CN109032401A - Conductive laminate structure, the preparation method of conductive laminate structure and touch panel - Google Patents
Conductive laminate structure, the preparation method of conductive laminate structure and touch panel Download PDFInfo
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- CN109032401A CN109032401A CN201810703651.5A CN201810703651A CN109032401A CN 109032401 A CN109032401 A CN 109032401A CN 201810703651 A CN201810703651 A CN 201810703651A CN 109032401 A CN109032401 A CN 109032401A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The present invention provides a kind of conductive laminate structures, the preparation method and touch panel of conductive laminate structure, the opening for exposing the routing layer is formed on the corresponding adhesion promoting layer in the rim area, the nano metal line conductive layer filling opening with the routing layer to contact, increase the contact area of the nano metal line conductive layer and the cabling, and then electric conductivity and sensitivity are increased, the design requirement of narrow frame can also be met；Further, the size close to described routing layer one end of the opening is big further away from the size of described routing layer one end, the nano metal line conductive layer fills the opening, make the nano metal line conductive layer form buckle-type with the adhesion promoting layer by the opening to connect, the adhesion strength of the nano metal line conductive layer and the adhesion promoting layer is increased, and then indirectly enhances the adhesion strength of the nano metal line conductive layer and the substrate.
Description
Technical field
The present invention relates to the preparation sides of field of display technology more particularly to a kind of conductive laminate structure, conductive laminate structure
Method and touch panel.
Background technique
With the rapid development of science and technology, sci-tech product considers that human nature has been increasingly becoming trend because of usually exploitation design.Touch-control
Panel (Touch Panel) is convenient to use mode in tourist's guide system, ATM, portable electronic product because of it
And the fields such as industrial control system obtain more and more applications.
Touch panel orients touch position by receiving the touching of the contacts such as finger or stylus, then passes through controller
It reads the instruction of touch position and shows required image.The material of transparent electrode in the touch control electrode of traditional touch panel
Usually tin indium oxide (ITO), light transmittance is higher, and electric conductivity is also good.But the surface resistance of ITO is very big, applies
When on large-sized touch panel, the electric conductivity of touch panel and sensitivity not can guarantee.In addition, the integral manufacturing of ITO at
This is very expensive, and is easily destroyed.So nano metal line has been increasingly becoming the material of substitution ITO at present.However, passing
The nano metal line manufacture craft of system is difficult to meet the requirement of adhesiveness and narrow frame simultaneously.
Summary of the invention
The purpose of the present invention is to provide a kind of conductive laminate structures, the preparation method and touch surface of conductive laminate structure
Plate can meet the design requirement of adhesiveness and narrow frame simultaneously.
In order to achieve the above object, the present invention provides a kind of conductive laminate structures, comprising:
Substrate, the substrate include visible area and around the rim area of the visible area；
Routing layer, the routing layer are located on the rim area of the substrate；
Adhesion promoting layer, the adhesion promoting layer is located on the visible area and rim area of the substrate, and covers the routing layer, described
There is the opening of the exposure routing layer, the opening is arranged around the visible area in adhesion promoting layer；
Nano metal line conductive layer, the nano metal line conductive layer filling is described to be open and covers the adhesion promoting layer, with
It is electrically connected by the opening with the routing layer.
Optionally, the size being open close to described routing layer one end is big further away from the size of described routing layer one end,
Make the nano metal line conductive layer form buckle-type with the adhesion promoting layer by the opening to connect.
Optionally, shape of the opening along the section of the adhesion promoting layer thickness direction is inverted " t " type；Alternatively, described open
The shape in the section of adhesion promoting layer thickness direction described in opening's edge is trapezoidal.
Optionally, the routing layer includes a plurality of cabling, has gap, the gap exposed portion between every cabling
Divide the substrate, the nano metal line conductive layer filled in the opening covers the base of a plurality of cabling and gap exposure
Plate.
The present invention also provides a kind of preparation methods of conductive laminate structure, comprising:
There is provided a substrate, the substrate includes visible area and around the rim area of the visible area；
Routing layer is formed on the rim area of the substrate；
Adhesion promoting layer is formed on the visible area of the substrate and rim area, the adhesion promoting layer covers the routing layer, in institute
The opening that the exposure routing layer is formed in the adhesion promoting layer of rim area is stated, the opening is arranged around the visible area；
Nano metal line conductive layer is formed on the adhesion promoting layer, the nano metal line conductive layer filling opening is simultaneously
The adhesion promoting layer is covered, to be electrically connected by the opening with the routing layer.
