CN109088963B

CN109088963B - Electronic device

Info

Publication number: CN109088963B
Application number: CN201811075568.4A
Authority: CN
Inventors: 张学勇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-09-14
Filing date: 2018-09-14
Publication date: 2020-08-28
Anticipated expiration: 2038-09-14
Also published as: CN109088963A

Abstract

The application discloses an electronic device. The electronic device comprises a cover plate component and a light emitter, wherein the cover plate component comprises a first surface and a second surface which are opposite, and a diffraction structure is formed on the second surface; the light emitter is located the one side at the second face place of apron subassembly and sets up with diffraction structure relatively, and the light that the light emitter sent jets out from first face behind the diffraction structure. According to the electronic device, the diffraction structure is arranged on the cover plate assembly, namely the cover plate assembly is multiplexed, so that a diffuser with the diffraction structure is not required to be arranged on the light emitter, the volume of the light emitter can be smaller, and the space occupied by the laser projection module in the electronic device is further reduced; meanwhile, the diffuser does not occupy the internal space of the electronic device, so that the available space volume inside the electronic device is increased.

Description

Electronic device

Technical Field

The present application relates to the field of consumer electronics, and more particularly, to an electronic device.

Background

The existing laser projection module used in the electronic device comprises a light source, a lens barrel and a diffuser, wherein the light source and the diffuser are both installed in the lens barrel to be used as a whole, and the diffuser is used for modulating light emitted by the light source into uniform light spots and then emitting the light. Since the light source and the diffuser are both mounted in the lens barrel, the lens barrel and the laser projection module are made large, thereby occupying a large space when the laser projection module is mounted in the electronic device and reducing the volume of the available space inside the electronic device.

Disclosure of Invention

The embodiment of the application provides an electronic device.

The electronic device comprises a cover plate component and a light emitter, wherein the cover plate component comprises a first surface and a second surface which are opposite, and a diffraction structure is formed on the second surface; the light emitter is located on one side where the second face of the cover plate assembly is located and arranged opposite to the diffraction structure, and light emitted by the light emitter is emitted from the first face after passing through the diffraction structure.

According to the electronic device, the diffraction structure is arranged on the cover plate assembly, namely the cover plate assembly is multiplexed, so that a diffuser with the diffraction structure is not required to be arranged on the light emitter, the volume of the light emitter can be smaller, and the space occupied by the laser projection module in the electronic device is further reduced; meanwhile, the diffuser does not occupy the internal space of the electronic device, so that the available space volume inside the electronic device is increased.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic plan view of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic, partially cross-sectional view of an electronic device according to an embodiment of the present application;

FIG. 4 is a schematic, partially cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 5 is a schematic, partially cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 6 is a schematic, partially cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 7 is a schematic, partially cross-sectional view of an electronic device according to another embodiment of the present application;

FIG. 8 is a schematic, partially cross-sectional view of an electronic device in accordance with another embodiment of the present application;

FIG. 9 is a schematic, partially cross-sectional view of an electronic device in accordance with another embodiment of the present application;

FIG. 10 is a schematic, partially cross-sectional view of an electronic device in accordance with another embodiment of the present application;

FIG. 11 is a schematic, partially cross-sectional view of an electronic device in accordance with another embodiment of the present application;

FIG. 12 is a schematic, partially cross-sectional view of an electronic device in accordance with another embodiment of the present application;

FIG. 13 is a schematic drawing in section of a portion of an electronic device according to another embodiment of the present application;

FIG. 14 is a schematic drawing in section with portions broken away showing an electronic device in accordance with yet another embodiment of the present application;

FIG. 15 is a schematic, partially cross-sectional view of an electronic device in accordance with yet another embodiment of the present application;

FIG. 16 is a schematic perspective view of a time-of-flight module according to an embodiment of the present disclosure;

FIG. 17 is a schematic top view of a time of flight module according to an embodiment of the present application;

FIG. 18 is a schematic bottom view of a time of flight module according to an embodiment of the present application;

FIG. 19 is a schematic side view of a time of flight module according to an embodiment of the present application;

FIG. 20 is a schematic cross-sectional view of the time-of-flight module shown in FIG. 17 along line XX-XX;

FIG. 21 is an enlarged schematic view of the portion XXI in the time of flight module shown in FIG. 20; and

fig. 22 is a schematic front view of the time-of-flight module according to the embodiment of the present disclosure when the flexible circuit board is not bent.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

Referring to fig. 1 and fig. 2, an electronic device 1000 according to an embodiment of the present disclosure includes a cover plate assembly 300 and a light emitter 23, and referring to fig. 3, the cover plate assembly 300 includes a first surface 310 and a second surface 320 opposite to each other, the second surface 320 is formed with a diffraction structure 331; the light emitter 23 is located on the side of the cover plate assembly 300 where the second surface 320 is located and is disposed opposite to the diffraction structure 331, and light emitted by the light emitter 23 passes through the diffraction structure 331 and then exits from the first surface 310.

