CN109068565A - A kind of liquid metal printer and its plaster mechanism and pasting method - Google Patents

Abstract

The invention discloses a kind of liquid metal printer and its plaster mechanisms and pasting method, plaster mechanism, it including the cast patch rifle to link with the first movable device, is used for through bottom suction surface mount elements, and surface mount elements is moved to the working face of different height by the first movable device；With the subassembly wrapper of the second movable device linkage, one or more surface mount elements are inside placed with, for the surface mount elements in it to be moved to the underface of cast patch rifle suction nozzle by the second movable device；With the Glue dripping head of third movable device linkage, the glue discharging mouth of Glue dripping head carries out dispensing in the bottom surface of the surface mount elements upward, for being moved to the underface of the surface mount elements by third movable device, and by its glue discharging mouth.The present invention carries out dispensing by the way that Glue dripping head to be inverted, in the bottom surface of surface mount elements, and avoid the Glue dripping head of plastic emitting from below influences vulnerable to gravity, the various problems such as cause colloid leakage, gel quantity not easy to control.

Description

A kind of liquid metal printer and its plaster mechanism and pasting method

Technical field

The invention belongs to liquid metal printer technology field more particularly to a kind of liquid metal printers and its chip mounter Structure and pasting method.

Background technique

Automatic placement machine is a kind of mounting device designed for element or surface mount elements, for element to be attached to printing On designated position on circuit, it is electrically connected it with conducting wire at the position, and then obtain corresponding combinational circuit；

The working method of chip mounter mainly passes through gum outlet Glue dripping head directed downwardly at present, by the substrate of colloid point thereunder On, then drive surface mount elements to be placed on realization patch at dispensing by paster component.Due to the plastic emitting mouth down of Glue dripping head, hold Vulnerable to the influence of self gravity, lead to the problem of that glue amount is excessive during for dispensing glue, due to surface mount elements size very It is small, the conducting wire on corresponding printed circuit be also it is very delicate, glue amount is excessively easy to squeeze colloid in surface mount elements In the process, the conducting wire for making extra colloid covering periphery, so that making can not be just between the pin of surface mount elements and conducting wire Often contact.

Summary of the invention

In view of this, it is an object of the invention to propose a kind of plaster mechanism, to solve Glue dripping head in the prior art Gel quantity problem not easy to control.

In some illustrative embodiments, the plaster mechanism, comprising: the cast patch with the linkage of the first movable device Rifle is used for through bottom suction surface mount elements, and is moved to the surface mount elements by first movable device The working face of different height；With the subassembly wrapper of the second movable device linkage, one or more surface mount elements are inside placed with, are used for Surface mount elements in it are moved to the underface of the cast patch rifle suction nozzle by second movable device；It is living with third The Glue dripping head of motivation structure linkage, the glue discharging mouth of the Glue dripping head are upward, described for being moved to by the third movable device The underface of surface mount elements, and dispensing is carried out in the bottom surface of the surface mount elements by its glue discharging mouth.

In some optionally embodiments, the plaster mechanism, further includes: storage glue tank；The Glue dripping head by pipeline with The storage glue tank is connected to and fixes；The third movable device is the rotating mechanism being cooperatively connected with the storage glue tank, drives institute Glue dripping head is stated to move in the horizontal direction using the storage glue tank as the center of circle.

In some optionally embodiments, up and down magnetism is provided with by bracket in the glue discharging mouth of the Glue dripping head Thimble, the end face of the magnetism thimble are planar structure, and when the magnetic thimble is in its extreme lower position, top is located at glue Under body fluid face；It is provided with the electromagnet with the magnetic thimble cooperation on the cast patch rifle, is used in the energized state, Magnetic thimble is sucked out out of glue discharging mouth, the colloid point for taking its end out of is on the bottom surface of surface mount elements.

In some optionally embodiments, the flexibility being provided on the top of the magnetism thimble for adhering to colloid is fine Dimension.

In some optionally embodiments, second movable device, comprising: the cunning cooperated with the shell of the subassembly wrapper Rail；The subassembly wrapper is popped up or is withdrawn in the horizontal direction along the sliding rail by electromagnetism part.

In some optionally embodiments, the subassembly wrapper is the multilayered structure stacked along the vertical direction, and every layer of structure is logical It crosses independent sliding rail and electromagnetism part moves in the horizontal direction.

In some optionally embodiments, the subassembly wrapper is " L " font trough body structure, groove body equivalent width；Its content One or more shapes of receiving are consistent and the dispatching unit that is arranged successively, the groove body constitute the sliding slot of the dispatching unit, institute It is mobile from one end of the groove body to the other end by electromagnetism part to state dispatching unit；Wherein, the upper surface of the dispatching unit is opened Equipped with placing groove corresponding with the surface mount elements shape；The subassembly wrapper be used for by second movable device will be in it Surface mount elements be moved to the underface of the cast patch rifle suction nozzle, specifically include: the subassembly wrapper passes through one or more The driving of electromagnetism part will be moved to the underface of the cast patch rifle suction nozzle in subassembly wrapper bending place surface mount elements.

In some optionally embodiments, the plaster mechanism, further includes: while driving the cast patch rifle, described Subassembly wrapper, the Glue dripping head carry out the 4th mobile movable device of consistency in vertical direction and/or horizontal direction.

It is another object of the present invention to propose a kind of pasting method, to solve problems of the prior art.

In some illustrative embodiments, the pasting method, applied to above-mentioned plaster mechanism, comprising: equipment is initial Change, cast patch rifle is made to be in initialization face；Drive the second movable device that subassembly wrapper is driven to be moved to target surface mount elements The underface of the cast patch rifle suction nozzle；Drive the first movable device that the cast patch rifle is driven to be displaced downwardly to load work Target surface mount elements are adsorbed under suction nozzle by face；Drive the second movable device that subassembly wrapper is driven to remove the cast patch rifle Whereabouts range；Driving third movable device drive the Glue dripping head be moved to the object component being adsorbed under suction nozzle just under Side；It drives the first movable device that the cast patch rifle is driven to be displaced downwardly to dispensing working face, cooperates with the Glue dripping head and complete mesh The dispensing of labeling piece element bottom surface；The whereabouts model for driving third movable device that the Glue dripping head is driven to remove the cast patch rifle It encloses；It drives the first movable device that the cast patch rifle is driven to be displaced downwardly to patch working face, and stops adsorption operations, paste target Piece element is placed on designated position of the surface with the substrate of liquid metal route.

Another object of the present invention is to propose a kind of liquid metal printer, which includes above-mentioned Described in any item plaster mechanisms.

Compared with prior art, the present invention has following technical advantage:

The present invention carries out dispensing by the way that Glue dripping head to be inverted, in the bottom surface of surface mount elements, avoids the point of plastic emitting from below Rubber head is influenced vulnerable to gravity, the various problems such as cause colloid leakage, gel quantity not easy to control.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the printing mechanism of the liquid metal printer in the embodiment of the present invention；

Fig. 2 is the print state schematic diagram of the liquid metal printer in the embodiment of the present invention；

Fig. 3 is liquid metal line syncretizing effect schematic diagram；

Fig. 4 is the control flow chart of the printing mechanism of the printing mechanism in the embodiment of the present invention；

Fig. 5 is the printing schematic diagram of the printing mechanism in the embodiment of the present invention；

Fig. 6 is liquid metal threadiness printing effect in the embodiment of the present invention；

Fig. 7 is the repairing flow chart of the liquid metal printer in the embodiment of the present invention；

Fig. 8 is the repairing flow chart of the liquid metal printer in the embodiment of the present invention；

Fig. 9 is the structural schematic diagram of the liquid metal printer in the embodiment of the present invention；

Figure 10 is the structural schematic diagram of the repair mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 11 is the structural schematic diagram of the repair mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 12 is the structural schematic diagram of the repair mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 13 is the structural schematic diagram of the wiping pen of the repair mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 14 is the structural schematic diagram of the wiping pen of the repair mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 15 is the structural schematic diagram of the liquid metal printer in the embodiment of the present invention；

Figure 16 is the structural schematic diagram of the plaster mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 17 is the operation schematic diagram of the plaster mechanism in the embodiment of the present invention；

Figure 18 is the structural schematic diagram of the subassembly wrapper of the plaster mechanism in the embodiment of the present invention；

Figure 19 is the structural schematic diagram of the plaster mechanism of the liquid metal printer in the embodiment of the present invention；

Figure 20 is the structural schematic diagram of the Glue dripping head of plaster mechanism in the embodiment of the present invention；

Figure 21 is the structural schematic diagram of the welding mechanism of liquid metal printer in the embodiment of the present invention；

Figure 22 is the partial schematic diagram of the welding mechanism in the embodiment of the present invention；

Figure 23 is the operation schematic diagram of the welding mechanism in the embodiment of the present invention；

Figure 24 is the partial schematic diagram of the welding mechanism in the embodiment of the present invention；

Figure 25 is the structural schematic diagram of the liquid metal printer in the embodiment of the present invention；

Figure 26 is the partial structural diagram of the liquid metal printer in the embodiment of the present invention.

