CN109032438A - Touch panel and its manufacturing method - Google Patents
Touch panel and its manufacturing method Download PDFInfo
- Publication number
- CN109032438A CN109032438A CN201810706419.7A CN201810706419A CN109032438A CN 109032438 A CN109032438 A CN 109032438A CN 201810706419 A CN201810706419 A CN 201810706419A CN 109032438 A CN109032438 A CN 109032438A
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- China
- Prior art keywords
- nano metal
- metal line
- conductive structure
- touch panel
- line conductive
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Abstract
The present invention provides a kind of touch panel and its manufacturing method, the manufacturing method of the touch panel includes: to provide a substrate；It is coated with nano metal line on the substrate to form nano metal line conductive layer；The nano metal line conductive layer is patterned to form nano metal line conductive structure；And fixed structure is formed in the nano metal line conductive structure, so as to be fixedly connected between nano metal line in the nano metal line conductive structure.By forming fixed structure in nano metal line conductive structure, so as to be fixedly connected between nano metal line in nano metal line conductive structure, it is possible thereby to be reliably connected between the nano metal line in nano metal line conductive structure, to improve sensitivity and the conductive capability of nano metal line conductive structure.
Description
Technical field
The present invention relates to display screen manufacturing technology field, in particular to a kind of touch panel and its manufacturing method.
Background technique
With touch panel in recent years communications industry rapid emergence, especially in the flourishing hair of mobile communication industry
Exhibition, touch panel become the preferred product of imaging display apparatus now at one stroke.The highest touch panel of utilization rate is mainly resistance
Formula touch panel and capacitance type touch-control panel, but the considerations of user is for controllability, ease for use and appearance, most meeting
Select capacitance type touch-control panel as its best preferred unit.
In the capacitance type touch-control panel of traditional smart phone, the material of touch control electrode be usually tin indium oxide (referred to as
ITO).The light transmittance of ITO is very high, and electric conductivity is preferable.But with incrementally increasing for touch panel size, it is especially applied to 15
When the very little above panel, the defect of ITO is more and more prominent, and most obvious one defect is exactly that the surface resistance of ITO is excessive, and price is high
It is expensive, it not can guarantee the good electric conductivity of large touch panel and enough sensitivity, can not be suitable for electronic product not yet
The development trend of disconnected low priceization.
In addition, in manufacturing method, ITO originally need vacuum chamber, higher depositing temperature and/or high annealing temperature with
High conductance is obtained, causes the integral manufacturing cost of ITO very expensive.Moreover, ito thin film is very fragile, though encounter compared with
The bending of small physical stress is also more easily damaged very much, therefore the tide in the emerging product market that wearable device gradually emerges
Under, ITO material has been unable to cope with the demand in market as conductive electrode and has gradually been eliminated.
Just because of this, industrial circle is being dedicated to developing the alternative materials of ITO always, and that is gradually developed and applied at present replaces
It include nano metal line, metal grill (Metal Mesh), carbon nanotube, Organic Conductive Films and graphene etc. for material.
Wherein, the nano-silver thread in nano metal line (Silver Nano Wires, abbreviation SNW) is many ITO substitution materials
The presently the most mature one kind of material.The electric conductivity that nano-silver thread has silver excellent, simultaneously because the dimensional effect of its Nano grade,
So that it is with excellent translucency and flexible resistance, therefore preferably material of the substitution ITO as touch control electrode.
But at present nano metal line as conductive layer there is a problem that poor sensitivity, conductive capability difference.
Summary of the invention
The purpose of the present invention is to provide a kind of touch panel and its manufacturing methods, to solve nano metal in the prior art
Line as conductive layer there is a problem that sensitivity and conductive capability difference.