Specifically, the optical transmitter 23 is installed in the electronic device 1000, and the cover plate assembly 300 may serve as a back cover of the electronic device 1000, when the optical transmitter 23 reflects an optical signal outwards, the optical signal irradiates the second surface 320 of the cover plate assembly 300, and the optical signal is modulated by the diffraction structure 331, so that the modulated optical signal is converted into a uniform optical spot and then is emitted from the first surface 310 of the cover plate assembly 300.

In the electronic device 1000 according to the embodiment of the application, the diffractive structure 331 is disposed on the cover plate assembly 300, that is, the cover plate assembly 300 is reused, so that a diffuser having the diffractive structure 331 is not required to be disposed on the light emitter 23, and thus the volume of the light emitter 23 can be made smaller, and the space occupied by the laser projection module in the electronic device 1000 is further reduced; at the same time, the diffuser does not occupy the internal space of the electronic device 1000, thereby increasing the volume of space available inside the electronic device 1000.

Referring to fig. 1 to 3, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 200, a cover assembly 300, a main board 600, and a time-of-flight assembly 100, where the time-of-flight assembly 100 includes a light emitter 23 and a light receiver 24.

The electronic device 1000 may be a mobile phone, a tablet computer, a game machine, a smart watch, a head display device, an unmanned aerial vehicle, and the like, and in the embodiment of the present application, the electronic device 1000 is taken as a mobile phone as an example for description, and it is understood that the specific form of the electronic device 1000 is not limited to the mobile phone.

The housing 200 may serve as a mounting carrier for functional elements of the electronic device 1000, and the housing 200 may provide protection for the functional elements such as the display screen 500, the receiver, and the sensor against dust, water, and falling. The chassis 200 includes opposing front and back sides. The display screen 500 may be disposed on the front surface.

The cover plate assembly 300 may be disposed at the rear of the set cover 200 and serve as a rear cover of the electronic device 1000. Specifically, the cover assembly 300 includes a first surface 310 and a second surface 320, which are opposite to each other, the cover assembly 300 is disposed on the back surface of the chassis 200, and the second surface 320 is opposite to the back surface of the chassis 200, the cover assembly 300 and the chassis 200 are combined to form an accommodating space 201, the accommodating space 201 can be used for accommodating components such as a battery, a sensor, and a circuit board, and the time-of-flight assembly 100 and the motherboard 600 can also be installed in the accommodating space 201. The cover plate assembly 300 may be made of glass or optical plastic, light in the accommodating space 201 may enter the external environment through the cover plate assembly 300, and light of the external environment may also enter the accommodating space 201 through the cover plate assembly 300. Of course, in other embodiments, the cover plate assembly 300 may also be a front cover or a side cover of the electronic device 1000.

The cover plate assembly 300 includes a diffractive region 330 and a non-diffractive region 340 disposed around the diffractive region 330. The diffraction region 330 is formed with a diffraction structure 331 on the second surface 320 of the cover member 300, and the diffraction structure 331 can modulate the light emitted from the light emitter 23 into a uniform light spot and then emit the light from the first surface 310. The non-diffractive region 340 includes a main region 341 and an incident region 342, and the main region 341 surrounds the diffractive region 330 and the incident region 342. The light incident region 342 is located at one side of the diffraction region 330, and light emitted by the light emitter 23 can be received by the light receiver 24 through the light incident region 342 after being reflected by an external object. The light incident region 342 may be directly connected to the diffraction region 330, and the light incident region 342 may be spaced apart from the diffraction region 330. It is to be understood that, in the above-described embodiment, the cover unit 300 and the diffraction structure 331 are formed integrally (as shown in fig. 3), but in another embodiment, the cover unit 300 and the diffraction structure 331 may be formed separately as described below.

Referring to fig. 4, in some embodiments, the cover assembly 300 includes a cover 301 and a diffraction plate 302, the cover 301 has a through hole 303, the diffraction plate 302 is installed in the through hole 303, the diffraction plate 302 is opposite to the light emitter 23, and the diffraction plate 302 has a diffraction structure 331. Specifically, the cover plate 301 and the diffraction plate 302 are both of a single structure, and the diffraction plate 302 can be mounted in the through hole 303 by means of gluing. In this manner, the cover plate assembly 300 of the present embodiment is formed by nesting the diffraction plate 302 in the cover plate 301, thereby facilitating the fabrication of the diffraction structure 331 on the diffraction plate 302.

