CN109049372B - Diamond wire cutting machine for solar-grade silicon wafer - Google Patents
Diamond wire cutting machine for solar-grade silicon wafer Download PDFInfo
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- CN109049372B CN109049372B CN201810989423.9A CN201810989423A CN109049372B CN 109049372 B CN109049372 B CN 109049372B CN 201810989423 A CN201810989423 A CN 201810989423A CN 109049372 B CN109049372 B CN 109049372B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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Abstract
The invention relates to the field of cutting machines, in particular to a diamond wire cutting machine for solar-grade silicon wafers, which comprises a machine body, a material discharging mechanism, a sliding mechanism, an installation mechanism, a cooling mechanism, a conveying mechanism, a buffering mechanism, a cutting mechanism, a driving mechanism and a filtering mechanism, wherein the material discharging mechanism is arranged on the machine body; two curved bars that length is the same of surface mounting that are located the inside bent axle of mounting panel, curved bar and swivel sleeve threaded connection, and the inside of swivel sleeve rotates the fixed axle that connects and be "T" shape structure, clockwise, anticlockwise rotation swivel sleeve realizes shortening, length between bent axle and the fixed axle has been lengthened, thereby the contact length of diamond wire and silica plate has been increaseed, the silica plate cutting of adaptable different thickness, avoid the silica plate to damage, improve the accuracy of cutting, the surface is the lateral wall of the organism that the slope set up and rotates the filter plate of connecting the coolant liquid that is used for after filtering the cooling, the bottom that is located the filter plate is equipped with the filter basket that is used for collecting the silica plate sediment with balladeur train sliding connection, avoid the water pump to block up, the life of water pump has been increased.
Description
Technical Field
The invention relates to the field of cutting machines, in particular to a diamond wire cutting machine for a solar-grade silicon wafer.
Background
The diamond wire cutting machine adopts the mode of unidirectional circulation or reciprocating circulation motion of the diamond wire to enable the diamond wire and an object to be cut to form relative grinding motion, thereby achieving the purpose of cutting, and the cutting principle of the diamond wire cutting machine is similar to that of a bow saw. The wire winding cylinder rotating at high speed and rotating in a reciprocating way drives the diamond wire to do reciprocating motion, the diamond wire is tensioned by two tensioning wire wheels (springs or pneumatic), and two guide wheels are additionally arranged to ensure the cutting precision and the surface shape.
However, the diamond wire of the traditional diamond wire cutting machine for the solar-grade silicon wafer is wound on the cutting part of the machine body for multiple times, so that the installation and disassembly processes are complicated, the walking directions of the diamond wire are consistent, the diamond wire cutting machine cannot adapt to cutting of silicon plates with different thicknesses, cooling liquid directly flows into the cooling box during cutting and is not filtered, and the service life of equipment is influenced.
(1) According to the diamond wire cutting machine for the solar-grade silicon wafer, the two bent rods with the same length are arranged on the surface of the crankshaft positioned in the mounting plate, the bent rods are in threaded connection with the rotary sleeve, the rotary sleeve is rotatably connected with the fixed shaft in a T-shaped structure, and the rotary sleeve is rotated clockwise and anticlockwise to shorten and lengthen the length between the crankshaft and the fixed shaft, so that the contact length between the diamond wire and a silicon plate is increased, the diamond wire cutting machine is suitable for cutting silicon plates with different thicknesses, the silicon plate is prevented from being damaged, and the cutting accuracy is improved.
(2) According to the diamond wire cutting machine for the solar-grade silicon wafer, the side wall of the machine body with the surface being obliquely arranged is rotatably connected with the filter plate for filtering the cooled cooling liquid, the filter basket which is connected with the sliding frame in a sliding mode and used for collecting the silicon plate residues is arranged at the bottom of the filter plate, the filter plate is opened, the fact that the glass residues directly fall into the filter basket is achieved, collection is convenient, the water pump is prevented from being blocked, and the service life of the water pump is prolonged.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a diamond wire cutting machine for solar-grade silicon wafers, wherein two bent rods with the same length are arranged on the surface of a crankshaft positioned in an installation plate, the bent rods are in threaded connection with a rotary sleeve, the inner part of the rotary sleeve is rotatably connected with a fixed shaft in a T-shaped structure, the length between the crankshaft and the fixed shaft is shortened and lengthened by rotating the rotary sleeve clockwise and anticlockwise, so that the contact length between a diamond wire and a silicon plate is increased, the diamond wire cutting machine is suitable for cutting silicon plates with different thicknesses, the silicon plate is prevented from being damaged, the cutting accuracy is improved, the side wall of a machine body with the inclined surface is rotatably connected with a filter plate for filtering cooled cooling liquid, a filter basket which is connected with a sliding frame in a sliding manner and is positioned at the bottom of the filter plate and used for collecting silicon plate slag, the glass slag directly falls into the filter basket by opening the filter plate, and, avoid the water pump to block up, increased the life of water pump.
