CN109102791A - Flexible circuit board and preparation method thereof - Google Patents
Flexible circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN109102791A CN109102791A CN201811130793.3A CN201811130793A CN109102791A CN 109102791 A CN109102791 A CN 109102791A CN 201811130793 A CN201811130793 A CN 201811130793A CN 109102791 A CN109102791 A CN 109102791A
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- China
- Prior art keywords
- absorbent treatment
- circuit board
- flexible circuit
- protective layer
- plate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/162—Selection of materials
- G10K11/168—Plural layers of different materials, e.g. sandwiches
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/162—Selection of materials
Abstract
The invention discloses a kind of flexible circuit boards and preparation method thereof.Flexible circuit board includes: plate body and device；Wherein, plate body includes absorbent treatment, and absorbent treatment is made of sound-absorbing porous material, and absorbent treatment is the film layer on plate body surface；Device is located on absorbent treatment.The present invention realizes the purpose of sound absorption by the setting of absorbent treatment, reduces the noise for even being eliminated device sending, and then is conducive to be promoted the usage experience of electronic product.
Description
Technical field
The present invention relates to field of display technology, more particularly, to a kind of flexible circuit board and preparation method thereof.
Background technique
Flexible circuit board is a kind of using organic material as the high reliablity of substrate support, flexible good printed circuit board.
It has the characteristics that Distribution density is high, light-weight, thickness is thin, bending performance is good, is widely used in electronics field.
Various electronic components are usually fixed on flexible circuit board, these devices are after being passed through voltage, in charge and discharge
When, it can be stretched due to electrostriction or piezoelectric effect, to generate noise.Although these noise sound are small, compared with
Under quiet environment, human ear is still more sensitive to these noises, influences the usage experience of electronic product.
Therefore it provides a kind of flexible circuit board and preparation method thereof that can be effectively reduced device noise, be this field urgently
Technical problem to be solved.
Summary of the invention
In view of this, solving reduces device noise the present invention provides a kind of flexible circuit board and preparation method thereof
Technical problem.
In a first aspect, to solve the above-mentioned problems, the present invention provides a kind of flexible circuit board, comprising: plate body and device；Its
In,
Plate body includes absorbent treatment, and absorbent treatment is made of sound-absorbing porous material, and absorbent treatment is the film layer on plate body surface；
Device is located on absorbent treatment.
Based on the same inventive concept, second aspect, the present invention provide a kind of production method of flexible circuit board, comprising:
Making the plate body of flexible circuit board, wherein plate body includes absorbent treatment, and absorbent treatment is made of sound-absorbing porous material,
Absorbent treatment is the film layer on plate body surface；
Device is welded on plate body, device is located on absorbent treatment.
Compared with prior art, flexible circuit board provided by the invention and preparation method thereof, at least realizing following has
Beneficial effect:
In flexible circuit board provided by the invention, plate body surface is provided with absorbent treatment, device is arranged on absorbent treatment,
Using the surface of the absorbent treatment of sound-absorbing porous material production or the inside of communicating surface with many small holes or mutually
The hole of connection.When device is due to flexible sending noise, sound wave incident to porous material surface, since the vibration that sound wave generates is drawn
The air movement in hole is played, air and hole wall rub, and the air against hole wall is influenced to be not easy to move by hole wall, and one
Aspect can enable quite a few sound be converted into thermal energy, to make acoustic attenuation due to the effect to rub with viscous force.It is another
Aspect, heat loss caused by the heat exchange between air and hole wall in hole, also makes sound energy attenuation.To setting by absorbent treatment
The purpose for realizing sound absorption is set, the noise for even being eliminated device sending is reduced, and then is conducive to be promoted the use body of electronic product
It tests.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is flexible circuit board schematic diagram provided in an embodiment of the present invention；
Fig. 2 is a kind of optional embodiment schematic diagram of flexible circuit board provided in an embodiment of the present invention；
Fig. 3 is flexible circuit board another kind optional embodiment schematic diagram provided in an embodiment of the present invention；