In order to solve the above-mentioned technical problems, the present invention provides a kind of manufacturing method of touch panel, the touch panel
Manufacturing method include:
One substrate is provided；
It is coated with nano metal line on the substrate to form nano metal line conductive layer；
The nano metal line conductive layer is patterned to form nano metal line conductive structure；And
Fixed structure is formed in the nano metal line conductive structure, so that in the nano metal line conductive structure
It is fixedly connected between nano metal line.
Optionally, it in the manufacturing method of the touch panel, is formed in the nano metal line conductive structure solid
Structure is determined, so that being fixedly connected between the nano metal line in the nano metal line conductive structure includes: in the nanogold
The specific position belonged in line conductive structure forms fixed structure, so that specific location in the nano metal line conductive structure
It is fixedly connected between nano metal line.
Optionally, in the manufacturing method of the touch panel, by being carried out to the nano metal line conductive structure
Heat treatment forms fixed structure to form fusion point in the nano metal line conductive structure, and the fixed structure is melting
Point.
Optionally, in the manufacturing method of the touch panel, by laser irradiation to be led to the nano metal line
Electric structure is heat-treated.
Optionally, in the manufacturing method of the touch panel, by being carried out to the nano metal line conductive structure
Soldering forms fixed structure to form pad in the nano metal line conductive structure, and the fixed structure is weldering
Contact.
Optionally, in the manufacturing method of the touch panel, the thickness of the nano metal line conductive layer between
10nm~200nm.
Optionally, it in the manufacturing method of the touch panel, is formed in the nano metal line conductive structure solid
Determine structure, so that after being fixedly connected between the nano metal line in the nano metal line conductive structure, the touch panel
Manufacturing method further include:
An adhesion layer is formed on the substrate, and the adhesion layer covers the nano metal line conductive structure.
Optionally, in the manufacturing method of the touch panel, the material of the adhesion layer is selected from transparent optical cement,
The thickness of the adhesion layer is between 10nm~300nm.
The present invention also provides a kind of touch panel, the touch panel includes: substrate, the nanometer that is formed on the substrate
Metal wire conductive structure and the fixed structure being formed in the nano metal line conductive structure, the fixed structure make described receive
It is fixedly connected between nano metal line in rice metal wire conductive structure.
Optionally, in the touch panel, the fixed structure is fusion point or pad.
It is solid by being formed in nano metal line conductive structure in touch panel provided by the invention and its manufacturing method
Structure is determined, so as to be fixedly connected between the nano metal line in nano metal line conductive structure, it is possible thereby to make nano metal
It can be reliably connected between nano metal line in line conductive structure, to improve the sensitivity of nano metal line conductive structure
And conductive capability.
Detailed description of the invention
Fig. 1 is the flow diagram of the manufacturing method of the touch panel of the embodiment of the present invention；
Fig. 2 is the partial structure diagram of substrate provided by the embodiment of the present invention；
Fig. 3 is that the partial structure diagram after nano metal line is coated on device shown in Fig. 2；
Fig. 4 is that the partial structure diagram after nano metal line conductive layer is patterned on device shown in Fig. 3；
Fig. 5 is that the partial structure diagram after fixed structure is formed on device shown in Fig. 4；
Fig. 6 is that the structural schematic diagram after adhesion layer is formed on device shown in Fig. 5；
Wherein,
110- substrate；120- nano metal line conductive layer；130- nano metal line conductive structure；131- the first line knot
Structure；The second connecting line construction of 132-；140- fixed structure；150- adhesion layer；
Specific embodiment
Touch panel proposed by the present invention and its manufacturing method are made below in conjunction with the drawings and specific embodiments further detailed
It describes in detail bright.According to following explanation and claims, advantages and features of the invention will be become apparent from.It should be noted that attached drawing is equal
Using very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating the embodiment of the present invention
Purpose.