Specific embodiment

The following description and drawings fully show specific embodiments of the present invention, to enable those skilled in the art to Practice them.Other embodiments may include structure, logic, it is electrical, process and other change.Embodiment Only represent possible variation.Unless explicitly requested, otherwise individual components and functionality is optional, and the sequence operated can be with Variation.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments.This hair The range of bright embodiment includes equivalent obtained by the entire scope of claims and all of claims Object.Herein, these embodiments of the invention can individually or generally be indicated that this is only with term " invention " For convenience, and if in fact disclosing the invention more than one, the range for being not meant to automatically limit the application is to appoint What single invention or inventive concept.

Referring now to fig. 1, Fig. 1 shows a kind of structural schematic diagram of the liquid metal printer in the embodiment of the present invention, As shown in the structural schematic diagram, liquid metal printer 100, comprising: working face (workbench) 10, and it is enterprising in working face 10 The printing mechanism 20 of row print job, printing mechanism 20 are put for the liquid metal of fluid state to be printed on according to predetermined pattern It sets on the printing substrate 201 on working face 10, liquid metal impressing pattern is formed, thus the printed wiring as printed circuit Or it draws a design as decorative liquid metal.

Mercury, gallium, indium, tin simple substance, gallium-indium alloy, gallium-indium-tin alloy, gallium can be used in liquid metal in the embodiment of the present invention Tin alloy, gallium kirsite, gallium indium kirsite, gallium red brass, gallium indium red brass, gallium tin cadmium alloy, gallium Zn-Cd alloy, bismuth indium Alloy, bismuth tin alloy, bismuth indium stannum alloy, bismuth indium kirsite, bismuth red brass, bismuth indium red brass, leypewter, Xi Tonghe One or more of gold, tin pltine, Tin Silver Copper Alloy, bismuth terne metal.This kind of low-melting-point metal has outstanding lead Electrical property and Liquid phase flowability, therefore have unique application value in novel electron structure manufacturing field.Wherein, it is in printer Liquid metal on structure 20 and printing substrate 201 is in fluid state, and fusing point is at 100 degrees Celsius or less (for above-mentioned conjunction For gold, alloy ratio is selected by the melting point curve in the phasor of alloy), made by way of heating in some embodiments Liquid metal is in fluid molten condition.

In some preferred embodiments, the low melting point that (35 degrees Celsius) are in a liquid state at normal temperature is can be used in liquid metal Metal, such as gallium-indium alloy, specific gallium indium proportion are 75.5% gallium and 24.5% indium, which is 15.5 degree, It is in liquid form substantially at normal temperature.

In some embodiments, printing mechanism 20 is by mechanical arm or single shaft/multi-shaft interlocked component in the top of working face The mobile operation in one or more directions.

Printing mechanism 20 uses liquid metal write-through print head 21, is similar to direct write pen/lettering pen, is being printed by pearl The liquid metal in pen tube is taken in movement on substrate processed out of, formation and the consistent track route of motion track on printing substrate, To form target pattern, figure.It is connected between print head 21 and print cartridge 22 by pipeline 23.

Liquid metal write-through print head is compared with ink jet type printing type, although the amount out of ink of liquid metal is more easily-controllable System, but print formed liquid metal figure, pattern still can exist it is some such as route cissings, line interruption, route spilling The problem of Deng printing quality is influenced.

A major reason for influencing printing quality is exactly the surface tension of liquid metal fluid state, so that being just printed upon The liquid metal line on substrate surface is printed due to the effect of surface tension, drives liquid metal in certain area to the region Center convergence, until the region in liquid metal gravity and surface tension reach balance and stability, similar to the remittance of drop Poly- phenomenon.

To solve the above-mentioned problems, present invention is alternatively directed to liquid metal write-through print head, i.e. printing mechanism 20 proposes A kind of image-forming method, so that the phenomenon that avoiding diminishing line as far as possible, even breaking, promotes the steady of liquid metal printing process Qualitative and reliability guarantees the quality of liquid metal printing product.

As shown in Fig. 2, the pattern forming method, comprising: by successively drawing at least 2 liquid gold on the work surface Belong to the metal pattern that line forms molten state；Wherein, at least 2 liquid metal lines draw when along wide direction phase interconnection It connects.

Wherein, wide direction mutually overlaps and refers to that there are a certain range of heavy in two online wide directions of liquid metal line along the line It is folded, and the overlapping range uniformity on the extending direction of liquid metal line (perpendicular to line width direction).

In some embodiments, size, the shape of mutually overlapped two liquid metal lines are consistent, and are parallel to each other, liquid State metal wire overlaps completely；In other embodiments, the size on the whole, shape of mutually overlapped two liquid metal lines are different It causes, wherein a liquid metal line is consistent with the local shape of another liquid metal line, and is parallel to each other, realize at this and take It connects, liquid metal line locally overlaps；In further embodiments, mutually the size on the whole of overlapped two liquid metal lines, Shape is inconsistent, and two liquid metal lines are respectively provided with local reciprocal correspondence, realizes that liquid metal line locally overlaps；

In some embodiments, at least 2 liquid metal lines draw when along wide direction mutually overlap, have Body includes: the sequencing according to drafting, and wide direction successively overlaps one by one along the liquid metal line.Formed in rear drafting Liquid metal line 1020 be overlapped on formerly draw formed liquid metal line 1010 on, one by one overlap joint realize filling out for figure It fills.

Figure in the embodiment of the present invention may include line segment, circular arc, it is rectangular (containing just, rectangle), it is round (containing ellipse Shape) and triangle, five deformation etc. multiple standards polygon, be also possible to off-gauge polygonal shape.Pattern is then by one Or multiple figures composition, between figure can it is continuous, can also be separation.Pattern can such as printed circuit comprising: several by Conducting wire (being electrically connected at two for making, such as component pin-component pin, component pin-power supply line), crosses hole site at pad Deng；Conducting wire can be the line segment of any route shape.

Liquid metal write-through Method of printing disclosed in the embodiment mainly in the way of gradually description/filling, Make liquid metal line composition targeted graphical, pattern one by one.

Firstly, the present invention, which is ridden over and (partly overlapped) by the liquid metal line that will currently draw, has drawn another of formation It is drawn on liquid metal line, i.e., a mode for taking one draws liquid metal route, wider compared to using single line width The print head one molding liquid metal route (i.e. one can be obtained target line width) of (or control single line width broaden) and Speech, the line width of the liquid metal line of single is thinner, and diminishing line range is reduced.

In addition, the pearl of the print head in this programme is in liquid gold from the point of view of the contact surface of liquid metal and substrate surface Belong in the region of route and forms the compressive plane being evenly distributed, the pressure that the liquid metal at the position applies due to pearl The effect of impregnation between substrate is improved and prints, relatively stable is attached to substrate surface, passes through the extruded threads being evenly distributed The compressive plane of composition can limit the size of liquid metal route entirety from bottom, shape carries out a degree of limitation.

Further more, the lapping drafting in this programme can be such that liquid metal mutually merges from the point of view of the surface of liquid metal, although The influence by surface tension, but the rock-steady structure due to being evenly distributed on the bottom position of liquid metal can not be avoided completely Convergence of the liquid metal route from edge bottom to center can be greatly reduced in (aforementioned stable attachment).

Therefore, the present invention merges the complete liquid metal figure/pattern of composition by way of a plurality of single line lapping, one Determine to reduce the influence of the diminishing line due to caused by liquid metal surface tension in degree, improves liquid metal write-through printer Stability and reliability, ensure that the printing quality for the liquid metal pattern to be formed.

The effect diagram of different lapping ranges between single line is shown referring now to Fig. 3, Fig. 3.

Offset step in Fig. 3 a between liquid metal line using single line width as print head designs, i.e. liquid metal list Lapping range between line is 0, and ideally it should just be connected, but in practice due to the surface tension of liquid metal Effect, leads to the state being separated from each other between liquid metal single line.

It is less than the design of single line width, but single line lapping range between liquid metal single line in Fig. 3 b using offset step Smaller, laps are not enough to overcome respective single wire surface tension (stress point), so that still there may be due to surface tension The phenomenon that breaking.

It is less than the design of single line width, but single line lapping range between liquid metal single line in Fig. 3 c using offset step Larger, the surface area that the line group of two single lines reconstruct is contacted with printing substrate is not enough to fetter the liquid metal in the region, i.e., The gravity of liquid metal is greater than the liquid metal surface tension in the region, so as to cause the liquid metal in the region indefinite To overflow problem.

It is less than the design of single line width between liquid metal single line in Fig. 3 d using offset step, single line lapping range was both It is not too small, only greatly, to guarantee being stabilized for liquid metal line.

