CN109047188A - MEMS chip Superficial Foreign Body removal device and method - Google Patents
MEMS chip Superficial Foreign Body removal device and method Download PDFInfo
- Publication number
- CN109047188A CN109047188A CN201810698803.7A CN201810698803A CN109047188A CN 109047188 A CN109047188 A CN 109047188A CN 201810698803 A CN201810698803 A CN 201810698803A CN 109047188 A CN109047188 A CN 109047188A
- Authority
- CN
- China
- Prior art keywords
- mems chip
- pcb
- fixing tool
- foreign matter
- air blowing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
Landscapes
- Cleaning In General (AREA)
Abstract
The present invention provides a kind of MEMS chip Superficial Foreign Body removal device and method, method therein includes that the PCB for being provided with MEMS chip is fixed on PCB fixing tool, wherein, the PCB one side for being provided with MEMS chip is corresponding with air blowing panel, the PCB for being not provided with MEMS chip is provided with pressing plate on one side, and PCB is fixed on PCB fixing tool by pressing plate；Vibrator vibration, vibrator drive the PCB fixing tool vibration mutually fixed with it, the surface of the MEMS chip of PCB fixing tool are arranged in and the foreign matter battle array around MEMS chip is fallen；Viscous bottom hull adsorbs the foreign matter that the vibrator vibration is fallen, wherein viscous bottom hull is fixed on mounting plate corresponding with PCB fixing tool；Air blowing panel blows to the MEMS chip surface of PCB, and the foreign matter on MEMS chip surface is blown off.Using the present invention, the problem of being able to solve the foreign matter on MEMS chip surface not can be removed.
Description
Technical field
The present invention relates to MEMS technology fields, and more specifically, chip surface foreign matter removal device can not be touched by being related to one kind
And method.
Background technique
It is integrated in recent years using MEMS (Micro-Electro-Mechanical-System, abbreviation MEMS) technique
MEMS microphone is by the electronic products such as batch application to mobile phone, laptop, and encapsulation volume is than traditional electret wheat
Gram wind is small, therefore the favor by most of microphone manufacturer.
MEMS microphone is made of metal shell and wiring board (Printed Circuit Board, referred to as PCB)
Encapsulating structure.It include wiring board inside encapsulating structure, assist side surface is equipped with MEMS acoustic-electric chip and asic chip.
Wherein, the MEMS chip in MEMS microphone is very sensitive for foreign matter, and encapsulation process difficulty avoids foreign matter from falling on
The surface MEMS, currently without the process of removal foreign matter, can only pass through since the functional areas of MEMS chip are very fragile
Foreign matter detection is scrapped entire microphone by AOI.
Therefore, the present invention provides a kind of MEMS chip Superficial Foreign Body removal device and methods.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of MEMS chip Superficial Foreign Body removal device and method, with
Solve the problems, such as that the foreign matter on MEMS chip surface not can be removed.
The present invention provides a kind of MEMS chip Superficial Foreign Body removal device, including mounting plate, setting are on mounting plate
Two vibrators and air blowing panel；Wherein,
PCB fixing tool is provided on two vibrators, PCB fixing tool is for being fixedly installed MEMS chip
PCB；
The one side that MEMS chip is provided on PCB is corresponding with air blowing panel；
MEMS chip is not provided on PCB is provided with pressing plate on one side.
Furthermore it is preferred that scheme be further include the viscous liner being arranged on the mounting plate, the viscous liner is arranged two
Between a vibrator, wherein
The viscous liner, for adsorbing the foreign matter of MEMS chip surface removal.
Furthermore it is preferred that scheme be that gas hole is provided on the air blowing panel, the gas hole and purified gas
Body is connected；Wherein, the air blowing panel is fixed on the mounting plate by support plate.
Furthermore it is preferred that scheme be that through slot is provided on the PCB fixing tool, the through slot is for described in fixed
PCB, wherein
The PCB fixing tool is bolted on the vibrator.
The present invention also provides a kind of MEMS chip Superficial Foreign Body minimizing technologies, using above-mentioned apparatus to MEMS chip surface
Foreign matter is removed, and the specific method is as follows:
The PCB for being provided with MEMS chip is fixed on PCB fixing tool, wherein be provided with the PCB one side of MEMS chip
Corresponding with air blowing panel, the PCB for being not provided with MEMS chip is provided with pressing plate on one side, and the PCB is fixed on by the pressing plate
On the PCB fixing tool；
Vibrator vibration, the vibrator drive the PCB fixing tool mutually fixed with it to vibrate, are arranged described
Foreign matter battle array around the surface of the MEMS chip of PCB fixing tool and the MEMS chip is fallen；
Viscous bottom hull adsorbs the foreign matter that the vibrator vibration is fallen, wherein the viscous bottom hull is fixed on and the PCB fixing tool
On corresponding mounting plate；
Air blowing panel blows to the MEMS chip surface of the PCB, and the foreign matter on the MEMS chip surface is blown off.
