CN109021848A - A kind of preparation method of SMT Heraeus - Google Patents
A kind of preparation method of SMT Heraeus Download PDFInfo
- Publication number
- CN109021848A CN109021848A CN201810798500.2A CN201810798500A CN109021848A CN 109021848 A CN109021848 A CN 109021848A CN 201810798500 A CN201810798500 A CN 201810798500A CN 109021848 A CN109021848 A CN 109021848A
- Authority
- CN
- China
- Prior art keywords
- parts
- heraeus
- curing agent
- preparation
- smt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/06—Biodegradable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/06—Polymer mixtures characterised by other features having improved processability or containing aids for moulding methods
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/18—Spheres
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of preparation methods of SMT Heraeus, belong to technical field of electronic encapsulation.The characteristics of present invention is according to microcapsules composite codeposition, Simple coacervation is selected to prepare curing agent microcapsules, capsule-core substance selects curing agent PN-23 and EH-4070S, the selection of cyst wall substance and gelatin, cyst wall of the gelatin as liquid microcapsule, Heraeus is during heating, gelatin rupture, curing agent outflow, with curing accelerator coordinative role, to reduce solidification temperature, accelerate curing rate, better effect；Reactive diluent is introduced in the present invention can reduce the viscosity of resin, more inorganic fillers can be added simultaneously, the addition of inorganic filler can reduce the thermal expansion coefficient of solidfied material, the phenomenon that Heraeus will not lead to fall part because of expanded by heating during crossing wave-soldering, the addition of sodium bentonite can accelerate curing rate；Heraeus solidification temperature prepared by the present invention is low, and curing time is short, has preferable cementation to various components.
Description
Technical field
The present invention relates to a kind of preparation methods of SMT Heraeus, belong to technical field of electronic encapsulation.
Background technique
SMT is surface installation technique (surface mounting technology) (abbreviation of Surface Mounted Technology), is
A kind of most popular technology and technique in electronic assembly industry at present.SMT includes two kinds of entirely different techniques, a kind of to use weldering
Tin cream；Another kind uses glue, and 0 is normally defined Heraeus, and SMT Heraeus is the special adhesive applied to surface-assembled,
Also known as surface-assembled adhesive, Heraeus.Former technique is that solder(ing) paste is coated on PCB by halftone, when surface is pasted
After dress device (SurfaceMountedDevices is abbreviated as SMD) is installed, complete to connect with Reflow Soldering.Second of technique
It is generally used for existing SMD, and is had on the mixed type PCB of connector.Connector is connect by wave-soldering with PCB, in wave-soldering
Hot melt scolding tin is filled out between component pin and insert hole to be connected and fixed.SMD can also use identical solder wave process, but element must
It must be bonded in pcb board bottom, piece is fallen when preventing wave-soldering, this bonding process is committed step.
Heraeus is that binder can be completed with the following method on pcb board for SMD to be bonded on PCB
Coating: scraper-type printing, the syringe-type dispensing for moving pin type print and using earliest, syringe-type dispensing include air pressure/time control
Or volume type control.After SMD is installed, binder must have enough wet strengths, by element it is fixed in position until
Solidification.Binder after solidification must have enough binding abilities that SMD and PCB connect together during wave-soldering, and
The electric property of element is not influenced after the completion of welding.Because glue must satisfy following demand: longer shelf life；Glue point is big
Small, shape keeps stable and consistent；Glue point shape is high, without hangover；Wet strength is high；Rapid curing；Nothing is collapsed in heat curing process
It falls into；High intensity is in conjunction with flexibility, heat shock resistance；Good electric property after solidification.
Patch red glue currently on the market is primarily present: glue point shape is bad；Wet strength is low；Solidification temperature is high, and speed is slow；
Cure shrinkage is big, and high temperature resistance is poor, it is high to fall part rate, therefore the use for being unable to satisfy the present and following high-end technique at all is wanted
It asks.
Since the size of present electronic component becomes smaller and smaller, for be easy to appear in encapsulation process part rate and
More stringent requirements are proposed for hot candied problem, and a kind of novel SMT Heraeus is researched and developed in design, and reaching expected properties of product seems especially
It is important.