Further, when the lapping range between liquid metal single line is not less than the 20% of single line width, can obviously change The problem of shown in kind Fig. 3 b.When lapping range between liquid metal single line is no more than the 80% of single line width, it can keep away Exempt from problem shown in Fig. 3 c.When region i.e. in lapping range between the 20%-80% of single line width, can effectively it change Defect problem caused by kind print liquid metallic circuit, reaches the printing effect of Fig. 3 d.

In some preferred embodiments, when lapping range is set as the 45%-60% of single line width, can greatly it be promoted The reliability and stability of print liquid metallic circuit make the fused stable structure of liquid metal, are not susceptible to deform and overflow It goes wrong.

Preferably, a kind of pattern forming device is also disclosed in the embodiment of the present invention, which, which has, executes One or more components of above-mentioned pattern forming method.

Referring now to Fig. 4, present invention is alternatively directed to the liquid metal write-through printing techniques to propose a kind of liquid metal Write-through Method of printing is applied to liquid metal write-through printer, comprising:

Step S21, pending direct write print track is generated according to target pattern；

Wherein, target pattern can for by one or more targeted graphicals combination, targeted graphical include linear (route), Rectangle, circle, circular arc etc. be regular or irregular figure.

Step S22, the metal pattern that the direct write print track forms molten state is executed；

It wherein, include at least one instruction in the direct write print track by describing a plurality of liquid metal line formation unit The filling track of figure, the offset step filled in track are no more than single line width.

Wherein, in the embodiment of the present invention the acquisition, identification, positioning etc. of target pattern can be used it is in the prior art Technology, such as the Software for producing and/or machining software of the acquisition of pixel, setting coordinate and existing electronic circuit.

In some embodiments, the offset step in the filling track is the 40%-55% of single line width.It can reach State the printing effect of Fig. 3 d.

It illustrates by targeted graphical of rectangle illustrated in fig. 5, using write-through print head, pen tip uses the rolling of 0.5mm Pearl, amount out of ink control be it is certain, corresponding single is averaged line width as 0.15mm, and the offset step of write-through print head is set in 0.6–0.8mm.Mode is described using gradually winding type in direct write track, and the leftmost side of top is set as starting point, is then passed through From left to right, sequence detour from top to bottom prints liquid metal line, moves down 0.6-0.8mm every time.Until completing target The whole of figure draw.In the embodiment, targeted graphical is drawn by the way of a forming, it in further embodiments, can Complete the row liquid metal line printing after, lift print head and moved down (offset), then pushing print head after The continuous horizontal liquid metal line for printing the row, so that the amount of the position liquid metal caused by avoiding deviation post from printing is larger.

In some embodiments, the target pattern includes the continuous unit figure of at least two；It is described according to target pattern During generating pending direct write print track, comprising: by adjusting institute in the range of the 40%-55% of single line width Offset step is stated, the direct write end point for the unit figure formerly drawn and the direct write starting point of the unit figure in rear drafting are connected It is continuous.

In some embodiments, direct write print track instruction metal pattern one molding or more moldings.

Above-mentioned Method of printing for any figure, the pattern drawn by liquid metal, can such as be imbued with the plane print of aesthetic feeling Product, as plan view is drawn；And it is imbued with the intelligent drawing of existing conductive characteristic while aesthetic feeling, such as touch-control LED light decorations liquid gold Category figure is drawn；And the printed wiring in the printed circuit (PCB) of standard, comprising: route itself, patch contact route, pad position Set, cross hole site etc..

Preferably, a kind of liquid metal printer is also disclosed in the embodiment of the present invention, which has Execute one or more components of above-mentioned Method of printing.

In conclusion it is irregular/imperfect (i.e. at this to be easy to produce line break-point test, route in liquid metal impressing pattern Although route is still connected to, do not meet normal line it is wide/line style, such as hollow, cissing), route overflow line defct, for above-mentioned Defect should in different ways repair it, be such as directed to line break-point test and the imperfect defect of route, can pass through breakpoint bit It sets or lacks position and replenish liquid metal, and be directed to route overflow problem, then should remove the liquid metal of spilling.Fig. 6 is shown The various printing effects of liquid metal, Fig. 6 (a) are normal liquid metal route, and Fig. 6 (b) is line break-point test, Fig. 6 (c) is in route Sky, Fig. 6 (d) are line break-point test caused by obvious diminishing line.

Referring now to Fig. 7, Fig. 7 show when due to liquid metal pattern/figure there are drawbacks described above (cissing, breakpoint, overflow Out, imperfect) when repairing flow chart, as shown in the flow chart, method for repairing and mending, comprising:

Step S31, surface sweeping targeted graphical/pattern, the route for obtaining the liquid metal in the targeted graphical/pattern lack It falls into；

Scanning targeted graphical/pattern mode in the step can be by way of snapshot, such as camera shooting, photograph, or It can be known by projection otherwise (such as CCD sensitive image sensor), by being obtained to the light and shade of projection generated after polishing Then the actual conditions of actual targeted graphical/pattern find out the difference of the two, analysis by comparing original figure/pattern again Line defct therein out；

Pixel technology in the prior art can be used in the method for above-mentioned comparison, first by ifq circuit partition of a graph Cheng Youruo Dry pixel, each pixel correspond to a coordinate points, and region shared by the liquid metal in ifq circuit figure can be denoted as 1, Remaining region can be denoted as 0, and when getting the actual circuit diagram of objective circuit, which is clicked through in the manner described above with pixel Row decouples and carries out respective markers, then two pixel maps are compared, to find out the pixel and position seat of the two difference Mark.

Step S32, the defect type for determining the line defct selects corresponding repairing plan according to the defect type Slightly liquid metal is carried out to the line defct to replenish or wipe.

The present invention solves different defects and asks to liquid metal drafting bring quality by using different repairing methods Topic.

Specifically, as described above,

Line defct, comprising: line break-point test and/or route are imperfect；Then according to the defect type described in step S32 It selects corresponding repair strategy to carry out liquid metal to the line defct to replenish or wipe, specifically can include: determine the line The starting point and end point of liquid metal line segment and the line defct where the defect of road, liquid metal is replenished in institute State the region on liquid metal line segment between the starting point and end point.

Line defct may also include that route overflows；It is then selected described in step S32 according to the defect type corresponding Repair strategy carries out liquid metal to the line defct and replenishes or wipe, specifically can include: obtain overflow area；Control is moistened with The rubbing head of alcohol wipes the overflow area with certain dynamics.

As shown in figure 8, in some alternative embodiments, before the scanning targeted graphical/pattern, further includes:

Step S30. prepares the objective circuit using liquid metal direct write printing technique；

Include: to draw liquid metal line segment by way of multiple reciprocal detour during this, is beaten before each detour printing It prints head and deviates certain deviation step-length to assigned direction, the offset step is less than the single line width of the print head.It is therein inclined The long selection of walk can be chosen in the range of offset step hereinbefore.

In some embodiments, it is described by liquid metal replenish on the liquid metal line segment between the starting point with Region between the point of end, specifically includes: using above-mentioned liquid metal direct write printing technique, liquid metal is replenished in the liquid Region in state metal wire sections between the starting point and end point.

As the job description of above-mentioned liquid metal printer, printer forms the liquid metal line segment in control print head Before, need to calculate working trajectory when print head draws the liquid metal route, in one embodiment, liquid metal route It is with each section for a line segment unit, liquid metal printer continues to print next route after having printed a line segment unit Unit corresponds to a print logic/print command of liquid metal printer, the print logic/beat for every section of line segment unit Commands direct liquid metal printer is printed according to preset working trajectory print liquid metal wire sections, the interior starting comprising printing Point and end point, offset step, the depression degree of print head, print speed etc..

In some embodiments, it is described to replenish liquid metal described when the line defct is the line break-point test Region on liquid metal line segment between the starting point and end point, specifically includes: transferring the liquid where line defct The print command of state metal wire sections replaces liquid metal route described in the print command with the starting point and end point The line break-point test on the liquid metal line segment is replenished in head and the tail coordinate, the print command after executing replacement.

Repair strategy in the embodiment replaces specified parameter therein without regenerating, using original print command It can be completed, reduce the calculation amount of liquid metal printer, be conducive to the whole printing effect for promoting liquid metal printer.

In some embodiments, it is described to replenish liquid metal in the liquid when line defct is that route is imperfect Region in state metal wire sections between the starting point and end point, specifically includes: obtaining the line of route institute absent region Width recalculates the offset step of the print head according to the line width；Transfer the liquid metal line segment where line defct Print command, with the starting point and end point replace liquid metal route described in the print command head and the tail coordinate, And original detour offset in the print command is replaced with the detour offset recalculated, after executing replacement Print command the incomplete region of route is replenished.

Due to the imperfect situation of route, line width is varied, and is printed according to the offset step in former print command, having can Repair efficiency can be influenced, therefore avoids the appearance of the problem by recalculating offset step, guarantees the matter of liquid metal route Amount.

