CN109096933A - A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity - Google Patents
A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity Download PDFInfo
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- CN109096933A CN109096933A CN201810754963.9A CN201810754963A CN109096933A CN 109096933 A CN109096933 A CN 109096933A CN 201810754963 A CN201810754963 A CN 201810754963A CN 109096933 A CN109096933 A CN 109096933A
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- Prior art keywords
- parts
- thermal conductivity
- heat
- filling
- aluminum
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Abstract
The present invention relates to a kind of aluminum-based copper-clad plate insulating heat-conductive glue films of low filling high thermal conductivity, are made of the following component counted with mass fraction: 100-120 parts of epoxy resin, 2-3 parts of epoxy hardener, 0.05-0.1 parts of curing accelerator, 3-4 parts of coupling agent, 40-50 parts of heat filling, 25-30 parts of solvent；The heat filling is made of the boron nitride, silicon nitride, nano silica that mass ratio is 3:2:0.3, and the heat filling pretreating process is that nano silica is first carried out surface coating modification；Boron nitride, silicon nitride, nano silica are put in proportion into high speed disperser afterwards and carry out high speed blending；Insulating heat-conductive glue film heat filling of the invention uses completely new system, can quickly form heat conduction network structure in the case where low sizing additive amount, to significantly improve thermal conductivity and guarantee biggish peel strength.
Description
Technical field
The present invention relates to the design of heat radiating metal base pcb board and technologies of preparing, more particularly to a kind of aluminium of low filling high thermal conductivity
Base copper-clad plate insulating heat-conductive glue film.
Background technique
As electronic component develops to integrated, high power direction, it can effectively solve the problem that heat dissipation is asked using aluminum base PCB plate
Inscribe and extend the service life of component, at present restrict China's aluminum substrate development principal element be the thermal conductivity of insulating layer not
Height, peel strength are low.
Heat filling is as directly affecting the principal element of thermal conductivity its additive amount, processability, adhesive property all to aluminium
The performance of base copper-clad plate has significant impact；In general, the additive amount of heat filling is bigger, thermal conductivity is higher but its at
Type performance can but be reduced with peel strength；Therefore, the relationship between thermal conductivity and processability and peel strength how is balanced,
Main direction of studying as the art.
Summary of the invention
In order to solve the above-mentioned technical problem, the insulating heat-conductive glue film that a kind of heat filling loading is low, thermal conductivity is high is provided,
The present invention the following technical schemes are provided:
A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity, is made of the following component counted with mass fraction:
100-120 parts of epoxy resin, 2-3 parts of epoxy hardener, 0.05-0.1 parts of curing accelerator, 3-4 parts of coupling agent, heat filling
40-50 parts, 25-30 parts of solvent；Boron nitride, the silicon nitride, nano silica that the heat filling is 3:2:0.3 by mass ratio
Composition.The present invention is added to a small amount of nano silica in heat filling, primarily serves the effect for improving filler dispersibility,
And its add number cannot it is excessively high, this is because nano silica thermal conductivity itself is lower.
Further, the loading of the heat filling is lower than 40%, and the stripping performance of insulating heat-conductive glue film is enabled to protect
It holds in higher level.
The preparation method of the aluminum-based copper-clad plate insulating heat-conductive glue film of above-mentioned low filling high thermal conductivity, comprising the following steps:
S1, heat filling pretreatment: first intermolecular electrostatic repulsion is greater than nano silica progress surface coating modification
Attraction；Boron nitride, silicon nitride, nano silica are put in proportion into high speed mixer afterwards and carry out high speed blending；It was blended
Be equivalent in journey by nano-silicon dioxide particle be adsorbed in boron nitride with silicon nitride surrounding, since nano silica carries out in advance
Surface coating modification not will form reunion between the filler particles adsorbed by it, thus can be fast in insulating cement system
Speed forms heat conduction network structure；
S2, match glue: first stirring evenly epoxy resin, epoxy hardener, curing accelerator, solvent with high speed disperser, then plus
Enter coupling agent and heat filling, after continued to stir 2-3h with high speed disperser；The present invention, which is used, is directly added into glue for coupling agent
Method in glutinous agent component, so that coupling agent one's share of expenses for a joint undertaking moves at bonding interface, to reduce the bubbles volume inside glue film, and energy
Enough improve the binding force between glue film and aluminium base.
S3, silk-screen printing: the prepared glue of step S2 is poured into feeder channel, setting silk-screen speed, starts automatic silk screen printing.
Further, it is 600-800r/min that speed, which is blended, in step S1 high speed.
It further, is at the uniform velocity to stir when step S2 high speed dispersion machine stirs, mixing speed 200-300r/min.
The beneficial effects of the present invention are: the collaboration giving full play to different fillers by the improvement between heat filling system
Effect, so that remaining to constitute heat conduction network structure rapidly in the case where lower loading, thus guaranteeing high heat conductance
Under the premise of improve its peel strength, improve its processability.
