CN109087972A - 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 - Google Patents

一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 Download PDF

Info

Publication number
CN109087972A
CN109087972A CN201810912493.4A CN201810912493A CN109087972A CN 109087972 A CN109087972 A CN 109087972A CN 201810912493 A CN201810912493 A CN 201810912493A CN 109087972 A CN109087972 A CN 109087972A
Authority
CN
China
Prior art keywords
translation
sleeve
silicon wafer
sides
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810912493.4A
Other languages
English (en)
Other versions
CN109087972B (zh
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiaxing Jinrui Photovoltaic Technology Co ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201810912493.4A priority Critical patent/CN109087972B/zh
Publication of CN109087972A publication Critical patent/CN109087972A/zh
Application granted granted Critical
Publication of CN109087972B publication Critical patent/CN109087972B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Weting (AREA)
  • Silicon Compounds (AREA)
  • Photovoltaic Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

本发明公开了一种晶体硅太阳电池生产用硅片放置固定机构的工作方法,属于光伏加工机械设备领域。该发明包括平移套筒、平移板、平移液压缸、调节套筒、调节板和固定机构,平移液压缸水平设置在平移套筒下侧,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,平移套筒两侧的平移板上侧分别对称设置有固定机构,一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒与调节板之间竖直设置有锁紧栓。本发明结构设计合理,可以将多种尺寸规格的硅片平稳的进行放置,并能将硅片牢固的进行压紧固定,提高了硅片的生产加工效率,满足生产使用的需要。