Firstly, referring to FIG. 1, it is the flow diagram of the manufacturing method of the touch panel of the embodiment of the present invention.Such as Fig. 1
Shown, the manufacturing method of the touch panel includes:
Step S10: a substrate is provided；
Step S11: it is coated with nano metal line solution on the substrate to form nano metal line conductive layer；
Step S12: the nano metal line conductive layer is patterned to form nano metal line conductive structure；
Step S13: forming fixed structure in the nano metal line conductive structure, so that the nano metal line is conductive
It is fixedly connected between nano metal line in structure.
In the embodiment of the present application, by forming fixed structure in nano metal line conductive structure, so that nano metal
It is fixedly connected between nano metal line in line conductive structure, it is possible thereby to make the nanogold in nano metal line conductive structure
Belonging to can be reliably connected between line, to improve sensitivity and the conductive capability of nano metal line conductive structure.
Subsequently, Fig. 2 to Fig. 6 is please referred to, to further describe the manufacturing method of the touch panel and by described
The manufacturing method of touch panel is formed by touch panel.Wherein, Fig. 2 is the part knot of substrate provided by the embodiment of the present invention
Structure schematic diagram；Fig. 3 is that the partial structure diagram after nano metal line solution is coated on device shown in Fig. 2；Fig. 4 is to scheme
The partial structure diagram after nano metal line conductive layer is patterned on device shown in 3；Fig. 5 is on device shown in Fig. 4
Partial structure diagram after forming fixed structure；Fig. 6 is that the structural representation after adhesion layer is formed on device shown in Fig. 5
Figure.
As shown in Fig. 2, providing substrate 110, wherein the substrate 110 can be hard substrate, or flexible base
Plate.For example, the substrate 110 can be the hard substrate of glass substrate etc..For another example, the material of the substrate 110 can be selected from
It is poly- in polymethyl methacrylate (PMMA), acrylic nitrile-butadiene-styrene (ABS), polyamide (PA), polybenzimidazoles
Butylene (PB), polybutylene terephthalate (PBT) (PBT), polycarbonate (PC), polyether-ether-ketone (PEEK), polyetherimide
(PEI), polyether sulfone (PES), polyethylene (PE), polyethylene terephthalate (PET), polyethylene tetrafluoroethene (ETFE),
Polyglycolic acid (PGA), polymethylpentene (PMP), polyformaldehyde (POM), polyphenylene oxide (PPE), polypropylene (PP), polystyrene
(PS), polytetrafluoroethylene (PTFE) (PTFE), polyurethane (PU), polyvinyl chloride (PVC), polyvinyl fluoride (PVF), polyvinylidene chloride
(PVDC), polyvinylidene fluoride (PVDF), styrene-acrylonitrile (SAN) etc., to be made to the flexible base board of bending.Into one
Step, the substrate 110 can also be to be formed with circuit/functional structure hard substrate or be formed with circuit/functional structure
Flexible base board.The control line etc. that the circuit/functional structure for example may include transistor and connect with transistor.
Then, as shown in figure 3, being coated with nano metal line solution on the substrate 110 to form nano metal line conduction
Layer 120.At this point, by the way that overlapped, mode connects the nano metal line in the nano metal line conductive layer 120 between each other, i.e.,
Nano metal line in the nano metal line conductive layer 120 is only merely to be in contact between each other, is easy under external force
It is separated from each other, thus the case where generating disconnection.
The nano metal line conductive layer 120 can specifically include the multi-layer nano gold of one layer of nano metal line or stacking
Belong to line.Preferably, the nano metal line conductive layer 120 with a thickness of 10nm~200nm, for example, the nano metal line is led
The thickness of electric layer 120 can be 10nm, 15nm, 20nm, 50nm, 80nm, 100nm, 120nm, 150nm, 180nm or 200nm
Deng.Wherein, the nano metal line conductive layer 120 can be formed by way of coating, further, the nano metal line
Conductive layer 120 can be formed by being once coated with or being repeatedly coated with and then carry out cured mode.
The nano metal line can be the nanometer of golden (Au), silver-colored (Ag), platinum (Pt), copper (Cu), cobalt (Co), palladium (Pd) etc.