The technical scheme adopted by the invention for solving the technical problems is as follows: a diamond wire cutting machine for solar-grade silicon wafers comprises a machine body, a material discharging mechanism, a sliding mechanism, an installation mechanism, a cooling mechanism, a conveying mechanism, a buffering mechanism, a cutting mechanism, a driving mechanism and a filtering mechanism; the utility model discloses a cutting mechanism, including the cutting mechanism, the fixed surface of organism is connected with the unloading mechanism, the side wall installation of organism is used for fixing actuating mechanism installation mechanism, actuating mechanism's bottom is installed and is used for cutting the silicon chip cutting mechanism, the fixed surface of organism is connected with and is used for making things convenient for the material loading drop feed mechanism, the top fixedly connected with of organism is used for fixing cutting mechanism slide mechanism, cutting mechanism sliding connection in slide mechanism's inside, the inside of organism be equipped with cutting mechanism's bottom fixed connection buffer gear, the side of organism is equipped with and is used for carrying the coolant liquid conveying mechanism, cutting mechanism's the outside be equipped with be used for the refrigerated, with conveying mechanism communicates cooling mechanism, the side of organism be equipped with and be used for filtering coolant liquid and glass piece filtering mechanism.
Specifically, installation mechanism includes mounting panel, solid fixed cylinder and mount, inside cavity of one of them lateral wall fixed connection of organism, bottom open-ended the mounting panel, the lateral wall of organism be equipped with the mounting panel corresponds the mount, the inside welding of mount is cavity cylinder type structure gu the fixed cylinder will actuating mechanism install in the accident takes place when the rotation of machine is avoided to the inside of mounting panel.
Specifically, the actuating mechanism includes access panel, two curved bars, swivel housing, fixed axle, connecting rod, motor and bent axle, another lateral wall of organism is installed the motor, the inside of mounting panel rotate be connected with motor fixed connection the bent axle, the fixed surface of bent axle connects length equal the curved bar, two the bottom of curved bar is threaded connection inside respectively hollow, the lateral wall is the two of hexagonal prism structure the swivel housing, two the bottom of swivel housing rotates connect be "U" shape structure the fixed axle, the surface of fixed axle rotates connect the connecting rod, the swivel housing, curved bar reaches be "nearly" font structure between the bent axle, the side of mounting panel is equipped with the access panel that conveniently overhauls, clockwise rotation the swivel housing shortens the distance between the curved bar and the fixed axle, the rotating sleeve rotates anticlockwise to shorten the distance between the curved rod and the fixed shaft, so that the cutting length between the cutting mechanism and the cut glass is increased, and silicon plates with different thicknesses can be conveniently cut.
Specifically, cutting mechanism includes fixed head, hexagon socket head nut, diamond wire, mounting bracket, connector and take-up pulley, is the arc structure the mounting bracket passes through the fixed head weld in the bottom of connecting rod, the one end of diamond wire is passed through hexagon socket head nut is fixed in the lateral wall of fixed head, diamond wire winding is located the mounting bracket bottom the surface of take-up pulley, the other end of diamond wire is fixed in and is located the mounting bracket side the inside of connector will realize behind the motor switch on power the mounting bracket is at reciprocating motion with the silicon slab cutting, through dismantling hexagon socket head nut installation is dismantled the diamond wire.
Specifically, slide mechanism includes spout, fixed column and slider, the top of organism is equipped with the lateral wall and sets up the spout the fixed column, what be "T" shape structure of mounting bracket side the slider slide in the inside of spout, the lateral wall of mounting bracket passes through the slider slide in the inside of fixed column avoids the shake influences the cutting during mounting bracket reciprocating motion.
Specifically, buffer gear includes spring, fender post and apopore, fixed connection is hollow cylindrical structure, the lateral wall is seted up in the organism the apopore the fender post, the inside fixedly connected with of fender post with the bottom fixed connection of mounting bracket the spring mounting bracket reciprocating motion in-process the spring opens or contracts, and it is right to have realized the bottom of mounting bracket is fixed.
