CN109075535B - Overvoltage protection equipment - Google Patents

Overvoltage protection equipment Download PDF

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Publication number
CN109075535B
CN109075535B CN201780012021.7A CN201780012021A CN109075535B CN 109075535 B CN109075535 B CN 109075535B CN 201780012021 A CN201780012021 A CN 201780012021A CN 109075535 B CN109075535 B CN 109075535B
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Prior art keywords
overvoltage protection
protection device
interface
resistor
metal
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CN109075535A (en
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赖内·达诗
斯蒂芬·普费尔特纳
安德烈·西格尔
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Phoenix Contact GmbH and Co KG
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Phoenix Contact GmbH and Co KG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00Overvoltage arresters using spark gaps
    • H01T4/04Housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T1/00Details of spark gaps
    • H01T1/16Series resistor structurally associated with spark gap
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T21/00Apparatus or processes specially adapted for the manufacture or maintenance of spark gaps or sparking plugs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00Overvoltage arresters using spark gaps
    • H01T4/06Mounting arrangements for a plurality of overvoltage arresters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00Overvoltage arresters using spark gaps
    • H01T4/10Overvoltage arresters using spark gaps having a single gap or a plurality of gaps in parallel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T4/00Overvoltage arresters using spark gaps
    • H01T4/10Overvoltage arresters using spark gaps having a single gap or a plurality of gaps in parallel
    • H01T4/12Overvoltage arresters using spark gaps having a single gap or a plurality of gaps in parallel hermetically sealed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12Overvoltage protection resistors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

The invention discloses an overvoltage protection device (1) which comprises a housing (G) and a first overvoltage protection device arranged in the housing
Figure DDA0001768707550000011
And a second overvoltage protection device
Figure DDA0001768707550000012
The first overvoltage protection device
Figure DDA0001768707550000013
Having a first interface
Figure DDA0001768707550000014
And a second interface
Figure DDA0001768707550000015
The second overvoltage protection device
Figure DDA0001768707550000016
Also has a first interface
Figure DDA0001768707550000017
And a second interface
Figure DDA0001768707550000018
The first overvoltage protection device
Figure DDA0001768707550000019
And a second overvoltage protection device
Figure DDA00017687075500000110
Respectively, is one of the classes of transient suppression diodes, piezoresistors, gas-filled surge arresters, spark gaps, wherein the first overvoltage protection device
Figure DDA00017687075500000111
Is of a different class than the second overvoltage protection device
Figure DDA00017687075500000112
Class of, said first interface of different classes of overvoltage protection devices
Figure DDA00017687075500000113
And/or a second interface
Figure DDA00017687075500000114
Are connected to each other by at least one resistor (R) which is made of an organic conductive material.