Optionally, the step of forming the adhesion promoting layer and the opening include:
The first insulating layer, shape in the first insulating layer of the rim area are formed on the visible area of the substrate and rim area
At there is the first opening；
Form second insulating layer on the first insulating layer, be formed in the second insulating layer of the rim area with it is described
Second opening of the first opening alignment, first opening and second opening constitute the opening, first insulating layer
And the second insulating layer constitutes the adhesion promoting layer.
Optionally, it is formed after first opening, is formed before the second insulating layer, the conductive laminate structure
Preparation method further include:
Nano metal line solution is coated in first opening；
It is heating and curing to the nano metal line solution of the first opening coating.
Optionally, it is formed after second opening, the preparation method of the conductive laminate structure further include:
It is coated with nano metal line solution on the second insulating layer and in second opening；
It is heating and curing to the nano metal line solution in the second insulating layer and in second opening, described the
The cured nano metal line solution composition nano metal line is led in one opening and the second opening and in the second insulating layer
Electric layer.
Optionally, the step of forming the adhesion promoting layer and the opening include:
Third insulating layer and the 4th insulating layer are sequentially formed on the substrate；
Form third opening in the third insulating layer and the 4th insulating layer, third opening is through described the
Three insulating layers and the 4th insulating layer；
The third insulating layer for removing the third opening sidewalls makes the third be open and is opened up close to one end of the substrate
Width forms the opening, and the remaining third insulating layer and the 4th insulating layer constitute the adhesion promoting layer.
The present invention provides a kind of touch panel, the touch panel includes the conductive laminate structure.
In conductive laminate structure provided by the invention, the preparation method of conductive laminate structure and touch panel, described
The opening for exposing the routing layer is formed on the corresponding adhesion promoting layer in rim area, the opening surrounds the visible area, described to receive
Rice metal wire conductive layer filling it is described opening to be contacted with the routing layer, increase the nano metal line conductive layer with it is described
The contact area of cabling, and then electric conductivity and sensitivity are increased, the design requirement of narrow frame can also be met.
Further, size of the size close to described routing layer one end of the opening further away from described routing layer one end
Greatly, the nano metal line conductive layer fills the opening, make the nano metal line conductive layer by the opening with it is described
Adhesion promoting layer forms buckle-type connection, keeps the nano metal line conductive layer closer in conjunction with the adhesion promoting layer, increases institute
The adhesion strength for stating nano metal line conductive layer Yu the adhesion promoting layer is more difficult to the nano metal line conductive layer from the substrate
On fall off, and then indirectly enhance the adhesion strength of the nano metal line conductive layer and the substrate.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of conductive laminate structure provided in an embodiment of the present invention；
Fig. 2 a is the schematic diagram of one provided in an embodiment of the present invention opening；
Fig. 2 b is the schematic diagram of two provided in an embodiment of the present invention openings；
Fig. 3 is the schematic diagram of another conductive laminate structure provided in an embodiment of the present invention；
Fig. 4 is the flow chart of conductive laminate structure preparation method provided in an embodiment of the present invention；
Fig. 5 is the schematic diagram provided in an embodiment of the present invention that routing layer is formed on substrate；
Fig. 6 is the schematic diagram after first insulating layer of formation provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram provided in an embodiment of the present invention that the first opening is formed in the first insulating layer；
Fig. 8 is the schematic diagram after formation second insulating layer provided in an embodiment of the present invention；
Fig. 9 is the schematic diagram provided in an embodiment of the present invention that the second opening is formed in second insulating layer；
Figure 10 is the schematic diagram provided in an embodiment of the present invention for forming nano metal line conductive layer；
Figure 11 is the schematic diagram of formation third opening provided in an embodiment of the present invention；
Figure 12 is the schematic diagram provided in an embodiment of the present invention for widening the third opening；
Figure 13 is the schematic diagram provided in an embodiment of the present invention for forming touch control electrode；
Wherein, 1- substrate, 11- visible area, the rim area 12-, 2- routing layer, 3- adhesion promoting layer, the first insulating layer of 31-, 32-
Two insulating layers, 33- third insulating layer, the 4th insulating layer of 34-, 4- opening, 41- first are open, and 42- second is open, and 43- third is opened
Mouthful, 5- nano metal line conductive layer, the first branch of 51-, the second branch of 52-.