Specifically, the discharging mechanism comprises a discharging plate and a discharging hole, the surface of the machine body is fixedly connected with the discharging plate for discharging glass, and the discharging hole corresponding to the discharging plate and used for discharging is formed in the side wall of the machine body, so that the discharging mechanism is convenient to feed and discharge and is convenient to cut.
Specifically, the conveying mechanism comprises a conveying pipe, a water pump and a water tank, the side face of the machine body is fixedly connected with the water tank for containing cooling liquid, and the conveying pipe located on the side wall of the machine body penetrates through the inside of the water tank and is communicated with the water pump; cooling body includes protection casing, hole for water spraying and outlet pipe, is located the cavity round platform shape structure that is in the diamond wire outside the protection casing with conveyer pipe fixed connection, the conveyer pipe runs through the inside of protection casing with the outlet pipe intercommunication, be spiral distribution in the protection casing inside wall the side of outlet pipe is seted up and is used for spraying the coolant liquid, sprays even doing diamond wire radiating the hole for water spraying during mounting bracket reciprocating motion diamond wire and silicon plate contact heat production will water pump switch-on power supply realizes the conveyer pipe sends the coolant liquid to the outlet pipe sprays water, will the diamond wire cools off.
Specifically, filtering mechanism includes the filter plate, strains basket and balladeur train, the side of organism is rotated and is connected glass in being arranged in filtering the coolant liquid the filter plate, the bottom fixedly connected with of organism is located the filter plate bottom the balladeur train is used for collecting the glass sediment strain basket sliding connection in the balladeur train, for rivers after the diamond wire cooling arrive the surperficial glass sediment of organism is filtered the filter plate is opened after the cutting completion the filter plate realizes that the glass sediment falls the inside of straining the basket, convenient collection.
The invention has the beneficial effects that:
(1) according to the diamond wire cutting machine for the solar-grade silicon wafer, the two bent rods with the same length are arranged on the surface of the crankshaft positioned in the mounting plate, the bent rods are in threaded connection with the rotary sleeve, the rotary sleeve is rotatably connected with the fixed shaft in a T-shaped structure, and the rotary sleeve is rotated clockwise and anticlockwise to shorten and lengthen the length between the crankshaft and the fixed shaft, so that the contact length between the diamond wire and a silicon plate is increased, the diamond wire cutting machine is suitable for cutting silicon plates with different thicknesses, the silicon plate is prevented from being damaged, and the cutting accuracy is improved.
(2) According to the diamond wire cutting machine for the solar-grade silicon wafer, the side wall of the machine body with the surface being obliquely arranged is rotatably connected with the filter plate for filtering the cooled cooling liquid, the filter basket which is connected with the sliding frame in a sliding mode and used for collecting the silicon plate residues is arranged at the bottom of the filter plate, the filter plate is opened, the fact that the glass residues directly fall into the filter basket is achieved, collection is convenient, the water pump is prevented from being blocked, and the service life of the water pump is prolonged.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a diamond wire saw for solar grade silicon wafers according to a preferred embodiment of the present invention;
FIG. 2 is a schematic view of the internal structure of the housing shown in FIG. 1;
FIG. 3 is an enlarged view of the part A shown in FIG. 1;
FIG. 4 is a schematic view of the mounting plate shown in FIG. 1 shown coupled to a drive mechanism;
FIG. 5 is a schematic view of the cooling mechanism shown in FIG. 1;
fig. 6 is an enlarged schematic view of the structure of the part B shown in fig. 2.