Description

Overvoltage protection equipment
Technical Field
The invention relates to an overvoltage protection device.
Background
Numerous overvoltage protection devices are known from the prior art. Both primary and secondary overvoltage protection devices are known from this.
The so-called primary overvoltage protection device has only one overvoltage protection means, for example a gas-filled overvoltage arrester (GDT-gas discharge tube). Such overvoltage protectors have a high discharge capacity and, although they have a very good protective function, they do not have a significant effect on small overvoltages and can therefore lead to damage to the electrical installation to be protected.
In the past, starting from this problem-the applicant himself-developed so-called secondary plants. These devices have, for example, Transient Suppressor diodes (TVS-Transient Voltage supressors) and gas-filled surge arresters (GDT-gasdischarge tube). With this arrangement, it is possible, with suitable wiring, to combine the good (low) protection level of the transient suppressor with the significantly higher discharge capacity of the gas-filled surge arrester (GDT-gas discharge tube). For example, a transient suppressor diode may have a discharge capacity of a few hundred a rush current, while at the same time a gas-filled surge arrester (GDT-gas discharge tube) may have a discharge capacity of a few kA. This combination is made possible by a commutation resistor which is switched between the charging surge arrester (GDT-gas discharge tube) and the Transient Voltage Suppressor (TVS-Transient Voltage Suppressor).
An important criterion is, however, that the commutation resistor itself needs to have a resistance value which is as small as possible, so that no unnecessary electrical energy is converted into thermal energy during operation.
The commutation resistor must be able to withstand the high pulse strengths of the circuit and to withstand a large amount of electrical energy, since the electrical energy increases at least quadratically with the value of the current (E — I2t — R). At high resistance values, the current required for commutation is reduced, so that a commutation resistance as high as possible would be advantageous.
On the contrary, it is also necessary that the commutation resistor can also temporarily carry higher power without being destroyed by thermal effects, which would otherwise no longer ensure proper operation of the overvoltage protection device.
These boundary conditions are not at all possible to meet using current techniques that require a cost-effective structure to be ensured.
Thus, although SMD resistors can be used as commutation resistors, these resistors are not sufficiently suitable for carrying higher powers without being destroyed by thermal effects. These SMD resistors are often expensive in particular and, in addition, exhibit significant problems with regard to stability in the case of thermal or electrical strain.
Disclosure of Invention
Based on the above problems, it is an object of the present invention to provide new and cost-effective alternatives which avoid one or more of the disadvantages of the prior art.
The solution to the above object is obtained by the features of the independent claims. Advantageous embodiments of the invention are specified in the dependent claims and in the description.
Drawings
The invention is further elucidated by means of preferred embodiments with reference to the drawing.
Wherein:
FIG. 1 is a first schematic circuit diagram illustration according to an embodiment of the present invention;
FIG. 2 is a schematic diagram according to an embodiment of the present invention;
FIG. 3 is an aspect of an embodiment according to the invention; and
fig. 4 is another aspect of an embodiment according to the invention.
Description of the labeling:
overvoltage protection device 1
Outer cover G
Conductor L
Overvoltage protection device
Figure BDA0001768707530000021
First interface A1-
Figure BDA0001768707530000022
A1-
Figure BDA0001768707530000023
A1-
Figure BDA0001768707530000024
Second interface A2-
Figure BDA0001768707530000025
A2-
Figure BDA0001768707530000026
A2-
Figure BDA0001768707530000027
Resistance R
Metal forming part S
Detailed Description
Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. It should be noted that various aspects are described, which can be used alone or in combination. Any aspect may be used with different embodiments of the invention, unless explicitly stated as an alternative only.
Furthermore, for the sake of simplicity, only one entity is often referred to. But the invention may also comprise more related entities, respectively, as long as there is no explicit remark. In this respect, the use of the words "a" or "an" should only be understood to mean that at least one entity is used in a simple embodiment.
Fig. 1 and 2 show an overvoltage protection device 1, said overvoltage protection device 1 having a first overvoltage protection means enclosed by a housing G, as shown in fig. 2
Figure BDA0001768707530000031
And a second overvoltage protection device
Figure BDA0001768707530000032
Said first overvoltage protection device
Figure BDA0001768707530000033
Having a first interface A1-
Figure BDA0001768707530000034
And a second interface A2-
Figure BDA0001768707530000035
Said second overvoltage protection device
Figure BDA0001768707530000036
Also has a first interface A1-
Figure BDA0001768707530000037
And a second interface A2-
Figure BDA0001768707530000038
Said first overvoltage protection device
Figure BDA0001768707530000039
And said second overvoltage protection device
Figure BDA00017687075300000310
Is one selected from the group consisting of a transient suppression diode, a varistor, a charging surge arrester, and a spark gap. Said first overvoltage protection device
Figure BDA00017687075300000311
And said second overvoltage protection device