In some embodiments, the cover plate assembly 300 is a silica glass material. The silica glass material refers to glass with a silica base material, the silica glass material has a high transmittance to infrared light (for example, infrared light with a wavelength of 940 nm), the transmittance can reach more than 92%, when the transmittance is high, the loss of an optical signal when the optical signal passes through the cover plate assembly 300 is small, and the detection accuracy that the time-of-flight assembly 100 can achieve is also high under the same optical power of the optical transmitter 23. In one example, the silica glass material glass is a Corning 5 generation glass.

Referring to fig. 5-8, in some embodiments, an anti-reflection film 33 may be disposed on the surface of the cover plate assembly 300. Referring to fig. 5, an antireflection film 33 may be disposed on the first surface 310 of the diffraction region 330. Alternatively, referring to fig. 6 to 8, at least one of the first surface 310 and the second surface 320 of the light incident region 342 may be provided with an antireflection film 33. For example, referring to fig. 6, an antireflection film 33 is disposed on the first surface 310 of the light incident region 342. Alternatively, referring to fig. 7, an antireflection film 33 is disposed on the second surface 320 of the light incident region 342. Alternatively, referring to fig. 8, antireflection films 33 are disposed on both the first surface 310 and the second surface 320 of the light incident region 342. The antireflection film 33 can further improve the transmittance of the light signal passing through the diffraction region 330 (or the diffraction plate 302) or the light exit region 342, reduce the loss of the light signal, and improve the detection accuracy. In one example, after the antireflection film 33 is disposed on the first surface 310 or the second surface 320 of the light incident region 342, the transmittance of the light incident region 342 for infrared light may reach 95% or more.

Referring to fig. 9 to 10, in some embodiments, the cover plate assembly 300 includes an infrared-transmissive ink layer 34 that only transmits infrared light, and the infrared-transmissive ink layer 34 is disposed on at least an area of the first surface 310 corresponding to the light receiver 24 and the light emitter 23. For example, referring to fig. 9, the infrared-transmitting ink layer 34 is disposed on a partial area of the first surface 310, and the infrared-transmitting ink layer 34 is respectively opposite to the light receiver 24 and the light emitter 23. Alternatively, referring to fig. 10, the infrared-transmissive ink layer 34 covers the entire area of the first side 310.

Referring to fig. 11 to 12, in some embodiments, the cover assembly 300 includes an infrared-transmissive ink layer 34 that only transmits infrared light, the infrared-transmissive ink layer 34 is disposed on the second surface 320 and at least corresponds to the light receiver 24, and the infrared-transmissive ink layer 34 is disposed on the first surface 310 and at least corresponds to the light emitter 23. For example, referring to fig. 11, the ir-transmissive ink layer 34 is disposed on a partial region of the first side 310 and opposite to the light emitter 23, and the ir-transmissive ink layer 34 is also disposed on a partial region of the second side 320 and opposite to the light receiver 24. Alternatively, referring to fig. 12, the infrared-transmitting ink layer 34 is disposed on a partial area of the first surface 310 and opposite to the light emitter 23, and the infrared-transmitting ink layer 34 is further disposed on an area of the second surface 320 except for the diffraction structure 331.

Specifically, the infrared-transmitting ink layer 34 has a transmittance of more than 85% for infrared light and a transmittance of less than 6% for visible light. Since the infrared transmitting ink has a characteristic of low transmittance to visible light, the light emitter 23 and the light receiver 24 disposed under the infrared transmitting ink layer 34 are not visible by human eyes when the electronic device 100 is viewed from the outside. Meanwhile, the wavelength of the infrared light which can be transmitted through the infrared transmission ink layer 34 is 850nm-940nm, so that the light emitter 23 can not be influenced to emit the infrared light outwards, the light receiver 24 can not be influenced to receive the infrared light reflected back from the outside, and the normal work of the flight time assembly 100 is ensured.

It is understood that the ir-transmissive ink layer 34 can be selectively applied to different positions of the cover assembly 300 according to the arrangement position of the internal structure of the electronic device 100. In other examples, infrared-transmissive ink layer 34 may be applied directly to the surface of the part.

Referring to fig. 13 to 14, in some embodiments, an antireflection film 33 and an infrared transmissive ink layer 34 may be disposed on a surface of the cover assembly 300. Referring to fig. 13, an antireflection film 33 may be disposed on the first surface 310 of the diffraction region 330, and an infrared-transmitting ink layer 34 may be disposed on the first surface 310 of the light incident region 342. Thus, the antireflection film 33 can improve the transmittance of the optical signal passing through the diffraction region 330 (or the diffraction plate 302), reduce the loss of the optical signal, and improve the detection accuracy; the infrared transparent ink layer 34 can block the light receiver 24 without affecting the light receiver 24 to receive the infrared light reflected from the outside. Of course, in other embodiments, a portion of the second surface 320 of the cover plate assembly 300 (except for the diffraction region 330) is provided with the antireflection film 33, and another portion is provided with the infrared-transmitting ink layer 34. Alternatively, the first surface 310 of the cover plate assembly 300 may be covered with the antireflection film 33, and the second surface 320 of the cover plate assembly 300 (except for the diffraction region 330) may be covered with the infrared-transmitting ink layer 34. Alternatively, the first surface 310 of the cover plate assembly 300 may be covered with the infrared transmissive ink layer 34, and the second surface 320 of the cover plate assembly 300 (except for the diffraction region 330) may be covered with the antireflection film 33.