Summary of the invention
The technical problems to be solved by the invention: bad for existing Heraeus glue point shape；Wet strength is low；Solidification temperature
Height, speed are slow；High temperature resistance is poor, falls the high problem of part rate, provides a kind of preparation method of SMT Heraeus.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
(1) according to parts by weight, weighing 17~24 parts of mass fractions respectively is 2% gelatin solution, 3~5 parts of PN-23,3~5 parts
EH-4070S, 0.2~0.6 part of triethanolamine, 0.1~0.4 part of dehydrated alcohol, in the case where revolving speed is 1000~1200r/min, in matter
Measuring score is that curing agent PN-23 and EH-4070S are added in 2% gelatin solution, stirs 10~15min, obtains lotion, and three ethyl alcohol are added dropwise
Dehydrated alcohol is slowly added dropwise after continuing 1~2h of stirring in amine, and being added dropwise reduces mixing speed and stop stirring, and obtains composite curing
Agent；
(2) according to parts by weight, 40~60 parts of epoxy resin, 10~18 parts of composite curing agents, 1~8 part of solidification rush are weighed respectively
Into agent, 10~20 parts of diluents, 5~12 parts of toughener, 8~12 parts of inorganic fillers, by epoxy resin, diluent, toughener, nothing
Machine filler, composite curing agent and curing accelerator carry out mixing processing, obtain SMT Heraeus.
Epoxy resin described in step (2) is bisphenol A epoxide resin, bisphenol F epoxy resin and phenolic aldehyde based epoxy resin
At least one of.
Curing accelerator described in step (2) is to mix polyethylene wax and stearic acid in mass ratio 1: 1.
Diluent described in step (2) is epoxy propane butyl ether.
Toughener described in step (2) is in dioctyl phthalate, dibutyl phthalate and citrate
One kind.
Inorganic filler described in step (2) is the mixing of talcum powder, silicon powder and sodium bentonite in mass ratio 1: 1: 2.
The processing of mixing described in step (2) is to mix epoxy resin, diluent, toughener and inorganic filler,
0.05~1MPa of vacuum degree, under conditions of 300~350r/min, is mixed 1~2h by 20~30 DEG C；Composite curing agent is added
And curing accelerator is stirred 60~90min under conditions of revolving speed is 50~100r/min.
The present invention is compared with other methods, and advantageous effects are:
(1) the characteristics of present invention is according to microcapsules composite codeposition selects Simple coacervation to prepare curing agent microcapsules, core-clad material
Matter selection curing agent PN-23 and EH-4070S, the selection of cyst wall substance and gelatin, cyst wall of the gelatin as liquid microcapsule, at
Film property is also fine, and flexible, is natural polymer Biodegradable material, and during heating, gelatin ruptures Heraeus,
Curing agent outflow greatly prolongs storage period, imitates with curing accelerator coordinative role to reduce solidification temperature, accelerate curing rate
Fruit is more preferably；
(2) viscosity of resin can be reduced by reactive diluent being introduced in the present invention, while can add more inorganic fillers, nothing
The addition of machine filler can reduce the thermal expansion coefficient of solidfied material, and Heraeus will not be because of expanded by heating during crossing wave-soldering
And the phenomenon that leading to fall part, the quality of Heraeus is preferably improved, the addition of sodium bentonite can accelerate curing rate；
(3) Heraeus storage stability prepared by the present invention is excellent, and thixotropy is good, and wet strength is high, and solidification temperature is low, curing time
It is short, to various components have preferable cementation, high temperature resistance and fall part rate be improved significantly.
Specific embodiment
According to parts by weight, weighing 17~24 parts of mass fractions respectively is 2% gelatin solution, 3~5 parts of PN-23,3~5 parts
EH-4070S, 0.2~0.6 part of triethanolamine, 0.1~0.4 part of dehydrated alcohol, in the case where revolving speed is 1000~1200r/min, in matter
Measuring score is that curing agent PN-23 and EH-4070S are added in 2% gelatin solution, stirs 10~15min, obtains lotion, and three ethyl alcohol are added dropwise
Dehydrated alcohol is slowly added dropwise after continuing 1~2h of stirring in amine, and being added dropwise reduces mixing speed and stop stirring, and obtains composite curing
Agent；Polyethylene wax and stearic acid in mass ratio 1: 1 is mixed, curing accelerator is obtained；In mass ratio 1: 1: 2 is micro- by talcum powder, silicon
Powder and sodium bentonite mixing, obtain inorganic filler；According to parts by weight, 40~60 parts of epoxy resin, 10~18 parts are weighed respectively
Composite curing agent, 1~8 part of curing accelerator, 10~20 parts of diluents, 5~12 parts of toughener, 8~12 parts of inorganic fillers, by ring
Oxygen resin, diluent, toughener and inorganic filler mixing, in 0.05~1MPa of vacuum degree, 20~30 DEG C, 300~350r/min
Under conditions of, 1~2h is mixed；Composite curing agent and curing accelerator is added, in the condition that revolving speed is 50~100r/min
Under, it is stirred 60~90min, obtains SMT Heraeus.