Figure BDA00017687075300000312
Is of a different class, i.e. the first overvoltage protection device
Figure BDA00017687075300000313
For example a GDT as shown in fig. 1, while at the same time the second overvoltage protection means
Figure BDA00017687075300000314
For example a varistor.
WhereinSaid first overvoltage protection device
Figure BDA00017687075300000315
First interface A of1-
Figure BDA00017687075300000316
And said second overvoltage protection device
Figure BDA00017687075300000317
First interface A of1-
Figure BDA00017687075300000318
And/or a first overvoltage protection device
Figure BDA00017687075300000319
Second interface A2-
Figure BDA00017687075300000320
And a second overvoltage protection device
Figure BDA00017687075300000321
Second interface A of2-
Figure BDA00017687075300000322
Connected to each other by at least one resistor R.
For example, as shown in FIG. 1, at A1-
Figure BDA00017687075300000323
And A1-
Figure BDA00017687075300000324
With a resistor R arranged therebetween. However, alternatively or additionally, the process can also be carried out at A2-
Figure BDA00017687075300000325
And A2-
Figure BDA00017687075300000326
With another resistance R of the same or other electrical parameters being arranged in between. For the sake of distinction, the latter resistor is indicated by a dashed line.
The resistor R is made of an organic, electrically conductive material. Organic conductive materials may be of different nature and for example have a generally intrinsically conductive polymer, but may alternatively be synthetic materials which are improved in their conductive ability by carbon black or other conductive materials. For example, polyaniline or polyaniline containing a dopant of another organic material, such as, for example, ZnO or another organic material, may be used.
With the organic, electrically conductive material, it is possible to produce suitably sized resistors, for example from 0.5Ohm up to 4Ohm, which have excellent heat transfer capability, so that even high surge currents do not lead to disintegration or damage. In other words, with the invention described, it is now possible to carry high surge currents with a comparatively low resistance value, while at the same time the heat can be stored without any problems also in the large volume of the resistor and can be released slowly and thus also in an environmentally friendly manner over a large area. In particular, the resistor produced in this way can be produced cost-effectively and also permits, for example, conventional machining to be carried out later.
The circuit arrangement is multi-stage. However, this multistage nature is not limited to two stages, but may also have 3 or more stages as shown in fig. 1. In fig. 1, a transient suppressor diode is illustrated as an additional stage, for example, as an overvoltage protection device
Figure BDA00017687075300000327
Here, the IN side constitutes the unprotected side, while the OUT side constitutes the protected side.
The electrical resistance R can be formed in the housing G by, but not limited to, a spray casting process, polymerization, that is to say polymerization, polycondensation, polyaddition, rapid prototyping process.
Of particular value is mentioned an aspect of the invention as shown at 3a and 3b in figure 3. There is shown various exemplary metal formed parts S which can be used in connection with the present invention. Such a shaped part S of metal facilitates the electrical contact with said resistor R. It preferably has a large surface, for example formed by a large number of teeth, on the side intended to contact the resistor R. These teeth can be surrounded by the base material of the resistor R during the manufacturing process and make contact around them. The contact can also comprise a mechanical locking function in addition to the electrical contact. Furthermore, a safety function can be provided in a suitable configuration, so that, for example, an overvoltage protection connected to the metal profile part is isolated from the heating that is not permitted.
Of course, the shaped metal part S can also be embodied in such a way that it provides an outward contact end of the overvoltage protection device 1, i.e. a device interface, for example, to the conductor L.
Incidentally, it can be provided that the metal-molded part S is part of a lead frame which is inserted during the production process and is subsequently further processed, for example by cutting off and/or bending individual sections of the lead frame.
Although the substrate of the resistor allows an approximately random structuring, which is essentially limited by processing, a subsequent fine-tuning of the R-characteristic of the resistor can also be of interest. This is possible by means of a structured adjustment. That is, after the resistance R is generated, it may be desirable to measure the resistance rise, for example, in succession. This can be achieved by targeted (structured) abrasion, for example by means of a laser. Other suitable machining means for structuring include, for example, milling, whirling, punching, stamping, chemical and/or physical etching.
In contrast to the prior art, a true fine adjustment is now possible, so that the parameters can be set in a targeted manner. Thereby a more accurate overvoltage protection device with a further increased protection level can be provided.
In an exemplary method for producing the overvoltage protection device 1, the following steps are carried out (in a suitable sequence).
First, the housing G is provided. A metal molding S is inserted into the housing G, for example in the form of a lead frame, in order to provide a connection contact.
One or more electrical resistors R are inserted by means of injection molding, polymerization or rapid prototyping, wherein the electrical resistors R are inserted between the inserted metal shapes (S).
