A kind of chain type polycrystalline acid etch automatic weighing device
Technical field
The present invention relates to crystal silicon solar batteries fields, and in particular to a kind of chain type polycrystalline acid etch automatic weighing device.
Background technique
It is a vital step in solar energy highly effective battery manufacturing process that solar battery, which etches polishing process, to finished product
The electrical property and EL yield of cell piece have great influence, and the uniformity of silicon chip back side reflectivity determines that back is blunt after etching
Change the uniformity of plated film, the uniformity of plated film determines the uniformity of laser opening rate and size.Therefore etching is in entire crystal silicon
Very important effect is played during manufacture of solar cells.
Chain type polycrystalline acid etch is one of solar cell fabrication process normal method, existing chain type polycrystalline acid etch
Equipment mainly uses the road 5-8-10 while running, and wet process acid etch is the PN that silicon chip back side and surrounding are eroded by chemically reacting
Knot to achieve the purpose that front and back insulate, while removing positive phosphorosilicate glass layer.Silicon wafer is reacted with the different degrees of of acid
Loss of weight also has fluctuation, to cause etching uneven, finally influences yields.The size of loss of weight, which becomes, influences product yield
A key factor, thus need that weighing personnel specially are arranged in existing crystal silicon solar batteries production producing line to weigh in time and subtract
Weight situation facilitates technologist to control producing line stability, so as to accurately hold the real-time loss of weight situation in each road so as to improve quarter
Difference caused by erosion is unstable, finally improves yields.Although this mode can improve the unstable institute of etching to a certain extent
Caused by difference, but due to existing weighting manner be manual weighing, this mode of operation is not only time-consuming and laborious, labor intensity
Greatly, working efficiency is low, and manually weighs easily because of visual fatigue caused by working long hours, and claims to generate leakage, prior
It is that artificial weighting manner causes weighing results uniformity poor, influence product due to having differences between different weighing personnel
Yields.
Summary of the invention
Present invention aim to address the deficiencies of above-mentioned test condition in the prior art, provide a kind of time saving and energy saving, work
The chain type polycrystalline acid etch automatic weighing device high-efficient, weighing results are stable.
The present invention solves technical solution used by above-mentioned the deficiencies in the prior art:
A kind of chain type polycrystalline acid etch automatic weighing device, it is described for being weighed to the silicon chip erosion loss of weight in etching groove
Etching groove is equipped with feed end and discharge end, which is characterized in that including Weighing mechanism and reading mechanism, the Weighing mechanism includes the
One weighing apparatus and the second weighing apparatus, in the feed end, second weighing apparatus is arranged described for the first weighing apparatus setting
Discharge end, first weighing apparatus and second weighing apparatus are all connected with the reading mechanism, and the reading mechanism obtains respectively
The numerical value of first weighing apparatus and second weighing apparatus, the numerical value of first weighing apparatus subtract second weighing apparatus
Numerical value is the etching loss of weight number of the silicon wafer.
Preferably, heretofore described first weighing apparatus and the second weighing apparatus are electronic balance.
Preferably, heretofore described reading mechanism is the general purpose computer with data processing software.
Preferably, heretofore described reading mechanism is dedicated data processor.
Preferably, heretofore described feed end is equipped with feeding manipulator, and the discharge end is equipped with blanking mechanical hand.
Preferably, heretofore described feeding manipulator is equipped with feeding sucker, and the blanking mechanical is equipped with blanking on hand
Sucker.
The invention has the advantages that due to chain type polycrystalline acid etch automatic weighing device of the present invention include Weighing mechanism and
Reading mechanism, the Weighing mechanism include the first weighing apparatus and the second weighing apparatus, and first weighing apparatus is arranged in the charging
End, second weighing apparatus, which is arranged, is all connected with the reading in the discharge end, first weighing apparatus and second weighing apparatus
Number mechanism, the reading mechanism obtain the numerical value of first weighing apparatus Yu second weighing apparatus, first weighing respectively
The numerical value that the numerical value of device subtracts second weighing apparatus is the etching loss of weight number of the silicon wafer, thus can be convenient using the present invention
The real-time etching loss of weight for efficiently obtaining silicon wafer in etching groove, facilitates technologist to control producing line stability, so as to improve etching
Difference caused by shakiness, finally improves yields.And the present invention obtains the etching loss of weight of silicon wafer using reading mechanism automatically,
It is not necessary that operating personnel manual weighing is specially arranged, high degree of automation is time saving and energy saving, and work efficiency is high, and weighing results are accurate, produces
Product yields greatly improves, and has broad application prospects.
Detailed description of the invention
Fig. 1 is the structural schematic block diagram of chain type polycrystalline acid etch automatic weighing device of the present invention.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
In the description of the present invention, it should be noted that the orientation or position of the instructions such as term " on ", "lower", "left", "right"
Setting relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, rather than
The device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot
It is interpreted as limitation of the present invention.
Fig. 1 shows a kind of structural schematic block diagram of chain type polycrystalline acid etch automatic weighing device of the present invention.Such as Fig. 1 institute
Show, chain type polycrystalline acid etch automatic weighing device described in the present embodiment, for etching loss of weight in etching groove 10 silicon wafer 20
It being weighed, the etching groove is equipped with feed end 11 and discharge end 12, and arrow represents silicon wafer traffic direction in etching groove in Fig. 1,
The automatic weighing device includes Weighing mechanism and reading mechanism 40, wherein as shown in Figure 1, the Weighing mechanism includes first
Weighing apparatus 31 and the second weighing apparatus 32, first weighing apparatus 31 are arranged in the feed end 11, and second weighing apparatus 32 is set
It sets in the discharge end 12, first weighing apparatus 31 and second weighing apparatus 32 are all connected with the reading mechanism 40, described
Reading mechanism 40 obtains the numerical value of first weighing apparatus Yu second weighing apparatus respectively, and the numerical value of first weighing apparatus subtracts
Go the numerical value of second weighing apparatus for the etching loss of weight number of the silicon wafer.
Preferably, the first weighing apparatus 31 described in the present embodiment and the second weighing apparatus 32 are electronics day
Flat, structure is simple, low in cost, and weighing is convenient and accurate.
Preferably, reading mechanism 40 described in the present embodiment is the general-purpose computations with data processing software
Machine.First weighing apparatus 31 and second weighing apparatus 32 weigh weight of the silicon wafer before etching and after etching respectively, and divide
Acquired weight computer is not sent to, computer calculates the second weighing apparatus number using internal data processing software automatically
The difference of value and the first weighing apparatus numerical value, the etching loss of weight number of the as described silicon wafer carry out data processing using computer, convenient fast
Prompt and accuracy rate is high.
Preferably, reading mechanism described in the present embodiment is dedicated data processor.
Preferably, as shown in Figure 1, feed end 11 described in the present embodiment is equipped with feeding manipulator 110, institute
Discharge end 12 is stated equipped with blanking mechanical hand 120.It can be convenient using feeding manipulator 110 and blanking mechanical hand 120 and efficiently will
Weighed silicon wafer is wanted to be placed on the first weighing apparatus and the second weighing apparatus, without manually participating in, high degree of automation, operation is just
Benefit.
Preferably, as shown in Figure 1, feeding manipulator 110 described in the present embodiment is equipped with feeding sucker
111, the blanking mechanical hand 120 is equipped with blanking sucker 121, can be convenient surely using feeding sucker 111 and blanking sucker 121
Fixed will weighed silicon wafer crawl, raising operation stability and safety.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.