Line.Due to the features such as silver is conductive and translucency is good, the nano metal line is preferably silver nanowires (i.e. nano-silver thread).
Referring to FIG. 4, in the embodiment of the present application, then, patterning the nano metal line conductive layer 120 and being received with being formed
Rice metal wire conductive structure 130.At this point, the nano metal line in the nano metal line conductive structure 130 passes through between each other
Overlapped, and mode connects, i.e., the nano metal line in the described nano metal line conductive structure 130 is only merely to connect between each other
Touching, is easy to be separated from each other under external force, thus the case where generating disconnection.
Wherein, the nano metal line conductive structure 130 can be connecting line construction.Further, the nano metal line
Conductive structure 130 may include the first connecting line construction 131 extended along a first direction and along second direction extend second
Connecting line construction 132.Wherein, first connecting line construction 131 and second connecting line construction 132 is vertical or substantially vertical phase
It hands over, the first direction can be horizontal X direction, and the second direction can be horizontal Y-direction.In other implementations of the application
In example, the nano metal line conductive structure 130 is specifically also possible to the structure after the patterning needed for other.
In the embodiment of the present application, the nano metal line conductive layer 120 can be patterned by etching technics to be formed
Nano metal line conductive structure 130.For example, it is conductive to pattern the nano metal line by existing dry etch process
Layer 120 is to form nano metal line conductive structure 130, wherein the selection of the etch technological condition can be according to the nanometer
The thickness of metal wire conductive layer 120 adjusts accordingly, and the application does not limit this.
Then, referring to FIG. 5, fixed structure 140 is formed in the nano metal line conductive structure 130, so that described
It is fixedly connected between nano metal line in nano metal line conductive structure 130.Specifically, the nano metal line can be made to lead
It is fixedly connected between nano metal line and the fixed structure 140 in electric structure 130, to pass through the fixed structure 140
So that being fixedly connected between nano metal line in the nano metal line conductive structure 130, the nanogold is which thereby enhanced
Belong to the connection reliability between the nano metal line in line conductive structure 130, is led to also just improve the nano metal line
The sensitivity of electric structure 130 and conductive capability.
In the embodiment of the present application, fixed structure 140 is formed in the nano metal line conductive structure 130, so that institute
State that be fixedly connected between the nano metal line in nano metal line conductive structure 130 include: in the nano metal line conduction knot
Specific position in structure 130 forms fixed structure 140, so that specific location in the nano metal line conductive structure 130
It is fixedly connected between nano metal line.It can guarantee general more important spy by forming fixed structure 140 in specific position
Position the reliability connected between the nano metal line at the place of setting.Thereby, it is possible to realize biggish reliability by lesser cost
Income.
For example, the substrate 110 be flexible base board, the specific position can correspond to the substrate 110 be prone to it is curved
Folding place.Specifically, the specific position can be the midline position etc. of the corresponding substrate 110.
For another example, the specific position can correspond to first connecting line construction 131 and second connecting line construction 132 intersection
Position；Alternatively, the specific position can correspond to midline position and boundary position of first connecting line construction 131 etc., institute
The Along ent position of second connecting line construction 132 can also be corresponded to (for example, by second connecting line construction by stating specific position
Three quartering point positions of 132 quarterings) and boundary position etc..
Specifically, can and being heat-treated to the nano metal line conductive structure 130 to form fusion point
Fixed structure 140 is formed in the nano metal line conductive structure 130, the fixed structure 140 is fusion point.Wherein it is possible to
It is whole to the nano metal line conductive structure 130 to be heat-treated, so that the nano metal line conductive structure 130 is whole
It melts and makes to be fixedly connected between all nano metal lines in the nano metal line conductive structure 130, at this point, entire institute
Stating nano metal line conductive structure 130 may be considered a fusion point；It can also be to the nano metal line conductive structure 130
Part be heat-treated so that the partial melting of the nano metal line conductive structure 130 and make the nano metal line
It is fixedly connected between local nano metal line in conductive structure 130, at this point, in the nano metal line conductive structure 130
Each local location will form fusion point.