In this step, the resistance value can be controlled by the material to be inserted and can be reduced by further material additions as long as the process permits. In other words, the resistance value can also be monitored and influenced in a targeted manner during the insertion process.
In a subsequent step, a first overvoltage protection device is inserted and/or connected
Figure BDA0001768707530000041
And a second overvoltage protection device
Figure BDA0001768707530000042
Wherein the first overvoltage protection device
Figure BDA0001768707530000043
And said second overvoltage protection device
Figure BDA0001768707530000044
Is selected from the class comprising transient suppression diodes, varistors, gas-filled surge arresters, spark gaps, wherein said first overvoltage protection means
Figure BDA0001768707530000045
Is of a different class than the second overvoltage protection device
Figure BDA0001768707530000046
The category (2).
Furthermore, the first overvoltage protection device
Figure BDA0001768707530000051
Having a first interface A1-
Figure BDA0001768707530000052
And a second interface A2-
Figure BDA0001768707530000053
And said second overvoltage protection device
Figure BDA0001768707530000054
Also has a first interface A1-
Figure BDA0001768707530000055
And a second interface A2-
Figure BDA0001768707530000056
First interface A of different types of overvoltage protection devices1-
Figure BDA0001768707530000057
A1-
Figure BDA0001768707530000058
And/or a second interface A2-
Figure BDA0001768707530000059
A2-
Figure BDA00017687075300000510
Connected to each other by at least one respective resistor R.
It is noted that the above steps are not necessarily specified in the above order. In particular, it is also possible, for example, for the metal-molded part S to be connected to the overvoltage protection device
Figure BDA00017687075300000511
Or other structural elements or the housing G, and only then is the resistor R inserted. It may also be important, among other things, whether the resistance R can withstand theseA connection step, such as a reflow soldering process.
It is further noted that the step of joining has at least one step selected from the group consisting of reflow soldering, laser welding, wave soldering, selective soldering processes, placing into a suitably shaped container.
Furthermore, a structuring step of the resistor (R) can be provided for the resistance matching adjustment as described above. In particular, the structuring step can comprise at least one step selected from the group consisting of milling, whirling, laser, punching, stamping, etching.
The other components that can be connected by means of the resistors produced in this way are not subject to any restrictions, so that, for example, almost the resistance values that are necessary in electrical appliances can be generated by means of the invention described above and can be connected to various components, such as, for example, displays or telecommunications devices.
As described above, the individual profiled sections S and the structural elements already connected thereto, such as overvoltage protection elements
Figure BDA00017687075300000512
Figure BDA00017687075300000513
Can be pre-fabricated as a lead frame. Such a lead frame can then be inserted into the housing G and finally fixed there. Then, the resistor R is put in and the excess portion of the lead frame is removed.
In other words, according to the invention, the resistor R made of electrically conductive material is designed in such a way that it ensures the connection of the individual components in a large-area planar extension and thus can jointly fulfill the current-guiding function to be assumed by the conductor circuits of the printed circuit board.
It is advantageous if a casing G is provided which is as temperature-stable as possible (suitable for reflow soldering), which preferably already has a contour for accommodating the profiled part S.
Then, for the terminal, i.e. the external interface for the conductor L and forContacting said parts, e.g.
Figure BDA00017687075300000514
Can be fixed inside said housing G by pressing, punching or other procedures.
The shaped piece S may have a plurality of strips (fingers) in order to increase the effective contact area of the shaped piece S with the conductive material.
Other structures may also be fabricated by hot foil stamping.
By "injecting" the conductive plastic material, an (ohmic) connection is established in a suitable manner between the individual profiled sections S. Such a conductive plastic compound connection can fill the entire active area in order to ensure as large a surface as possible and thus good heat dissipation.
As long as not previously completed, the component part, for example
Figure BDA0001768707530000061
It can now be applied to the existing "footprint" in a cost-effective manner in a (reflow) (soldering) process.
By means of the invention, a better heat dissipation is achieved by a larger area. Thereby providing higher pulse capability with greater capacity. Furthermore, the use of circuit boards may even be dispensed with. A high number of pieces is of course possible due to the simple construction, and therefore a further cost reduction will be possible. It is particularly advantageous that the invention is insensitive to mechanical stresses (bending) in the longitudinal direction, whereby long-term stability is improved.
The invention can be particularly applied to the components of measurement and control technology (measurement and control). Thus, the structural element can be suitably fixed, for example, as shown in fig. 4
Figure BDA0001768707530000062
Wherein the component part is already provided with a profiled part S which is then encapsulated with the resistive material R on one side and then on the other side (for example by rotating the device).