It can be seen from the above technical scheme that MEMS chip Superficial Foreign Body removal device provided by the invention and method, utilize
Vibrator and air blowing panel remove MEMS chip Superficial Foreign Body, by vibrating, after air blowing processing MEMS chip surface foreign matter ratio
Example is greatly lowered, and foreign matter fraction defective reduces about 60%, to solve the problems, such as that the foreign matter on MEMS chip surface not can be removed.
To the accomplishment of the foregoing and related purposes, one or more aspects of the present invention includes the spy being particularly described below
Sign.Certain illustrative aspects of the invention is described in detail in the following description and the annexed drawings.However, these aspect instructions are only
It is that some of the various ways in the principles of the present invention can be used.In addition, the present invention is intended to include all such aspects with
And their equivalent.
Detailed description of the invention
By reference to the explanation below in conjunction with attached drawing, and with a more complete understanding of the present invention, of the invention is other
Purpose and result will be more clearly understood and understood.In the accompanying drawings:
Fig. 1 is the MEMS chip Superficial Foreign Body minimizing technology flow diagram according to the embodiment of the present invention；
Fig. 2 is one schematic diagram of MEMS chip Superficial Foreign Body removal device structure according to the embodiment of the present invention；
Fig. 3 is two schematic diagram of MEMS chip Superficial Foreign Body removal device structure according to the embodiment of the present invention；
Fig. 4 is the PCB fixing tool structural schematic diagram according to the embodiment of the present invention；
Fig. 5 is the air blowing panel construction schematic diagram according to the embodiment of the present invention.
Appended drawing reference therein includes: 1, mounting plate；2, vibrator；3, air blowing panel；4, PCB fixing tool；5, it presses
Plate；6, liner is glued；7,PCB；31, gas hole；41, through slot.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific embodiment
In the following description, for purposes of illustration, it in order to provide the comprehensive understanding to one or more embodiments, explains
Many details are stated.It may be evident, however, that these embodiments can also be realized without these specific details.
Very sensitive for foreign matter for the MEMS chip in the current MEMS microphone of aforementioned proposition, encapsulation process difficulty is kept away
Exempt from foreign matter and fall on the surface MEMS, since the functional areas of MEMS chip are very fragile, currently without removal foreign matter process,
Foreign matter detection can only be scrapped into entire microphone by AOI, to solve the process without removing foreign matter, the present invention is provided
A kind of MEMS chip Superficial Foreign Body removal device and method.
Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.
In order to illustrate the structure of MEMS chip Superficial Foreign Body removal device provided by the invention, Fig. 2 to Fig. 5 is respectively from difference
Angle has carried out exemplary mark to the structure of MEMS chip Superficial Foreign Body removal device.Specifically, Fig. 2 shows according to this hair
The MEMS chip Superficial Foreign Body removal device structure one of bright embodiment；Fig. 3 shows MEMS chip according to an embodiment of the present invention
Superficial Foreign Body removal device structure two；Fig. 4 shows PCB fixing tool structure according to an embodiment of the present invention；Fig. 5 shows root
According to the air blowing panel construction of the embodiment of the present invention.
As shown in Fig. 2 to common Fig. 5, MEMS chip Superficial Foreign Body removal device provided by the invention, including mounting plate
1, two vibrators 2 and air blowing panel 3 on mounting plate 1 are set.
Wherein, PCB fixing tool 4 is provided on two vibrators 2, PCB fixing tool 4 is for being fixedly installed MEMS
The PCB7 of chip；The one side that MEMS chip is provided on PCB7 is corresponding with air blowing panel 3；MEMS is not provided on PCB7
Chip is provided with pressing plate 5 on one side.
Wherein, when vibrator 2 vibrates, it is fixed on PCB fixing tool 4 on vibrator 2 as vibrator 2 vibrates, due to
PCB7 is fixed on PCB fixing tool 4, and therefore, PCB7 is vibrated with vibrator 2, and MEMS chip surface and chip perimeter are held
Caducous foreign matter vibration is fallen.
In addition, MEMS chip Superficial Foreign Body removal device further includes on setting mounting plate 1 in the embodiment of invention
Viscous liner 6 glues liner 6 and is arranged between two vibrators 2, wherein viscous liner 6, for adsorbing the removal of MEMS chip surface
Foreign matter.When the foreign matter vibration that MEMS chip surface and chip perimeter are easy to fall off is fallen, foreign matter is fallen on viscous liner 6, is glued liner 6 and is inhaled
The foreign matter of attached vibration.
