CN109021859B - Stirring method of conductive adhesive - Google Patents
Stirring method of conductive adhesive Download PDFInfo
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- CN109021859B CN109021859B CN201810649123.6A CN201810649123A CN109021859B CN 109021859 B CN109021859 B CN 109021859B CN 201810649123 A CN201810649123 A CN 201810649123A CN 109021859 B CN109021859 B CN 109021859B
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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Abstract
The invention discloses a stirring method of conductive adhesive, which comprises the following steps: preparing a conductive adhesive material based on the temperature return requirement of the conductive adhesive; weighing the conductive adhesive material based on the use requirement of the conductive adhesive; setting stirring parameters for the stirring stage and the defoaming stage respectively, wherein the stirring parameters comprise rotation speed and revolution speed; and (3) putting the conductive adhesive material into stirring equipment, and stirring the conductive adhesive material based on the stirring parameters. According to the stirring method of the conductive adhesive, the conductive adhesive is fully stirred by adopting revolution and rotation, so that the conductive adhesive material is acted by centrifugal force in the material cup, and the bubbles are separated out under the action of upward pushing generated by specific gravity separation motion along the vector direction and the self weight of the conductive adhesive, so that the number of cavities in a unit area is greatly reduced, the shearing strength of a vibrator can be greatly increased, the problem of poor resistance consistency is solved, and the characteristics of reliability, shock resistance, impact resistance and the like of a product are improved.
Description
Technical Field
The invention relates to a stirring method of a conductive adhesive. And more particularly, to a method of stirring a conductive paste for a crystal element device.
Background
The conductive adhesive is an adhesive which is composed of conductive filler and metals such as silver, copper and the like, has certain conductive performance after being cured or dried, generally takes matrix resin and conductive filler, namely conductive particles as main components, and combines the conductive particles together through the bonding action of the matrix resin to form a conductive path so as to realize the conductive connection of the bonded materials.
Because the matrix resin of the conductive adhesive is an adhesive, the conductive adhesive can be bonded at a proper curing temperature, for example, the epoxy resin adhesive can be cured at the temperature of between room temperature and 150 ℃ and is far lower than the welding temperature of more than 200 ℃ of tin-lead welding, so that material deformation, thermal damage of electronic devices and formation of internal stress which are possibly caused by high welding temperature are avoided. Meanwhile, due to the rapid development of miniaturization and miniaturization of electronic elements and high density and high integration of printed circuit boards, the minimum pitch of 0.65mm of lead-tin soldering can not meet the actual requirement of conductive connection, and conductive adhesive can be made into slurry to realize high linear resolution. The conductive adhesive has simple process and easy operation, can improve the production efficiency and also avoids the environmental pollution caused by heavy metal lead in the tin-lead solder. Therefore, conductive paste has become an indispensable new material in the electronic industry.
The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain special requirements on the conductivity and the adhesive bonding strength. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like. The conductive paste can be classified into silver-based conductive paste, gold-based conductive paste, copper-based conductive paste, carbon-based conductive paste, and the like according to the kind of conductive particles in the conductive paste, and the most widely used conductive paste is silver-based conductive paste.
Before the conductive adhesive is used, the conductive adhesive needs to be fully stirred, so that the electric filler particles in the conductive adhesive are uniformly distributed. During the stirring process, external air bubbles may be introduced to deteriorate the compactness of the conductive adhesive, and the fixing and supporting function of the conductive adhesive is weakened. The conductive ions of the conductive adhesive after the dispensing on the shelf are distributed unevenly or the bubbles in the conductive adhesive are more, so that the movement of the conductive particles in the adhesive is hindered, and the resistance consistency of one of the electrical performance indexes of the product is poor. Therefore, the stirring effect of the conductive adhesive, such as the uniformity and density of the adhesive, the number of internal bubbles, the shearing strength of the quartz vibrator after the electrode is placed on the frame and the like, plays an important role in the performance of the product.
Therefore, it is desirable to provide a method of stirring a conductive paste that overcomes at least one of the above problems.
Disclosure of Invention
The invention aims to provide a stirring method of a conductive adhesive, which is used for uniformly distributing electric filler particles in the conductive adhesive, reducing the number of cavities in a unit area and improving the bonding shearing force, thereby improving the resistance consistency of a product and improving the characteristics of the product, such as reliability, shock resistance, impact resistance and the like.
In order to achieve the purpose, the invention adopts the following technical scheme on one hand:
a stirring method of a single-component conductive adhesive comprises the following steps:
step S1: preparing a conductive adhesive material based on the temperature return requirement of the conductive adhesive;
step S2: weighing the conductive adhesive material based on the use requirement of the conductive adhesive;
step S3: stirring parameters are respectively set for the stirring stage and the defoaming stage, the stirring parameters comprise rotation speed and revolution speed, wherein,
and (3) stirring: the rotation speed is set to 1500-1800 rpm, and the revolution speed is set to
500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to 1500-2000 rpm, and the revolution speed is set to
30-100 revolutions per minute;
step S4: and (3) putting the conductive adhesive material into stirring equipment, and stirring the conductive adhesive material based on the stirring parameters.