Specific embodiment
In the preparation process of the current conductive laminate structure including nano metal line, usually by nano metal line solution
It is coated directly on substrate to form nano metal line conductive layer.But nano metal line conductive layer is very poor to substrate adhesion,
So needing to be coated with one layer of adhesion promoting layer on nano metal line conductive layer, to improve between nano metal line conductive layer and substrate
Adhesive force.However, although coating adhesion promoting layer solves the adhesion problem of nano metal line conductive layer, but due to nanogold
The material for belonging to line conductive layer can mutually be incorporated with the material of adhesion promoting layer, greatly reduce connecing for nano metal line conductive layer and cabling
Contacting surface product, causes the electric conductivity of touch panel to decline.In this way, in order to increase the contact surface of nano metal line conductive layer and cabling
Product, have to increase the size of rim area, but so just be unable to satisfy the design requirement of narrow frame exploitation.That is, this receive
Rice metal wire manufacture craft is difficult to meet the requirement of adhesiveness and narrow frame simultaneously.
Based on above-mentioned discovery, the application provides a kind of conductive laminate structure, the preparation method and touch-control of conductive laminate structure
Panel forms the opening for exposing the routing layer on the corresponding adhesion promoting layer in the rim area, and the opening can described in
Vision area, the nano metal line conductive layer filling opening increase the nano metal line to contact with the routing layer
The contact area of conductive layer and the cabling, and then electric conductivity and sensitivity are increased, the design of narrow frame can also be met
Demand.
Further, size of the size close to described routing layer one end of the opening further away from described routing layer one end
Greatly, the nano metal line conductive layer fills the opening, make the nano metal line conductive layer by the opening with it is described
Adhesion promoting layer forms buckle-type connection, keeps the nano metal line conductive layer closer in conjunction with the adhesion promoting layer, increases institute
The adhesion strength for stating nano metal line conductive layer Yu the adhesion promoting layer is more difficult to the nano metal line conductive layer from the substrate
On fall off, and then indirectly enhance the adhesion strength of the nano metal line conductive layer and the substrate.
A specific embodiment of the invention is described in more detail below in conjunction with schematic diagram.According to following description,
Advantages and features of the invention will become apparent from.It should be noted that attached drawing is all made of very simplified form and using non-accurate
Ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Referring to Fig. 1, it is a kind of schematic diagram of conductive laminate structure provided in this embodiment.The conductive laminate structure
It is formed on a substrate 1, the substrate 1 is including visible area 11 and around the rim area 12 of the visible area 11, the conductive layer
Stack structure includes routing layer 2, and the routing layer 2 is located on the rim area 12 of the substrate 1；Adhesion promoting layer 3, the adhesion promoting layer 3
In on the visible area 11 and rim area 12 of the substrate 1, and the routing layer 2 is covered, had in the adhesion promoting layer 3 of the rim area 12
There is the opening 4 of the exposure routing layer 2, the opening 4 is arranged around the visible area 11；Nano metal line conductive layer 5, it is described
Nano metal line conductive layer 5 fills the opening 4 and covers the adhesion promoting layer 3, to pass through the opening 4 and the routing layer 2
Electrical connection.
Specifically, Fig. 2 a, 2b are please referred to, the rim area 12 of the substrate 1 has certain width, and the visible area 11 is logical
It is usually used in light transmission to show, the usual opaque display content with the protrusion visible area 11 in the rim area 12.Implement at one
In example, the substrate 1 is square, and the rim area 12 is then square ring-type.