Preferably, melting is formed to be heat-treated to the nano metal line conductive structure 130 by laser irradiation
It puts and forms fixed structure 140 in the nano metal line conductive structure 130.Laser irradiation can be accurately to needing to form
The position of fixed structure 140 is melted to form fixed structure 140, and further, laser irradiation can also be realized quickly
The formation of fusion point, improves process efficiency.
It, can also be by being welded to the nano metal line conductive structure 130 in the other embodiments of the application
Processing forms fixed structure 140, the fixed structure to form pad and in the nano metal line conductive structure 130
140 be pad.With the development of welding technology, by carrying out soldering energy to the nano metal line conductive structure 130
It is fixedly connected between enough nano metal lines easily, efficiently realized in the nano metal line conductive structure 130.In addition,
Due to the position to fixed structure 140 in the nano metal line conductive structure 130, there is no very high requirements, pass through welding
Processing is fully able to meet the requirement for forming the fixed structure 140.
It please then refer to Fig. 6, in the embodiment of the present application, the manufacturing method of the touch panel further include: in the base
An adhesion layer 150 is formed on plate 110, the adhesion layer 150 covers the nano metal line conductive structure 130.By described viscous
The adhesiveness between the nano metal line conductive structure 130 and the substrate 110 can be improved in attached layer 150, to improve institute
The reliability of nano metal line conductive structure 130 is stated, and then improves the sensitivity of the nano metal line conductive structure 130 and leads
Electric energy power.
Wherein, the adhesion layer 150 can be realized by coating process.Specifically, the adhesion layer 150 can cover it is whole
A substrate 110, the nano metal line conductive structure 130 is coated on the substrate 110 and the adhesion layer 150 is formed
Space in, it is possible thereby to make the nano metal line conductive structure 130 with the substrate 110 securely, be reliably connected.
In the embodiment of the present application, the material of the adhesion layer 150 can be selected from transparent optical cement (OC), the adherency
Layer 150 thickness be preferably between 10nm~300nm, for example, the thickness of the adhesion layer 150 can for 10nm, 15nm, 20nm,
50nm, 80nm, 100nm, 120nm, 150nm, 180nm, 200nm, 250nm or 300nm etc..By to the adhesion layer 150
Thickness selection, both can achieve good adhesiving effect, and also can be good at the quality of forming film for controlling the adhesion layer 150
And it is formed by the thickness of touch panel.
Correspondingly, the application also provides a kind of touch panel as made from the manufacturing method of above-mentioned touch panel.Please
With continued reference to Fig. 6, in the embodiment of the present application, the touch panel 100 includes: substrate 110, is formed on the substrate 110
Nano metal line conductive structure 130 and the fixed structure 140 that is formed in the nano metal line conductive structure 130, it is described
Fixed structure 140 makes to be fixedly connected between the nano metal line in the nano metal line conductive structure 130.Specifically, can be with
Make to be fixedly connected between nano metal line and the fixed structure 140 in the nano metal line conductive structure 130, thus logical
It crosses the fixed structure 140 to be fixedly connected between nano metal line in the nano metal line conductive structure 130, thus
The connection reliability between the nano metal line in the nano metal line conductive structure 130 is improved, to also just improve
The sensitivity of the nano metal line conductive structure 130 and conductive capability.Wherein, the fixed structure 140 can be fusion point
Or pad.
Further, the touch panel 100 can also include adhesion layer 150, and the adhesion layer 150 covers the nanometer
Metal wire conductive structure 130.The nano metal line conductive structure 130 and the base can be improved by the adhesion layer 150
Adhesiveness between plate 110 to improve the reliability of the nano metal line conductive structure 130, and then improves the nanometer
The sensitivity of metal wire conductive structure 130 and conductive capability.