In the embodiment shown in fig. 4, through slot 42 is provided on PCB fixing tool 4, through slot 41 is used to fix PCB7,
That is: PCB7 is stuck in through slot 41, wherein one that MEMS chip is provided on PCB is face-down, towards viscous liner 6, when MEMS core
When the foreign matter battle array on piece surface is fallen, fall on viscous liner 6.And PCB fixing tool 4 is bolted on vibrator 2, PCB
Fixing tool 4 drives PCB to vibrate under the action of vibrator 2.
In the embodiment shown in fig. 5, gas hole 31, gas hole 31 and purified gas are provided on air blowing panel 3
Body (purified air) is connected；Wherein, air blowing panel 3 is fixed on mounting plate 2 by support plate.Due on PCB7
The one side for being provided with MEMS chip is corresponding with air blowing panel 3, and gas hole is by purified air to the surface of MEMS chip
It blows, is blown off the part foreign matter on MEMS chip surface by blowing, the foreign matter of MEMS chip can be removed more
Thoroughly.
In comprehensive embodiment shown in Fig. 2 to Fig. 5, air blowing panel 3, vibrator 2, PCB fixing tool 4, viscous bottom hull 6 are filled
Be fitted on the same platform, and by PLC program (control system) realize vibrator 2 and air blowing panel 3 switch opportunity and
Duration is realized and utilizes vibration and removal MEMS chip Superficial Foreign Body of blowing.
Corresponding to the above device, the present invention also provides a kind of MEMS chip Superficial Foreign Body minimizing technology, Fig. 1 shows root
According to the MEMS chip Superficial Foreign Body minimizing technology process of the embodiment of the present invention.
As shown in Figure 1, MEMS chip Superficial Foreign Body minimizing technology provided by the invention, using above-mentioned apparatus to MEMS chip
The foreign matter on surface is removed, and the specific method is as follows:
S110: the PCB for being provided with MEMS chip is fixed on PCB fixing tool, wherein be provided with MEMS chip
PCB one side is corresponding with air blowing panel, and the PCB for being not provided with MEMS chip is provided with pressing plate on one side, and PCB is fixed on by pressing plate
On PCB fixing tool；
S120: vibrator vibration, vibrator drive the PCB fixing tool vibration mutually fixed with it, are arranged in PCB regular worker
The surface of the MEMS chip of dress and the foreign matter battle array around MEMS chip are fallen；
S130: viscous bottom hull adsorbs the foreign matter that the vibrator vibration is fallen, wherein viscous bottom hull is fixed on pretends with PCB regular worker
On corresponding mounting plate；
S140: air blowing panel blows to the MEMS chip surface of PCB, and the foreign matter on MEMS chip surface is blown off.
It is examined after the above-mentioned technique for utilizing vibration and removal MEMS chip Superficial Foreign Body of blowing, then by passing through AOI
The qualification rate of the foreign matter of MEMS chip is surveyed, detection is qualified, then MEMS microphone assembling is carried out, so that it is bad to greatly reduce foreign matter
Rate.
By above embodiment as can be seen that MEMS chip Superficial Foreign Body removal device provided by the invention and method,
MEMS chip Superficial Foreign Body is removed using vibrator and air blowing panel, MEMS chip surface is different by vibrating, after air blowing processing
Object ratio is greatly lowered, and foreign matter fraction defective reduces about 60%, thus asking of not can be removed of the foreign matter for solving MEMS chip surface
Topic.
Describe the MEMS chip Superficial Foreign Body removal dress proposed according to the present invention in an illustrative manner above with reference to attached drawing
It sets and method.It will be understood by those skilled in the art, however, that the MEMS chip Superficial Foreign Body proposed for aforementioned present invention is gone
Except device and method, various improvement can also be made on the basis of not departing from the content of present invention.Therefore, protection model of the invention
Enclosing should be determined by the content of appended claims.
Claims (5)
1. a kind of MEMS chip Superficial Foreign Body removal device, including mounting plate, two vibrations being arranged on the mounting plate
Dynamic device and air blowing panel；Wherein,
PCB fixing tool is provided on described two vibrators, the PCB fixing tool is for being fixedly installed MEMS chip
PCB；
The one side for being provided with MEMS chip on the pcb is corresponding with the air blowing panel；
Be not provided with MEMS chip on the pcb is provided with pressing plate on one side.
2. MEMS chip Superficial Foreign Body removal device as described in claim 1, wherein
It further include the viscous liner being arranged on the mounting plate, the viscous liner is arranged between two vibrators, wherein
The viscous liner, for adsorbing the foreign matter of MEMS chip surface removal.
3. MEMS chip Superficial Foreign Body removal device as described in claim 1, wherein
Gas hole is provided on the air blowing panel, the gas hole is connected with purified gas；Wherein, the air blowing
Panel is fixed on the mounting plate by support plate.