Please continue to refer to Fig. 1, the routing layer 2 covers the rim area 12 of the substrate 1, i.e., the described routing layer 2 with it is described
Substrate 1 directly contacts, and compared to nano metal line, the adhesion strength between the routing layer 2 and the substrate 1 is bigger.Further,
The routing layer 2 includes a plurality of cabling, all has a gap between every cabling, it is preferable that between adjacent two cablings
Gap it is equal, every cabling can be used for drawing the touch control electrode of visible area 11 in subsequent technical process.Institute
It states gap and exposes the part substrate 1, be embedded in the nano metal line conductive layer 5 between the part in the opening 4
Every contacted with the substrate 1, and the adhesiveness between the routing layer 2 and the nano metal line conductive layer 5 is preferable, can be with
The nano metal line conductive layer 5 is further prevented to be detached from the substrate 1.In the present embodiment, since the rim area 12 is then in
Square ring, every cabling is also square ring.
Further, the adhesion promoting layer 3 covers the routing layer 2 and the corresponding substrate 1 of the visible area 11, the adhesion promoting layer
3 be usually sticking organic matter, for enhancing the adhesion strength between the nano metal line conductive layer 5 and the substrate 1.Institute
The material for stating adhesion promoting layer 3 at least partly can mutually incorporate in the thickness direction thereof with the material of the nano metal line conductive layer 5,
It is attached to the nano metal line conductive layer 5 preferably on the substrate 1, and the nanometer in nano metal line conductive layer 5
Metal wire is due to the adherency of the material of the adhesion promoting layer 3, to be not susceptible to vacillate, overlap joint is stronger, and then increases institute
State the conductivity and sensitivity of conductive laminate structure.
Further, the opening 4 is formed in the corresponding adhesion promoting layer 3 in the rim area 12, it is described as shown in Fig. 2 a, 2b
Opening 4 is located in the rim area 12, and surrounds the visible area 11, and for the opening 4, can be entirety is in
It is cyclic annular.The quantity of the cricoid opening 4 can be 1, be in " returning " type, as shown in Figure 2 a.The quantity of the cricoid opening 4
It is also possible to multiple, e.g. 2, as shown in Figure 2 b, the nano metal line conductive layer 5 and the increasing can be further enhanced
Adhesion strength between adhesion coating 3 makes the nano metal line conductive layer 5 be less susceptible to fall off from substrate 1.It is described opening 4 with it is described
The inward flange and outer edge of rim area 12 have a certain distance, are convenient for subsequent filling nano metal line conductive.It is described
The bottom-exposed of opening 4 goes out the part routing layer 2 and the part substrate 1, and the nano metal line conductive layer 5 is filled described
Opening 4 simultaneously extends over the adhesion promoting layer 3.Cabling described in 5 covering part of nano metal line conductive layer filled in the opening 4
Layer 2 stretches out and routing layer overlapped mode, the nano metal line conduction compared to traditional nano metal line from adhesion promoting layer
Layer 5 and the contact area of the routing layer 2 increased, so that conduction property is increased, it can while guaranteeing ducting capacity
Frame is reduced with adaptability, meets the design requirement of narrow frame.
Further, described to be open 4 close to the routing layer 2 one as shown in figure 3, on the vertical direction with the substrate 1
The cross-sectional width H at end further away from described 2 one end of routing layer cross-sectional width H ' greatly, make the opening 4 in up-small and down-big structure,
Make the nano metal line conductive layer 5 form buckle-type with the adhesion promoting layer 3 by the opening 4 to connect, to receive described in increase
Adhesion strength between rice metal wire conductive layer 5 and the adhesion promoting layer 3, and the adhesion promoting layer 3 is contacted with the substrate 1, so
Indirectly increase the adhesion strength between the nano metal line conductive layer 5 and the substrate 1.Optionally, described to be open 4 along it
The shape in the section of thickness direction can be inverted " t " type (as shown in Figure 1), and 4 forming step of opening of the inverted " t " type is simple,
Requirement to technique and equipment is lower；Alternatively, the shape in 4 section along its thickness direction that is open can be trapezoidal (such as Fig. 3
It is shown), that is, the side wall of the opening 4 is oblique, to further enhance the nano metal line conductive layer 5 and the thickening
Adhesion strength between layer 3；Certainly, the opening 4 can also be other shapes, no longer illustrate one by one here.