Preferably, the agitation parameters further include time.
Further preferably, the time of the stirring stage is 3 to 5 minutes.
More preferably, the time of the defoaming stage is 0.5 to 2 minutes.
In order to achieve the purpose, the other aspect of the invention adopts the following technical scheme:
a stirring method of a multi-component conductive adhesive is characterized by comprising the following steps:
step S1: preparing each component conductive adhesive material in the multi-component conductive adhesive material based on the temperature return requirement of the conductive adhesive;
step S2: weighing each component conductive adhesive material in the multi-component conductive adhesive material based on the use requirement of the conductive adhesive;
step S3: for each component conductive adhesive material in the multi-component conductive adhesive material, stirring parameters are respectively set in a stirring stage and a defoaming stage, the stirring parameters comprise a rotation speed and a revolution speed, wherein,
and (3) stirring: the rotation speed is set to 1500-1800 rpm, and the revolution speed is set to
500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to 1500-2000 rpm, and the revolution speed is set to
30-100 revolutions per minute;
step S4: putting each component of the conductive adhesive material in the multi-component conductive adhesive material into stirring equipment, and stirring each component of the conductive adhesive material in the multi-component conductive adhesive material based on stirring parameters;
step S5: taking out each component of the conductive adhesive material from the stirred multi-component conductive adhesive material and mixing based on the proportion of each component of the conductive adhesive material in the multi-component conductive adhesive material;
step S6: for the multi-component conductive adhesive material, stirring parameters are respectively set for a stirring stage, a defoaming stage and a mixing stage, wherein,
and (3) mixing: the rotation speed is set to be 500-800 r/min, and the revolution speed is set to be
200-400 rpm;
and (3) stirring: the rotation speed is set to 1500-1800 rpm, and the revolution speed is set to
500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to 1500-2000 rpm, and the revolution speed is set to
30-100 revolutions per minute;
step S7: and stirring the multi-component conductive adhesive material based on the stirring parameters in the mixing and stirring stage.
Preferably, the agitation parameters further include time.
Further preferably, the time of the mixing stage is 0.5 to 2 minutes.
Further preferably, the time of the stirring stage is 3 to 5 minutes.
More preferably, the time of the defoaming stage is 0.5 to 2 minutes.
The invention has the following beneficial effects:
according to the stirring method of the conductive adhesive, the conductive adhesive is fully stirred by revolution and rotation at the same time, so that the conductive adhesive material is acted by centrifugal force in the material cup, and the bubbles are separated out under the action of upward pushing generated by specific gravity separation motion along the vector direction and the self weight of the conductive adhesive, so that the number of cavities in a unit area is greatly reduced, the shear strength of a vibrator can be greatly increased, the problem of poor resistance consistency of one of electrical performance indexes of a product is solved, and the characteristics of the product such as reliability, shock resistance, impact resistance and the like are improved.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 shows a schematic step diagram of a stirring method of the single-component conductive adhesive.
FIG. 2 is a schematic diagram showing the steps of a stirring method for a multicomponent conductive adhesive.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
The conductive adhesive is an adhesive with certain conductive performance after being cured or dried, and generally takes matrix resin and conductive filler, namely conductive particles as main components, and the conductive particles are combined together through the bonding action of the matrix resin to form a conductive path so as to realize the conductive connection of the bonded materials. Because the matrix resin of the conductive adhesive is an adhesive, the conductive adhesive can be bonded by selecting proper curing temperature, and simultaneously, because the miniaturization and the microminiaturization of electronic elements and the rapid development of the high density and the high integration of printed circuit boards, the conductive adhesive can be made into slurry to realize high linear resolution.
At present, a common conductive adhesive mainly comprises a polymer bonding matrix and a metal conductive filler, and conductive particles are bonded together through the bonding action of matrix resin to form a conductive path so as to realize the conductive connection of bonded materials.
The conductive adhesive has the functions of conducting, radiating and bonding, and overcomes the defects of infirm joint, part deformation, reduced application performance and the like of a welding method. With the miniaturization and weight reduction of electric and electronic devices, conductive adhesives have become an indispensable material in the electronic industry. Conductive adhesives are widely used in electrical components and parts such as large scale integrated circuits, detectors, body sensors, photosensors, cameras, and instrument waveguides. Low cost printed wiring boards can be manufactured using this technique. Conductive paste has thus made a great contribution to the development of microelectronic packages.
