CN109041438A - A kind of transfer of laser lithography PCB line pattern and moulding process - Google Patents
A kind of transfer of laser lithography PCB line pattern and moulding process Download PDFInfo
- Publication number
- CN109041438A CN109041438A CN201810952491.8A CN201810952491A CN109041438A CN 109041438 A CN109041438 A CN 109041438A CN 201810952491 A CN201810952491 A CN 201810952491A CN 109041438 A CN109041438 A CN 109041438A
- Authority
- CN
- China
- Prior art keywords
- ink
- line pattern
- moulding process
- laser lithography
- medical fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Abstract
The invention discloses a kind of transfer of laser lithography PCB line pattern and moulding process, include the following steps: 1) board surface treatment: board is surface-treated completely, guarantees to be coated with ink under surface free from admixture oxidizing condition；2) it is coated with photosensitive-ink: full working plate copper foil surface being covered by coating wheel, forms the ink of uniform thickness；3) ink solidification: dry film is formed after so that the solvent in wet ink is volatilized by the uniform temperature of tunnel furnace；4) photoetching line pattern: the light beam of different wave length energy is generated using laser and line pattern data, directly the working plate of existing photosensitive dry film is scanned；5) line map develops: by development medical fluid and ink chemistry reaction rinse, forming the anti-etching line pattern of protectiveness；6) circuit etching removal ink: being etched into route by alkalinity or acid medical fluid, the rear ink removed on route by alkaline striping medical fluid.
Description
Technical field
The present invention relates to PCB plate production method technical fields, more specifically, it relates to a kind of laser lithography PCB line
Road pattern transfer and moulding process.
Background technique
Traditional PCB line pattern transfer and moulding process are divided into two kinds, and one is printing technologies, and one is exposure developments
Technique, the line pattern that both last branch modes are formed are fabricated to copper foil circuit by the chemical reaction of acid and alkali etching
Layer.
It is logical that the process of printing technology is that computer photograph graphic documentation → light draws the line pattern positive film → film figure
Overexposure, which is transferred to figure printing screen plate, to be become negative figure → printing machine and scrapes screen printing ink and bite copper foil to form route to be etched
Protect figure.Light draws in the step of line pattern positive film that there are film lines and feature size length precision aspect to ask
Topic, precision controlling is in ± 0.05MM；Subsequent film figure is transferred to the step of figure printing screen plate becomes negative figure by exposure
The middle generation lines slickness and pattern precision that there are problems that the film and be converted to halftone figure, precision controlling is in ± 0.05MM；Most
Latter step will affect smooth lines and thickness and precision problem, precision controlling by frictioning pressure and halftone tension because ink is printed
In ± 0.10MM.Totally there is the partially long problem of thread-changing and debug time in above-mentioned technique, lines are smooth and figure length precision problem,
Precision controlling is in ± 0.15MM, it is also possible to be more than this margin of tolerance, can process to generate to the processing of rear process and client and lead to
Smooth degree decline.
The process of exposure development technique is that computer photograph graphic documentation → light draws the line pattern negative film film → film figure
Shape is transferred to the copper foil work for having been coated with the copper foil board of photosensitive ink → exposed by developer water development by exposure
Skill plate formed route want etched protective figure → by etching striping after formed copper foil circuit layer.There are film lines for the technique
With feature size length precision aspect problem, precision controlling is asked in ± 0.05MM, the consistency for existing simultaneously the film mostly set duplication
Precision controlling is inscribed in ± 0.10MM, there are also the film by Conservation environment variation cause the contraction distortion precision controlling of the film ±
0.15MM, total accuracy error of spending has been more than 0.15MM.
Summary of the invention
The object of the present invention is to provide a kind of transfer of laser lithography PCB line pattern and moulding process, it is intended to improve copper
The big pattern precision of lines slickness and technique of foil line pattern, precision overall control reduce finishing operations and add in ± 0.05MM
The unobstructed degree and Product Precision consistency of work, guarantee the smoothness that client uses；Overall reduction product is made because of multiple working procedure conversion
At the risk of scrap of the product, shorten the time of production debugging and tangent line；Production efficiency is improved by laser lithography equipment, changes and exposes
The single single machine poor efficiency of ray machine and highly energy-consuming state.
To achieve the above object, realized by following technological means: a kind of transfer of laser lithography PCB line pattern and at
Type technique, which comprises the steps of:
1) board is surface-treated: board is surface-treated to clean, dope under guarantee surface free from admixture oxidizing condition
Ink；
2) it is coated with photosensitive-ink: full working plate copper foil surface being covered by coating wheel, forms the oil of uniform thickness；
3) dry film of 4-6UM ink solidification: is formed after so that the solvent in wet ink is volatilized by the uniform temperature of tunnel furnace；
4) photoetching line pattern: the light beam of different wave length energy is generated using laser and line pattern data, directly to
There is the working plate of photosensitive dry film to scan, adhere to ink solidification using photochemistry molecular linkage principle, shading part is not changed
It learns reaction and passes through development liquid medicine water dissolution cleaning；
5) line map develops: by development medical fluid and the not no ink chemistry reaction rinse of molecular linkage, forming protectiveness
Anti-etching line pattern；
6) circuit etching removal ink: being etched into route by alkaline copper chloride or acidity of hydrochloric acid copper chloride medical fluid, after pass through
Ink on alkaline striping medical fluid removal route.