Claims (12)

1. An overvoltage protection device (1) comprises a housing (G) in which a first overvoltage protection means is arranged
Figure FDA0002258561600000011
And a second overvoltage protection device
Figure FDA0002258561600000012
Characterized in that said first overvoltage protection device
Figure FDA0002258561600000013
Having a first interface
Figure FDA0002258561600000014
And a second interface
Figure FDA0002258561600000015
The second overvoltage protection device
Figure FDA0002258561600000016
Also has a first interface
Figure FDA0002258561600000017
And a second interface
Figure FDA0002258561600000018
The first overvoltage protection device
Figure FDA0002258561600000019
And a second overvoltage protection device
Figure FDA00022585616000000110
Respectively one of the classes of transient suppressor diode, varistor, gas-filled surge arrester, spark gap, said first overvoltage protection device
Figure FDA00022585616000000111
Is of a different class than the second overvoltage protection device
Figure FDA00022585616000000112
Class of, said first interface of different classes of overvoltage protection devices
Figure FDA00022585616000000113
And/or a second interface
Figure FDA00022585616000000114
Are connected by at least one resistor (R) made of electrically conductive material, the connection to the resistor being provided by a metal profile (S) which connects the resistor (R) by increasing the contact surface.
2. Overvoltage protection device according to claim 1, characterized in that the resistor (R) is formed by means of a spray forming process, a polymerization or a rapid prototyping process.
3. Overvoltage protection device according to claim 1 or 2, characterized in that the enlarged contact surface is a plurality of teeth formed with the metal form (S).
4. Overvoltage protection device according to claim 3, characterized in that the metal profile part (S) provides the connection end of the overvoltage protection device (1) to the outside.
5. The overvoltage protection device of claim 3, wherein the metal molded part is part of a lead frame.
6. The overvoltage protection device of claim 4, wherein the metal molded part is part of a lead frame.
7. Overvoltage protection device according to one of claims 1, 2, 4, 5 or 6, characterized in that the resistor (R) is formed by further processing in the structure.
8. Overvoltage protection device according to claim 3, characterized in that the resistor (R) is formed by further processing in the structure.
9. A method of manufacturing an overvoltage protection device (1), characterized in that the method has the steps of:
the method comprises the following steps: providing a housing (G);
step two: -inserting a metal profile (S) into the housing to provide a connection contact;
step three: the resistors (R) are inserted by means of injection molding, polymerization or rapid prototyping, said resistors (R) being inserted between the inserted metal shapes (S);
step four: inserting and connecting a first overvoltage protection device
Figure FDA0002258561600000021
And a second overvoltage protection device
Figure FDA0002258561600000022
The first overvoltage protection device
Figure FDA0002258561600000023
And said second overvoltage protection device
Figure FDA0002258561600000024
Respectively, is one of the classes of transient suppressor diode, varistor, gas-filled surge arrester, spark gap, wherein the first overvoltage protection device
Figure FDA0002258561600000025
Is of a different class than the second overvoltage protection device
Figure FDA0002258561600000026
Class (d), said first overvoltage protection device
Figure FDA0002258561600000027
Having a first interface
Figure FDA0002258561600000028
And a second interface
Figure FDA0002258561600000029
The second overvoltage protection device
Figure FDA00022585616000000210
Also has a first interface
Figure FDA00022585616000000211
And a second interface
Figure FDA00022585616000000212
First interface of different types of overvoltage protection devices
Figure FDA00022585616000000213
And/or a second interface
Figure FDA00022585616000000214
Are connected to at least one of the resistors (R) by means of the shaped metal parts (S).
10. The method of claim 9, wherein the step of joining is one of the steps comprising reflow soldering, laser welding, wave soldering, and inserting into a suitably shaped container.
11. Method according to claim 9 or 10, characterized in that it further comprises the step of resistance matching adjustment of the resistance (R) by structuring.
12. The method according to claim 11, wherein the structuring step comprises one of the group of milling, punching, etching.
CN201780012021.7A 2016-02-18 2017-02-17 Overvoltage protection equipment Active CN109075535B (en)

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Application Number Priority Date Filing Date Title
DE102016202522.8 2016-02-18
DE102016202522.8A DE102016202522A1 (en) 2016-02-18 2016-02-18 Surge protection device
PCT/EP2017/053591 WO2017140830A1 (en) 2016-02-18 2017-02-17 Overvoltage protection device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3094148B1 (en) * 2019-03-20 2021-04-16 Citel Surge protection device
CN110086158B (en) * 2019-05-24 2020-12-22 武汉晴川学院 Overvoltage protection device for electronic circuit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586104A (en) * 1983-12-12 1986-04-29 Rit Research Corp. Passive overvoltage protection devices, especially for protection of computer equipment connected to data lines
EP0186939A2 (en) * 1984-10-03 1986-07-09 The M-O Valve Company Limited Circuit arrangements
JPH0969416A (en) * 1995-08-31 1997-03-11 Tdk Corp Organic resistor with positive temperature characteristics
CN2439737Y (en) * 2000-07-07 2001-07-18 贵阳诚聚电子有限公司 Device for preventing house keeping electric appliance from being struck by lightning

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4586104A (en) * 1983-12-12 1986-04-29 Rit Research Corp. Passive overvoltage protection devices, especially for protection of computer equipment connected to data lines
EP0186939A2 (en) * 1984-10-03 1986-07-09 The M-O Valve Company Limited Circuit arrangements
JPH0969416A (en) * 1995-08-31 1997-03-11 Tdk Corp Organic resistor with positive temperature characteristics
CN2439737Y (en) * 2000-07-07 2001-07-18 贵阳诚聚电子有限公司 Device for preventing house keeping electric appliance from being struck by lightning

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WO2017140830A1 (en) 2017-08-24
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DE102016202522A1 (en) 2017-08-24
CN109075535A (en) 2018-12-21

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