Referring to fig. 14, an antireflection film 33 and an infrared transmissive ink layer 34 may be stacked on a first surface 310 of the cover plate assembly 300, and the infrared transmissive ink layer 34 is disposed between the antireflection film 33 and the cover plate assembly 300. Thus, the antireflection film 33 can improve the transmittance of the optical signal passing through the diffraction region 330 (or the diffraction plate 302) and the light incident region 342, reduce the loss of the optical signal, and improve the detection accuracy; the infrared transmitting ink layer 34 can block the optical reflector 23 and the optical receiver 24 without affecting the transmission of infrared light from the optical emitter 23 to the outside and the reception of infrared light reflected from the outside by the optical receiver 24. Of course, in other embodiments, antireflection film 33 may also be disposed between infrared-transmissive ink layer 34 and cover assembly 300. Alternatively, antireflection film 33 and infrared-transmitting ink layer 34 may be stacked on second surface 320 of cover plate assembly 300 (except for diffraction region 330); alternatively, antireflection film 33 and infrared-transmitting ink layer 34 are laminated on both first surface 310 and second surface 320 of cover sheet assembly 300 (except for diffraction region 330).

Referring to fig. 2, in some embodiments, the electronic device 1000 further includes a dual-camera module 400, and the dual-camera module 400 includes a main camera 401 and a sub-camera 402. The centers of the light receiver 24, the light emitter 23, the main camera 401, and the sub camera 402 are located on the same straight line Z. It should be noted that the center refers to the position of the geometric center of each element of the time-of-flight assembly 100 and the bi-camera module 400 when the time-of-flight assembly 100 and the bi-camera module 400 are mounted on the chassis 200, and the position is viewed from the front (viewed from the front in the direction of the front of the electronic device 1000, or viewed from the front in the direction of the rear in the direction of the front), for example, the geometric center of the optical receiver 24 when the optical receiver 24 is viewed from the front is the center of the optical receiver 24. Line Z may be parallel to top wall 202 of chassis 200 or line Z may be parallel to side wall 203 of chassis 200. When the centers of the optical receiver 24, the optical transmitter 23, the main camera 401 and the sub-camera 402 are located on the same straight line Z, the width of the whole formed by the time-of-flight assembly 100 and the dual camera module 400 along the direction perpendicular to the straight line Z is small, so that the whole structure is compact and beautiful. The centers of the optical receiver 24, the optical transmitter 23, the main camera 401, and the sub-camera 402 may be arranged in this order, or may be arranged in another order, which is not limited herein.

Specifically, the main camera 401 and the sub-camera 402 may both be color cameras, for example, one is a telephoto camera and the other is a wide-angle camera; the main camera 401 and the sub camera 402 can be a color camera and the other one is a black-and-white camera; the main camera 401 and the sub camera 402 may be a color camera and the other an infrared camera; the main camera 401 and the sub camera 402 may be both infrared cameras. Of course, the types of the main camera 401 and the sub camera 402 are not limited to the above example.

An exemplary description of time-of-flight assembly 100 and associated structure is provided below.

Referring to FIG. 3, the time-of-flight assembly 100 includes a frame 10 and a time-of-flight module 20. The bracket 10 is disposed at a side of the second face 320 of the cover plate assembly 300. The bracket 10 includes a bracket body 11 and a spacer 12.

The holder body 11 is approximately rectangular frame-shaped (or plate-shaped) structure, and the holder body 11 is provided with a first accommodating space 111, a second accommodating space 112, a first light through hole 113 and a second light through hole 114. The bracket body 11 includes a mounting surface 115 and a light-passing surface 116 opposite to each other, and the light-passing surface 116 is opposite to the second surface 320. The mounting surface 115 is provided with a first receiving space 111 and a second receiving space 112, and the light-transmitting surface 116 is provided with a first light-transmitting hole 113 correspondingly communicated with the first receiving space 111 and a second light-transmitting hole 114 correspondingly communicated with the second receiving space 112. The first receiving space 111 corresponds to the diffraction region 330 (or the diffraction plate 302), and the second receiving space 112 corresponds to the light incident region 342.