In the figure: 1. the machine body comprises a material discharging mechanism 2, a material discharging mechanism 21, a material discharging plate 22, a material discharging hole 3, a sliding mechanism 31, a sliding chute 32, a fixed column 33, a sliding block 4, an installation mechanism 41, an installation plate 42, a fixed cylinder 43, a fixed frame 5, a cooling mechanism 51, a protective cover 52, a water spraying hole 53, a water outlet pipe 6, a conveying mechanism 61, a conveying pipe 62, a water pump 63, a water tank 7, a buffer mechanism 71, a spring 72, protection post, 73, apopore, 8, cutting mechanism, 81, fixed head, 82, hexagon socket head nut, 83, diamond wire, 84, mounting bracket, 85, connector, 86, take-up pulley, 9, actuating mechanism, 91, access panel, 92, curved bar, 93, swivel housing, 94, fixed axle, 95, connecting rod, 96, motor, 97, bent axle, 10, filtering mechanism, 101, filter plate, 102, filter basket, 103, carriage.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1, 2, 3 and 5, the diamond wire cutting machine for solar-grade silicon wafers according to the present invention comprises a machine body 1, a material discharging mechanism 2, a sliding mechanism 3, an installation mechanism 4, a cooling mechanism 5, a conveying mechanism 6, a buffering mechanism 7, a cutting mechanism 8, a driving mechanism 9 and a filtering mechanism 10; the side wall of the machine body 1 is provided with the mounting mechanism 4 for fixing the driving mechanism 9, the bottom of the driving mechanism 9 is provided with the cutting mechanism 8 for cutting silicon wafers, the surface of the machine body 1 is fixedly connected with the discharging mechanism 2 which is convenient for feeding, the top of the machine body 1 is fixedly connected with the sliding mechanism 3 which is used for fixing the cutting mechanism 8, the cutting mechanism 8 is connected in the sliding mechanism 3 in a sliding manner, the inside of the machine body 1 is provided with the buffer mechanism 7 fixedly connected with the bottom of the cutting mechanism 8, the side surface of the machine body 1 is provided with the conveying mechanism 6 for conveying cooling liquid, the outer side of the cutting mechanism 8 is provided with the cooling mechanism 5 which is used for cooling and is communicated with the conveying mechanism 6, the side of the machine body 1 is provided with the filtering mechanism 10 for filtering cooling liquid and glass debris.
Specifically, as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the mounting mechanism 4 of the diamond wire cutting machine for solar-grade silicon wafers according to the present invention includes a mounting plate 41, a fixing cylinder 42 and a fixing frame 43, one of the side walls of the machine body 1 is fixedly connected to the mounting plate 41 having a hollow interior and an open bottom, the fixing frame 43 corresponding to the mounting plate 41 is disposed on the side wall of the machine body 1, the fixing cylinder 42 having a hollow cylindrical structure is welded inside the fixing frame 43, and the driving mechanism 9 is mounted inside the mounting plate 41 to prevent accidents from occurring when the machine rotates.
Specifically, as shown in fig. 3 and 4, in the diamond wire cutting machine for solar grade silicon wafers according to the present invention, the driving mechanism 9 includes an access panel 91, two curved bars 92, a rotating sleeve 93, a fixed shaft 94, a connecting rod 95, a motor 96 and a crankshaft 97, the motor 96 is installed on the other side wall of the machine body 1, the crankshaft 97 fixedly connected with the motor 96 is rotatably connected inside the installation plate 41, the curved bars 92 with the same length are fixedly connected on the surface of the crankshaft 97, the bottoms of the two curved bars 92 are respectively in threaded connection with the two rotating sleeves 93 which are hollow inside and have a hexagonal prism structure on the outer side wall, the bottoms of the two rotating sleeves 93 are rotatably connected with the fixed shaft 94 which has a "U" -shaped structure, the connecting rod 95 is rotatably connected on the surface of the fixed shaft 94, and the connecting rod 95, the rotating sleeves 93, the curved bars 92 and the crankshaft 97 have a "n" -shaped structure, the side of mounting panel 41 is equipped with the convenient maintenance access panel 91, clockwise rotates rotatory cover 93 shortens curved bar 92 with distance between the fixed axle 94, anticlockwise rotation rotatory cover 93 shortens curved bar 92 with distance between the fixed axle 94 has realized increasing or cutting mechanism 8 and the silicon slab of being cut different thickness between the glass, convenient cutting.
Specifically, as shown in FIG. 2, the diamond wire cutting machine for solar grade silicon wafer according to the present invention, the cutting mechanism 8 comprises a fixing head 81, a hexagon socket nut 82, a diamond wire 83, a mounting bracket 84, a connecting head 85 and a tension wheel 86, the mounting bracket 84 with an arc-shaped structure is welded at the bottom of the connecting rod 95 through the fixing head 81, one end of the diamond wire 83 is fixed to the side wall of the fixing head 81 by the hexagon socket nut 82, the diamond wire 83 is wound around the surface of the tension wheel 86 at the bottom of the mounting bracket 84, the other end of diamond wire 83 is fixed in and is located the mounting bracket 84 side the inside of connector 85 will realize after motor 96 switch on the silicon board is cut at reciprocating motion to mounting bracket 84, through dismantling hexagon socket head nut 82 installs the dismantlement diamond wire 83.