Specifically, the quartz crystal component is subjected to procedures of cleaning, film coating, shelf-mounting and dispensing, chip mounting, chip bonding, frequency fine adjustment, sealing, normal-temperature testing, frequency-temperature testing and the like, and certain series products need to be subjected to secondary shelf-mounting and the like. In the processes, the processes of putting on shelf, dispensing, chip mounting and secondary putting on shelf all realize the functions of bonding, fixing and electric conduction through a conductive adhesive material, and the performance characteristics of the conductive adhesive play a key role in whether the whole product or even the whole batch of products is qualified or not and the later-stage aging performance.
The conductive adhesive has good conductivity and a certain fixing and supporting function, and becomes the first choice of the electric connection material of the crystal element, and the common conductive adhesives mainly comprise adhesive types such as DAD-24 and DAD-51 produced by Shanghai synthetic resin research institute, and adhesive types such as 3303N, 3301F and 3372C produced by Japan triple bond company. 3301F, which belongs to epoxy conductive adhesive, and the filling conductive material is silver particles. The 3303N 3372C glue type is a silicone conductive glue, and the filling conductive material is silver particles. The two types of conductive adhesives form a conductive path through mutual contact of internal conductive particles according to the conductive principle.
The conductive adhesive for the crystal element not only utilizes the good conductive performance and the fixed supporting effect of the conductive adhesive, but also has good elastic performance and plays an important role in ensuring the performance of the crystal element. The elastic layer can be formed between the quartz oscillator and the base due to the good elasticity of the conductive adhesive, so that the external impact vibration energy is absorbed, the soft vibration is realized without damaging the internal structure of the component, and the frequency of the quartz crystal component is more stable.
Inside the crystal components and parts, conducting resin often uses and switches on in the connection of quartz resonator and base or support, and conducting resin plays electric connection and supporting role simultaneously. Before the conductive adhesive is used, the conductive adhesive needs to be fully stirred, so that the electric filler particles in the conductive adhesive are uniformly distributed.
In the embodiment of the invention, a conductive adhesive for a crystal element is taken as an example, and a stirring method of the conductive adhesive is introduced.
The conductive adhesive for the crystal element is generally divided into a single-component conductive adhesive and a multi-component conductive adhesive.
In one embodiment, as shown in fig. 1, the method for stirring the single-component conductive adhesive is as follows:
the first step is as follows: preparing a conductive adhesive material
The conductive adhesive material is prepared according to the temperature return requirements of the conductive adhesive material specification.
The second step is that: agitation parameter setting
For the single-component conductive adhesive material for the crystal element, the stirring parameters are set as in the following table 1:
TABLE 1 stirring parameter table for single-component conductive adhesive
| Type (B) | Speed of rotation | Revolution speed | Time |
| Stirring stage | 1500rpm～1800rpm | 500rpm～800rpm | 3～5min |
| Defoaming stage | 1500rpm～2000rpm | 30rpm～100rpm | 0.5～2min |
Wherein, rpm: rpm/min
The third step: stirring of the conductive adhesive
And after the parameters are set, weighing the conductive adhesive material according to the use requirement, putting the conductive adhesive material into stirring equipment for stirring, and taking out the conductive adhesive material after the stirring is finished, so that the processing operation of the crystal component product can be carried out.
In another embodiment, as shown in fig. 2, the multi-component conductive adhesive requires mixing and stirring of multiple conductive adhesives, and the stirring method is as follows:
the first step is as follows: preparing a conductive adhesive material
Preparing each material required by the multi-component conductive adhesive according to the temperature return requirement of the specification of the conductive adhesive material.
The second step is that: respectively stirring the conductive adhesive of each component
And sequentially stirring the conductive adhesives of all the components according to the single-component conductive adhesive stirring method in the embodiment.
The third step: agitation parameter setting
For the multicomponent conductive adhesive material for the crystal device, the stirring parameters are set, as shown in table 2:
TABLE 2 stirring parameters table for multi-component conductive adhesive
| Type (B) | Speed of rotation | Revolution speed | Time |
| Mixing stage | 500rpm～800rpm | 200rpm～400rpm | 0.5～2min |
| Stirring stage | 1500rpm～1800rpm | 500rpm～800rpm | 3～5min |
| Defoaming stage | 1500rpm～2000rpm | 30rpm～100rpm | 0.5～2min |
Wherein, rpm: rpm/min
The fourth step: mixing and stirring the conductive adhesive of each component
And (3) putting the conductive adhesive of each component into a container after the conductive adhesive of each component is filled with a certain weight according to the proportion of each component, putting the container into stirring equipment for stirring, and taking out the conductive adhesive material after the stirring is finished, so that the processing operation of the crystal component product can be carried out.
