CN109027819A - Led远光探照灯 - Google Patents
Led远光探照灯 Download PDFInfo
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本发明提供一种LED远光探照灯,包括散热基座、基板、反光碗、光源组件、灯壳、透光镜、压紧套及连接座,所述的散热基座设置在基板的背部,与基板连接,所述的基板上安装光源组件,所述的散热基座上设置灯壳,所述的灯壳一端与散热基座紧固连接,灯壳的另一端设置透光镜,所述的透光镜通过压紧套与灯壳连接,所述的灯壳内设置反光碗,所述的反光碗两端开口,且一端开口直径大,另一端开口直径小,反光碗的开口直径小的一端与基板连接,反光碗的开口直径大的一端与灯壳连接,并与透光镜对应,所述的光源组件设置在反光碗内的基板上,所述的灯壳下端设置连接座。使用方便具有节能、轻型、超高亮、射程远、发热少、寿命长、衰减小等优点。
Description
技术领域
本发明涉及照明设备技术领域,具体涉及一种LED远光探照灯。
背景技术
探照灯是一种装置,具有强大的光源以及一面能将光线集中投射于特定方向的凹面镜,用于远距离照明和搜索的用途,探照灯多用于国防、边防、远洋等领域的远距离照明和搜索,要求探照灯灯具的光通量大,出光角小,灯具的体积小,照射距离远,通常照射距离要达到5KM,目前远光探照灯多采用氙气灯作为光源,其功率在7000W左右,才能达到远光探照灯的照射距离要求,这种探照灯的缺点是,灯具光源的寿命短、价格贵、功耗大、发热量大、成本高。
发明内容
综上所述,为了克服现有技术问题的不足,本发明提供一种LED远光探照灯,它是以LED为光源,采用晶圆级白光CSP无封装芯片,采用倒装共晶工艺,利用氮化铝陶瓷基板,采用无氧铜散热基座,LED光源700W就能达到照射5KM的远距离探照要求,氮化铝陶瓷基板及无氧铜散热基座散热效果好,本发明结构简单、使用方便具有节能、轻型、超高亮、射程远、发热少、寿命长、衰减小等优点。
为解决上述技术问题,本发明采用的技术方案为:
一种LED远光探照灯,其中:包括散热基座、基板、反光碗、光源组件、灯壳、透光镜、压紧套及连接座,所述的散热基座设置在基板的背部,与基板连接,所述的基板上安装光源组件,所述的散热基座上设置灯壳,所述的灯壳一端与散热基座紧固连接,灯壳的另一端设置透光镜,所述的透光镜通过压紧套与灯壳连接,所述的灯壳内设置反光碗,所述的反光碗两端开口,且一端开口直径大,另一端开口直径小,反光碗的开口直径小的一端与基板连接,反光碗的开口直径大的一端与灯壳连接,并与透光镜对应,所述的光源组件设置在反光碗内的基板上,所述的灯壳下端设置连接座。
进一步,所述的透光镜与反光碗之间设置密封环。
进一步,所述的散热基座与灯壳之间设置密封垫。
进一步,所述的散热基座为无氧铜散热座。
进一步,所述的基板为氮化铝陶瓷基板。
进一步,所述的光源组件包括LED芯片、荧光膜及透明硅胶球头,所述的LED芯片四周覆荧光膜,LED芯片被荧光膜包裹,所述的荧光膜外设置有透明硅胶球头,所述的透明硅胶球头为半球形结构。
进一步,所述的基板与LED芯片通过晶圆级CSP无封装技术连接。
进一步,所述的LED芯片为倒装共晶LED芯片。
本发明的有益效果为:
1、本发明构思巧妙,以LED为光源,采用晶圆级白光CSP无封装芯片,采用倒装共晶工艺,利用氮化铝陶瓷基板,采用无氧铜散热基座,LED光源700W就能达到照射5KM的远距离探照要求,氮化铝陶瓷基板及无氧铜散热基座散热效果好,本发明结构简单、使用方便具有节能、轻型、超高亮、射程远、发热少、寿命长、衰减小等优点。
2、本发明的光源组件的LED芯片外设置荧光膜,荧光膜外设置半球形的透明硅胶球头,半球形的透明硅胶球头,能够调节光线发散角度,增加亮度,具有很好的聚光效果。
附图说明
图1为本发明的结构示意图;
图2为本发明光源组件的结构示意图;
图中:散热基座1;基板2;反光碗3;光源组件4;灯壳5;透光镜6;压紧套7;连接座8;密封垫9;密封环10;LED芯片401;荧光膜402;透明硅胶球头403。
具体实施方式
下面结合附图及实施例对本发明作进一步的详细说明。