4. MEMS chip Superficial Foreign Body removal device as described in claim 1, wherein
Through slot is provided on the PCB fixing tool, the through slot is for fixing the PCB, wherein
The PCB fixing tool is bolted on the vibrator.
5. a kind of MEMS chip Superficial Foreign Body minimizing technology, using MEMS chip surface according to any one of claims 1-4
Foreign matter removal device is removed the foreign matter on MEMS chip surface, and the specific method is as follows:
The PCB for being provided with MEMS chip is fixed on PCB fixing tool, wherein be provided with MEMS chip PCB one side with blow
Gas panel is corresponding, and the PCB for being not provided with MEMS chip is provided with pressing plate on one side, and the PCB is fixed on described by the pressing plate
On PCB fixing tool；
Vibrator vibration, the vibrator drive the PCB fixing tool mutually fixed with it to vibrate, and setting is solid in the PCB
The foreign matter battle array determined around the surface and the MEMS chip of the MEMS chip of tooling is fallen；
Viscous bottom hull adsorbs the foreign matter that the vibrator vibration is fallen, wherein the viscous bottom hull is fixed on opposite with the PCB fixing tool
On the mounting plate answered；
Air blowing panel blows to the MEMS chip surface of the PCB, and the foreign matter on the MEMS chip surface is blown off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810698803.7A CN109047188A (en) | 2018-06-29 | 2018-06-29 | MEMS chip Superficial Foreign Body removal device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810698803.7A CN109047188A (en) | 2018-06-29 | 2018-06-29 | MEMS chip Superficial Foreign Body removal device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109047188A true CN109047188A (en) | 2018-12-21 |
Family
ID=64818541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810698803.7A Pending CN109047188A (en) | 2018-06-29 | 2018-06-29 | MEMS chip Superficial Foreign Body removal device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109047188A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110271820A (en) * | 2019-07-26 | 2019-09-24 | 吉林大学 | The integrated equipment of dedusting, monitoring, feeding of optical fiber group |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734698B1 (en) * | 2005-12-28 | 2007-07-02 | 안용욱 | The vibration which uses a public pressure and spray combination automatic washing system |
| CN101138766A (en) * | 2006-09-06 | 2008-03-12 | 比亚迪股份有限公司 | Cam lens module cleaning method |
| US20140109934A1 (en) * | 2012-10-18 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for removing particles from printed circuit board and method for removing particles from printed circuit board |
| CN203918622U (en) * | 2014-06-13 | 2014-11-05 | 越峰电子（昆山）有限公司 | Air blowing oscillatory type green compact glidepath device |
| CN205755070U (en) * | 2016-05-24 | 2016-11-30 | 天津克莱维科技发展有限公司 | What a kind of Novel circuit board was professional adds shake formula automatic air blowing device |
| CN207138346U (en) * | 2017-07-18 | 2018-03-27 | 佛山市兰海环保设备科技有限公司 | A kind of industrial production deduster |
| CN207288246U (en) * | 2017-06-29 | 2018-05-01 | 北塘区军之印纸品加工厂 | Debris removal equipment is used in a kind of paper product production |
-
2018
- 2018-06-29 CN CN201810698803.7A patent/CN109047188A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100734698B1 (en) * | 2005-12-28 | 2007-07-02 | 안용욱 | The vibration which uses a public pressure and spray combination automatic washing system |
| CN101138766A (en) * | 2006-09-06 | 2008-03-12 | 比亚迪股份有限公司 | Cam lens module cleaning method |
| US20140109934A1 (en) * | 2012-10-18 | 2014-04-24 | Samsung Electro-Mechanics Co., Ltd. | Apparatus for removing particles from printed circuit board and method for removing particles from printed circuit board |
| CN203918622U (en) * | 2014-06-13 | 2014-11-05 | 越峰电子（昆山）有限公司 | Air blowing oscillatory type green compact glidepath device |
| CN205755070U (en) * | 2016-05-24 | 2016-11-30 | 天津克莱维科技发展有限公司 | What a kind of Novel circuit board was professional adds shake formula automatic air blowing device |
| CN207288246U (en) * | 2017-06-29 | 2018-05-01 | 北塘区军之印纸品加工厂 | Debris removal equipment is used in a kind of paper product production |
| CN207138346U (en) * | 2017-07-18 | 2018-03-27 | 佛山市兰海环保设备科技有限公司 | A kind of industrial production deduster |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110271820A (en) * | 2019-07-26 | 2019-09-24 | 吉林大学 | The integrated equipment of dedusting, monitoring, feeding of optical fiber group |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200610 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Applicant after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Applicant before: GOERTEK Inc. |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181221 |
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| RJ01 | Rejection of invention patent application after publication |