Specifically, as shown in fig. 1 and 2, in the diamond wire cutting machine for solar-grade silicon wafers according to the present invention, the sliding mechanism 3 includes a sliding chute 31, a fixed column 32 and a sliding block 33, the fixed column 32 having the sliding chute 31 opened on a side wall thereof is disposed on the top of the machine body 1, the sliding block 33 having a "T" shaped structure on a side surface of the mounting block 84 slides inside the sliding chute 31, and a side wall of the mounting block 84 slides inside the fixed column 32 through the sliding block 33, so as to prevent the mounting block 84 from shaking during reciprocating motion to affect cutting.
Specifically, as shown in fig. 1, in the diamond wire cutting machine for solar grade silicon wafers, the buffer mechanism 7 includes a spring 71, a protection column 72 and a water outlet 73, the protection column 72 is fixedly connected in the machine body 1, the protection column 72 is in a hollow cylindrical structure, the water outlet 73 is formed in the side wall of the protection column 72, the spring 71 is fixedly connected in the protection column 72 and is fixedly connected with the bottom of the mounting rack 84, and the spring 71 expands or contracts during the reciprocating motion of the mounting rack 84, so that the bottom of the mounting rack 84 is fixed.
Specifically, as shown in fig. 1 and 2, in the diamond wire cutting machine for solar-grade silicon wafers, the material placing mechanism 2 includes a material placing plate 21 and a material discharging hole 22, the material placing plate 21 for placing glass is fixedly connected to the surface of the machine body 1, and the material discharging hole 22 for discharging material is formed in the side wall of the machine body 1 and corresponds to the material placing plate 21, so that the material can be conveniently loaded and unloaded, and the cutting is convenient.
Specifically, as shown in fig. 1, in the diamond wire cutting machine for solar-grade silicon wafers according to the present invention, the conveying mechanism 6 includes a conveying pipe 61, a water pump 62 and a water tank 63, the side surface of the machine body 1 is fixedly connected to the water tank 63 for containing a cooling liquid, and the conveying pipe 61 located on the side wall of the machine body 1 penetrates through the inside of the water tank 63 and is communicated with the water pump 62; cooling body 5 includes protection casing 51, hole for water spraying 52 and outlet pipe 53, is located the diamond wire 83 outside be cavity round platform shape structure the protection casing 51 with conveyer pipe 61 fixed connection, conveyer pipe 61 runs through the inside of protection casing 51 with outlet pipe 53 communicates, be the spiral distribution in the protection casing 51 inside wall the side of outlet pipe 53 is seted up and is used for spraying the coolant liquid, spray evenly do diamond wire 83 is radiating hole for water spraying 52 when mounting bracket 84 reciprocating motion diamond wire 83 and silicon plate contact generate heat will water pump 62 switch-on power realizes conveyer pipe 61 sends the coolant liquid outlet pipe 53 sprays water, will diamond wire 83 cools off.
Specifically, as shown in fig. 1 and 6, in the diamond wire cutting machine for solar-grade silicon wafers, the filtering mechanism 10 includes a filter plate 101, a filter basket 102 and a carriage 103, the side surface of the machine body 1 is rotatably connected to the filter plate 101 for filtering glass in a cooling liquid, the carriage 103 located at the bottom of the filter plate 101 is fixedly connected to the bottom of the machine body 1, the filter basket 102 for collecting glass residues is slidably connected to the carriage 103, so that the glass residues on the surface of the machine body 1, which is cooled by the diamond wire 83, are filtered by the filter plate 101, and after cutting, the filter plate 101 is opened to enable the glass residues to fall into the filter basket 102, thereby facilitating collection.