Referring to Fig. 4, its flow chart for the preparation method of conductive laminate structure provided in this embodiment, the conductive layer
The forming method of stack structure includes:
S1: providing a substrate, and the substrate includes visible area and around the rim area of the visible area；
S2: routing layer is formed on the rim area of the substrate；
S3: forming adhesion promoting layer on the visible area of the substrate and rim area, and the adhesion promoting layer covers the routing layer,
The opening of the exposure routing layer is formed in the adhesion promoting layer of the rim area, the opening is arranged around the visible area；
S4: nano metal line conductive layer is formed on the adhesion promoting layer, is opened described in the nano metal line conductive layer filling
Mouth simultaneously covers the adhesion promoting layer, to be electrically connected by the opening with the routing layer.
Specifically, the substrate 1 provides branch for the entire conductive laminate structure referring to Fig. 5, providing substrate 1 first
Support.The substrate 1 can be using the rigid substrates formed such as glass, metal or ceramic material, be also possible to using sub- gram
Power, polymethyl methacrylate (PMMA), acrylic nitrile-butadiene-styrene (ABS), polyamide (PA), polyimides
(PI), polybenzimidazoles polybutene (PB), polybutylene terephthalate (PBT) (PBT), polycarbonate (PC), polyether-ether-ketone
(PEEK), polyetherimide (PEI), polyether sulfone (PES), polyethylene (PE), polyethylene terephthalate (PET), poly- second
Alkene tetrafluoroethene (ETFE), polyethylene oxide, polyglycolic acid (PGA), polymethylpentene (PMP), polyformaldehyde (POM), polyphenylene oxide
(PPE), polypropylene (PP), polystyrene (PS), polytetrafluoroethylene (PTFE) (PTFE), polyurethane (PU), polyvinyl chloride (PVC), poly- fluorine
Ethylene (PVF), polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF) or styrene-acrylonitrile (SAN) etc. are any appropriate
Insulating materials formed flexible base board, the present invention is with no restriction.In the present embodiment, the substrate 1 is flexible base board.
Next, the routing layer 2 is formed on the rim area 12 of the substrate 1, as shown in figure 5, the routing layer 2 covers
It covers the rim area 12 and is directly contacted with the substrate 1.The material of the routing layer 4 can be silver, gold, tin indium oxide or stone
One of black alkene is a variety of, and in the present embodiment, the material of the routing layer 2 is nano silver, and the routing layer 2 passes through print
Dataller's skill is formed, and the routing layer 2 etching is then become a plurality of cabling using laser etching process.
Then Fig. 6 and Fig. 7 is please referred to, forms the first insulating layer 31 on the substrate 1, it is corresponding in the rim area 12
The first opening 41 is formed on first insulating layer 31.Specifically, as shown in fig. 6, first insulating layer 31 covers the routing layer 2
And the corresponding substrate 1 of the visible area 11, such as Fig. 7, first opening 41 is located at the rim area 12 corresponding first and insulate
In layer 31, the cross-sectional width h of first opening 41 is small compared with the width of the rim area 12, and 41 exposure of the first opening
The part routing layer 2 out, it can also be seen that first opening 41 is arranged around the visible area 11 from Fig. 2 a or 2b.
Next referring to Fig. 8, being coated with nano metal line solution in first opening 41, the nano metal line is molten
Liquid is dissolved in specific solvent for nano metal line and the aaerosol solution of formation, and it is molten which can be water, aqueous solution, ion
Or mixtures thereof liquid, saline solns, supercritical fluid, oil etc..It can also be containing such as dispersing agent, surface-active in the solvent
The additives such as agent, crosslinking agent, stabilizer, wetting agent or thickener.Populated nano metal line is molten in first opening 41
After liquid, heating, drying is carried out, to solidify to the nano metal line solution in first opening 41, to form the nanometer
First opening 41 is filled by first branch 51 of metal wire conductive layer 5, first branch 51.
Please continue to refer to Fig. 8 and Fig. 9, the second insulating layer 32 is formed, the second insulating layer 32 covers described first
Then insulating layer 31 forms the second opening 42 in the second insulating layer 32 of the surface of first opening 41, makes described the
One opening 41 is aligned with second opening 42.The section of the cross-sectional width h of first opening 41 second opening 42
Width h ' greatly, connects convenient for being subsequently formed buckle-type.First opening 41 and second opening 42 constitute the opening
4, first insulating layer 31 and the second insulating layer 32 constitute the adhesion promoting layer 3.
