JPH0225042A - Removal of chip - Google Patents
Removal of chipInfo
- Publication number
- JPH0225042A JPH0225042A JP63174575A JP17457588A JPH0225042A JP H0225042 A JPH0225042 A JP H0225042A JP 63174575 A JP63174575 A JP 63174575A JP 17457588 A JP17457588 A JP 17457588A JP H0225042 A JPH0225042 A JP H0225042A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- resin
- heat
- weaken
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract 3
- 230000001070 adhesive effect Effects 0.000 claims abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- CNIIGCLFLJGOGP-UHFFFAOYSA-N 2-(1-naphthalenylmethyl)-4,5-dihydro-1H-imidazole Chemical compound C=1C=CC2=CC=CC=C2C=1CC1=NCCN1 CNIIGCLFLJGOGP-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/799—Apparatus for disconnecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、混成集積回路や表示装置の基板上のＩＣチッ
プ除去の方法を提供するものである。これは、故障した
ＩＣチップの交換等に是非、必要な手段である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention provides a method for removing IC chips from a substrate of a hybrid integrated circuit or display device. This is a necessary means for replacing a failed IC chip.
従来の技術
混成集積回路や表示装置の基板上のＩＣチップの故障に
対する修正法に関して、より具体的には故障したＩＣチ
ップの除去法に関しては、現実的な方法は現在の所、無
い。There is currently no practical method for correcting failures in IC chips on substrates of conventional technology hybrid integrated circuits and display devices, and more specifically for removing failed IC chips.
発明が解決しようとする課題
表示装置において、表示容量が大きくなり、高精細度化
してきつつあり、この場合、駆動回路との接続は従来の
異方導電性フィルムや銅箔を有する有機フィルムを用い
ての接続では限界がある。Problems to be Solved by the Invention In display devices, the display capacity is increasing and the definition is becoming higher. There are limits to how many connections there are.
このときは、表示装置の基板上に、端部に駆動回路、あ
るいはその一部を設けて、前記基板からの配線を少なく
する必要がある。この場合、検査により、正常なＩＣチ
ップを前記基板上に電気的に接続がとれるように積載し
、信転性を高めるために樹脂等で固化した場合、この過
程でＩＣチップが破壊される確率は有限である。このと
き、ＩＣチップの交換、すなはちＩＣチップの基板から
の除去が歩留りを向上させるために必要となる。In this case, it is necessary to provide the drive circuit or a part thereof at the end of the substrate of the display device to reduce the number of wiring lines from the substrate. In this case, if a normal IC chip is mounted on the board so that it can be electrically connected through inspection, and it is solidified with resin etc. to improve reliability, there is a probability that the IC chip will be destroyed in this process. is finite. At this time, it is necessary to replace the IC chip, that is, to remove the IC chip from the substrate in order to improve the yield.
この場合において、従来、信鯨し得るＩＣチップの除去
法が無かったのは問題である。In this case, the problem is that there has been no method to remove the IC chip that can be used in the past.
課題を解決するための手段
本発明は前述のような課題を解決するために、基板上に
樹脂等で固定されたＩＣチップを基板上から除去するに
おいて、Ｉｃチップのみに熱または超音波振動、または
それらを共に加え、ＩＣチップの基板への固化用樹脂の
接着力を弱め、ＩＣチップの残部及び樹脂を基板から剥
離、除去するようなチップ除去法を提供するものである
。Means for Solving the Problems In order to solve the above-mentioned problems, the present invention aims to remove an IC chip fixed on a substrate with a resin or the like from a substrate by applying heat or ultrasonic vibration to only the IC chip. Alternatively, the present invention provides a chip removal method in which the adhesion of the solidifying resin to the substrate of the IC chip is weakened by adding them together, and the remaining portion of the IC chip and the resin are peeled off and removed from the substrate.
作用
熱や超音波振動、あるいはこれらの相乗効果により、Ｉ
Ｃチップと基板との結合を弱め、その後適当な治具によ
り、チップにズリ応力を加え、チップを基板から外すわ
けである。Due to action heat, ultrasonic vibration, or their synergistic effect, I
The bond between the C chip and the substrate is weakened, and then a suitable jig is used to apply shear stress to the chip and the chip is removed from the substrate.
実施例 以下、本発明の一実施例を説明する。Example An embodiment of the present invention will be described below.
本実施例では液晶表示用パネルの片側ガラス基板上に設
置されたＩＣチップ（いわゆるＣ０Ｇ）の取り外しを行
った。なお、ＩＣチップはガラス基板に強く固着されて
おり、ズリ応力を加えても、ガラス基板が破壊されるだ
けで、ＩＣチップは基板から除去し得なかった。In this example, an IC chip (so-called C0G) installed on one glass substrate of a liquid crystal display panel was removed. Note that the IC chip is strongly fixed to the glass substrate, and even if shear stress is applied, the glass substrate is only destroyed, and the IC chip cannot be removed from the substrate.
なお、ＩＣチップは、信顛性を向上させるため、樹脂で
被覆される。従って、ＩＣチップ周辺の基板表面は必然
的にこの樹脂で覆われる。このことは、ＣＯＧにおいて
極く一般的である。Note that the IC chip is coated with resin to improve reliability. Therefore, the substrate surface around the IC chip is inevitably covered with this resin. This is very common in COG.