Specifically, the line width for obtaining route institute absent region, recalculates the print head according to the line width Offset step specifically includes: the offset step of the print head is recalculated according to following formula；S=(X-D/N)；N= ((X-D)/D)+1；Wherein, it is the line width of route institute absent region that S, which is again calculated offset step, X, and D is initial offset Step-length, N are detour number needed for filling up route institute absent region.Wherein, the detour number rounds up.

Specifically, before the offset step for recalculating the print head according to the line width, further includes: sentence Break route institute absent region line width X and the initial offset step-length D size relation；If X >=D, according to the line Width recalculates the offset step of the print head；If X < D, with the middle line of route institute absent region by filling up one Liquid metal.

In some embodiments, before the defect type for determining the line defct, further includes: described in judgement Accounting of the line defct in the targeted graphical/pattern in wholly liquid state metallic circuit；If the accounting exceeds threshold value, abandon Current goal figure/pattern, is printed again；Otherwise, it is determined that the defect type of the line defct out, according to the defect Type selects corresponding repair strategy to replenish or wipe line defct progress liquid metal.

The embodiment repairs inefficiency for avoiding caused by complicated reason, to avoid enter into duplicate endless loop. In some embodiments, the threshold value includes ratio of the liquid metal line segment in wholly liquid state metallic circuit where line defct Ratio of the area that example and line defct are influenced in wholly liquid state metallic circuit；Preferably, the threshold value is specially line 60% accounting of the liquid metal line segment in wholly liquid state metallic circuit where the defect of road, the area that line defct is influenced exist 30% accounting in wholly liquid state metallic circuit.If above-mentioned threshold value can appoint one or second, by practical discovery printed circuit Middle actual defects situation exceeds above-mentioned threshold value, and the repairing time then will exceed its preparation time for the first time, lead to whole preparation time It is too long.

Preferably, a kind of liquid metal printer is also disclosed in the embodiment of the present invention, which has One or more components of above-mentioned method for repairing and mending are executed, such as includes the first component, is used for surface sweeping targeted graphical/pattern, obtain institute State the line defct of the liquid metal in targeted graphical/pattern；Second component, for determining the defect class of the line defct Type selects corresponding repair strategy to carry out liquid metal to the line defct and replenishes or wipe according to the defect type；The Three components, for preparing the objective circuit using liquid metal direct write printing technique.

Another structural representation of the liquid metal printer in the embodiment of the present invention is shown referring now to Fig. 9, Fig. 9 Figure, as shown in the structural schematic diagram, the invention discloses a kind of liquid metal printer 100, which exists On the basis of Fig. 1, further includes: figure acquisition system, figure acquisition system include the strip light band 91 positioned at 10 lower section of working face, And the CCD system 92 above working face 10, the two is opposite vertically.Working face uses transparent material, and strip light band is used for Light source is provided right above to it, the CCD system of top is then used to obtain light source and penetrates the image that printing substrate is formed on, from And obtain actual impressing pattern.The actual pattern of acquisition can be applied to the scanning target pattern in above-mentioned method for repairing and mending, in turn Analysis obtains line defct, and print head is then driven to complete the repairing to target pattern again.The repairing is mainly for liquid metal Route/pattern line break-point test and route are imperfect.

In a preferred embodiment, the CCD system above working face 10 and the strip light band below working face Size it is consistent and vertical opposite, printing substrate 201 of the covering on working face 10, when acquire image, control printer Structure 20 returns to its initial position (position for not influencing figure acquisition), disposably obtains reality by strip light band and CCD system Impressing pattern.

In another preferred embodiment, the strip light band positioned at 10 lower section of working face can be moved back and forth in one direction Dynamic, moving direction is as its width, and for other direction as its length, CCD system covers the printing base on entire working face 10 The length of material 201, strip light band is corresponding with CCD system, and the width of strip light band is then less than CCD system, passes through strip light band It is mobile, so that CCD system is obtained practical impressing pattern.

In another preferred embodiment, the CCD system above working face 10 and the strip light below working face The size of band is consistent, and vertical opposite, does not cover entire printing substrate 201, drives printing substrate 201 to move by transmission component It is dynamic, so that CCD system be made to obtain practical impressing pattern.In the embodiment, the position of strip light band and CCD system, which can be fixed, to be set It sets, and size is small, convenient for the miniaturization of entire printer and Degenerate Λ type three level atom.Pinch roller can be used in transmission component, passes through the rotation of pinch roller Drive moving horizontally for printing substrate 201.

0, Figure 10 shows a kind of structural schematic diagram of repair mechanism referring now to fig. 1, which is used for liquid Route in state metallic circuit/pattern overflows defect and carries out wiping repairing, comprising: is impregnated with the rubbing head 31 and band of wiping agent Rubbing head 31 is moved in the moving parts 32 horizontally and/or vertically moved, moving parts can use mechanical arm, single shaft/multiaxis Linkage unit, electromagnetic drive moving assembly etc..

When carrying out wiping operation, rubbing head 31 is bonded with printing substrate 201, and wipes printing substrate according to scheduled track The liquid metal of spilling on 201.

Further, repair mechanism 30, comprising: fiber rubbing head 31, the container 34 equipped with wiping agent and electrical-controlled lifting mechanism 32；Wherein, the bottom of fiber rubbing head 31 is used to wipe the target liquid gold on substrate surface by way of moving horizontally Belong to, the wiping agent in fiber rubbing head 31 and container 34 connects, and wiping agent maintains wetting fibre by the effect of infiltration always Rubbing head 31, fiber rubbing head 31 and electrical-controlled lifting mechanism 32 are cooperatively connected, and the bottom of fiber rubbing head 31 is in electrical-controlled lifting mechanism 32 Under drive, contacts or be detached from substrate surface 201；Wherein, when the bottom of fiber rubbing head 31 and substrate surface 201 contact, pass through Fiber rubbing head 31 move horizontally or moving horizontally for substrate realizes erasing operation to the target liquid metal on substrate surface. Wiping agent in Fig. 9 in container 34 is kept in contact formula with fiber rubbing head by the drain fiber in conduit 33 and connect, it is preferable that leads Cotton fibre can be used in liquid fiber, can keep good osmotic effect.

Electrical-controlled lifting mechanism 32 can pass through electrical-controlled lifting when two grades of (or two grades or more multi gear position) formulas controls, i.e. operation shelves The bottom that mechanism 32 controls fiber rubbing head 31 (can pass through the installation of fiber rubbing head 31 with substrate surface exposure level according to preset The selection of position is set), the bottom that non-operation Dang Shi electrical-controlled lifting mechanism 32 controls fiber rubbing head 31 is lifted off substrate surface. In further embodiments, electrical-controlled lifting mechanism 32 can free strip kinetodesma rubbing head 31 move any position in the vertical direction, The Accuracy Displacement of fiber rubbing head 31 in the vertical direction can be realized by motor or electromagnetic traction and corresponding fit structure.

Cotton fibre, glass fibre or macromolecular fibre, macromolecular fibre such as plastic optical fibre, height can be used in fiber rubbing head 31 Intensity sponge etc.；For glass fibre and macromolecular fibre, in one or more fine channel, for keeping fiber It can dip in rubbing head 31 with a small amount of wiping agent, for wiping liquid metal.The a length of 0.25mm-of the diameter of the bottom of fiber rubbing head 31 Between 5mm；Preferably, the fiber rubbing head 31 of unlike material, different path lengths can be used in repair mechanism 30, for for not homotype Enclose/the spilling liquid metal of position wiped；It wherein, can be in 2mm-using the bottom path length of the fiber rubbing head 31 of cotton fibre Between 5mm, liquid metal is overflowed for wiping on a large scale；Using the bottom of the fiber rubbing head 31 of macromolecular fibre or glass fibre Path length can overflow liquid metal for precision erasing between 0.25mm -2mm.

The end of the bottom of fiber rubbing head 31 uses flat configuration, prevents globoidal structure different for the contact of substrate surface It causes, destroy and overflows the liquid metal route of liquid metal phase even.Round or square planar can be used in its end.

Repair mechanism 30 proposed by the invention can be realized in the preparation process of printed circuit to route in printed circuit It overflows defect and carries out automation repairing, ensure that the final product quality of liquid metal printed circuit, improve liquid metal printing electricity The preparation stability and reliability on road.

Wiping agent can be selected be for ethyl alcohol or main component ethyl alcohol solution, as dehydrated alcohol, alcohol, mixed with can (easy) wave In the liquid mixture of 75%-99%, on the one hand which can be used for wiping spilling liquid for hair oil rouge and alcohol content Metal, another aspect grease can form anti-overflow outbound path together at the spilling sideline of liquid metal route, to liquid metal line Play the role of insulation blocking in road.Alcohol itself can also form above-mentioned side's overflow path, and effect is more for isolation for grease For ideal.