Description

一种晶体硅太阳电池生产用硅片放置固定机构的工作方法
技术领域
本发明属于光伏加工机械设备领域,尤其涉及一种晶体硅太阳电池生产用硅片放置固定机构的工作方法。
背景技术
光伏发电是太阳能光伏发电系统的简称,是一种利用太阳电池半导体材料的光伏效应,将太阳光辐射能直接转换为电能的一种新型发电系统,有独立运行和并网运行两种,现有的光伏发电材料主要是硅片,在晶体硅太阳电池的生产过程中,需要将硅片根据工艺加工的顺序依次经过制绒、高温扩散和刻蚀等加工工艺,在这些生产工艺加工过程中,都需要将硅片进行固定,现有的硅片放置固定机构结构复杂且操作麻烦,不能将多种尺寸规格的硅片平稳的进行放置,并且在将硅片放置后,难以准确牢固的将硅片压紧固定,使得硅片在生产加工过程中经常会产生偏移,影响硅片的加工质量和效率,并且硅片在放置过程中,硅片表面经常会与放置机构产生摩擦,导致硅片表面产生划痕,降低硅片的生产质量,不能满足生产加工的需要。
发明内容
本发明所要解决的技术问题是克服现有技术中所存在的上述不足,而提供一种结构设计合理,可以将多种尺寸规格的硅片平稳的进行放置,并能将硅片牢固的进行压紧固定的晶体硅太阳电池生产用硅片放置固定机构的工作方法。
为了解决上述技术问题,本发明所采用的技术方案是:一种晶体硅太阳电池生产用硅片放置固定机构的工作方法,其特征在于:所述硅片放置固定机构包括平移套筒、平移板、平移液压缸、调节套筒、调节板和固定机构,所述平移套筒设置有两根,两根平移套筒内分别水平设置有平移通道,平移套筒两侧分别水平对称设置有与平移通道相适配的平移板,平移液压缸水平设置在平移套筒下侧,平移液压缸为双活塞杆液压缸,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,平移套筒两侧的平移板上侧分别对称设置有固定机构,所述两根平移套筒中的一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒上沿水平方向依次均匀设置有多个安装孔,调节套筒与调节板之间竖直设置有锁紧栓;所述固定机构包括固定底座、转动支架、压紧气缸、固定支架和压紧丝杆,固定底座水平设置在平移板上侧,转动支架为L型支架,转动支架中部两侧分别铰连接于固定底座上方一侧,固定支架倾斜向上设置在固定底座上方另一侧,固定支架上端设置有连接板,连接板中部两侧分别铰连接于固定支架上侧,压紧气缸设置在连接板一侧,压紧气缸输出端铰连接于转动支架上端,转动支架另一侧竖直设置有压紧丝杆,转动支架上下两侧的压紧丝杆上分别螺纹连接有固定螺母,压紧丝杆下端设置有压紧块,所述压紧块下侧的平移板上水平设置有承料板。
进一步地,所述平移套筒上侧水平设置有软质橡胶层。
进一步地,所述两根平移套筒下侧的两个平移液压缸采用同一路油路并联驱动。
所述晶体硅太阳电池生产用硅片放置固定机构的工作方法包括:通过平移套筒两侧分别水平对称设置有与平移通道相适配的平移板,平移液压缸水平设置在平移套筒下侧,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,利用平移液压缸同步驱动两块平移板,使得两块平移板能够根据硅片的尺寸规格水平准确的同步相向移动,利用两根平移套筒中的一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒与调节板之间竖直设置有锁紧栓,使能根据硅片的尺寸规格准确调节两根平移套筒之间的间距,通过平移套筒两侧的平移板上侧分别对称设置有固定机构,利用压紧气缸驱动转动支架,使得压紧块能够牢固的将硅片压紧固定,利用转动支架上下两侧的压紧丝杆上分别螺纹连接有固定螺母,使得压紧丝杆能够根据硅片的厚度沿竖直方向进行调节并固定,利用平移套筒上侧水平设置有软质橡胶层,使能避免硅片在放置过程中产生划痕,确保硅片能够高效牢固的进行压紧固定。
本发明与现有技术相比,具有以下优点和效果:本发明结构简单,通过平移套筒两侧分别水平对称设置有与平移通道相适配的平移板,平移液压缸水平设置在平移套筒下侧,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,利用平移液压缸同步驱动两块平移板,使得两块平移板能够根据硅片的尺寸规格水平准确的同步相向移动,利用两根平移套筒中的一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒与调节板之间竖直设置有锁紧栓,使能根据硅片的尺寸规格准确调节两根平移套筒之间的间距,通过平移套筒两侧的平移板上侧分别对称设置有固定机构,利用压紧气缸驱动转动支架,使得压紧块能够牢固的将硅片压紧固定,利用转动支架上下两侧的压紧丝杆上分别螺纹连接有固定螺母,使得压紧丝杆能够根据硅片的厚度沿竖直方向进行调节并固定,利用平移套筒上侧水平设置有软质橡胶层,使能避免硅片在放置过程中产生划痕,确保硅片能够高效牢固的进行压紧固定,提高了硅片加工的效率和质量,满足生产使用的需要。
附图说明
图1是本发明一种硅片放置固定机构的主视图。
图2是本发明一种硅片放置固定机构的俯视图。
图中:1.平移套筒,2.平移板,3.平移液压缸,4.调节套筒,5.调节板,6.平移通道,7.安装孔,8.锁紧栓,9.固定底座,10.转动支架,11.压紧气缸,12.固定支架,13.压紧丝杆,14.连接板,15.固定螺母,16.压紧块,17.承料板,18.软质橡胶层。
具体实施方式
为了进一步描述本发明,下面结合附图进一步阐述一种硅片放置固定机构的具体实施方式,以下实施例是对本发明的解释而本发明并不局限于以下实施例。
如图1、图2所示,本发明一种硅片放置固定机构,包括平移套筒1、平移板2、平移液压缸3、调节套筒4、调节板5和固定机构,平移套筒1设置有两根,两根平移套筒1内分别水平设置有平移通道6,平移套筒1两侧分别水平对称设置有与平移通道6相适配的平移板2,平移液压缸3水平设置在平移套筒1下侧,平移液压缸3为双活塞杆液压缸,平移液压缸3两侧输出端分别与平移套筒1两侧的平移板2下侧连接固定,平移套筒1两侧的平移板2上侧分别对称设置有固定机构,两根平移套筒1中的一根平移套筒1一侧两端分别水平设置有调节套筒4,另一根平移套筒1一侧两端分别水平设置有与调节套筒4相适配的调节板5,调节套筒4上沿水平方向依次均匀设置有多个安装孔7,调节套筒4与调节板5之间竖直设置有锁紧栓8。
本发明的固定机构包括固定底座9、转动支架10、压紧气缸11、固定支架12和压紧丝杆13,固定底座9水平设置在平移板2上侧,转动支架10为L型支架,转动支架10中部两侧分别铰连接于固定底座9上方一侧,固定支架12倾斜向上设置在固定底座9上方另一侧,固定支架12上端设置有连接板14,连接板14中部两侧分别铰连接于固定支架12上侧,压紧气缸11设置在连接板14一侧,压紧气缸11输出端铰连接于转动支架10上端,转动支架10另一侧竖直设置有压紧丝杆13,转动支架10上下两侧的压紧丝杆13上分别螺纹连接有固定螺母15,压紧丝杆13下端设置有压紧块16,压紧块16下侧的平移板2上水平设置有承料板17。
本发明的平移套筒1上侧水平设置有软质橡胶层18,使能避免硅片在放置过程中产生划痕。本发明的两根平移套筒1下侧的两个平移液压缸3采用同一路油路并联驱动,使得两根平移套筒1两侧的平移板2能够同步进行平移,确保硅片能够平稳准确的进行放置。
采用上述技术方案,本发明一种硅片放置固定机构在使用的时候,通过平移套筒1两侧分别水平对称设置有与平移通道6相适配的平移板2,平移液压缸3水平设置在平移套筒1下侧,平移液压缸3两侧输出端分别与平移套筒1两侧的平移板2下侧连接固定,利用平移液压缸3同步驱动两块平移板2,使得两块平移板2能够根据硅片的尺寸规格水平准确的同步相向移动,利用两根平移套筒1中的一根平移套筒1一侧两端分别水平设置有调节套筒4,另一根平移套筒1一侧两端分别水平设置有与调节套筒4相适配的调节板5,调节套筒4与调节板5之间竖直设置有锁紧栓8,使能根据硅片的尺寸规格准确调节两根平移套筒1之间的间距,通过平移套筒1两侧的平移板2上侧分别对称设置有固定机构,利用压紧气缸11驱动转动支架10,使得压紧块16能够牢固的将硅片压紧固定,利用转动支架10上下两侧的压紧丝杆13上分别螺纹连接有固定螺母15,使得压紧丝杆13能够根据硅片的厚度沿竖直方向进行调节并固定,利用平移套筒1上侧水平设置有软质橡胶层18,使能避免硅片在放置过程中产生划痕,确保硅片能够高效牢固的进行压紧固定。通过这样的结构,本发明结构设计合理,可以将多种尺寸规格的硅片平稳的进行放置,并能将硅片牢固的进行压紧固定,提高了硅片的生产加工效率,满足生产使用的需要。
本说明书中所描述的以上内容仅仅是对本发明所作的举例说明。本发明所属技术领域的技术人员可以对所描述的具体实施例做各种各样的修改或补充或采用类似的方式替代,只要不偏离本发明说明书的内容或者超越本权利要求书所定义的范围,均应属于本发明的保护范围。