Fig. 4 is flexible circuit board another kind optional embodiment schematic diagram provided in an embodiment of the present invention；
Fig. 5 is flexible circuit board another kind optional embodiment schematic diagram provided in an embodiment of the present invention；
Fig. 6 is the production method flow chart of flexible circuit board provided in an embodiment of the present invention；
Fig. 7 is a kind of optional embodiment flow chart of production method of flexible circuit board provided in an embodiment of the present invention；
Fig. 8 is the production method another kind optional embodiment flow chart of flexible circuit board provided in an embodiment of the present invention.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention provides a kind of flexible circuit board, and Fig. 1 is flexible circuit board schematic diagram provided in an embodiment of the present invention.Such as figure
Shown in 1, flexible circuit board includes: plate body 11 and device 22；Plate body 11 is used to carry device 22, and plate body 11 is internally provided with complexity
Circuit trace, multiple devices 22 are usually provided on flexible circuit board, device 22 by via hole by that can be electrically connected to
Cabling inside plate body 11, Fig. 1 are only to have shown schematically a device 22.Wherein, plate body 11 includes absorbent treatment 111, is inhaled
Sound layer 111 is made of sound-absorbing porous material, and absorbent treatment 111 is the film layer on 11 surface of plate body；Device 22 be located at absorbent treatment 111 it
On.
In flexible circuit board provided by the invention, plate body surface is provided with absorbent treatment, device is arranged on absorbent treatment,
Using the surface of the absorbent treatment of sound-absorbing porous material production or the inside of communicating surface with many small holes or mutually
The hole of connection.When device is due to flexible sending noise, sound wave incident to porous material surface, since the vibration that sound wave generates is drawn
The air movement in hole is played, air and hole wall rub, and the air against hole wall is influenced to be not easy to move by hole wall, and one
Aspect can enable quite a few sound be converted into thermal energy, to make acoustic attenuation due to the effect to rub with viscous force.It is another
Aspect, heat loss caused by the heat exchange between air and hole wall in hole, also makes sound energy attenuation.To setting by absorbent treatment
The purpose for realizing sound absorption is set, the noise for even being eliminated device sending is reduced, and then is conducive to be promoted the use body of electronic product
It tests.In addition, the setting of absorbent treatment of the present invention, occupies little space in flexible circuit board, and flexible circuit board plate body is not influenced
Whole flexibility can realize the purpose for reducing device noise suitable for various various sizes of flexible circuit boards.
In some alternative embodiments, the porosity of the absorbent treatment of flexible circuit board provided by the invention is 10%-
90%.Porosity more high acoustic absorption performance is better, is more conducive to the noise of abatement device, but porosity is higher, absorbent treatment from
Body intensity may decrease, can basis in practice in the case where guaranteeing acoustic attenuation performance and flexible circuit board structure intensity
The specific material that absorbent treatment is selected designs the porosity of absorbent treatment.Optionally, the porosity of absorbent treatment can be 20%-
80%.
In some alternative embodiments, shown in continuing to refer to figure 1, the thickness D of absorbent treatment 111 is less than or equal to 30 μm.
In the flexible circuit board that the embodiment provides, the thickness of absorbent treatment is smaller, to the integral thickness and bending performance of flexible circuit board
It influences smaller.The embodiment ensure that the original performance of flexible circuit board while making absorbent treatment and carrying out abatement device noise
It is not affected.
In flexible circuit board provided by the invention, absorbent treatment is made of sound-absorbing porous material, and absorbent treatment has size
Small multiple holes.Optionally, the aperture of absorbent treatment mesoporous is d, wherein 20nm≤d≤250nm.The aperture mistake of absorbent treatment mesoporous
It is small, it will affect sound absorbing performance, and if aperture is excessive, the support strength of hole wall device to hole dies down, it is possible to and cause hole to collapse, thus
Influence the whole structural strength of absorbent treatment.20nm≤d≤250nm is set in the present invention, can realize the same of sound absorbing performance
When guarantee the whole structural strength of absorbent treatment.
The hole of absorbent treatment can be distributed in absorbent treatment close to the surface of device side, or simultaneously in absorbent treatment in the present invention
Inside also there is interconnected hole.So can be there are many situation for the structure of absorbent treatment itself.Following embodiments will
Detailed illustration is done to the structure of optional absorbent treatment.