Optionally, first insulating layer 31 can be identical with the material of the second insulating layer 32, with described in the formation
Identical technique can be used when the first opening 41 and second opening 42, to have saved the cost of manufacture.Described first absolutely
The material of edge layer 31 and the second insulating layer 32 can be such as high molecular polymer, oxide, one in nitride material
Kind is a variety of, and the high molecular polymer can be polyvinyl alcohol (PVA), polyvinyl butyral (PVB resin), polyaniline
(PAN or PANI), polyphenylene ether (PPE), polyparaphenylene's acetylene (PPV), poly- 3,4- ethylidene dioxy pheno (PEDOT), polyphenyl second
Alkene sulfonic acid (PSS), poly- 3- hexyl thiophene (P3HT), poly- 3- octyl thiophene (P3OT), poly- C-61- butyric acid-methyl esters (PCBM) gather
[2- methoxyl group -5- (2- ethyl-hexyloxy)-Isosorbide-5-Nitrae-phenylene ethylene] (MEH-PPV) etc. has sticking organic material, the nitrogen
Compound can be silicon nitride, and the oxide can be silica.First insulating layer 31 and described second described in the present embodiment
The material of insulating layer 32 is using one of adhesive materials such as polyamide, polyurethane resin and epoxy resin or a variety of
Transparent optical cement made of allotment.
Using spraying or spin coating proceeding transparent optical sol solution is coated on the substrate 1, then by being heating and curing after
Form first insulating layer 31 or second insulating layer 32；In the present embodiment, first opening 41 and second opening 42
The mode for being all made of exposure development is formed, certainly, if first insulating layer 31 or second insulating layer 32 use transparent optical
Material other than glue, other modes can also be used by forming first opening 41 and second opening 42, and the present invention does not make
Limitation.Further, it is trapezoidal opening 4 to form section as shown in Figure 3, the exposure of exposure development use can be increase accordingly
The precision of light device still can be open by the method for exposure development by first if the precision of the exposure sources is sufficiently high
41 and it is described second opening 42 side wall be made into it is skewed.
Next, referring to Fig. 10, being coated with the nano metal line in the second insulating layer 32 and in the opening 4
Solution.Specifically, being coated with the nano metal line solution in the second insulating layer 32 and in second opening 42, go forward side by side
Row is heating and curing, and to form the second branch 52 of the nano metal line 5, second opening is filled by second branch 52
42.Firstth branch 51 contacts and is connected to second branch 52, makes first branch 51 and described second point
Portion 52 collectively forms the nano metal line conductive layer 5, due to the cross-sectional width h of first opening 41 second opening
42 cross-sectional width h ' greatly, makes the nano metal line in nano metal line second opening 42 in first opening 41
More, make the nano metal line conductive layer 5 form buckle-type with the adhesion promoting layer 3 to connect, it is conductive to increase nano metal line
Layer 5 and 3 adhesion strength of adhesion promoting layer.Optionally, the nano metal line conductive layer 5 includes in matrix and the insertion matrix
Nano metal line is overlapped between the nano metal line by molecular force to form conductive network, and the matrix is for protecting institute
Nano metal line is stated the influences of external environments such as not to be corroded, wear.Nano metal line solution uses the method shape of the coating
At on the adhesion promoting layer 3, the method for the coating includes but is not limited to: ink-jet broadcasts sowing, is intaglio printing, letterpress, soft
Print, nano impression, silk-screen printing, blade coating, rotary coating, needle draw (stylus plotting), slit type coating or stream
It applies.
Further, as shown in figure 11, in order to form up-small and down-big opening 4, it is possible, firstly, to the first shape on the substrate 1
At third insulating layer 33 and the 4th insulating layer 34, third is then formed in the third insulating layer 33 and the 4th insulating layer 34 and is opened
Mouth 43, the third opening 43 run through the third insulating layer 33 and the 4th insulating layer 34 and expose the part routing layer 2,
Then as shown in figure 12, leaned on by removing the third insulating layer 33 of 43 side walls of the third opening with widening the third opening 43
One end of the nearly substrate 1 keeps the opening 4 big further away from the size of described 1 one end of substrate close to the size of 1 one end of substrate,
To form the opening 4.
