CN109041548A - A kind of radiator for inside equipment - Google Patents

A kind of radiator for inside equipment Download PDF

Info

Publication number
CN109041548A
CN109041548A CN201811063208.2A CN201811063208A CN109041548A CN 109041548 A CN109041548 A CN 109041548A CN 201811063208 A CN201811063208 A CN 201811063208A CN 109041548 A CN109041548 A CN 109041548A
Authority
CN
China
Prior art keywords
heat
silica gel
heater element
conductive silica
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811063208.2A
Other languages
Chinese (zh)
Inventor
于海波
林繁涛
徐英辉
李贺龙
王兴媛
刘佳
王春雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
State Grid Corp of China SGCC
China Electric Power Research Institute Co Ltd CEPRI
Original Assignee
State Grid Corp of China SGCC
China Electric Power Research Institute Co Ltd CEPRI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by State Grid Corp of China SGCC, China Electric Power Research Institute Co Ltd CEPRI filed Critical State Grid Corp of China SGCC
Priority to CN201811063208.2A priority Critical patent/CN109041548A/en
Publication of CN109041548A publication Critical patent/CN109041548A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

Abstract

The invention discloses a kind of radiators for inside equipment characterized by comprising heat conductive silica gel, heat pipe, heat sink;The heat conductive silica gel is attached on heater element, and one end of heat pipe is connect with heat conductive silica gel, and the other end is connect with heat sink;The inside cavity of equipment, heat sink are located at the containment portion of equipment where heat conductive silica gel and heat pipe are located at heater element;Apparatus casing where radiator is in sealing state, solve using fan radiating mode cannot by Instrument Design at sealed construction, cannot well waterproof and dustproof the problem of.

Description

A kind of radiator for inside equipment
Technical field
This application involves heat dissipation equipment fields, and in particular to a kind of radiator for inside equipment.
Background technique
At work, if not taking cooling measure, the temperature of instrument is reaching the big instrument of usual electronic component calorific value After to a certain extent, it cannot work normally.In order to reach the cooling purpose to instrument, it is common practice to inside housings plus A fan is filled, the related heat of air is continuously discharged to outside shell, to achieve the purpose that radiating and cooling.But make Cannot be by Instrument Design at sealed construction with the radiating mode of fan, it cannot waterproof and dustproof well.
Summary of the invention
The application provides a kind of radiator for inside equipment, and solving cannot be by instrument using the radiating mode of fan Device is designed to sealed construction, cannot well waterproof and dustproof the problem of.
The application provides a kind of radiator for inside equipment, comprising: heat conductive silica gel, heat pipe, heat sink;It is described to lead Hot silica gel is attached on heater element, and one end of heat pipe is connect with heat conductive silica gel, and the other end is connect with heat sink;Heat conductive silica gel and heat The inside cavity of equipment, heat sink are located at the containment portion of equipment where pipe is located at heater element;Equipment where radiator Shell is in sealing state.
Preferably, further includes:
According to the calorific value of internal element, the quantity of heat pipe and the size of heat sink are set.
Preferably, the heat conductive silica gel is a kind of insulating materials, is fitted in the surface of heater element.
Preferably, further includes:
Heat conductive silica gel is fitted in the surface of heater element, for absorbing the heat of heater element.
Preferably, the heat pipe, specifically can be copper pipe, and the heat of the heater element for absorbing heat conductive silica gel passes Pass heat sink.
Preferably, the heat sink specifically can be aluminum alloy material.
Preferably, further includes:
The heat sink, the heat for transmitting heat pipe diffuse to surrounding by heat sink, reduce the heater element And the temperature of the inside cavity of equipment where the heater element.
A kind of radiator for inside equipment provided by the present application absorbs heater element by using heat conductive silica gel One end of heat pipe is connect by heat with heat conductive silica gel, and the other end is connect with heat sink, by the heat of heater element setting from sealing Standby enclosure interior is transmitted to the heat sink outside apparatus casing and radiates, and solving cannot be by instrument using the radiating mode of fan Device is designed to sealed construction, cannot well waterproof and dustproof the problem of.
Detailed description of the invention
Fig. 1 is a kind of construction for heat radiating device figure for inside equipment provided by the embodiments of the present application.
Specific embodiment
Many details are explained in the following description in order to fully understand the application.But the application can be with Much it is different from other way described herein to implement, those skilled in the art can be without prejudice to the application intension the case where Under do similar popularization, therefore the application is not limited by following public specific implementation.
Fig. 1 is please referred to, Fig. 1 is a kind of construction for heat radiating device figure for inside equipment provided by the embodiments of the present application, under Face combines Fig. 1 that device provided by the present application is described in detail.
A kind of radiator for inside equipment provided by the present application, comprising: heat conductive silica gel, heat pipe, heat sink;It is described Heat conductive silica gel is attached on heater element, and one end of heat pipe is connect with heat conductive silica gel, and the other end is connect with heat sink;Heat conductive silica gel with The inside cavity of equipment, heat sink are located at the containment portion of equipment where heat pipe is located at heater element;Setting where radiator Standby shell is in sealing state.
For the cooling measure of general instrument, it is common practice to install a fan additional inside housings, air is related Heat is continuously discharged to outside shell, to achieve the purpose that radiating and cooling.But for some high-precisions of belonging to Instrument and equipment, for example, electric energy meter state analytical instrument, the requirement of water proof and dust proof is with regard to relatively high, if it is empty also to exclude heat using fan Gas cannot accomplish higher degree of protection.So in order to solve this problem, radiator provided by the present application, to sealing The apparatus casing of state is filled not by the way of fan cooling by the heat dissipation being made of heat conductive silica gel, heat pipe and heat sink It sets, cools down to instrument.
First according to the calorific value of instrument internal element, the quantity of heat pipe and the size of heat sink are set, it is generally the case that Heater element is integrated circuit and high-power resistance.So can be according to the power calculation instrument internal element of heater element Calorific value, thus the size of the quantity of reasonable equipment heat pipe and heat sink,
As shown in Figure 1, in box house, there are two circuit boards, and circuit board is heater element, and heat conductive silica gel is fitted in hair The surface of thermal element, heat conductive silica gel are a kind of insulating materials, not will cause the short circuit of circuit, while being had again thermally conductive well Property, for absorbing the heat of heater element.The inside cavity of equipment where being located at heater element due to heat conductive silica gel and heat pipe, It is exactly the inside of cabinet shown in FIG. 1, and cabinet is sealing, after institute's heat conductive silica gel absorbs the heat of heater element, also not Heat can be distributed, at this moment just need to transmit the heat that heat conductive silica gel absorbs by heat pipe.One end of heat pipe with Heat conductive silica gel connection, the other end are connect with heat sink.Heat pipe specifically can be copper pipe, the hair for absorbing heat conductive silica gel The heat transfer of thermal element is to heat sink.From figure 1 it appears that heat sink is located at the outside of cabinet, that is, the chamber of equipment Outside body, heat sink specifically can be aluminum alloy material, and the heat for transmitting heat pipe diffuses to week by heat sink It encloses, the temperature of the inside cavity of equipment where reducing the heater element and the heater element, to realize the instrument of sealing The heat sinking function of equipment ensures the normal work of instrument and equipment.
The above embodiments are merely illustrative of the technical scheme of the present invention and are not intended to be limiting thereof, although referring to above-described embodiment pair The present invention is described in detail, those of ordinary skill in the art still can to a specific embodiment of the invention into Row modifies perhaps equivalent replacement and these exist without departing from any modification of spirit and scope of the invention or equivalent replacement Apply within pending claims of the invention.