Such as Figure 11, the repair mechanism 30 may also include that moving horizontally for one or more directions movement along the horizontal plane Mechanism 35；The fiber rubbing head 31 and electrical-controlled lifting mechanism 32 are assemblied on the horizontal mobile mechanism 35, i.e., for example automatically controlled liter Descending mechanism 32 is fixed on horizontal mobile mechanism 35, follows the movement of horizontal mobile mechanism 35 in the horizontal direction, fiber rubbing head 31 are fixed in electrical-controlled lifting mechanism 35, to realize the movement in the horizontal direction (x and y) and vertical direction (z).

Such as Figure 12, the container 34 is the internal pen tube 36 for being filled with the wiping agent, and bottom opening simultaneously passes through described Fiber rubbing head 31 blocks, and the bottom-exposed of the fiber rubbing head 31 constitutes the pen tip of the pen tube 36 except the pen tube 36. Opposite in this, actuation electromagnet can be used in the electrical-controlled lifting mechanism 32；It is described be attracted electromagnet 32 on magnetizer 37 with It is connected between the pen tube 36 by overarm brace 38；The pen tube 36 follows the magnetizer 37 by the overarm brace 37 Actuation it is mobile.

Such as Figure 12 and 13, the repair mechanism 30 may also include that the pen tube bracket being fixed on horizontal mobile mechanism 35 39；The pen tube bracket 39 has the through-hole of vertical direction, and the shape of the through-hole is corresponding with the diametric plane of the pen tube 36, the pen Pipe 36 is located in the through-hole, and branch is formed on the pen tube bracket 39 by the first card holding structure 361 and elastic component 362 Support；When the actuation electromagnet 32 is powered, magnetizer 37 drives the pen tube 36 to be moved downward to its operating position thereon, this When 362 compressive deformation of elastic component；When the actuation electromagnet 32 power-off, 362 diastole of the elastic component release drives the pen Pipe 36 is moved upward to its initial position.In some embodiments, the upward restoring force of the vertical direction of pen tube 36 can be by being attracted 32 side of electromagnet provides, such as the spring in Figure 11 between magnetizer 37 and electromagnet 32.

Such as Figure 14, the pen tube bracket 39 can be tubular construction, for preventing pen tube 36 when vertical direction is mobile in water Square upward offset, top is provided with the first chuck 363 in cylinder, is provided with above the pen tube 36 and matches with the first chuck 363 The second card holding structure 364 closed, the maximum vertical penetration for limiting fiber rubbing head 31 are (for another example minimum to stretch out the pen tube bracket 39 length), lower section is provided with the second chuck 365 in cylinder, and the with the cooperation of the second chuck 365 is provided with below the pen tube 36 Three card holding structures 366, for limiting Maximum Descent Height (for another example maximum length for stretching out the pen tube bracket 39 of fiber rubbing head 31 Degree)

5, Figure 15 shows another structural representation of the liquid metal printer in the embodiment of the present invention referring now to fig. 1 Figure, as shown in the structural schematic diagram, the invention discloses a kind of liquid metal printers 100, comprising: above-mentioned repair mechanism 30.

In some preferred embodiments, liquid metal printer 100, further includes: working face 10, printing mechanism 20, image Acquisition system.Wherein, printing mechanism 20 be used on working face 10 to printing substrate 201 carry out liquid metal print job and The defects of liquid metal breakpoint, imperfect, cissing, is repaired；Repair mechanism 30 is then for lacking liquid metal spilling etc. It is trapped into capable repairing.

The structure in above-described embodiment can be used in printing mechanism 20 and repair mechanism 30, and photograph can be used in image capturing system The image techniques such as phase, camera shooting, projection.

When printing mechanism 20 print/repairing work when, repair mechanism 30 can be at initial position, i.e., does not influence to beat The mobile operation of printing mechanism 20；When repair mechanism 30 carries out repairing work, printing mechanism 20 can be at its initial position, i.e., not Influence the mobile operation of repair mechanism 30；When figure acquisition system operation, printing mechanism 20 and repair mechanism 30 be can be at Initial position avoids the Image Acquisition for influencing figure acquisition system.

Liquid metal printer in the embodiment can realize liquid metal printing product (such as liquid metal printed wiring) Integrated preparation improves liquid gold without manually repairing to the liquid metal pattern of liquid metal printer printing Belong to the reliability of printer.

With continued reference to Figure 15, printing mechanism 20 and repair mechanism 30 are assemblied on the same guide rail beam, guide rail beam It moves along the y axis, guide rail beam has along its length on printing substrate 201, guide rail beam from the top of working face 10 The sliding rail in direction, printing mechanism 20 and repair mechanism 30 are assemblied on the sliding rail and move along the x axis, under original state, printing Mechanism 20 and repair mechanism 30 are located at the both ends of guide rail beam, the outside in printing substrate 201, when its operation, printer 20/ repair mechanism 30 of structure inwardly surveys movement by the way that sliding rail is mobile, is at the surface of printing substrate 201, and pass through sliding rail Mobile operation is carried out to printing substrate 201 on working face 10 with guide rail beam.

In some embodiments, liquid metal printer 100, further includes: one or more pinch rollers, pinch roller pass through frictional force Printing substrate 201 is driven to enter working face 10 and move along the y axis on working face 10.In the embodiment, liquid metal Printing mechanism 20 and/or repair mechanism 30 in printer 100 can cooperate pinch roller that printing substrate 201 is driven to realize and printing substrate 201 relative movement.

Printing mechanism 20 and repair mechanism 30 are located on the same guide rail beam in the embodiment, save liquid metal and beat The device space of print machine, avoiding liquid metal printer, there are excessive mobile mechanisms, beat to simplify liquid metal The hardware device of print machine.

Referring now to fig. 16 and 17, the invention discloses a kind of plaster mechanisms 40, comprising: cast patch rifle 41, subassembly wrapper 42, Glue dripping head 43, the first movable component, the second movable component, third movable component, baric systerm.Wherein,

Cast patch rifle 41 and the first movable device link, for adsorbing surface mount elements 203 by bottom suction nozzle 411, with And the surface mount elements 203 are moved to the work surface of different height by first movable device；Cast patch rifle 411 Top is connected to the first gas-guide tube 44 of baric systerm, passes through the absorption and release for opening/stopping control suction nozzle 411 of negative pressure.Preferably, Flexible gaskets are provided with outside suction nozzle 411, for avoiding suction nozzle 411 and the direct rigid contact of surface mount elements 203, are reduced between the two Issuable gap solves the problems, such as that suction nozzle 411 adsorbs that surface mount elements 203 are insecure, easy loosening.

The present invention carries out dispensing by the way that Glue dripping head to be inverted, in the bottom surface of surface mount elements, avoids the point of plastic emitting from below Rubber head is influenced vulnerable to gravity, the various problems such as cause colloid leakage, gel quantity not easy to control.

Elevating mechanism can be used in first movable device, and different gears is arranged by the work surface for different height, from And it controls on the working face that cast patch rifle 41 stops at various height；Wherein, work surface may include load work surface, dispensing Work surface and patch work surface, when being in load work surface, for surface mount elements 203 to be adsorbed under suction nozzle 411；In dispensing The bottom surface of work surface, the surface mount elements 203 for adsorbing under suction nozzle 411 carries out dispensing processing；When in patch work surface, use In bottom surface surface mount elements 203 for dispensing glue are placed on printing substrate 201 on liquid metal pattern 202 designated position on, and Generate the pressing of (slight) to a certain degree.

In another embodiment, elevating mechanism can also carry out the movement of the arbitrary height of vertical direction with unit distance, excellent Selection of land, unit are measured with millimeter.First movable device can be used motor, electromagnetism, pressure (such as pneumatic/hydraulic) mode and drive.

Subassembly wrapper 42 and the second movable device link, and can be the trough body structure of upper seal, or in specific position On be provided with the box body structure of windowing, in there is space for placing one or more surface mount elements 203, for a certain Surface mount elements 203 in it are moved to the cast by second movable device by the moment (when needing to carry out load work) The underface of 41 suction nozzle 411 of patch rifle；Preferably, there is the structure that surface mount elements 203 are carried out with beam shape, to protect in subassembly wrapper 42 Demonstrate,proving the surface mount elements 203 being adsorbed under suction nozzle 411 can be attached in predetermined angular on the designated position of printed wiring 202.

Preferably, horizontal mobile mechanism (such as sliding rail 421 and cooperation electromagnetism part 422) can be used in the second movable device, is used for Being horizontally moved for subassembly wrapper 42 is driven or driven in the horizontal direction of certain altitude, and surface mount elements 203 is made to reach cast Below the operating position of patch rifle 41, and leave the whereabouts range of cast patch rifle 41；Preferably, the second movable device can be adopted Controlled with two-level, i.e., initial shelves when so that the position of subassembly wrapper 42 is not blocked the whereabouts of cast patch rifle 41, work shelves when make member The specified region of part box 42 is located at the underface of cast patch rifle 41.Motor, electromagnetism, pressure can be used (such as in second movable device Pneumatic/hydraulic) etc. modes drive.