Claims (1)

1.一种晶体硅太阳电池生产用硅片放置固定机构的工作方法,其特征在于:所述硅片放置固定机构包括平移套筒、平移板、平移液压缸、调节套筒、调节板和固定机构,所述平移套筒设置有两根,两根平移套筒内分别水平设置有平移通道,平移套筒两侧分别水平对称设置有与平移通道相适配的平移板,平移液压缸水平设置在平移套筒下侧,平移液压缸为双活塞杆液压缸,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,平移套筒两侧的平移板上侧分别对称设置有固定机构,所述两根平移套筒中的一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒上沿水平方向依次均匀设置有多个安装孔,调节套筒与调节板之间竖直设置有锁紧栓;所述固定机构包括固定底座、转动支架、压紧气缸、固定支架和压紧丝杆,固定底座水平设置在平移板上侧,转动支架为L型支架,转动支架中部两侧分别铰连接于固定底座上方一侧,固定支架倾斜向上设置在固定底座上方另一侧,固定支架上端设置有连接板,连接板中部两侧分别铰连接于固定支架上侧,压紧气缸设置在连接板一侧,压紧气缸输出端铰连接于转动支架上端,转动支架另一侧竖直设置有压紧丝杆,转动支架上下两侧的压紧丝杆上分别螺纹连接有固定螺母,压紧丝杆下端设置有压紧块,所述压紧块下侧的平移板上水平设置有承料板;
所述平移套筒上侧水平设置有软质橡胶层;
所述晶体硅太阳电池生产用硅片放置固定机构的工作方法包括:通过平移套筒两侧分别水平对称设置有与平移通道相适配的平移板,平移液压缸水平设置在平移套筒下侧,平移液压缸两侧输出端分别与平移套筒两侧的平移板下侧连接固定,利用平移液压缸同步驱动两块平移板,使得两块平移板能够根据硅片的尺寸规格水平准确的同步相向移动,利用两根平移套筒中的一根平移套筒一侧两端分别水平设置有调节套筒,另一根平移套筒一侧两端分别水平设置有与调节套筒相适配的调节板,调节套筒与调节板之间竖直设置有锁紧栓,使能根据硅片的尺寸规格准确调节两根平移套筒之间的间距,通过平移套筒两侧的平移板上侧分别对称设置有固定机构,利用压紧气缸驱动转动支架,使得压紧块能够牢固的将硅片压紧固定,利用转动支架上下两侧的压紧丝杆上分别螺纹连接有固定螺母,使得压紧丝杆能够根据硅片的厚度沿竖直方向进行调节并固定,利用平移套筒上侧水平设置有软质橡胶层,使能避免硅片在放置过程中产生划痕,确保硅片能够高效牢固的进行压紧固定。
CN201810912493.4A 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法 Expired - Fee Related CN109087972B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810912493.4A CN109087972B (zh) 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610709923.3A CN106298619B (zh) 2016-08-24 2016-08-24 一种硅片放置固定机构
CN201810912493.4A CN109087972B (zh) 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201610709923.3A Division CN106298619B (zh) 2016-08-24 2016-08-24 一种硅片放置固定机构