Claims (7)

1. a kind of radiator for inside equipment characterized by comprising heat conductive silica gel, heat pipe, heat sink;It is described to lead Hot silica gel is attached on heater element, and one end of heat pipe is connect with heat conductive silica gel, and the other end is connect with heat sink;Heat conductive silica gel and heat The inside cavity of equipment, heat sink are located at the containment portion of equipment where pipe is located at heater element;Equipment where radiator Shell is in sealing state.
2. radiator according to claim 1, which is characterized in that further include:
According to the calorific value of internal element, the quantity of heat pipe and the size of heat sink are set.
3. radiator according to claim 1, which is characterized in that the heat conductive silica gel is a kind of insulating materials, fitting On the surface of heater element.
4. radiator according to claim 3, which is characterized in that further include:
Heat conductive silica gel is fitted in the surface of heater element, for absorbing the heat of heater element.
5. radiator according to claim 1, which is characterized in that the heat pipe specifically can be copper pipe, and being used for will The heat transfer for the heater element that heat conductive silica gel absorbs is to heat sink.
6. radiator according to claim 1, which is characterized in that the heat sink specifically can be aluminium alloy material Matter.
7. radiator according to claim 6, which is characterized in that further include:
The heat sink, the heat for transmitting heat pipe diffuse to surrounding by heat sink, reduce the heater element and institute The temperature of the inside cavity of equipment where stating heater element.
CN201811063208.2A 2018-09-12 2018-09-12 A kind of radiator for inside equipment Pending CN109041548A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811063208.2A CN109041548A (en) 2018-09-12 2018-09-12 A kind of radiator for inside equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811063208.2A CN109041548A (en) 2018-09-12 2018-09-12 A kind of radiator for inside equipment

Publications (1)

Publication Number Publication Date
CN109041548A true CN109041548A (en) 2018-12-18

Family

ID=64621972

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811063208.2A Pending CN109041548A (en) 2018-09-12 2018-09-12 A kind of radiator for inside equipment

Country Status (1)

Country Link
CN (1) CN109041548A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193534A (en) * 2006-11-29 2008-06-04 富准精密工业(深圳)有限公司 Heat radiator
CN101600325A (en) * 2009-07-02 2009-12-09 北京东土科技股份有限公司 A kind of combination heat abstractor of closed shell electronic equipment
CN101742872A (en) * 2008-11-14 2010-06-16 和硕联合科技股份有限公司 Radiation module and electronic device using same
US20120307452A1 (en) * 2011-05-30 2012-12-06 Foxconn Technology Co., Ltd. Portable electronic device with heat pipe
CN207604107U (en) * 2017-10-23 2018-07-10 江苏泽景汽车电子股份有限公司 A kind of radiator of HUD

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101193534A (en) * 2006-11-29 2008-06-04 富准精密工业(深圳)有限公司 Heat radiator
CN101742872A (en) * 2008-11-14 2010-06-16 和硕联合科技股份有限公司 Radiation module and electronic device using same
CN101600325A (en) * 2009-07-02 2009-12-09 北京东土科技股份有限公司 A kind of combination heat abstractor of closed shell electronic equipment
US20120307452A1 (en) * 2011-05-30 2012-12-06 Foxconn Technology Co., Ltd. Portable electronic device with heat pipe
CN207604107U (en) * 2017-10-23 2018-07-10 江苏泽景汽车电子股份有限公司 A kind of radiator of HUD

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20181218