Preferably, second movable device, comprising: the sliding rail 421 cooperated with the shell of the subassembly wrapper；The element Box is popped up or is withdrawn in the horizontal direction along the sliding rail by electromagnetism part 422.

Such as Figure 18, in some optionally embodiments, the subassembly wrapper is the multilayered structure 423 stacked along the vertical direction, Every layer of structure 423 is moved in the horizontal direction by independent sliding rail 421 and electromagnetism part 422.The subassembly wrapper is " L " font groove Body structure, groove body equivalent width；The dispatching unit 424 that one or more shapes are consistent and are arranged successively is accommodated in it, it is described Groove body constitutes the sliding slot 425 of the dispatching unit, and the dispatching unit 424 passes through electromagnetism part 426 and 427 from the one of the groove body It holds mobile to the other end；Wherein, the upper surface of the dispatching unit 424 offers placement corresponding with the surface mount elements shape Slot 428；The subassembly wrapper is used to that the surface mount elements 203 in it to be moved to the cast patch by second movable device The underface of 41 suction nozzle of piece rifle, specifically includes: the subassembly wrapper 42 passes through the driving of one or more electromagnetism parts, will be in element The surface mount elements 201 of 42 bending place position of box are moved to the underface of 41 suction nozzle 411 of cast patch rifle.

Such as Figure 19, Glue dripping head 43 and third movable device link, its own is in inverted structure, glue discharging mouth 431 straight up, It is adsorbed under suction nozzle 411 for being at a time moved to (when needing to carry out dispensing work) by the third movable device The underface of surface mount elements 203, and dispensing operation is carried out in the bottom surface of the surface mount elements 203 by its glue discharging mouth 431.

In some embodiments, the bottom of Glue dripping head 43 is by the connection storage glue tank 433 of pipeline 432, and storage glue tank 433 is for depositing A certain amount of colloid is stored up, pipeline 432 uses hard pipeline, is connected between Glue dripping head 43 and storage glue tank 433 by hard pipeline 432 And it is relatively fixed.Rotating mechanism can be used in third movable device, by driving the rotation of storage glue tank 433, to drive indirectly The Glue dripping head 43 to link with storage glue tank 433 is that the center of circle is displaced to store up glue tank 433.Drive Glue dripping head 43 mobile by rotating mechanism To the underface for the surface mount elements 203 being adsorbed under suction nozzle 411, and leave the whereabouts range of cast patch rifle 41.

As Figure 20 is provided with up and down in the glue discharging mouth 431 of the Glue dripping head 43 by bracket 434 in some embodiments Movable magnetism thimble 435, the end face of the magnetism thimble 435 are planar structure, and to be in its minimum for the magnetic thimble 435 When position, top is located under colloid liquid level；It is provided on the cast patch rifle 41 and the magnetic cooperation of thimble 435 Electromagnet 412, in the energized state, magnetic thimble 435 being sucked out out of glue discharging mouth 431, the colloid for taking its end out of Point is on the bottom surface of surface mount elements 203.In some optionally embodiments, it is arranged on the top of the magnetism thimble 435 useful In the flexible fiber of attachment colloid, fiber can be used cotton fibre or plastic optical fibre, and when stress itself is easily squeezed and deformed, and can reduce Surface mount elements 203 are stressed directly, it is avoided to deviate/fall as caused by hitting.Preferably, flexible fiber is fine using cotton Dimension in have subtle gap, in can a small amount of colloid of adhesive tape.

Colloid uses optic-solidified adhesive or heat-curable glue, it is preferable that solidification temperature can be used at 60 DEG C or more in heat-curable glue Colloid.

In some embodiments, the plaster mechanism 40, further includes: while driving the cast patch rifle 41, the member Part box 42, the Glue dripping head 43 carry out the 4th mobile movable device of consistency in vertical direction and/or horizontal direction.It is preferred that Ground, the 4th movable device can be the mobile bracket of x, y, z axis of liquid metal printer.

It is another object of the present invention to propose a kind of pasting method for above-mentioned plaster mechanism 40, to solve existing skill The problem of art.

Pasting method, applied to above-mentioned plaster mechanism, comprising:

Step S41, equipment initializes, and cast patch rifle is made to be in initialization face；

Step S42, the second movable device of driving drives subassembly wrapper that target surface mount elements are moved to the cast patch rifle The underface of suction nozzle；

Step S43, the first movable device of driving drives the cast patch rifle to be displaced downwardly to load working face, by target patch Element is adsorbed under suction nozzle；

Step S44, the second movable device of driving drive subassembly wrapper removes the whereabouts range of the cast patch rifle；

Step S45, driving third movable device drives the Glue dripping head to be moved to the target element being adsorbed under suction nozzle The underface of part；

Step S46, the first movable device of driving drives the cast patch rifle to be displaced downwardly to dispensing working face, with the dispensing The dispensing of target surface mount elements bottom surface is completed in head cooperation；

Step S47, the whereabouts range for driving third movable device that the Glue dripping head is driven to remove the cast patch rifle；

Step S48, the first movable device of driving drives the cast patch rifle to be displaced downwardly to patch working face, and stops adsorbing Operation is placed on target surface mount elements on designated position of the surface with the substrate of liquid metal route.

It include above-mentioned plaster mechanism 40 in component the invention also provides a kind of liquid metal printer 100.The embodiment Middle liquid metal printer 100 not only can be used to prepare liquid metal printing pattern/printed wiring, can also be to progress vigour part Attachment, realizes that the integration system of printed circuit is standby.

1, Figure 21 shows the welding mechanism 50 in the embodiment of the present invention referring now to Fig. 2, which is used for will be normal Lower temperature is in thick metal mixture (conductive mixture) to liquid metal printed wiring 202 and 203 pin of surface mount elements Junction carries out closure fixation.Welding mechanism 50, comprising: horizontal mobile mechanism 51, the first elevating mechanism 52, the second elevating mechanism 53, extrusion molding mechanism 54 and plastotype pen 55, wherein the first elevating mechanism 52 and the second elevating mechanism 53 are fixed on horizontal mobile mechanism It on 51, links in the horizontal direction with the movement of horizontal mobile mechanism 51, extrusion molding mechanism 54 is arranged in the first elevating mechanism It on 52, is moved in the vertical direction with the first elevating mechanism 52, plastotype pen 55 is arranged on the second elevating mechanism 53, with second liter Descending mechanism 53 moves in the vertical direction, wherein the movement of the first elevating mechanism 52 and the second elevating mechanism 53 in the vertical direction It is independent from each other.

Extrusion molding mechanism 54, discharge port straight down, for be located at its immediately below substrate surface on squeeze out unit matter The solder of (or being measured with unit volume) is measured, it is in thick metal mixture, the metal under room temperature that solder, which uses, Mixture has good electric conductivity, and in some preferred embodiments, metal mixture is metallic particles with good conductivity (such as silver-coated copper powder, copper powder) and the solidliquid mixture of liquid metal after evenly mixing, liquid metal are selected and are printed upon substrate table The composition proportion of liquid metal on face is consistent, so that the wellability and amalgamation between solder and liquid metal route are improved, Guarantee being stably connected between the two.

Such as Figure 22, extrusion molding mechanism 54 includes the tube body 541 for accommodating solder, and the bottom of the tube body 541 is in the cone for converging solder Shape throat structure, opening fix a discharge nozzle 542 vertically, and discharge nozzle 542 is hollow tube structure, and are connected in tube body 541； And the pressure assembly 543 in the tube body 541 for driving the solder to move into the discharge nozzle 542, the pressure Mechanical fashion of extrusion can be used in power component 543, for example, by using extrusion screw, in such a way that extrusion screw rotates, drives weldering Expect to move to discharge nozzle 542.

Pressure assembly 543 can also squeeze solder by pressure head 544 using the structure located as shown in figure 23, make solder into Enter discharge nozzle.Wherein, the upper end of discharge nozzle 542 is located at the inside of tube body 541, and pressure head 544 is by electromagnetic drive in vertical direction The end of upper movement, pressure head 544 is notch arrangement, and shape is corresponding with the nozzle of discharge nozzle 542, and can coat discharge nozzle 542 Nozzle, when pressure head 544, which moves down, squeezes solder, the notch of pressure head 544 is by accommodating portion solder, when pressure head 544 moves to discharging When at the nozzle of pipe 542, notch and nozzle mutual extrusion cooperate, and the solder in notch is squeezed from the nozzle of discharge nozzle 542 It squeezes in feed and exhaust tube.It can control the unit extrusion output of solder with this configuration.