The spacer 12 is formed to extend from the holder body 11 to a side away from the first receiving space 111 and the second receiving space 112, and a direction in which the spacer 12 extends from the holder body 11 may be perpendicular to a plane in which the holder body 11 is located. The spacer 12 is disposed between the diffraction region 330 (or the diffraction plate 302) and the light incident region 342, and specifically, an end surface of the spacer 12 facing away from the holder body 11 is flush with the first surface 310 or higher than the first surface 310. The spacer 12 may be made of a material that is opaque to light, and further, the surface of the spacer 12 may have a high reflectivity or absorptivity to light, which prevents light signals from passing through the spacer 12.

In some embodiments, the spacer 12 and the bracket body 11 may be an integrally molded structure, for example, the spacer 12 and the bracket body 11 may be integrally molded by injection molding or the like, or the spacer 12 and the bracket body 11 may be obtained from a blank by cutting. In another example, the spacer 12 and the bracket body 11 may be formed as separate bodies, and the spacer 12 is fixedly connected to the bracket body 11, for example, by welding, gluing, clipping, etc.

In some embodiments, the bracket 10 and the cover assembly 300 are integrally formed, and the time-of-flight module 20 can be first mounted on the chassis 200 and then the bracket 10 and the cover assembly 300 are integrally combined to the chassis 200 when the electronic device 1000 is assembled. In another example, the bracket 10 and the cover assembly 300 may be formed as separate bodies, and when assembling the electronic device 1000, the time-of-flight module 20 and the bracket 10 may be assembled into the time-of-flight assembly, the time-of-flight assembly is integrally mounted on the housing 200, and finally the cover assembly 300 is combined with the housing 200.

Referring to fig. 3 and 16, the time-of-flight module 20 includes a first substrate assembly 21, a pad 22, a light emitter 23 and a light receiver 24.

The first substrate assembly 21 is mounted on the chassis 200. Specifically, in the example shown in fig. 3, the main board 600 is mounted on the chassis 200, the main board 600 is opened with a through hole 601, and the first substrate assembly 21 is mounted on the main board 600 and accommodated in the through hole 601. The time-of-flight module 20 can be mounted on a frame (not shown), and the time-of-flight module 20 and the frame jointly pass through the through hole 601 and fix the frame on the motherboard 600. In the example shown in fig. 15, the first substrate 21 may also be carried on the main board 600.

The housing 200 may be any one of a front housing, a rear housing, and a middle frame of the electronic device 1000. Correspondingly, when the case 200 is a front case or a middle frame of the electronic device 1000, the cover plate assembly 300 may be a rear case of the electronic device 1000; when the chassis 200 is a rear case or a middle frame of the electronic device 1000, the cover plate assembly 300 may be a front case of the electronic device 1000.

In some embodiments, referring to fig. 16 to 19, the first substrate assembly 21 includes a first substrate 211 and a flexible circuit board 212 connected to each other. The first substrate 211 may be a printed circuit board or a flexible circuit board, and a control circuit and the like may be laid on the first substrate 211. One end of the flexible circuit board 212 may be connected to the first substrate 211, and the other end may be connected to the light emitter 23, so as to transmit a control signal from the first substrate 211 to the light emitter 23, or transmit a feedback signal of the light emitter 23 (e.g., time information, frequency information of the light emitting signal of the light emitter 23, temperature information of the light emitter 23, etc.) to the first substrate 211. The flexible circuit board 212 can be bent at an angle, so that the relative positions of the devices connected to the two ends of the flexible circuit board 212 can be selected.

Referring to fig. 16 and 20, the pad 22 contacts the first substrate 211 and is supported on the first substrate 211, and the pad 22 may be bonded to the first substrate 211 by gluing or the like. The material of the spacer 22 may be metal, plastic, etc. In the embodiment of the present application, the surface of the spacer 22 combined with the first substrate 211 may be a plane, and the surface of the spacer 22 away from the first substrate 211 may also be a plane, so that the light emitter 23 has better smoothness when disposed on the spacer 22.

The optical transmitter 23 is disposed on the pad 22 and opposite to the diffraction region 330 (or the diffraction plate 302), and the optical transmitter 23 can be used to transmit an optical signal outwards, and the optical signal is emitted from the optical transmitter 23 at a certain divergence angle. In the embodiment of the present application, the light emitter 23 is disposed on a surface of the pad 22 away from the first substrate 211, or the pad 22 separates the first substrate 211 and the light emitter 23, so that a height difference is formed between the light emitter 23 and the first substrate 211. Therefore, the height of the light emitter 23 can be increased by the cushion block 22, and then the height of the emergent surface of the light emitter 23 is increased, so that the light signal emitted by the light emitter 23 is not easy to be shielded or received by the light receiver 24, and the light signal can be completely irradiated onto the object to be measured. The exit surface of the light emitter 23 may be flush with the entrance surface of the light receiver 24, or the exit surface of the light emitter 23 may be slightly lower than the entrance surface of the light receiver 24, or the exit surface of the light emitter 23 may be slightly higher than the entrance surface of the light receiver 24.