Specific embodiment
A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity, by the following component group in terms of mass fraction
At: 100 parts of epoxy resin, 2.5 parts of epoxy hardener, 0.07 part of curing accelerator, 3.5 parts of coupling agent, 50 parts of heat filling, molten
28 parts of agent；The heat filling is made of the boron nitride, silicon nitride, nano silica that mass ratio is 3:2:0.3.It is above-mentioned low to fill out
Fill the preparation method of the aluminum-based copper-clad plate insulating heat-conductive glue film of high thermal conductivity, comprising the following steps:
S1, heat filling pretreatment: first intermolecular electrostatic repulsion is greater than nano silica progress surface coating modification
Attraction；Boron nitride, silicon nitride, nano silica are put in proportion into high speed mixer afterwards and carry out high speed blending, speed is
600-800r/min；Be equivalent in Blending Processes by nano-silicon dioxide particle be adsorbed in boron nitride and silicon nitride surrounding, due to
Nano silica has carried out surface coating modification in advance and not will form reunion between the filler particles adsorbed by it, thus
Heat conduction network structure can be quickly formed in insulating cement system；
S2, match glue: first stirring evenly epoxy resin, epoxy hardener, curing accelerator, solvent with high speed disperser, then plus
Enter coupling agent and heat filling, after continued to stir 2-3h with high speed disperser；The present invention, which is used, is directly added into glue for coupling agent
Method in glutinous agent component, so that coupling agent one's share of expenses for a joint undertaking moves at bonding interface, to reduce the bubbles volume inside glue film, and energy
Enough improve the binding force between glue film and aluminium base；High speed disperser is at the uniform velocity to stir when stirring, mixing speed 200-300r/
min
S3, silk-screen printing: the prepared glue of step S2 is poured into feeder channel, setting silk-screen speed, starts automatic silk screen printing.
The heat filling loading of the present embodiment is 28.7%, and glue film thermal conductivity is 3.9W/(mK), peel strength is
2.25N, thermal conductivity is consistent with the glue film that traditional loading is 60% or so, peel strength is than glue film that traditional loading is 60%
12% or more is improved, the coating film forming of the present embodiment has excellent performance, is easy to uniform coating.
It is enlightenment with above-mentioned desirable embodiment according to the present invention, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention'.This invention it is technical
Range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (5)
1. a kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity, by the following component group in terms of mass fraction
At: 100-120 parts of epoxy resin, 2-3 parts of epoxy hardener, 0.05-0.1 parts of curing accelerator, 3-4 parts of coupling agent, thermally conductive fill out
40-50 parts, 25-30 parts of solvent of material；It is characterized by: the heat filling is by the boron nitride that mass ratio is 3:2:0.3, nitridation
Silicon, nano silica composition.
2. a kind of preparation method of the aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity as described in claim 1,
Characterized by comprising the following steps:
S1, heat filling pretreatment: first intermolecular electrostatic repulsion is greater than nano silica progress surface coating modification
Attraction；Boron nitride, silicon nitride, nano silica are put in proportion into high speed mixer afterwards and carry out high speed blending；
S2, match glue: first stirring evenly epoxy resin, epoxy hardener, curing accelerator, solvent with high speed disperser, then plus
Enter coupling agent and heat filling, after continued to stir 2-3h with high speed disperser；
S3, silk-screen printing: the prepared glue of step S2 is poured into feeder channel, setting silk-screen speed, starts automatic silk screen printing.
3. a kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity as described in claim 1, it is characterised in that:
The loading of the heat filling is lower than 40%.
4. a kind of preparation method of the aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity as claimed in claim 2,
It is characterized by: it is 600-800r/min that speed, which is blended, in step S1 high speed.
5. a kind of preparation method of the aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity as claimed in claim 2,
It is characterized by: step S2 high speed dispersion machine is at the uniform velocity to stir when stirring, mixing speed 200-300r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754963.9A CN109096933A (en) | 2018-07-11 | 2018-07-11 | A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810754963.9A CN109096933A (en) | 2018-07-11 | 2018-07-11 | A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109096933A true CN109096933A (en) | 2018-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810754963.9A Pending CN109096933A (en) | 2018-07-11 | 2018-07-11 | A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity |
Country Status (1)
| Country | Link |
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| CN (1) | CN109096933A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
-
2018
- 2018-07-11 CN CN201810754963.9A patent/CN109096933A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722807A (en) * | 2013-12-17 | 2014-04-16 | 浙江伟弘电子材料开发有限公司 | High-thermal-conductivity and high-pressure-resistance aluminum-based copper-clad plate and preparation method thereof |
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 任慧等: "《微纳米含能材料》", 30 April 2015, 北京理工大学出版社 * |
| 周文英等: "《导热高分子材料》", 30 April 2014, 国防工业出版社 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No. 1801, Tongjiang Avenue, Xinbei District, Changzhou, Jiangsu province (Electronic Industrial Park) Applicant after: Changzhou Aohong Electronics Co.,Ltd. Address before: No. 1801, Tongjiang Avenue, Xinbei District, Changzhou, Jiangsu province (Electronic Industrial Park) Applicant before: CHANGZHOU AOHONG ELECTRONICS Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181228 |