In flexible circuit board provided by the invention, the sound-absorbing porous material for making absorbent treatment includes insulating polymer material.
Optionally, insulating polymer material includes polymethyl methacrylate, polyimides, polycarbonate, poly terephthalic acid second two
At least one of alcohol ester, polyethylene naphthalate, polyurethane, epoxy resin, polypropylene, polytetrafluoroethylene (PTFE), polyethylene.This
It invents the flexible circuit board provided in the production process, can be and insulating polymer material is made with porous membrane material first
Later, membrane material is pasted onto the outermost layer of flexible circuit board plate body using adhesive, forms the structure of absorbent treatment.Or it can also be with
By the solution of insulating polymer material be coated in flexible circuit board plate body outermost layer, to solvent evaporation after, plate body most
Outer layer forms porous absorbent treatment.
In one embodiment, Fig. 2 is a kind of optional embodiment signal of flexible circuit board provided in an embodiment of the present invention
Figure.As shown in Fig. 2, absorbent treatment 111 includes multiple hole K, hole K includes aperture K1；Surface of the absorbent treatment 111 close to 22 side of device
For first surface M1, there are multiple aperture K1 in first surface M1.The flexible circuit board that the embodiment provides, due to device
When flexible generation noise, the aperture positioned at first surface can be realized the sound energy for weakening noise, even be eliminated noise to reduce.
The absorbent treatment in flexible circuit board that the embodiment provides can be made of insulating polymer material, with absorbent treatment using poly-
For acid imide production.It can be the Kapton for being fabricated to surface first and there is aperture in production, then by polyamides
Imines film is attached to the surface of flexible circuit board plate body.
Optionally, the manufacturing process of the Kapton with multiple apertures can be with are as follows: first with dianhydride, diamines and silicon
Alkane coupling agent (such as: aminopropyl triacetic acid oxysilane) it is that raw material prepares polyimides/SiO2Colloidal sol；By polyimides/SiO2
Colloidal sol is coated uniformly on the surface of substrate into polyimides/SiO2Dissolved glue film；Then hydrofluoric acid is sprayed on polyimides/SiO2
The surface of dissolved glue film, hydrofluoric acid and the silica of colloidal sol film surface react, then former in colloidal sol film surface after high temperature drying
Position where first silica forms aperture, so as to form porous Kapton；Then by porous polyamides
Imines film is removed from substrate, the production membrane material for absorbent treatment in the production of flexible circuit board.
It wherein, can be by adjusting polyimides/SiO when making porous Kapton2SiO in colloidal sol2Grain
Diameter adjusts pore size in porous polyimide film to realize.Optionally, in porous polyimide film aperture be 20~
120nm, porous polyimide film with a thickness of 7-25 μm.
In one embodiment, Fig. 3 is that flexible circuit board another kind optional embodiment provided in an embodiment of the present invention is shown
It is intended to.As shown in figure 3, absorbent treatment 111 includes multiple hole K, hole K includes aperture K1, table of the absorbent treatment 111 close to 22 side of device
Face is first surface M1, has multiple aperture K1 in first surface M1.Hole K further includes hole K2, is had in the inside of absorbent treatment 111
There are multiple hole K2, hole K2 to be connected with aperture K1.In the inside of absorbent treatment 111, multiple hole K2 can also be interconnected.
Optionally, in the embodiment, the structure of absorbent treatment entirety can be similar to the structure of sponge.Hole inside absorbent treatment and
The aperture on one surface is connected, device is flexible generate noise when, aperture and hole collective effect can weaken the sound energy of noise,
Noise even is eliminated to reduce.The absorbent treatment in flexible circuit board that the embodiment provides can use insulating polymer material
Material production, by taking absorbent treatment is using polymethyl methacrylate production as an example.In flexible circuit board production, can be poly- methyl
Methyl acrylate solution is coated in the outermost layer of flexible circuit board plate body, after solvent evaporation, is formed in the outermost layer of plate body
Porous polymethyl methacrylate film layer is as absorbent treatment.