Referring to fig. 16, 17 and 19, the optical receiver 24 can be used to receive the reflected optical signal emitted by the optical transmitter 23. The light receiver 24 is disposed on the first substrate 211 opposite to the light incident region 342, and a contact surface of the light receiver 24 and the first substrate 211 is disposed substantially flush with (i.e., the mounting start points of) a contact surface of the spacer 22 and the first substrate 211. The light receiver 24 includes a housing 241 and an optical element 242.

The housing 241 is disposed on the first substrate 211, the optical element 242 is disposed on the housing 241, the housing 241 may be a lens holder and a lens barrel of the optical receiver 24, and the optical element 242 may be an element such as a lens disposed in the housing 241. Further, the light receiver 24 may further include a light sensing chip (not shown), and a light signal reflected by the object to be measured is irradiated into the light sensing chip after being acted on by the optical element 242, and the light sensing chip responds to the light signal.

In the embodiment, the housing 241 is integrally connected to the cushion block 22. Specifically, the housing 241 and the pad 22 may be integrally formed, and the housing 241 and the pad 22 may be mounted on the first substrate 211 together, for convenience of mounting, for example, the housing 241 and the pad 22 are made of the same material and are integrally formed by injection molding, cutting, and the like; or the shell 241 and the cushion block 22 are made of different materials and are integrally formed by two-color injection molding or the like.

Of course, in other embodiments, the housing 241 and the cushion block 22 may be formed separately, and they form a matching structure, and when assembling the time-of-flight module 20, the housing 241 and the cushion block 22 may be connected into a whole and then disposed on the first substrate 211 together; one of the case 241 and the spacer 22 may be disposed on the first substrate 211, and the other may be disposed on the first substrate 211 and integrally connected.

Referring to fig. 18 and 20, in some embodiments, the first substrate assembly 21 further includes a stiffener plate 213, and the stiffener plate 213 is coupled to a side of the first substrate 211 opposite to the pad 22. The reinforcing plate 213 may cover one side surface of the first substrate 211, and the reinforcing plate 213 may be used to increase the strength of the first substrate 211 and prevent the first substrate 211 from being deformed. In addition, the reinforcing plate 213 may be made of a conductive material, such as metal or alloy, and when the time of flight module 20 is mounted on the electronic device 1000, the reinforcing plate 213 may be electrically connected to the chassis 200, so as to ground the reinforcing plate 213 and effectively reduce the interference of static electricity of external components on the time of flight module 20.

Referring to fig. 20 to 22, in some embodiments, the pad 22 includes a protrusion 225 protruding from a side edge 2111 of the first substrate 211, and the flexible circuit board 212 is bent around the protrusion 225. Specifically, a portion of the pad 22 is directly carried on the first substrate 211, and another portion is not in direct contact with the first substrate 211 and protrudes relative to a side edge 2111 of the first substrate 211 to form a protrusion 225. The flexible circuit board 212 may be connected to the side edge 2111, and the flexible circuit board 212 is bent around the protruding portion 225, or the flexible circuit board 212 is bent so that the protruding portion 225 is located in a space surrounded by the bending of the flexible circuit board 212, when the flexible circuit board 212 is subjected to an external force, the flexible circuit board 212 does not collapse inward to cause an excessive bending degree, which may damage the flexible circuit board 212.

Further, as shown in fig. 21, in some embodiments, the outer side 2251 of the protrusion 225 is a smooth curved surface (e.g., a cylindrical outer side), that is, the outer side 2251 of the protrusion 225 does not have a sudden curvature, so that even if the flexible circuit board 212 bends along the outer side 2251 of the protrusion 225, the bending degree of the flexible circuit board 212 is not too large, and the integrity of the flexible circuit board 212 is further ensured.

Referring to fig. 14-18, in some embodiments, the time-of-flight module 20 further includes a connector 26, and the connector 26 is connected to the first substrate 211. The connector 26 is used to connect the first board assembly 21 and an external device. The connector 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211. The connector 26 may be a connecting socket or a connecting head, and when the time-of-flight module 20 is installed in the housing 200, the connector 26 may be connected to a motherboard of the electronic device 1000, so that the time-of-flight module 20 is electrically connected to the motherboard. The connectors 26 and the flexible circuit board 212 are respectively connected to opposite ends of the first substrate 211, for example, the connectors may be respectively connected to the left and right ends of the first substrate 211, or respectively connected to the front and rear ends of the first substrate 211.

Referring to fig. 17 and 18, in some embodiments, the optical transmitter 23 and the optical receiver 24 are arranged along a straight line L, and the connector 26 and the flexible circuit board 212 are respectively located on two opposite sides of the straight line L. It will be appreciated that the time-of-flight module 20 may already be relatively large in size in the direction of line L due to the arrangement of the optical transmitter 23 and the optical receiver 24. The connectors 26 and the flexible circuit board 212 are respectively disposed on two opposite sides of the straight line L, so that the size of the time-of-flight module 20 along the direction of the straight line L is not increased, and the time-of-flight module 20 is conveniently mounted on the chassis 200 of the electronic device 1000.