Optionally, when the third insulating layer 33 and the 4th insulating layer 34 are inorganic layer, such as: the third insulation
The material of layer 33 is silica, and the material of the 4th insulating layer 34 is silicon nitride, can etch institute using dry etch process
The third insulating layer 33 of third 43 inner walls of opening is stated, the etching gas can be such as NF3Or SF6One of or it is a variety of,
It is fast compared with the etch rate of silicon nitride to the etch rate of silica, the third insulating layer of 43 inner walls of the third opening can be etched
33 and to the third be open 43 inner walls the 4th insulating layer 34 generate influence it is smaller so that formed the opening 4 present
Small lower big structure, and the etching gas will not have an impact routing layer 2.
Optionally, when the third insulating layer 33 is organic layer, and the 4th insulating layer 34 is inorganic layer, such as: institute
The material for stating third insulating layer 33 is photoresist, and when the material of the 4th insulating layer 34 is silicon oxide or silicon nitride, it can be with
The photoresist of 43 inner walls of the third opening is dissolved using glass metal, and influence of the glass metal to silicon oxide or silicon nitride is very
It is small, so that the opening 4 formed is in up-small and down-big structure.Certainly, when the third insulating layer 33 has for others
When machine material, it can choose other organic solvents, no longer illustrate one by one herein.
It optionally, can be according to the third when the third insulating layer 33 and the 4th insulating layer 34 are organic layer
The difference of the molecular weight of insulating layer 33 and the 4th insulating layer 34 selects suitable organic solvent, makes the organic solvent to described the
The solution rate of the rate of dissolution of three insulating layers 33 the 4th insulating layer 34 is fast, makes the close described of the third opening 43
One end of substrate 1 is widened, to form the opening 4.
Using being initially formed third opening 43, then widen its formed close to the method for 1 one end size of substrate it is described
After opening 4, the nano metal line conductive layer 5 disposably can be formed in the opening 4 and in the second insulating layer 32,
Preparation process is simplified, to accelerate the efficiency of preparation.
Optionally, as shown in figure 13, the present embodiment additionally uses laser after forming the nano metal line conductive layer 5
Etching technics performs etching the nano metal line conductive layer 5, to form discrete touch-control electricity in the visible area 11
Pole is overlapped a plurality of cabling and the touch control electrode by subsequent technique.
In view of this, the present embodiment additionally provides a kind of touch panel, the touch panel includes the conductive laminate knot
Structure.Further, the touch panel further includes cover board and laminating layer, and the laminating layer is located at the conductive laminate structure and described
The conductive laminate structure and the cover board to be bonded between cover board.It can be coated on the cover board of the rim area 12 opaque
Ornament materials, the figure shown with the protrusion visible area 11.
It is to be appreciated that nano metal line herein can be gold (Au), silver (Ag), platinum (Pt), copper (Cu), cobalt
(Co), the nano wire of palladium (Pd) etc..Due to the features such as silver is conductive and translucency is good, the nano metal line is preferably silver
Nano wire.
To sum up, in conductive laminate structure provided in an embodiment of the present invention, the preparation method and touch surface of conductive laminate structure
In plate, the opening for exposing the routing layer is formed on the corresponding adhesion promoting layer in the rim area, the nano metal line is conductive
The layer filling opening increases the contact surface of the nano metal line conductive layer and the cabling to contact with the routing layer
Product, and then electric conductivity and sensitivity are increased, the design requirement of narrow frame can also be met；Further, the opening is leaned on
The size of nearly described routing layer one end is big further away from the size of described routing layer one end, and the nano metal line conductive layer fills institute
Opening is stated, so that the nano metal line conductive layer is formed buckle-type with the adhesion promoting layer by the opening and connect, increase institute
State the adhesion strength of nano metal line conductive layer Yu the adhesion promoting layer, so indirectly enhance the nano metal line conductive layer with
The adhesion strength of the substrate.
The above is only a preferred embodiment of the present invention, does not play the role of any restrictions to the present invention.Belonging to any
Those skilled in the art, in the range of not departing from technical solution of the present invention, to the invention discloses technical solution and
Technology contents make the variation such as any type of equivalent replacement or modification, belong to the content without departing from technical solution of the present invention, still
Within belonging to the scope of protection of the present invention.