To sum up, in touch panel provided in an embodiment of the present invention and its manufacturing method, by nano metal line
Fixed structure is formed in conductive structure, so as to be fixedly connected between the nano metal line in nano metal line conductive structure, thus
It can be reliably connected between the nano metal line in nano metal line conductive structure, to improve nano metal line
The sensitivity of conductive structure and conductive capability.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (10)
1. a kind of manufacturing method of touch panel, which is characterized in that the manufacturing method of the touch panel includes:
One substrate is provided；
It is coated with nano metal line solution on the substrate to form nano metal line conductive layer；
The nano metal line conductive layer is patterned to form nano metal line conductive structure；And
Fixed structure is formed in the nano metal line conductive structure, so that the nanometer in the nano metal line conductive structure
It is fixedly connected between metal wire.
2. the manufacturing method of touch panel as described in claim 1, which is characterized in that in the nano metal line conductive structure
Middle formation fixed structure, so that being fixedly connected between nano metal line in the nano metal line conductive structure includes: in institute
The specific position stated in nano metal line conductive structure forms fixed structure, so that specific in the nano metal line conductive structure
It is fixedly connected between nano metal line at position.
3. the manufacturing method of touch panel as described in claim 1, which is characterized in that by conductive to the nano metal line
Structure is heat-treated to form fusion point and forms fixed structure in the nano metal line conductive structure, the fixed knot
Structure is fusion point.
4. the manufacturing method of touch panel as claimed in claim 3, which is characterized in that by laser irradiation to the nanometer
Metal wire conductive structure is heat-treated.
5. the manufacturing method of touch panel as described in claim 1, which is characterized in that by conductive to the nano metal line
Structure carries out soldering and forms fixed structure in the nano metal line conductive structure to form pad, the fixation
Structure is pad.
6. such as the manufacturing method of touch panel according to any one of claims 1 to 5, which is characterized in that the nano metal
The thickness of line conductive layer is between 10nm~200nm.
7. such as the manufacturing method of touch panel according to any one of claims 1 to 5, which is characterized in that in the nanogold
Belong in line conductive structure and form fixed structure, so that fixed between the nano metal line in the nano metal line conductive structure connect
After connecing, the manufacturing method of the touch panel further include:
An adhesion layer is formed on the substrate, and the adhesion layer covers the nano metal line conductive structure.
8. the manufacturing method of touch panel as claimed in claim 7, which is characterized in that the material of the adhesion layer is selected from saturating
Bright optical cement, the thickness of the adhesion layer is between 10nm~300nm.
9. a kind of touch panel, which is characterized in that the touch panel includes: substrate, the nanogold that is formed on the substrate
The fixed structure for belonging to line conductive structure and being formed in the nano metal line conductive structure, the fixed structure make the nanometer
It is fixedly connected between nano metal line in metal wire conductive structure.
10. touch panel as claimed in claim 9, which is characterized in that the fixed structure is fusion point or pad.
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| CN201810706419.7A CN109032438B (en) | 2018-06-30 | 2018-06-30 | Touch panel and manufacturing method thereof |
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| CN201810706419.7A CN109032438B (en) | 2018-06-30 | 2018-06-30 | Touch panel and manufacturing method thereof |
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| CN109032438B (en) | 2022-12-02 |
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Application publication date: 20181218 Assignee: YUNGU (GU'AN) TECHNOLOGY Co.,Ltd.|BAZHOU YUNGU ELECTRONIC TECHNOLOGY Co.,Ltd.|KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CENTER Co.,Ltd. Assignor: KUNSHAN GO-VISIONOX OPTO-ELECTRONICS Co.,Ltd. Contract record no.: X2019990000156 Denomination of invention: Light-penetrating type touching control panel and its manufacture method License type: Common License Record date: 20191030 |
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