Optionally, the manufacturing process of polymethyl methacrylate solution can be with are as follows: by methyl methacrylate, surface-active
Agent (such as maleate sodium salt), initiator (such as dibenzoyl peroxide), aided initiating (such as hydroxyethyl methacrylate) and molten
Agent is mixed into microemulsion；Reaction certain time obtains polymethyl methacrylate solution.
Optionally, in the manufacturing process of flexible circuit board, above-mentioned polymethyl methacrylate solution is sprayed on plate body
Outermost layer, evaporate solvent after obtain porous polymethyl methacrylate film as absorbent treatment.Wherein, by adjusting poly- first
The content of surfactant in base methyl acrylate solution manufacturing process may be implemented to adjust polymethyl methacrylate film
The size in middle aperture.Optionally, aperture is 100-250nm in porous polymethyl methacrylate film, and thickness can be less than
30μm。
Complicated circuit trace is usually provided with inside the plate body of flexible circuit board, the plate body of flexible circuit board usually wraps
Two protective layers (the first protective layer and the second protective layer) up and down are included, circuit trace is set between two protective layers up and down.It protects
Sheath plays protection and supporting role.The making material of protective layer may include polyimides, the making material packet of circuit trace
Include copper.In flexible circuit board provided by the invention, absorbent treatment can be produced on protective layer or absorbent treatment at the same as protect
Sheath uses.
In one embodiment, Fig. 4 is that flexible circuit board another kind optional embodiment provided in an embodiment of the present invention is shown
It is intended to.As shown in figure 4, plate body 11 includes the first protective layer 112, the second protective layer 113 and at least one metal routing layer 114,
Between the first protective layer 112 and the second protective layer 113, the circuit trace in flexible circuit board is located at metal routing layer 114
Metal routing layer 114；Absorbent treatment 111 is located at the second protective layer 113 far from 114 side of metal routing layer.Only with flexible electrical in Fig. 4
For road plate includes metal routing floor 114, it is also provided with glue-line between metal routing layer and protective layer, in figure simultaneously
It is not shown.In the embodiment, the structure of absorbent treatment can be as shown in Fig. 2 or Fig. 3.The making material of absorbent treatment can be poly-
Methyl methacrylate, polyimides, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, poly- ammonia
Ester, epoxy resin, polypropylene, polytetrafluoroethylene (PTFE), any one in polyethylene.
In one embodiment, Fig. 5 is that flexible circuit board another kind optional embodiment provided in an embodiment of the present invention is shown
It is intended to.As shown in figure 5, plate body 11 includes the first protective layer 112, the second protective layer 113 and at least one metal routing layer 114,
Between the first protective layer 112 and the second protective layer 113, the circuit trace in flexible circuit board is located at metal routing layer 114
Metal routing layer 114；Absorbent treatment 111 is the second protective layer 113.A metal routing layer is only included with flexible circuit board in Fig. 5
For 114.In the embodiment, the structure of absorbent treatment can be as shown in Fig. 2 or Fig. 3.The making material of absorbent treatment can be
Polymethyl methacrylate, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, gathers polyimides
Urethane, epoxy resin, polypropylene, polytetrafluoroethylene (PTFE), any one in polyethylene.In the embodiment, absorbent treatment is multiplexed with electricity
The protective layer of road cabling does not increase the integral thickness of flexible circuit board while realizing that reduction even is eliminated device noise.
Based on the same inventive concept, the present invention also provides a kind of production method of flexible circuit board, Fig. 6 is that the present invention is implemented
The production method flow chart for the flexible circuit board that example provides.As shown in Figure 6, comprising:
Step S101: the plate body of flexible circuit board is made, wherein plate body includes absorbent treatment, and absorbent treatment uses porous sound absorption
Material production, absorbent treatment are the film layer on plate body surface；
Step S102: welding device on plate body, and device is located on absorbent treatment.