In order to reach more preferably effect, preferably:
The detailed process of step 1) is the dilution heat of sulfuric acid by 3-5% concentration, in 4-6 ms/min of transmission speed, is used
The fiber brush surface round brush of 320 mesh and 500 mesh, 1.2-1.5KG high pressure water rinse, air knife drying, 80-100 DEG C of hot-air seasoning.
The detailed process of step 2) is to adjust liquid photosensitive ink to viscosity 400-600mps with grease is opened, and uses 300-
350 mesh coating wheels adjust upper lower whorl gap according to plate thickness, by 4-6 ms/min of transmission speed, control wet film in 8-12UM thickness
It spends, baker is entered under the complete uniformity state in surface.
Continuous tunnel furnace head and the tail temperature is at 85-95 DEG C in step 3), and intermediate warm area is 105-110 DEG C, by 4-6 ms/min of speed
Pass through continuous tunnel furnace.
Control beam energy is 200-300MJ, scanning speed 180-240MM/S in step 4).
Development medical fluid described in step 5) is the sodium carbonate or solution of potassium carbonate of 1.2-1.5% concentration.
Etching process controls spray pressure 2.2-2.7KG in step 6), and temperature is 45-55 DEG C, control temperature when removing ink
Degree is 35-45 DEG C.
The advantages of the present invention over the prior art are that:
1, the technique for leading to laser lithography technique completion protectiveness line pattern, which eliminates, makes the film in traditional handicraft, the film
It is converted to halftone, three processes of screen painting figure eliminate the film, printing down, printing because more by material, environment, pressure, duplication
The factors such as the consistent sex differernce of set exposure film lead to line width line-spacing, the deformation of board pattern precision, the hidden danger of quality of breathing, from normal
Processing line the wide line is advised away from tolerance+10% and absolute difference ± 0.025-0.075MM, board pattern precision deformation, breathing ±
0.075-0.15MM is promoted in line width line-spacing tolerance absolute difference ± 0.025MM, board pattern precision deformation, breathing ±
In 0.05MM.
2, lead to laser lithography technique and reduce production procedure link, production procedure and tangent line time can be shortened, from routine
The 8-12 hours 20 points of kinds shortened till now.
3, lead to laser lithography technique and reduce production procedure link, especially contacted without the film and space of a whole page ink, reduced because of phenanthrene
Woods and exposure desk impurity level cause the ink defect of shading, cause to open a way, and can reduce the risk of scrap of the product, reduce product report
Useless quantity, it is overall improve product line the wide line away from guarantee and smooth degree, ensure that the superior function of product conduction and communication.
Specific embodiment
Invention is described in further detail below by specific embodiment, it is not to limit that following embodiment, which is descriptive,
Protection scope of the present invention of property.
Embodiment
A kind of transfer of laser lithography PCB line pattern and moulding process include the following steps: in the present invention
First is that technique copper-clad plate surface cleaning is handled: by the dilution heat of sulfuric acid of 3-5% concentration, in 4-6 ms/min of biography
Speed is sent, with the fiber brush surface round brush plate of 320 mesh and 500 mesh, 1.2-1.5KG high pressure water is rinsed, air knife drying, and 80-100 DEG C
Hot-air seasoning.
Second is that coating photosensitive-ink: liquid photosensitive ink being adjusted with grease is opened to viscosity 400-600mps, 300-350 is used
Mesh coating wheel adjusts upper lower whorl gap according to plate thickness, by 4-6 ms/min of transmission speed, controls wet film in 8-12UM thickness,
Enter baker under the complete uniformity state in surface.
Third is that ink solidification: forming the dry of 4-6UM after so that the solvent in wet ink is volatilized by the uniform temperature of tunnel furnace
Film；Wet ink enters the road 10-12 meter Sui, and tunnel is divided into 10-12 warm area, and at 85-95 DEG C, intermediate warm area is head and the tail temperature
105-110 DEG C, by 4-6 ms/min of speed, lithographic equipment is sent into using the automatic handgrip of cooling fan cooling in the outlet of tail warm area.
Fourth is that photoetching line pattern: the light beam of different wave length energy is generated using laser and line pattern data, it is directly right
The working plate scanning of existing photosensitive dry film, adheres to ink solidification using photochemistry molecular linkage principle, and shading part does not have
Chemical reaction passes through development liquid medicine water dissolution cleaning；It voluntarily positions, inhales flat copper foil whole plate, lithography laser is 9 and penetrates head, Dan Kuan altogether
12CM, pressing board width setting penetrate a number, energy 200-300MJ, and the sweep parameter of speed 180-240MM/S completes line pattern
Into development.
Fifth is that line map develops: being protected by development medical fluid and not the ink chemistry reaction rinse of molecular linkage, formation
The anti-etching line pattern of property；Detailed process is that the process line plate that photoetching is completed enters developing apparatus, 4-6 meters of speed/
Minute, with the sodium carbonate or solution of potassium carbonate of 1.2-1.5% concentration, 22-32 DEG C of temperature, under the conditions of spray pressure 1.7-2.3KG
Etching protectiveness line pattern is developed to, carries out the detection of ADI graphical element mass defect into etching is preceding.