Claims (10)
1. a kind of conductive laminate structure characterized by comprising
Substrate, the substrate include visible area and around the rim area of the visible area；
Routing layer, the routing layer are located on the rim area of the substrate；
Adhesion promoting layer, the adhesion promoting layer is located on the visible area and rim area of the substrate, and covers the routing layer, the thickening
There is the opening of the exposure routing layer, the opening is arranged around the visible area in layer；
Nano metal line conductive layer, the nano metal line conductive layer filling is described to be open and covers the adhesion promoting layer, to pass through
The opening is electrically connected with the routing layer.
2. conductive laminate structure as described in claim 1, which is characterized in that described to be open close to the ruler of described routing layer one end
The very little size further away from described routing layer one end is big, and the nano metal line conductive layer is made to pass through the opening and the adhesion promoting layer
Form buckle-type connection.
3. conductive laminate structure as claimed in claim 2, which is characterized in that the opening is along the adhesion promoting layer thickness direction
The shape in section is inverted " t " type；Alternatively, shape of the opening along the section of the adhesion promoting layer thickness direction is trapezoidal.
4. conductive laminate structure as described in claim 1, which is characterized in that the routing layer includes a plurality of cabling, every institute
Stating has gap between cabling, substrate described in the gap expose portion, the nano metal line conductive layer filled in the opening
Cover the substrate of a plurality of cabling and gap exposure.
5. a kind of preparation method of conductive laminate structure characterized by comprising
There is provided a substrate, the substrate includes visible area and around the rim area of the visible area；
Routing layer is formed on the rim area of the substrate；
Adhesion promoting layer is formed on the visible area of the substrate and rim area, the adhesion promoting layer covers the routing layer, on the side
The opening of the exposure routing layer is formed in the adhesion promoting layer in frame area, the opening is arranged around the visible area；
Nano metal line conductive layer is formed on the adhesion promoting layer, the nano metal line conductive layer is filled the opening and covered
The adhesion promoting layer, to be electrically connected by the opening with the routing layer.
6. the preparation method of conductive laminate structure as claimed in claim 5, which is characterized in that form the adhesion promoting layer and described
The step of opening includes:
The first insulating layer is formed on the visible area of the substrate and rim area, is formed in the first insulating layer of the rim area
First opening；
Second insulating layer is formed on the first insulating layer, is formed in the second insulating layer of the rim area and described first
Second opening of opening alignment, first opening and second opening constitute the opening, first insulating layer and institute
It states second insulating layer and constitutes the adhesion promoting layer.
7. the preparation method of conductive laminate structure as claimed in claim 6, which is characterized in that form first opening
Afterwards, it is formed before the second insulating layer, the preparation method of the conductive laminate structure further include:
Nano metal line solution is coated in first opening；
It is heating and curing to the nano metal line solution of the first opening coating.
8. the preparation method of conductive laminate structure as claimed in claims 6 or 7, which is characterized in that form second opening
Later, the preparation method of the conductive laminate structure further include:
It is coated with nano metal line solution on the second insulating layer and in second opening；
It is heating and curing to the nano metal line solution in the second insulating layer and in second opening, described first opens
Cured nano metal line solution constitutes the nano metal line conductive layer in mouth and the second opening and in the second insulating layer.
9. the preparation method of conductive laminate structure as claimed in claim 5, which is characterized in that form the adhesion promoting layer and described
The step of opening includes:
Third insulating layer and the 4th insulating layer are sequentially formed on the substrate；
Third opening is formed in the third insulating layer and the 4th insulating layer, the third opening is exhausted through the third
Edge layer and the 4th insulating layer；
The third insulating layer for removing the third opening sidewalls makes the third be open and is widened shape close to one end of the substrate
At the opening, the remaining third insulating layer and the 4th insulating layer constitute the adhesion promoting layer.
10. a kind of touch panel, which is characterized in that the touch panel includes leading as of any of claims 1-4
Electric layer stack structure.
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Application publication date: 20181218 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Assignor: The valley (Guan) Technology Co. Ltd. Contract record no.: X2019990000155 Denomination of invention: Conductive laminated structure, preparation method of conductive laminated structure, and touch panel License type: Common License Record date: 20191030 |
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