The production method of flexible circuit board provided by the invention, the plate body of production include absorbent treatment, and absorbent treatment is using porous
Sound-absorbing material production, then device is arranged on absorbent treatment.The flexible circuit board made of production method of the invention
In, the surface of the absorbent treatment of sound-absorbing porous material production or the inside of communicating surface have many small holes or mutually interconnect
Logical hole.When device is due to flexible sending noise, sound wave incident to porous material surface, since the vibration that sound wave generates causes
Air movement in hole, air and hole wall rub, and are influenced to be not easy movement, a side by hole wall against the air of hole wall
Face can enable quite a few sound be converted into thermal energy, to make acoustic attenuation due to the effect to rub with viscous force.Another party
Face, heat loss caused by the heat exchange between air and hole wall in hole, also makes sound energy attenuation.It is realized by the setting of absorbent treatment
The purpose of sound absorption reduces the noise for even being eliminated device sending, and then is conducive to be promoted the usage experience of electronic product.
Complicated circuit trace is usually provided with inside the plate body of flexible circuit board, the plate body of flexible circuit board usually wraps
Two protective layers (the first protective layer and the second protective layer) up and down are included, circuit trace is set between two protective layers up and down.It adopts
The plate body of the flexible circuit board made of production method provided in an embodiment of the present invention includes the first protective layer, absorbent treatment and at least
One metal routing layer.
In one embodiment, Fig. 7 is a kind of optional reality of production method of flexible circuit board provided in an embodiment of the present invention
Apply mode flow chart.As shown in fig. 7, the production method of flexible circuit board includes:
Step S201: the first protective layer and metal routing layer are successively made；
Step S202: absorbent treatment is attached far from the first protective layer side in metal routing layer, wherein absorbent treatment is far from metal
The surface of routing layer side has multiple apertures.
It can be shown referring to figs. 2 and 5 using the schematic diagram of the flexible circuit board of embodiment production.The embodiment
In, absorbent treatment is the porous membrane layer of pre-production, and the making material of absorbent treatment includes insulating polymer material, is used with absorbent treatment
For polyimides production.Optionally, the manufacturing process of the Kapton with multiple apertures can be with are as follows: first with two
Acid anhydride, diamines and silane coupling agent (such as: aminopropyl triacetic acid oxysilane) are that raw material prepares polyimides/SiO2 colloidal sol；It will
Polyimides/SiO2 colloidal sol is coated uniformly on the surface of substrate into polyimides/SiO2 dissolved glue film；Then hydrofluoric acid is sprayed on
Polyimides/SiO2 dissolved glue film surface, hydrofluoric acid and the silica of colloidal sol film surface react, then exist after high temperature drying
Position where the original silica of colloidal sol film surface forms aperture, so as to form porous Kapton；Then
Porous Kapton is removed from substrate, forms the production membrane material of absorbent treatment.
In another embodiment, Fig. 8 is that the production method another kind of flexible circuit board provided in an embodiment of the present invention can
Select embodiment flow chart.As shown in figure 8, the production method of flexible circuit board includes:
Step S301: the first protective layer, metal routing layer and the second protective layer are successively made；
Step S302: the sprayed-on polymer solution on the second protective layer；
Step S303: the solvent in vaporized polymer solution forms absorbent treatment.
It can be with reference to shown in Fig. 3 and Fig. 4 using the schematic diagram of the flexible circuit board of embodiment production.The embodiment
In, the making material of absorbent treatment includes insulating polymer material, by taking absorbent treatment is using polymethyl methacrylate production as an example.It is first
It first needs to prepare methyl methacrylate solution, optionally, the manufacturing process of polymethyl methacrylate solution can be with are as follows: by first
Base methyl acrylate, surfactant (such as maleate sodium salt), initiator (such as dibenzoyl peroxide), aided initiating are (such as
Hydroxyethyl methacrylate) and solvent be mixed into microemulsion；Reaction certain time obtains polymethyl methacrylate solution.Its
In, solvent can be water or ethyl alcohol.