Sixth is that circuit etching removal ink: after the detection of ADI line pattern, by 4-6 ms/min of speed, beryllium magnesium degree 1.19-
1.20 (content of copper ion 75-125 grams per liter, chloride ion 180-200 grams per liter, pH value 8.2-8.8 alkalies etching or copper from
Sub- content 65-105 grams per liter, the Acidic Liquid that HCL content is 8.5-9.5% etch, spray pressure 2.2-2.7KG, temperature 45-
Route figure layer is etched under the conditions of 55 DEG C of technological parameter.By with 0.2%NAOH and 10% ammonium hydroxide be formula remove film liquid, body
The ink (film) of product specific concentration 5-8%, 35-45 DEG C of state of the art removal surface of temperature become copper foil circuit layer pattern.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of laser lithography PCB line pattern transfer and moulding process, which comprises the steps of:
1) board is surface-treated: board being surface-treated completely, guarantees to be coated with ink under surface free from admixture oxidizing condition；
2) it is coated with photosensitive-ink: full working plate copper foil surface being covered by coating wheel, forms the ink of uniform thickness；
3) dry film of 4-6UM ink solidification: is formed after so that the solvent in wet ink is volatilized by the uniform temperature of tunnel furnace；
4) photoetching line pattern: the light beam of different wave length energy is generated using laser and line pattern data, directly to thoughts
The working plate of photosensitiveness dry film scans, and adheres to ink solidification using photochemistry molecular linkage principle, and shading part is anti-without chemistry
Being dissolved by developer water for answering is cleaned；
5) line map develops: by development medical fluid and the not no ink chemistry reaction rinse of molecular linkage, it is against corrosion to form protectiveness
The line pattern at quarter；
6) circuit etching removal ink: being etched into route by alkaline copper chloride or acidity of hydrochloric acid copper chloride medical fluid, after pass through alkalinity
Striping medical fluid removes the ink on route.
2. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
The detailed process of step 1) be by the dilution heat of sulfuric acid of 3-5% concentration, in 4-6 ms/min of transmission speed, with 320 mesh and
The fiber brush surface round brush of 500 mesh, 1.2-1.5KG high pressure water rinse, air knife drying, 80-100 DEG C of hot-air seasoning.
3. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
The detailed process of step 2) is to adjust liquid photosensitive ink to viscosity 400-600mps with grease is opened, and is coated with 300-350 mesh
Wheel adjusts upper lower whorl gap according to plate thickness, by 4-6 ms/min of transmission speed, controls wet film in 8-12UM thickness, surface is complete
Enter baker under whole uniformity state.
4. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
For continuous tunnel furnace head and the tail temperature at 85-95 DEG C, intermediate warm area is 105-110 DEG C in step 3), passes through tunnel by 4-6 ms/min of speed
Furnace.
5. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
Control beam energy is 200-300MJ, scanning speed 180-240MM/S in step 4).
6. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
Development medical fluid described in step 5) is the sodium carbonate or solution of potassium carbonate of 1.2-1.5% concentration.
7. a kind of laser lithography PCB line pattern transfer according to claim 1 and moulding process, which is characterized in that
Etching process controls spray pressure 2.2-2.7KG in step 6), and temperature is 45-55 DEG C, controlled at 35-45 when removing ink
℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810952491.8A CN109041438A (en) | 2018-08-21 | 2018-08-21 | A kind of transfer of laser lithography PCB line pattern and moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810952491.8A CN109041438A (en) | 2018-08-21 | 2018-08-21 | A kind of transfer of laser lithography PCB line pattern and moulding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109041438A true CN109041438A (en) | 2018-12-18 |
Family
ID=64626684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810952491.8A Pending CN109041438A (en) | 2018-08-21 | 2018-08-21 | A kind of transfer of laser lithography PCB line pattern and moulding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109041438A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104869A1 (en) * | 2001-10-05 | 2007-05-10 | Cabot Corporation | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN106658976A (en) * | 2017-03-06 | 2017-05-10 | 四会富士电子科技有限公司 | Graphic transfer production method of circuit board |
-
2018
- 2018-08-21 CN CN201810952491.8A patent/CN109041438A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070104869A1 (en) * | 2001-10-05 | 2007-05-10 | Cabot Corporation | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN106658976A (en) * | 2017-03-06 | 2017-05-10 | 四会富士电子科技有限公司 | Graphic transfer production method of circuit board |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 322300 No. 15 Changwen Road, Anwen Town, Pan'an County, Jinhua City, Zhejiang Province Applicant after: Zhejiang Rochtek Technology Co., Ltd. Address before: 322300 No. 15 Changwen Road, Anwen Town, Pan'an County, Jinhua City, Zhejiang Province Applicant before: ZHEJIANG LUOQI TAIKE ELECTRONIC CO., LTD. |
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| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181218 |
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| WD01 | Invention patent application deemed withdrawn after publication |