Such as Figure 24, in some embodiments, the plastotype pen 55 includes: penholder 551 and positioned at the half of 551 bottom end of penholder Spherical nib 552；Wherein, written 552 cambered surface is downward；One layer of hair fibre, hair one side of fibre are wound on described written 552 Face fine gap as existing for it, it is possible to reduce the surface nature of the contact area with liquid metal, another aspect hair fibre makes It is also not easy to adhere to liquid metal, and selection hair fibre can band runs solder during promotion to avoid nib.Wherein, the plastotype Pen pushes the solder mobile to the tie point between surface mount elements and the liquid metal route by the nib of its lower end；? During Level Promoting, nib uniform motion from bottom to top in the vertical direction forms the solder described in fitting The slope of surface mount elements side.Ramped shaped can surface encapsulation glue enter the connection between liquid metal route and surface mount elements pin Place, can make it along inclined-plane water conservancy diversion.

The present invention by the way that solder will be used as in thick electrocondution slurry under room temperature, using solder to liquid metal route and The junction of component pin is blocked, and on the one hand be can be used as conductive connection agent auxiliary connection liquid metal route and is drawn with element On the other hand foot can avoid colloid when subsequent sealing and penetrate into junction, caused physical separation problem.

The workflow of the welding mechanism of printed circuit in the embodiment of the present invention, example:

Step 1. in the direction y moving substrate and by horizontal mobile mechanism by driving extrusion molding mechanism to move in the direction x It is dynamic, so that the discharge nozzle face of extrusion molding mechanism is squeezed out point in preset solder, it is preferable that solder squeezes out point apart from surface mount elements pin Distance be set as the position of 0.2mm.

Step 2. drives extrusion molding mechanism to move along the vertical direction by the first elevating mechanism, is at away from printing substrate table Face height is in the position of 5mm；

Step 3. driving extrusion molding pressure mechanism within the organization squeezes out the solder of unit volume on substrate surface, wherein can lead to Conventional vibration or shake component cooperation are crossed, the whereabouts of solder is completed；

Step 4. lifts extrusion molding mechanism, plastotype pen is moved to side of the solder far from surface mount elements pin, at this time plastotype Height of the nib of pen lower than solder (i.e. nib exists in the vertical direction with solder and partly overlaps)；

The nib that step 5. controls plastotype pen drives solder mobile to the pin direction of surface mount elements, and nib is gradually in the process It lifts, so that solder is formed the slope that height becomes larger along its direction of motion, be bonded with the side wall of surface mount elements.

It is another object of the present invention to propose a kind of liquid metal printer, which includes as above State any one welding mechanism.

The invention discloses a kind of liquid metal printers 100, comprising: working face 10, plaster mechanism 40 and welding mechanism 50；Wherein, plaster mechanism 40 and welding mechanism 50 are assemblied on the same guide rail beam, and guide rail beam moves along the y axis, Guide rail beam has sliding rail along its length, patch from the top of working face 10 on printing substrate 201, guide rail beam Mechanism 40 and welding mechanism 50 are assemblied on the sliding rail and move along the x axis, under original state, plaster mechanism 40 and welding mechanism 50 are located at the both ends of guide rail beam, the outside in printing substrate 201, and when its operation, 40/ welding mechanism 50 of plaster mechanism is logical It crosses mobile inwardly survey of sliding rail to move, is at the surface of printing substrate 201, and by sliding rail and guide rail beam in working face Mobile operation is carried out to printing substrate 201 on 10.

In some embodiments, liquid metal printer 100, further includes: one or more pinch rollers, pinch roller pass through frictional force Printing substrate 201 is driven to enter working face 10 and move along the y axis on working face 10.In the embodiment, liquid metal Plaster mechanism 40 and/or welding mechanism 50 in printer 100 can cooperate pinch roller that printing substrate 201 is driven to realize and printing substrate 201 relative movement.

Plaster mechanism 40 and/or welding mechanism 50 are located on the same guide rail beam in the embodiment, save liquid gold The device space for belonging to printer, avoiding liquid metal printer, there are excessive mobile mechanisms, to simplify liquid gold Belong to the hardware device of printer.

5, Figure 25 shows the structural schematic diagram of the liquid metal printer in the embodiment of the present invention referring now to Fig. 2, such as Shown in the structural schematic diagram, liquid metal printer 100, comprising: working face (workbench) 10, and phase is carried out on working face Answer printing mechanism 20, repair mechanism 30, plaster mechanism 40, welding mechanism 50 and the packaging mechanism 60 of operation, the printing mechanism 20, under the drive of repair mechanism 30, plaster mechanism 40, welding mechanism 50 and packaging mechanism 60 by one or more mobile mechanisms In the mobile operation in the top of working face 10.Wherein, working face 10 is for carrying printing substrate 200；Printing mechanism 20 is for printing Liquid metal pattern 202 is drawn on substrate 201 processed；Repair mechanism 30 is used for the liquid metal figure formed on printing substrate 201 Defect present in case 202 is repaired；Plaster mechanism 40 is used for the liquid metal pattern 202 formed on printing substrate 201 Surface mount elements 203 are placed in designated position on (liquid metal pattern is as the printed wiring for forming printed circuit at this time), make patch The liquid metal printed wiring reserved at the pin of element 203 and the position connects；Welding mechanism 50 is for being mounted on Drop coating solder at the pin of the surface mount elements on substrate 20 is printed, and realizes binding foot for pin and liquid metal printed wiring, weldering It is in thick liquid metal mixture under room temperature that material, which uses,；Packaging mechanism 60 is used to coat the surface of the printed circuit of formation Packaging plastic realizes level Hermetic Package.

Working face 10 includes mutual first working face 11 and the second working face 12 in succession, in succession including being directly connected to and indirectly Connection is available for printing substrate 201 from the first working face 11 and is transferred to the second working face 12；Specifically, the first working face 11 is used In printing mechanism 20, repair mechanism 30, plaster mechanism 40, welding mechanism 50 Job Operations, the second working face 12 is for encapsulating The Job Operations of mechanism 60.I.e. liquid metal printer 100 carries out liquid gold on the printing substrate 201 on the first working face 11 Belong to printing, repairing, patch, operation of binding foot, after completing above-mentioned Job Operations, printing substrate is turned to be transferred to from the first work surface 11 In second work surface 12, liquid metal printer 100 is packaged operation to printing substrate on the second working face 12 at this time, to The liquid metal printed circuit or liquid metal impressing pattern completed after encapsulation adhesive curing.Preferably, liquid metal prints Machine 100 further includes transfer device 70, and transfer device 70 is for driving printing substrate to be transferred to the second work from the first working face 11 Face 12.

Liquid metal printer 100 further includes master control borad, and master control borad is for receiving user instructions and liquid metal being driven to beat Each mechanism in print machine 100 is accordingly moved and operation.

Liquid metal printer in the embodiment of the present invention not only solves liquid metal route/pattern defect and repairs automatically It mends, and improves the standby reliability of integration system of printing, repairing, patch, welding (binding foot), encapsulation based on this, ensure that Printing quality.

Specifically, the first working face 11 and the second working face 12 are continuous and "Z"-shaped be bent to form two work of height Face, height working face is as the first working face 11, and low working face is as the second working face 12.Preferably, it is set on the second working face 12 One or more encapsulation slots are equipped with, for placing one or more printing substrates, and are packaged operation respectively.The sealing machine Structure uses two-component flexibility colloid or two-component hard colloid, such as AB glue.

It is public that any of the above-described Working mechanism can be used in each Working mechanism in liquid metal printer 100 in the embodiment The structure opened, driving Working mechanism therein can be shared mutually in horizontal, vertical direction moving parts.

With continued reference to Figure 25, the preferred knot of one kind of liquid metal printer proposed by the present invention is disclosed in the embodiment Structure, comprising: rack 80, and across 81 and of the first guide rail beam moved above first work surface 11, along the y axis Second guide rail beam 82 and across the third guide rail beam 83 moved above second work surface 12, along the y axis； First guide rail beam 81, the second guide rail beam 82 and third guide rail beam 83 are erected in rack 80, the phase in rack 80 Position is answered to be provided with Y direction sliding rail, the first guide rail beam 81, the second guide rail beam 82 and third guide rail beam 83 pass through Y-axis Direction sliding rail moves along the y axis.Wherein, the first guide rail beam 81, the second guide rail beam 82 moving range be limited in The region of one work surface 11, the moving range of third guide rail beam 83 are limited in the region of the second work surface 12.

Printing mechanism 20 and repair mechanism 30 are directed to the operation of liquid metal route, therefore Liang Ge mechanism is all disposed within On one guide rail beam 81, so that printing mechanism 20 and repair mechanism 30 be driven to move along the y axis by the first guide rail beam 81. Direction is extended along on first guide rail beam 81 and is provided with X-direction sliding rail, and printing mechanism 20 and repair mechanism 30 pass through X-axis side It is connect to sliding rail with the first guide rail beam 81, and realizes that carrying out X-direction along the first guide rail beam 81 moves, it is preferable that printing The initial position of mechanism 20 and repair mechanism 30 on the first guide rail beam 81 is the both ends of the crossbeam, does not influence any mechanism and exists The operation on substrate is printed, middle section of the width of substrate between the both ends of crossbeam 81 is printed, when a machine in Liang Ge mechanism When structure is in job state, another is then located at its initial position and awaits orders.