Through the foregoing embodiment it is found that flexible circuit board provided by the invention and preparation method thereof, at least realizes as follows
The utility model has the advantages that
In flexible circuit board provided by the invention, plate body surface is provided with absorbent treatment, device is arranged on absorbent treatment,
Using the surface of the absorbent treatment of sound-absorbing porous material production or the inside of communicating surface with many small holes or mutually
The hole of connection.When device is due to flexible sending noise, sound wave incident to porous material surface, since the vibration that sound wave generates is drawn
The air movement in hole is played, air and hole wall rub, and the air against hole wall is influenced to be not easy to move by hole wall, and one
Aspect can enable quite a few sound be converted into thermal energy, to make acoustic attenuation due to the effect to rub with viscous force.It is another
Aspect, heat loss caused by the heat exchange between air and hole wall in hole, also makes sound energy attenuation.To setting by absorbent treatment
The purpose for realizing sound absorption is set, the noise for even being eliminated device sending is reduced, and then is conducive to be promoted the use body of electronic product
It tests.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (13)
1. a kind of flexible circuit board characterized by comprising plate body and device；Wherein,
The plate body includes absorbent treatment, and the absorbent treatment is made of sound-absorbing porous material, and the absorbent treatment is the plate body table
The film layer in face；
The device is located on the absorbent treatment.
2. flexible circuit board according to claim 1, which is characterized in that
The absorbent treatment includes multiple holes, and the hole includes aperture；
The absorbent treatment is first surface close to the surface of the device side, has multiple described open in the first surface
Hole.
3. flexible circuit board according to claim 2, which is characterized in that
The hole further includes hole；
There are multiple described holes in the inside of the absorbent treatment, described hole is connected with the aperture.
4. flexible circuit board according to claim 2, which is characterized in that
The aperture in the hole is d, wherein 20nm≤d≤250nm.
5. flexible circuit board according to claim 1, which is characterized in that
The sound-absorbing porous material includes insulating polymer material.
6. flexible circuit board according to claim 5, which is characterized in that
The insulating polymer material includes polymethyl methacrylate, polyimides, polycarbonate, poly terephthalic acid second two
At least one of alcohol ester, polyethylene naphthalate, polyurethane, epoxy resin, polypropylene, polytetrafluoroethylene (PTFE), polyethylene.
7. flexible circuit board according to claim 1, which is characterized in that
The plate body includes the first protective layer, the second protective layer and at least one metal routing layer, and the metal routing layer is located at
Between first protective layer and second protective layer；
The absorbent treatment is located at second protective layer far from metal routing layer side.
8. flexible circuit board according to claim 1, which is characterized in that
The plate body includes the first protective layer, the second protective layer and at least one metal routing layer, and the metal routing layer is located at
Between first protective layer and second protective layer；
The absorbent treatment is second protective layer.
9. flexible circuit board according to claim 1, which is characterized in that
The porosity of the absorbent treatment is 10%-90%.
10. flexible circuit board according to claim 1, which is characterized in that
The thickness of the absorbent treatment is less than or equal to 30 μm.
11. a kind of production method of flexible circuit board characterized by comprising
Make the plate body of the flexible circuit board, wherein the plate body includes absorbent treatment, and the absorbent treatment uses porous sound absorption material
Material production, the absorbent treatment are the film layer on the plate body surface；
Device is welded on the plate body, the device is located on the absorbent treatment.
12. the production method of flexible circuit board according to claim 11, which is characterized in that
The plate body includes the first protective layer, absorbent treatment and at least one metal routing layer,
The step of making the plate body of the flexible circuit board further comprises:
Successively make first protective layer and the metal routing layer；
The absorbent treatment is attached far from first protective layer side in the metal routing layer, wherein the absorbent treatment is separate
The surface of metal routing layer side has multiple apertures.
13. the production method of flexible circuit board according to claim 11, which is characterized in that
The plate body includes the first protective layer, the second protective layer and at least one metal routing layer,
The step of making the plate body of the flexible circuit board further comprises:
Successively make first protective layer, the metal routing layer and second protective layer；
The sprayed-on polymer solution on second protective layer；
The solvent in the polymer solution is evaporated, the absorbent treatment is formed.
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| CN201811130793.3A CN109102791A (en) | 2018-09-27 | 2018-09-27 | Flexible circuit board and preparation method thereof |
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Application publication date: 20181228 |