The revolution and rotation to the movement track adopted by the method are used for fully stirring the conductive adhesive, so that the conductive adhesive material is acted by centrifugal force in the material cup, and the bubbles are separated out under the action of upward pushing generated by specific gravity separation movement generated along the vector direction and the self weight of the conductive adhesive, thereby greatly reducing the number of cavities in unit area, greatly increasing the shear strength of the quartz vibrator, solving the problem of large resistance of one of electrical performance indexes of the product, and improving the characteristics of the product such as reliability, shock resistance, impact resistance and the like.
The terms "first," "second," and the like in the description and claims of the present invention and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other gas steps or elements inherent to such process, method, or apparatus.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (6)
1. A method of stirring a single-component conductive paste consisting essentially of a polymeric binder matrix and a metallic conductive filler, the method comprising:
step S1: preparing a conductive adhesive material based on the temperature return requirement of the conductive adhesive;
step S2: weighing the conductive adhesive material based on the use requirement of the conductive adhesive;
step S3: stirring parameters are respectively set for the stirring stage and the defoaming stage, the stirring parameters comprise rotation speed and revolution speed, wherein,
and (3) stirring: the rotation speed is set to be 1500-1800 rpm, and the revolution speed is set to be 500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to be 1500-2000 rpm, and the revolution speed is set to be 30-100 rpm;
step S4: putting the conductive adhesive material into stirring equipment, and stirring the conductive adhesive material based on the stirring parameters;
the agitation parameters further include a time, wherein,
the time of the stirring stage is 3-5 minutes;
the time of the defoaming stage is 0.5-2 minutes.
2. A method of agitating a multi-component conductive adhesive comprised primarily of a polymeric bonding matrix and a metallic conductive filler, the method comprising:
step S1: preparing each component conductive adhesive material in the multi-component conductive adhesive material based on the temperature return requirement of the conductive adhesive;
step S2: weighing each component conductive adhesive material in the multi-component conductive adhesive material based on the use requirement of the conductive adhesive;
step S3: for each component conductive adhesive material in the multi-component conductive adhesive material, setting stirring parameters for a stirring stage and a defoaming stage respectively, wherein the stirring parameters comprise a rotation speed and a revolution speed, wherein,
and (3) stirring: the rotation speed is set to be 1500-1800 rpm, and the revolution speed is set to be 500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to be 1500-2000 rpm, and the revolution speed is set to be 30-100 rpm;
step S4: placing each component of the multi-component conductive adhesive material into a stirring device, and stirring each component of the multi-component conductive adhesive material based on the stirring parameters;
step S5: taking out each component of the conductive adhesive material from the stirred multi-component conductive adhesive material and mixing based on the proportion of each component of the conductive adhesive material in the multi-component conductive adhesive material;
step S6: for the multi-component conductive adhesive material, the stirring parameters are respectively set for a stirring stage, a defoaming stage and a mixing stage, wherein,
and (3) mixing: the rotation speed is set to be 500-800 revolutions per minute, and the revolution speed is set to be 200-400 revolutions per minute;
and (3) stirring: the rotation speed is set to be 1500-1800 rpm, and the revolution speed is set to be 500-800 rpm; and
and (3) a defoaming stage: the rotation speed is set to be 1500-2000 rpm, and the revolution speed is set to be 30-100 rpm;
step S7: stirring the multi-component conductive adhesive material based on the stirring parameters of the mixing and stirring stage.
3. The method of claim 2, wherein the parameters further include time.
4. The method for stirring a multicomponent conductive adhesive according to claim 3, wherein the time of the mixing step is 0.5 to 2 minutes.
5. The method for stirring a multicomponent conductive adhesive according to claim 3, wherein the time of the stirring stage is 3 to 5 minutes.
6. The method for stirring the multicomponent conductive adhesive according to claim 3, wherein the time of the defoaming stage is 0.5 to 2 minutes.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560367A (en) * | 2008-04-18 | 2009-10-21 | 黄楚填 | Aqueousneoprene type environment-friendly glue and preparation method thereof |
| WO2016051829A1 (en) * | 2014-09-30 | 2016-04-07 | リンテック株式会社 | Electroconductive pressure-sensitive adhesive sheet |
| CN108140839A (en) * | 2015-10-30 | 2018-06-08 | 东亚合成株式会社 | The agent of non-aqueous electrolyte secondary battery electrode binding and its manufacturing method, with and application thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101560367A (en) * | 2008-04-18 | 2009-10-21 | 黄楚填 | Aqueousneoprene type environment-friendly glue and preparation method thereof |
| WO2016051829A1 (en) * | 2014-09-30 | 2016-04-07 | リンテック株式会社 | Electroconductive pressure-sensitive adhesive sheet |
| CN108140839A (en) * | 2015-10-30 | 2018-06-08 | 东亚合成株式会社 | The agent of non-aqueous electrolyte secondary battery electrode binding and its manufacturing method, with and application thereof |
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