Plaster mechanism 40 and welding mechanism 50 are directed to the operation of surface mount elements, therefore Liang Ge mechanism is all disposed within second and leads On rail crossbeam 82, so that plaster mechanism 40 and welding mechanism 50 be driven to move along the y axis by the second guide rail beam 82.Second Direction is extended along on guide rail beam 82 to be provided with and the consistent X-direction sliding rail of the first guide rail beam 81,40 He of plaster mechanism It assembly, movement, position and collaborative work state and printing mechanism 20 of the welding mechanism 50 on the second guide rail beam 82 and repairs Assisting vehicle structure 30 is consistent on the first guide rail beam 81, and details are not described herein.

Such as Figure 26, transfer device 70, comprising: be mounted on 82 lower section of first guide rail beam 81 and the second guide rail beam Pinch roller prevents printing substrate sideslip for contacting printing substrate, and drives printing substrate to move along the y axis by frictional force It is dynamic.On the one hand the effect of substrate mobile mechanism 70 is to cooperate the first guide rail beam 81 and second in the region of the first work surface 11 The position of the adjustment printing substrate of guide rail beam 82, to realize that target mechanism is opposite with the printing designated position of substrate.Based on shifting On the other hand motivation structure is exactly to be transferred to printing substrate and continuous second operation of the first work surface 11 from the first work surface 11 In face 12.

In some embodiments, the first work surface 11 is located at the front of the second work surface 12, and the first opposite guide rail is horizontal Beam 81, the second guide rail beam 82 and third guide rail beam 83 are set gradually from proximad remote.So set, meeting in the present invention The demand of the preparation section of liquid metal printer.

Image acquisition mechanism 90 can be using image capturing systems such as photograph, camera shootings；Preferably, first work surface 11 For light transmission hard material；Described image collecting mechanism, using be located at the first work surface 11 below be provided with strip light band, for Top provides light source；And the perspective view positioned at the setting of the top of first guide rail beam 81 and second guide rail beam 82 Shape identifying system, it is opposite in the vertical direction with first work surface 11, for irradiating what printing substrate was formed by light source Projection identifies practical print image.Such as ccd image sensor CCD system.Specifically, strip light band and perspective view The position of shape identifying system is fixed and vertical direction is opposite, drives printing substrate to move along the y axis by substrate mobile mechanism, To identify the surface image of entire printing substrate.

It is another object of the present invention to the preparation methods for proposing a kind of printed circuit, are applied to above-mentioned liquid metal and beat Print machine 100, comprising:

Step a, the printing substrate of blank is sent into the first working face；

Step b, the print liquid metal on the printing substrate forms liquid metal printed wiring；

Step c, quality inspection is carried out to the liquid metal printed wiring formed on the printing substrate；Wherein, quality inspection is closed Lattice enter step e, otherwise enter step d；

Step d, it is accordingly repaired for line defct present in the liquid metal printed wiring；Enter step c；

Step e, it transfers electronic component to be attached on the printing substrate, with specifying in the liquid metal printed wiring Position connection；

Step f, will under room temperature in thick solder-coated in the junction of liquid metal printed wiring and electronic component, It binds foot fixation；

Step g, the printing substrate is transferred to the second working face from the first working face；

Step h, on the printing substrate drop cover packaging plastic, to thereon liquid metal printed wiring and electronic component into Row encapsulation obtains printed circuit after glue levelling solidification to be packaged.

It in some illustrative embodiments, can be again to described after executing the step one or more of e, step f The liquid metal printed wiring formed on printing substrate carries out quality inspection, and (such as step c), quality inspection qualification, which is then allowed for access, to be moved down Otherwise link starts repairing work.

It should also be appreciated by one skilled in the art that various illustrative logical boxs, mould in conjunction with the embodiments herein description Electronic hardware, computer software or combinations thereof may be implemented into block, circuit and algorithm steps.In order to clearly demonstrate hardware and Interchangeability between software surrounds its function to various illustrative components, frame, module, circuit and step above and carries out It is generally described.Hardware is implemented as this function and is also implemented as software, depends on specific application and to entire The design constraint that system is applied.Those skilled in the art can be directed to each specific application, be realized in a manner of flexible Described function, still, this realization decision should not be construed as a departure from the scope of protection of this disclosure.

Claims (10)

1. a kind of plaster mechanism characterized by comprising

It with the cast patch rifle of the first movable device linkage, is used for through bottom suction surface mount elements, and by described The surface mount elements are moved to the working face of different height by the first movable device；

With the subassembly wrapper of the second movable device linkage, one or more surface mount elements are inside placed with, for passing through described second Surface mount elements in it are moved to the underface of the cast patch rifle suction nozzle by movable device；

With the Glue dripping head of third movable device linkage, the glue discharging mouth of the Glue dripping head upward, is used to pass through the third moving machine Structure is moved to the underface of the surface mount elements, and carries out dispensing in the bottom surface of the surface mount elements by its glue discharging mouth.

2. plaster mechanism according to claim 1, which is characterized in that further include: storage glue tank；The Glue dripping head passes through pipeline It is connected to and fixes with the storage glue tank；

The third movable device is the rotating mechanism being cooperatively connected with the storage glue tank, drives the Glue dripping head with the storage glue Tank is that the center of circle is moved in the horizontal direction.

3. plaster mechanism according to claim 1, which is characterized in that be arranged in the glue discharging mouth of the Glue dripping head by bracket There is up and down magnetic thimble, the end face of the magnetism thimble is planar structure, and the magnetic thimble is in its lowest order When setting, top is located under colloid liquid level；

It is provided with the electromagnet with the magnetic thimble cooperation on the cast patch rifle, is used in the energized state, it will be magnetic Thimble is sucked out out of glue discharging mouth, and the colloid point for taking its end out of is on the bottom surface of surface mount elements.

4. plaster mechanism according to claim 3, which is characterized in that be provided on the top of the magnetism thimble for attached The flexible fiber of colloid.

5. plaster mechanism according to claim 1, which is characterized in that second movable device, comprising: with the element The sliding rail of the shell cooperation of box；

The subassembly wrapper is popped up or is withdrawn in the horizontal direction along the sliding rail by electromagnetism part.

6. plaster mechanism according to claim 5, which is characterized in that the subassembly wrapper is the multilayer stacked along the vertical direction Structure, every layer of structure are moved in the horizontal direction by independent sliding rail and electromagnetism part.

7. plaster mechanism according to claim 5, which is characterized in that the subassembly wrapper is " L " font trough body structure, groove body Equivalent width；

The dispatching unit that one or more shapes are consistent and are arranged successively is accommodated in it, it is single that the groove body constitutes the dispatching The sliding slot of member, the dispatching unit are mobile from one end of the groove body to the other end by electromagnetism part；

Wherein, the upper surface of the dispatching unit offers placing groove corresponding with the surface mount elements shape；

The subassembly wrapper, which is used to that the surface mount elements in it to be moved to the cast patch rifle by second movable device, to be inhaled The underface of mouth, specifically includes:

The subassembly wrapper passes through the driving of one or more electromagnetism parts, will be moved in subassembly wrapper bending place surface mount elements described The underface of cast patch rifle suction nozzle.

8. plaster mechanism according to claim 1, which is characterized in that further include: while driving the cast patch rifle, institute It states subassembly wrapper, the Glue dripping head and carries out the 4th mobile movable device of consistency in vertical direction and/or horizontal direction.

9. a kind of pasting method of printed circuit, which is characterized in that be applied to plaster mechanism described in claim 1, comprising:

Equipment initialization, makes cast patch rifle be in initialization face；

The underface for driving the second movable device to drive subassembly wrapper that target surface mount elements are moved to the cast patch rifle suction nozzle；

It drives the first movable device that the cast patch rifle is driven to be displaced downwardly to load working face, target surface mount elements is adsorbed on Under mouth；

The whereabouts range for driving the second movable device that subassembly wrapper is driven to remove the cast patch rifle；

The underface for driving third movable device that the Glue dripping head is driven to be moved to the object component being adsorbed under suction nozzle；

It drives the first movable device that the cast patch rifle is driven to be displaced downwardly to dispensing working face, cooperates with the Glue dripping head and complete mesh The dispensing of labeling piece element bottom surface；

The whereabouts range for driving third movable device that the Glue dripping head is driven to remove the cast patch rifle；

It drives the first movable device that the cast patch rifle is driven to be displaced downwardly to patch working face, and stops adsorption operations, make target Surface mount elements are placed on designated position of the surface with the substrate of liquid metal route.

10. a kind of liquid metal printer, which is characterized in that including the described in any item plaster mechanisms of claim 1-8.