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| CN109640416A (en) * | 2019-01-23 | 2019-04-16 | 昆明大方自动控制科技有限公司 | A kind of Novel resistor fever tablet with temperature thermocouple |
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| CN111035073A (en) * | 2019-11-12 | 2020-04-21 | 深圳顺络电子股份有限公司 | Ceramic electronic cigarette heating body, manufacturing method thereof and electronic cigarette |
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| CN114947225B (en) * | 2022-07-04 | 2023-08-25 | 江苏富乐华功率半导体研究院有限公司 | Ceramic heating sheet for heating nonflammable electronic cigarette and preparation method thereof |
| CN115381143B (en) * | 2022-08-17 | 2023-11-17 | 江苏富乐华功率半导体研究院有限公司 | Electronic cigarette ceramic heating sheet based on magnetron sputtering technology and preparation method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2096182U (en) * | 1991-05-07 | 1992-02-12 | 中国科学院上海硅酸盐研究所 | Lamp type infrared heater |
| CN1438834A (en) * | 2002-02-15 | 2003-08-27 | E·I·内穆尔杜邦公司 | Improved method for imlaying thick-film assembly |
| CN1687992A (en) * | 2005-05-13 | 2005-10-26 | 范琳 | Electrode thick liquid without lead and silver and mfg. method thereof |
| CN102446804A (en) * | 2011-12-28 | 2012-05-09 | 贵州振华风光半导体有限公司 | Integration method of high-integration high-reliability working temperature controllable thick film hybrid integrated circuit |
| CN102480809A (en) * | 2010-11-30 | 2012-05-30 | 深圳腾航科技有限公司 | High performance metal oxide doped transparent electric heating film technology and preparation process thereof |
| CN102677202A (en) * | 2011-03-11 | 2012-09-19 | 艾普特佩克股份有限公司 | Fiber, fiber aggregate, and adhesive having the fiber aggregate |
| CN102751000A (en) * | 2012-06-16 | 2012-10-24 | 华东微电子技术研究所合肥圣达实业公司 | Lead-free and cadmium-free electrode silver slurry for piezoelectric ceramics and preparation method thereof |
| CN103688365A (en) * | 2011-07-25 | 2014-03-26 | 日立化成株式会社 | Element and solar cell |
| CN104703308A (en) * | 2015-02-12 | 2015-06-10 | 颐中（青岛）实业有限公司 | Partition temperature control type electronic cigarette heater |
| CN105679403A (en) * | 2014-12-08 | 2016-06-15 | 硕禾电子材料股份有限公司 | Conductive paste containing lead-free glass frit |
| CN107721181A (en) * | 2010-01-21 | 2018-02-23 | 尤罗科拉公司 | Display assembly comprising glass ceramic board |
-
2018
- 2018-10-13 CN CN201811192388.4A patent/CN109105962B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2096182U (en) * | 1991-05-07 | 1992-02-12 | 中国科学院上海硅酸盐研究所 | Lamp type infrared heater |
| CN1438834A (en) * | 2002-02-15 | 2003-08-27 | E·I·内穆尔杜邦公司 | Improved method for imlaying thick-film assembly |
| CN1687992A (en) * | 2005-05-13 | 2005-10-26 | 范琳 | Electrode thick liquid without lead and silver and mfg. method thereof |
| CN107721181A (en) * | 2010-01-21 | 2018-02-23 | 尤罗科拉公司 | Display assembly comprising glass ceramic board |
| CN102480809A (en) * | 2010-11-30 | 2012-05-30 | 深圳腾航科技有限公司 | High performance metal oxide doped transparent electric heating film technology and preparation process thereof |
| CN102677202A (en) * | 2011-03-11 | 2012-09-19 | 艾普特佩克股份有限公司 | Fiber, fiber aggregate, and adhesive having the fiber aggregate |
| CN103688365A (en) * | 2011-07-25 | 2014-03-26 | 日立化成株式会社 | Element and solar cell |
| CN102446804A (en) * | 2011-12-28 | 2012-05-09 | 贵州振华风光半导体有限公司 | Integration method of high-integration high-reliability working temperature controllable thick film hybrid integrated circuit |
| CN102751000A (en) * | 2012-06-16 | 2012-10-24 | 华东微电子技术研究所合肥圣达实业公司 | Lead-free and cadmium-free electrode silver slurry for piezoelectric ceramics and preparation method thereof |
| CN105679403A (en) * | 2014-12-08 | 2016-06-15 | 硕禾电子材料股份有限公司 | Conductive paste containing lead-free glass frit |
| CN104703308A (en) * | 2015-02-12 | 2015-06-10 | 颐中（青岛）实业有限公司 | Partition temperature control type electronic cigarette heater |
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