Publications (2)

Publication Number Publication Date
CN109087972A true CN109087972A (zh) 2018-12-25
CN109087972B CN109087972B (zh) 2020-03-17

Family

ID=57614701

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201610709923.3A Active CN106298619B (zh) 2016-08-24 2016-08-24 一种硅片放置固定机构
CN201811028022.3A Withdrawn CN109390269A (zh) 2016-08-24 2016-08-24 一种提高加工效率的硅片放置固定机构
CN201810912493.4A Expired - Fee Related CN109087972B (zh) 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构的工作方法
CN201810912484.5A Pending CN109037400A (zh) 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN201610709923.3A Active CN106298619B (zh) 2016-08-24 2016-08-24 一种硅片放置固定机构
CN201811028022.3A Withdrawn CN109390269A (zh) 2016-08-24 2016-08-24 一种提高加工效率的硅片放置固定机构

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201810912484.5A Pending CN109037400A (zh) 2016-08-24 2016-08-24 一种晶体硅太阳电池生产用硅片放置固定机构

Country Status (1)

Country Link
CN (4) CN106298619B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108538770B (zh) * 2018-03-12 2020-04-03 金华美诺机电有限公司 一种环保电力组件敷设机
CN109559970A (zh) * 2019-01-21 2019-04-02 苏州赛森电子科技有限公司 一种射频等离子刻蚀用硅片固定装置及方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2838851Y (zh) * 2005-08-19 2006-11-22 北京英讯通光电科技有限公司 倒角机
CN204264993U (zh) * 2014-11-27 2015-04-15 浙江尚源实业有限公司 一种硅片加工平移装置
CN204384441U (zh) * 2015-01-07 2015-06-10 浙江尚源实业有限公司 一种硅片加工上料装置
CN105731054A (zh) * 2016-04-30 2016-07-06 桐乡市红旗塑料包装袋厂 一种钢管放置下料机构
CN106217328A (zh) * 2016-08-24 2016-12-14 屠明州 一种板材加工翻转机构