Firstly, a silicon plate is placed on a material placing plate 21 on the surface of a machine body 1, a motor 96 is powered on to realize that a driving mechanism 9 drives a cutting mechanism 8 to reciprocate, the silicon plate to be cut is slowly placed on the surface of a diamond wire 83 to be cut, a water pump 62 is powered on to realize that a conveying pipe pumps internal cooling liquid of a water tank 63 to a cooling mechanism 5 to cool the diamond wire 83 during cutting, glass debris and cooled cooling liquid flow to a filter plate 101 on the side surface of the machine body 1 to be filtered, the water pump is prevented from being blocked, and a filter basket 102 is opened to process the debris; the method specifically comprises the following steps:
(1) a motor 96 is arranged on the other side wall of the machine body 1, a crankshaft 97 fixedly connected with the motor 96 is rotatably connected in the mounting plate 41, curved rods 92 with the same length are fixedly connected on the surface of the crankshaft 97, the bottoms of the two curved rods 92 are respectively in threaded connection with two rotary sleeves 93 with a hexagonal prism structure, the inner side walls of the two rotary sleeves 93 are respectively in a hollow shape, the bottoms of the two rotary sleeves 93 are rotatably connected with a fixed shaft 94 in a U-shaped structure, the surface of the fixed shaft 94 is rotatably connected with a connecting rod 95, the rotary sleeves 93, the curved rods 92 and the crankshaft 97 are in a reversed U-shaped structure, an overhaul plate 91 convenient to overhaul is arranged on the side surface of the mounting plate 41, the rotary sleeves 93 are rotated clockwise and anticlockwise to shorten and lengthen the length between the crankshaft 92 and the fixed shaft 94, so that the contact length between the diamond wire 83 and the silicon plate is increased, the, the accuracy of cutting is improved, and the slider 33 that the side of mounting bracket 84 was fixed slides with fixed column 32 during the cutting, has realized spacing to mounting bracket 84, avoids mounting bracket 84 shake influence cutting.
(2) The water dropping pump 62 is powered on, a water tank 63 used for containing cooling liquid is fixedly connected to the side surface of the machine body 1, and a conveying pipe 61 positioned on the side wall of the machine body 1 penetrates through the inside of the water tank 63 and is communicated with the water pump 62; cooling body 5 includes protection casing 51, hole for water spraying 52 and outlet pipe 53, be located the protection casing 51 and the conveyer pipe 61 fixed connection that are the hollow round platform shape structure in the diamond wire 83 outside, conveyer pipe 61 runs through the inside and the outlet pipe 53 intercommunication of protection casing 51, it is used for spraying the coolant liquid to be seted up in the side of the outlet pipe 53 of protection casing 51 inside wall for the spiral distribution, spray evenly for the radiating hole for water spraying 52 of diamond wire 83, diamond wire 83 produces the heat with the silicon plate contact when mounting bracket 84 reciprocating motion and realizes that conveyer pipe 61 sends the coolant liquid to outlet pipe 53 with water pump 62 switch-on power supply and spray water, cool off diamond wire 83.
(3) During cutting, the cooling liquid and the glass debris flow to the side wall of the filter plate 101, the filter basket 102 which is connected with the sliding frame 103 in a sliding mode and used for collecting the silicon plate slag is arranged at the bottom of the filter plate 101, the filter plate 101 is opened, the glass slag directly falls into the filter basket 102, collection is facilitated, the water pump is prevented from being blocked, and the service life of the water pump 62 is prolonged.
(3) The surface of the crankshaft 97 positioned in the mounting plate 41 is provided with two bent rods 92 with the same length, the bent rods 92 are in threaded connection with the rotary sleeve 93, the rotary sleeve 93 is rotatably connected with the fixed shaft 94 in a T-shaped structure, and the rotary sleeve 93 is rotated clockwise and anticlockwise to shorten and lengthen the length between the bent rods 92 and the fixed shaft 94, so that the contact length between the diamond wire 83 and a silicon plate is increased, the silicon plate cutting device can adapt to cutting of silicon plates with different thicknesses, the silicon plate is prevented from being damaged, and the cutting accuracy is improved; the lateral wall of organism 1 that the surface is the slope setting rotates connects the filter plate 101 that is used for filtering the coolant liquid after the cooling, is located the bottom of filter plate 101 and is equipped with the filter basket 102 that is used for collecting the silica plate sediment with carriage 103 sliding connection, opens filter plate 101 and has realized that the glass sediment directly falls the inside of filter basket 102, and convenient the collection avoids the water pump to block up, has increased water pump 62's life.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the embodiments and descriptions given above are only illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (1)