ＩＣチップに熱または超音波振動、またはそれらを共に
加えるための熱源や超音波振動源として、ガラスにイン
ジウム系合金を着けるための、いわゆるセラソルザー（
旭硝子製）のコテを使用した。The so-called Cerasolzer (Cerasolzer) is used to apply indium-based alloy to glass as a heat source or ultrasonic vibration source for applying heat or ultrasonic vibration, or both of them, to IC chips.
A trowel manufactured by Asahi Glass was used.
コテの先端をＩＣチップに着け、熱や超音波振動を加え
た。概略図に様子を示す０図において１はチップ、２は
基板、３は固着用樹脂、４はコテの先端である。The tip of the iron was attached to the IC chip, and heat and ultrasonic vibrations were applied. In Figure 0, which shows the state in a schematic diagram, 1 is a chip, 2 is a substrate, 3 is a fixing resin, and 4 is the tip of a soldering iron.
熱と超音波振動の両方を加えた方が、チップを外すには
、より効果的であった。Applying both heat and ultrasonic vibration was more effective at removing the chip.
次にシリコン片はピンセットや簡単な治具によリズリ応
力をかけると簡単に除去し得る。The silicone pieces can then be easily removed by applying a gentle stress using tweezers or a simple jig.
かくて、容易にチップを外し得た。Thus, the chip could be easily removed.
発明の効果
以上本発明は基板上からＩＣチップを容易に外し得る方
法を提供するものであり、産業上の価値は大なるものが
ある。Effects of the Invention The present invention provides a method for easily removing an IC chip from a substrate, and has great industrial value.
図はチップを剥す状況を示すための概略図である。
１・・・・・・チップ、２・・・・・・基板、３・・・
・・・固着用樹脂、４・・・・・・コテの先端。
代理人の氏名 弁理士 粟野重孝 はか１名１−−−チ
、ソフ
２−一一石１反
３−面着用尉朋
４−−−コｙ−−先を畠The figure is a schematic diagram showing the situation in which the chip is peeled off. 1...chip, 2...substrate, 3...
...Fixing resin, 4...Tip of iron. Name of agent Patent attorney Shigetaka Awano Haka 1 person 1 --- Chi, Sofu 2 - Ichikoku 1 Antan 3 - Mengeki Naotomo 4 --- Coy --- Ahead of Hatake
Claims (1)
去するにおいて、ＩＣチップのみに熱または超音波振動
、またはそれらを共に加え、ＩＣチップの基板への固化
用樹脂の接着力を弱め、ＩＣチップの残部及び樹脂を基
板から剥離、除去することを特徴するチップ除去法。When removing an IC chip fixed on a substrate with a resin or the like from the substrate, heat or ultrasonic vibration, or both of them are applied only to the IC chip to weaken the adhesive force of the solidifying resin of the IC chip to the substrate. A chip removal method characterized by peeling off and removing the remaining part of an IC chip and resin from a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63174575A JPH0225042A (en) | 1988-07-13 | 1988-07-13 | Removal of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63174575A JPH0225042A (en) | 1988-07-13 | 1988-07-13 | Removal of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0225042A true JPH0225042A (en) | 1990-01-26 |
Family
ID=15980955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63174575A Pending JPH0225042A (en) | 1988-07-13 | 1988-07-13 | Removal of chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225042A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0600289A3 (en) * | 1992-11-27 | 1994-07-06 | Matsushita Electric Ind Co Ltd | Semiconductor chip removal process and apparatus. |
| JP2005105263A (en) * | 2003-09-12 | 2005-04-21 | Yazaki Corp | Method for separating bonded body |
| JP2005281533A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Method for peeling member off |
| JP2006124564A (en) * | 2004-10-29 | 2006-05-18 | Yazaki Corp | Method for separating bound body |
| WO2024046983A1 (en) * | 2022-08-31 | 2024-03-07 | Pac Tech - Packaging Technologies Gmbh | Method and device for separating a semiconductor component from a carrier |
-
1988
- 1988-07-13 JP JP63174575A patent/JPH0225042A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0600289A3 (en) * | 1992-11-27 | 1994-07-06 | Matsushita Electric Ind Co Ltd | Semiconductor chip removal process and apparatus. |
| US5425833A (en) * | 1992-11-27 | 1995-06-20 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip removal process and apparatus |
| JP2005105263A (en) * | 2003-09-12 | 2005-04-21 | Yazaki Corp | Method for separating bonded body |
| JP4644455B2 (en) * | 2003-09-12 | 2011-03-02 | 矢崎総業株式会社 | Method for separating adhesive |
| JP2005281533A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Method for peeling member off |
| JP4660106B2 (en) * | 2004-03-30 | 2011-03-30 | 積水化学工業株式会社 | Part peeling method |
| JP2006124564A (en) * | 2004-10-29 | 2006-05-18 | Yazaki Corp | Method for separating bound body |
| WO2024046983A1 (en) * | 2022-08-31 | 2024-03-07 | Pac Tech - Packaging Technologies Gmbh | Method and device for separating a semiconductor component from a carrier |
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