如图1图2所示,一种LED远光探照灯,包括散热基座1、基板2、反光碗3、光源组件4、灯壳5、透光镜6、压紧套7及连接座8,所述的散热基座1设置在基板2的背部,与基板2连接,所述的基板2为氮化铝陶瓷基板2,所述的散热基座1为无氧铜散热座,所述的基板2上安装光源组件4,所述的光源组件4包括LED芯片401、荧光膜402及透明硅胶球头403,所述的LED芯片401四周覆荧光膜402,LED芯片401被荧光膜402包裹,所述的荧光膜402外设置有透明硅胶球头403,所述的透明硅胶球头403为半球形结构,所述的基板2与LED芯片401通过晶圆级CSP无封装技术连接,所述的LED芯片401为倒装共晶LED芯片401,所述的散热基座1上设置灯壳5,所述的散热基座1与灯壳5之间设置密封垫9,所述的灯壳5一端与散热基座1紧固连接,灯壳5的另一端设置透光镜6,所述的透光镜6通过压紧套7与灯壳5连接,所述的灯壳5内设置反光碗3,所述的反光碗3两端开口,且一端开口直径大,另一端开口直径小,反光碗3的开口直径小的一端与基板2连接,反光碗3的开口直径大的一端与灯壳5连接,并与透光镜6对应,所述的光源组件4设置在反光碗3内的基板2上,所述的透光镜6与反光碗3之间设置密封环10,所述的灯壳5下端设置连接座8。
在使用时,首先将透明硅胶球头403罩装在LED芯片401上,基板2与LED芯片401通过晶圆级CSP无封装技术连接, LED芯片401为倒装共晶LED芯片401,基板2为氮化铝陶瓷基板2,在氮化铝陶瓷基板2后安装无氧铜散热座,在无氧铜散热座设置接线孔,电线穿过无氧铜散热座连接氮化铝陶瓷基板2为光源组件4提供电源,无氧铜散热座安装螺钉连接灯壳5一端,在灯壳5与无氧铜散热座之间安装密封垫9,灯壳5另一端设置有用于连接透光罩的螺纹,灯壳5内设置反光碗3,反光碗3的开口直径小的一端与基板2连接,反光碗3的开口直径大的一端与灯壳5连接,并与透光镜6对应,光源组件4设置在反光碗3内的基板2上,反光碗3将光源组件4发出的光经过一定角度的反射,使光源在一定距离内聚光,照射更远,在透光罩内设置密封环10与灯壳5密封,灯壳5细端在靠近无氧铜散热座处设置连接座8,连接座8与灯壳5紧固连接。
要说明的是,以上所述实施例是对本发明技术方案的说明而非限制,所属技术领域普通技术人员的等同替换或者根据现有技术而做的其它修改,只要没超出本发明技术方案的思路和范围,均应包含在本发明所要求的权利范围之内。
Claims (9)
1.一种LED远光探照灯,其特征在于:包括散热基座、基板、反光碗、光源组件、灯壳、透光镜、压紧套及连接座,所述的散热基座设置在基板的背部,与基板连接,所述的基板上安装光源组件,所述的散热基座上设置灯壳,所述的灯壳一端与散热基座紧固连接,灯壳的另一端设置透光镜,所述的透光镜通过压紧套与灯壳连接,所述的灯壳内设置反光碗,所述的反光碗两端开口,且一端开口直径大,另一端开口直径小,反光碗的开口直径小的一端与基板连接,反光碗的开口直径大的一端与灯壳连接,并与透光镜对应,所述的光源组件设置在反光碗内的基板上,所述的灯壳下端设置连接座。
2.根据权利要求1所述的LED远光探照灯,其特征在于:所述的透光镜与反光碗之间设置密封环。
3.根据权利要求1所述的LED远光探照灯,其特征在于:所述的散热基座与灯壳之间设置密封垫。
4.根据权利要求1所述的LED远光探照灯,其特征在于:所述的散热基座为无氧铜散热座。
5.根据权利要求1所述的LED远光探照灯,其特征在于:所述的基板为氮化铝陶瓷基板。
6.根据权利要求1所述的LED远光探照灯,其特征在于:所述的基板为氮化铝陶瓷基板。
7.根据权利要求1所述的LED远光探照灯,其特征在于:所述的光源组件包括LED芯片、荧光膜及透明硅胶球头,所述的LED芯片四周覆荧光膜,LED芯片被荧光膜包裹,所述的荧光膜外设置有透明硅胶球头,所述的透明硅胶球头为半球形结构。
8.根据权利要求7所述的LED远光探照灯,其特征在于:所述的基板与LED芯片通过晶圆级CSP无封装技术连接。
9.根据权利要求7所述的LED远光探照灯,其特征在于:所述的LED芯片为倒装共晶LED芯片。
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