1. A diamond wire cutting machine for solar grade silicon wafers is characterized in that: the automatic feeding machine comprises a machine body (1), a feeding mechanism (2), a sliding mechanism (3), an installation mechanism (4), a cooling mechanism (5), a conveying mechanism (6), a buffering mechanism (7), a cutting mechanism (8), a driving mechanism (9) and a filtering mechanism (10); the side wall of the machine body (1) is provided with the mounting mechanism (4) for fixing the driving mechanism (9), the bottom of the driving mechanism (9) is provided with the cutting mechanism (8) for cutting silicon wafers, the surface of the machine body (1) is fixedly connected with the discharging mechanism (2) for facilitating feeding, the top of the machine body (1) is fixedly connected with the sliding mechanism (3) for fixing the cutting mechanism (8), the cutting mechanism (8) is connected in the sliding mechanism (3) in a sliding manner, the inside of the machine body (1) is provided with the buffering mechanism (7) fixedly connected with the bottom of the cutting mechanism (8), the side surface of the machine body (1) is provided with the conveying mechanism (6) for conveying cooling liquid, the outer side of the cutting mechanism (8) is provided with the cooling mechanism (5) for cooling and communicated with the conveying mechanism (6), the side surface of the machine body (1) is provided with the filtering mechanism (10) for filtering cooling liquid and glass debris;
the mounting mechanism (4) comprises a mounting plate (41), a fixed cylinder (42) and a fixing frame (43), one side wall of the machine body (1) is fixedly connected with the mounting plate (41) which is hollow inside and has an opening at the bottom, the side wall of the machine body (1) is provided with the fixing frame (43) corresponding to the mounting plate (41), and the fixed cylinder (42) which is of a hollow cylindrical structure is welded inside the fixing frame (43);
actuating mechanism (9) are including access panel (91), two curved bar (92), rotatory cover (93), fixed axle (94), connecting rod (95), motor (96) and bent axle (97), another lateral wall installation of organism (1) motor (96), the inside rotation of mounting panel (41) be connected with motor (96) fixed connection bent axle (97), the fixed surface of bent axle (97) is connected length equals curved bar (92), two the bottom of curved bar (92) is threaded connection inside hollow respectively, the lateral wall is two of hexagonal prism structure rotatory cover (93), two the bottom of rotatory cover (93) is rotated and is connected fixed axle (94) that are "U" shape structure, the surface of fixed axle (94) is rotated and is connected connecting rod (95), connecting rod (95) rotatory cover (93), The bent rod (92) and the bent shaft (97) are in a structure like a Chinese character 'ji', and the side surface of the mounting plate (41) is provided with the maintenance plate (91) which is convenient to maintain;
the cutting mechanism (8) comprises a fixing head (81), an inner hexagonal nut (82), a diamond wire (83), an installation frame (84), a connecting head (85) and a tension wheel (86), the installation frame (84) in an arc-shaped structure is welded to the bottom of the connecting rod (95) through the fixing head (81), one end of the diamond wire (83) is fixed to the side wall of the fixing head (81) through the inner hexagonal nut (82), the diamond wire (83) is wound on the surface of the tension wheel (86) located at the bottom of the installation frame (84), and the other end of the diamond wire (83) is fixed inside the connecting head (85) located on the side face of the installation frame (84);
the sliding mechanism (3) comprises a sliding chute (31), a fixed column (32) and a sliding block (33), the fixed column (32) with the sliding chute (31) opened on the side wall is arranged at the top of the machine body (1), and the sliding block (33) with a T-shaped structure on the side surface of the mounting rack (84) slides in the sliding chute (31);
the buffer mechanism (7) comprises a spring (71), a protective column (72) and a water outlet hole (73), the protective column (72) which is of a hollow cylindrical structure and is provided with the water outlet hole (73) on the side wall is fixedly connected in the machine body (1), and the spring (71) fixedly connected with the bottom of the mounting frame (84) is fixedly connected in the protective column (72);
the discharging mechanism (2) comprises a discharging plate (21) and a discharging hole (22), the surface of the machine body (1) is fixedly connected with the discharging plate (21) for discharging glass, and the discharging hole (22) corresponding to the discharging plate (21) and used for discharging is formed in the side wall of the machine body (1);