Referring to fig. 20 and 21, in some embodiments, a receiving cavity 223 is formed at a side of the pad 22 combined with the first substrate 211. The time-of-flight module 20 further includes an electronic component 25 disposed on the first substrate 211, and the electronic component 25 is received in the receiving cavity 223. The electronic component 25 may be a capacitor, an inductor, a transistor, a resistor, or the like, and the electronic component 25 may be electrically connected to a control circuit laid on the first substrate 211 and used to drive or control the operation of the optical transmitter 23 or the optical receiver 24. The electronic component 25 is accommodated in the accommodating cavity 223, so that the space in the cushion block 22 is reasonably utilized, the electronic component 25 is arranged without increasing the width of the first substrate 211, and the whole size of the time-of-flight module 20 is favorably reduced. The number of the receiving cavities 223 may be one or more, and the plurality of receiving cavities 223 may be spaced apart from each other, and when the spacer 22 is mounted, the receiving cavities 223 may be aligned with the positions of the electronic components 25 and the spacer 22 may be disposed on the first substrate 211.

Referring to fig. 20 and 22, in some embodiments, the cushion block 22 is provided with a relief through hole 224 communicated with the at least one accommodating cavity 223, and the at least one electronic component 25 extends into the relief through hole 224. It is understood that when the electronic component 25 needs to be accommodated in the accommodating cavity 223, the height of the electronic component 25 is required to be not higher than the height of the accommodating cavity 223. For the electronic component 25 higher than the accommodating cavity 223, a bypass through hole 224 corresponding to the accommodating cavity 223 may be formed, and the electronic component 25 may partially extend into the bypass through hole 224, so as to arrange the electronic component 25 without increasing the height of the cushion block 22.

Referring to fig. 20, in some embodiments, the light emitter 23 includes a second substrate assembly 231, a light source assembly 232, and a housing 233. The second substrate assembly 231 is disposed on the spacer 22, and the second substrate assembly 231 is connected to the flexible circuit board 212. A light source assembly 232 is disposed on the second substrate assembly 231, the light source assembly 232 for emitting a light signal. The housing 233 is disposed on the second substrate assembly 231, and the housing 233 forms an accommodating space 2331, and the accommodating space 2331 can be used to accommodate the light source assembly 232. The flexible circuit board 212 may be removably attached to the second substrate assembly 231. The light source assembly 232 is electrically connected to the second substrate assembly 231. The casing 233 may be bowl-shaped as a whole, and an opening of the casing 233 is covered downward on the second substrate assembly 231 to accommodate the light source assembly 232 in the accommodating space 2331. In the embodiment of the present application, the housing 233 is provided with a light exit 2332 corresponding to the diffraction structure 331 (see fig. 3), the light emitting surface of the light source module 232 faces the light exit 2332, the optical signal emitted from the light source module 232 passes through the light exit 2332 and is emitted into the diffraction region 330, and the optical signal is emitted from the first surface 310 of the cover plate assembly 300 after being adjusted by the diffraction structure 331.

With continued reference to fig. 20, in some embodiments, the second substrate assembly 231 includes a second substrate 2311 and a stiffener 2312. The second substrate 2311 is connected to the flexible circuit board 212. The light source assembly 232 and the reinforcement member 2312 are disposed on opposite sides of the second substrate 2311. A specific type of the second substrate 2311 may be a printed wiring board, a flexible wiring board, or the like, and a control circuit may be laid on the second substrate 2311. The reinforcement 2312 may be fixedly connected to the second substrate 2311 by gluing, riveting, or the like, and the reinforcement 2312 may increase the overall strength of the second substrate assembly 231. When the light emitter 23 is disposed on the pad 22, the reinforcement 2312 may be in direct contact with the pad 22, the second substrate 2311 is not exposed to the outside and does not need to be in direct contact with the pad 22, and the second substrate 2311 is not easily contaminated by dust and the like.

In the embodiment shown in fig. 20, the stiffener 2312 is formed separately from the spacer 22. When assembling the time-of-flight module 20, the spacer 22 may be first mounted on the first substrate 211, and at this time, the two ends of the flexible circuit board 212 are respectively connected to the first substrate 211 and the second substrate 2311, and the flexible circuit board 212 may not be bent (as shown in fig. 22), and then the flexible circuit board 212 is bent, so that the reinforcement 2312 is disposed on the spacer 22 (as shown in fig. 21).

Of course, in other embodiments, the stiffener 2312 and the spacer 22 may be integrally formed, for example, by injection molding, and the spacer 22 and the light emitter 23 may be mounted on the first substrate 211 together when the time-of-flight module 20 is assembled.