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030015851A1 (en) * 2001-07-18 2003-01-23 Hahn Richard D.W. Combination toolbox, workbench, dispensing crib and stool
NZ531574A (en) * 2004-03-08 2004-06-25 Ross Patrick Mathews table with platforms projecting from at least three sides, each being adjustable longitudinally and vertically
KR200431057Y1 (ko) * 2006-08-30 2006-11-14 경신공업 주식회사 길이 가변형 작업대
CN201304641Y (zh) * 2008-11-13 2009-09-09 青岛地恩地机电科技股份有限公司 一种便携式支架
CN102368897B (zh) * 2011-09-30 2014-10-22 东莞市新泽谷机械制造股份有限公司 插件机用长板工作台
CN202591957U (zh) * 2012-04-28 2012-12-12 桂林电子科技大学 电磁启动器底板在适合高度可旋转可水平固定的组件组装装置
CN202583640U (zh) * 2012-05-25 2012-12-05 深圳Tcl新技术有限公司 背光模组测试治具
CN102730469B (zh) * 2012-07-16 2015-09-30 建科机械(天津)股份有限公司 焊接网片的无极调整对齐装置
TWI444267B (zh) * 2012-12-25 2014-07-11 Rexon Ind Corp Ltd 可調整長度的工作台
CN203821076U (zh) * 2014-03-10 2014-09-10 江苏大岛机械集团有限公司 一种多功能幅式绗绣机的压布装置
CN203804940U (zh) * 2014-04-21 2014-09-03 王秀兰 多功能工装底座
CN104291135A (zh) * 2014-09-15 2015-01-21 南通凯迪自动机械有限公司 多尺寸基材自动校正平台
CN205057979U (zh) * 2015-09-28 2016-03-02 魏俊杰 一种圆管加工调节机构
CN205466797U (zh) * 2016-03-15 2016-08-17 嘉兴能发电子科技有限公司 一种设置可调节料长结构的硅片切割设备
CN105619351B (zh) * 2016-04-12 2019-02-12 藤县正钻门业有限公司 一种门框用伸缩工作台

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2838851Y (zh) * 2005-08-19 2006-11-22 北京英讯通光电科技有限公司 倒角机
CN204264993U (zh) * 2014-11-27 2015-04-15 浙江尚源实业有限公司 一种硅片加工平移装置
CN204384441U (zh) * 2015-01-07 2015-06-10 浙江尚源实业有限公司 一种硅片加工上料装置
CN105731054A (zh) * 2016-04-30 2016-07-06 桐乡市红旗塑料包装袋厂 一种钢管放置下料机构
CN106217328A (zh) * 2016-08-24 2016-12-14 屠明州 一种板材加工翻转机构

Also Published As

Publication number Publication date
CN109087972B (zh) 2020-03-17
CN109037400A (zh) 2018-12-18
CN106298619B (zh) 2018-09-28
CN106298619A (zh) 2017-01-04
CN109390269A (zh) 2019-02-26

Similar Documents

Publication Publication Date Title
CN206541820U (zh) 一种光伏板夹持固定机构
CN206373210U (zh) 一种冲床
CN105731054B (zh) 一种钢管放置下料机构
CN106298619B (zh) 一种硅片放置固定机构
CN208199774U (zh) 一种光伏玻璃生产用夹具
CN203650618U (zh) 一种薄膜切块装置
CN107484376A (zh) 一种密封效果好的防爆电气控制柜
CN204414766U (zh) 一种硅片丝网印刷机构
CN107593862A (zh) 剖鱼夹
CN110526568A (zh) 一种圆形玻璃切割装置
CN205888653U (zh) 一种圆管放置固定机构
CN206212440U (zh) 一种铝基板热压成型装置
CN102244363B (zh) 半导体激光器台式旋转装置
CN206976309U (zh) 一种硅片夹持平移机构
CN210093156U (zh) 一种可调节的光伏电板支撑装置
CN206536686U (zh) 一种玻璃板放置固定机构
CN102059548B (zh) 汽轮机装配拉钢丝找中装置
CN106206398A (zh) 一种硅片平移放置机构
CN211253229U (zh) 一种生物制药用封口装置
CN108556055A (zh) 一种便于建筑保温板的简易切割装置
CN204264993U (zh) 一种硅片加工平移装置
CN103009152A (zh) 内部夹紧装置
CN206029476U (zh) 一种轴承套圈磨床加工用辅助夹具
CN110768618A (zh) 水上光伏浮体支架
CN219692446U (zh) 一种水利水电大口径管道辅助安装结构

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20200205

Address after: No.170, provincial road 01, Baofeng village, LindaI Town, Pinghu City, Jiaxing City, Zhejiang Province

Applicant after: JIAXING JINRUI PHOTOVOLTAIC TECHNOLOGY Co.,Ltd.

Address before: 213000 run 29 building, 29 Airport Road, Xinbei District, Changzhou, Jiangsu

Applicant before: Yu Wei

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200317

Termination date: 20210824

CF01 Termination of patent right due to non-payment of annual fee