the conveying mechanism (6) comprises a conveying pipe (61), a water pump (62) and a water tank (63), the side face of the machine body (1) is fixedly connected with the water tank (63) used for containing cooling liquid, and the conveying pipe (61) located on the side wall of the machine body (1) penetrates through the inside of the water tank (63) and is communicated with the water pump (62); the cooling mechanism (5) comprises a protective cover (51), water spray holes (52) and a water outlet pipe (53), the protective cover (51) which is located on the outer side of the diamond wire (83) and is of a hollow round table-shaped structure is fixedly connected with the conveying pipe (61), the conveying pipe (61) penetrates through the interior of the protective cover (51) and is communicated with the water outlet pipe (53), and the water spray holes (52) which are used for spraying cooling liquid and uniformly spray the cooling liquid and dissipate heat of the diamond wire (83) are formed in the side face of the water outlet pipe (53) which is spirally distributed on the inner side wall of the protective cover (51);
the filtering mechanism (10) comprises a filtering plate (101), a filtering basket (102) and a sliding frame (103), the side surface of the machine body (1) is rotatably connected with the filtering plate (101) for filtering glass in cooling liquid, the bottom of the machine body (1) is fixedly connected with the sliding frame (103) positioned at the bottom of the filtering plate (101), and the filtering basket (102) for collecting glass residues is slidably connected with the sliding frame (103);
firstly, place the silicon slab on blowing board (21) on organism (1) surface, realize that actuating mechanism (9) drive cutting mechanism (8) reciprocating motion with motor (96) switch on power supply, the silicon slab that will cut slowly puts diamond wire (83) surface and cuts, realize during the cutting that water pump (62) switch on power supply that the conveyer pipe is taken out the inside coolant liquid of water tank (63) to cooling body (5) and cool off diamond wire (83), glass piece and the coolant liquid that cools off filter plate (101) of organism (1) side filter, avoid the water pump to block up, open filter basket (102) and handle the piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810989423.9A CN109049372B (en) | 2018-08-28 | 2018-08-28 | Diamond wire cutting machine for solar-grade silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810989423.9A CN109049372B (en) | 2018-08-28 | 2018-08-28 | Diamond wire cutting machine for solar-grade silicon wafer |
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| Publication Number | Publication Date |
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| CN109049372A CN109049372A (en) | 2018-12-21 |
| CN109049372B true CN109049372B (en) | 2020-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810989423.9A Active CN109049372B (en) | 2018-08-28 | 2018-08-28 | Diamond wire cutting machine for solar-grade silicon wafer |
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| Country | Link |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113858463A (en) * | 2021-11-03 | 2021-12-31 | 燕飞 | Diamond wire cutting machine for solar-grade silicon wafer |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1342359A (en) * | 1970-08-28 | 1974-01-03 | Prowse Co Ltd D H | Abrasive cutting device |
| CN1488480A (en) * | 2003-08-13 | 2004-04-14 | 沈阳工业学院 | Ultrasonic wire cutting saw for hard-fragile material processing |
| CN201056035Y (en) * | 2007-06-14 | 2008-05-07 | 江显秋 | Stone frame saw machine |
| CN203401618U (en) * | 2013-08-29 | 2014-01-22 | 天威新能源控股有限公司 | Multi-wire cutting machine device |
| CN203957169U (en) * | 2014-07-25 | 2014-11-26 | 苏州科技学院 | Rotary ultrasonic vibrational line cutter sweep |
-
2018
- 2018-08-28 CN CN201810989423.9A patent/CN109049372B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1342359A (en) * | 1970-08-28 | 1974-01-03 | Prowse Co Ltd D H | Abrasive cutting device |
| CN1488480A (en) * | 2003-08-13 | 2004-04-14 | 沈阳工业学院 | Ultrasonic wire cutting saw for hard-fragile material processing |
| CN201056035Y (en) * | 2007-06-14 | 2008-05-07 | 江显秋 | Stone frame saw machine |
| CN203401618U (en) * | 2013-08-29 | 2014-01-22 | 天威新能源控股有限公司 | Multi-wire cutting machine device |
| CN203957169U (en) * | 2014-07-25 | 2014-11-26 | 苏州科技学院 | Rotary ultrasonic vibrational line cutter sweep |
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| CN109049372A (en) | 2018-12-21 |
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Effective date of registration: 20200908 Address after: The northern section of Taishan city of Tongling province Anhui road 244000 No. 1688 No. 2 building three layer (taixiang Industrial Park) Applicant after: ANHUI HERO ELECTRONIC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 211189 Southeast University, No. 2 Southeast University Road, Jiangning District, Nanjing City, Jiangsu Province Applicant before: LAN Feng |
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Effective date of registration: 20221118 Address after: 014030 Workshop 9, Shuangliang Production Base, No. 35, Cuihu Road, Binhe New Area, Baotou Rare Earth Development Zone, Inner Mongolia Autonomous Region Patentee after: Baotou Kesitong Energy Technology Co.,Ltd. Address before: 244000 third floor of plant 2, No. 1688, north section of Taishan Avenue, Tongling City, Anhui Province (in taixiang Industrial Park) Patentee before: ANHUI HERO ELECTRONIC SCIENCE AND TECHNOLOGY CO.,LTD. |