Referring to fig. 22, in some embodiments, the reinforcing member 2312 is formed with a first positioning member 2313. The spacer 22 includes a body 221 and a second positioning member 222, wherein the second positioning member 222 is formed on the body 221. When the second substrate assembly 231 is disposed on the spacer 22, the first positioning member 2313 is engaged with the second positioning member 222.

Specifically, the first positioning member 2313 and the second positioning member 222 cooperate to effectively limit the relative movement between the second substrate assembly 231 and the spacer 22. The specific types of the first positioning element 2313 and the second positioning element 222 can be selected according to the requirement, for example, the first positioning element 2313 is a positioning hole formed on the reinforcing element 2312, and the second positioning element 222 is a positioning column which extends into the positioning hole to enable the first positioning element 2313 and the second positioning element 222 to be matched with each other; or the first positioning piece 2313 is a positioning column formed on the reinforcing piece 2312, the second positioning piece 222 is a positioning hole, and the positioning column extends into the positioning hole so that the first positioning piece 2313 and the second positioning piece 222 are matched with each other; or the number of the first positioning elements 2313 and the second positioning elements 222 is plural, part of the first positioning elements 2313 are positioning holes, part of the second positioning elements 222 are positioning columns, part of the first positioning elements 2313 are positioning columns, part of the second positioning elements 222 are positioning holes, and the positioning columns extend into the positioning holes so that the first positioning elements 2313 and the second positioning elements 222 are matched with each other.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

the cover plate assembly comprises a first surface and a second surface which are opposite, and the second surface is provided with a diffraction structure; and

the light emitter is positioned on one side where the second surface of the cover plate component is positioned and arranged opposite to the diffraction structure, and light emitted by the light emitter is emitted from the first surface after passing through the diffraction structure;

the electronic device further comprises a first substrate assembly and a light receiver, wherein the light emitter and the light receiver are arranged on the first substrate assembly.

2. The electronic device according to claim 1, wherein the cover member includes a diffractive region and a non-diffractive region disposed around the diffractive region, the diffractive region being opposite to the light emitter, the diffractive structure being formed in the diffractive region.

3. The electronic device of claim 1, wherein the cover assembly comprises a cover plate and a diffraction plate, the cover plate defines a through hole, the diffraction plate is mounted in the through hole, the diffraction plate is opposite to the light emitter, and the diffraction plate is formed with the diffraction structure.

4. The electronic device of claim 1, wherein the cover assembly further comprises an infrared-transmissive ink layer that only transmits infrared light, the infrared-transmissive ink layer being disposed on the first surface at least in an area corresponding to the light receiver and in an area corresponding to the light emitter; or

The infrared transmitting ink layer is arranged on the second surface and at least in a region opposite to the light receiver, and the infrared transmitting ink layer is arranged on the first surface and at least in a region opposite to the light emitter.

5. The electronic device of claim 1, further comprising a motherboard and a chassis, wherein the cover assembly is disposed on the chassis, the motherboard is disposed in the chassis, and the first substrate assembly is carried on the motherboard; or

The main board is provided with a through hole, and the first substrate assembly is installed on the main board and contained in the through hole.

6. The electronic device according to claim 1, wherein the light emitter comprises a housing defining a light exit opening, and a light source assembly, the light emitter is carried on the first substrate assembly, the light source assembly is accommodated in the housing, a light emitting surface of the light source assembly faces the light exit opening, and the light exit opening is opposite to the diffractive structure.

7. The electronic device of claim 6, wherein the first substrate assembly comprises a first substrate and a flexible circuit board connected to each other; the electronic device further comprises a cushion block, and the cushion block is arranged on the first substrate; the light emitter further comprises a second substrate assembly arranged on the cushion block, the shell and the light source assembly are borne on the second substrate assembly, the flexible circuit board is bent, one end of the flexible circuit board is connected with the first substrate, and the other end of the flexible circuit board is connected with the second substrate assembly; the light receiver is arranged on the first substrate and comprises a shell and an optical element arranged on the shell, and the shell and the cushion block are connected into a whole.

8. The electronic device of claim 1, further comprising a light receiver and a bracket disposed on a side of the second surface of the cover member, wherein the cover member comprises a main area, a diffraction area and a light incident area, the diffraction area is spaced apart from the light incident area, the main area surrounds the diffraction area and the light incident area, and the diffraction structure is formed in the diffraction area; the support comprises a support body, a first accommodating space corresponding to the diffraction region and a second accommodating space corresponding to the light incident region are formed in the support body, the light emitter is installed in the first accommodating space, and the light receiver is installed in the second accommodating space.

9. The electronic device according to claim 8, wherein the holder further includes a spacer formed to extend from the holder body to a side away from the first receiving space and the second receiving space, the spacer being disposed between the diffraction region and the light incident region.