According to parts by weight, weigh respectively 17 parts of mass fractions be 2% gelatin solution, 3 parts of PN-23,3 parts of EH-4070S,
0.2 part of triethanolamine, 0.1 part of dehydrated alcohol are to be added in 2% gelatin solution in mass fraction in the case where revolving speed is 1000r/min
Curing agent PN-23 and EH-4070S stir 10min, obtain lotion, and triethanolamine is added dropwise, and continue after stirring 1h, are slowly added dropwise anhydrous
Ethyl alcohol, being added dropwise reduces mixing speed and stops stirring, and obtains composite curing agent；By polyethylene wax and stearic acid in mass ratio 1:
1 mixing, obtains curing accelerator；In mass ratio 1: 1: 2 mixes talcum powder, silicon powder and sodium bentonite, obtains inorganic filler；It presses
Parts by weight meter weighs 40 parts of epoxy resin, 10 parts of composite curing agents, 1 part of curing accelerator, 10 parts of diluents, 5 parts of increasings respectively
Tough dose, 8 parts of inorganic fillers mix epoxy resin, diluent, toughener and inorganic filler, in vacuum degree 0.05MPa, 20 DEG C,
Under conditions of 300r/min, 1h is mixed；Composite curing agent and curing accelerator is added, in the condition that revolving speed is 50r/min
Under, it is stirred 60min, obtains SMT Heraeus.
According to parts by weight, weigh respectively 20 parts of mass fractions be 2% gelatin solution, 4 parts of PN-23,4 parts of EH-4070S,
0.4 part of triethanolamine, 0.25 part of dehydrated alcohol are to be added in 2% gelatin solution in mass fraction in the case where revolving speed is 1100r/min
Curing agent PN-23 and EH-4070S stir 13min, obtain lotion, and triethanolamine is added dropwise, and continue after stirring 1.5h, nothing is slowly added dropwise
Water-ethanol, being added dropwise reduces mixing speed and stops stirring, and obtains composite curing agent；In mass ratio by polyethylene wax and stearic acid
1: 1 mixing, obtains curing accelerator；In mass ratio 1: 1: 2 mixes talcum powder, silicon powder and sodium bentonite, obtains inorganic filler；
According to parts by weight, 50 parts of epoxy resin, 14 parts of composite curing agents, 4 parts of curing accelerators, 15 parts of diluents, 9 parts are weighed respectively
Toughener, 10 parts of inorganic fillers mix epoxy resin, diluent, toughener and inorganic filler, in vacuum degree 0.55MPa, 25
DEG C, under conditions of 325r/min, 1.5h is mixed；Composite curing agent and curing accelerator is added, is 75r/min's in revolving speed
Under the conditions of, it is stirred 75min, obtains SMT Heraeus.
According to parts by weight, weigh respectively 24 parts of mass fractions be 2% gelatin solution, 5 parts of PN-23,5 parts of EH-4070S,
0.6 part of triethanolamine, 0.4 part of dehydrated alcohol are to be added in 2% gelatin solution in mass fraction in the case where revolving speed is 1200r/min
Curing agent PN-23 and EH-4070S stir 15min, obtain lotion, and triethanolamine is added dropwise, and continue after stirring 2h, are slowly added dropwise anhydrous
Ethyl alcohol, being added dropwise reduces mixing speed and stops stirring, and obtains composite curing agent；By polyethylene wax and stearic acid in mass ratio 1:
1 mixing, obtains curing accelerator；In mass ratio 1: 1: 2 mixes talcum powder, silicon powder and sodium bentonite, obtains inorganic filler；It presses
Parts by weight meter weighs 60 parts of epoxy resin, 18 parts of composite curing agents, 8 parts of curing accelerators, 20 parts of diluents, 12 parts respectively
Toughener, 12 parts of inorganic fillers mix epoxy resin, diluent, toughener and inorganic filler, in vacuum degree 1MPa, 30 DEG C,
Under conditions of 350r/min, 2h is mixed；Composite curing agent and curing accelerator is added, in the condition that revolving speed is 100r/min
Under, it is stirred 90min, obtains SMT Heraeus.
The Heraeus that SMT Heraeus prepared by the present invention and Fujian company produce is detected, specific testing result
Such as following table table 1:
Detection method:
The SMT Heraeus that above embodiments are prepared is tested according to standard SJ/T11187-1998 and carries out performance survey
Examination.
Table 1SMT patch performance characterization
SMT patch prepared by the present invention as shown in Table 1, solidification temperature is low, and curing time is short, and the hard bubble-free of solidification rear surface produces
It is raw, have a vast market value and application prospect.
Claims (7)
1. a kind of preparation method of SMT Heraeus, it is characterised in that specific steps are as follows:
(1) according to parts by weight, weighing 17~24 parts of mass fractions respectively is 2% gelatin solution, 3~5 parts of PN-23,3~5 parts
EH-4070S, 0.2~0.6 part of triethanolamine, 0.1~0.4 part of dehydrated alcohol, in the case where revolving speed is 1000~1200r/min, in matter
Measuring score is that curing agent PN-23 and EH-4070S are added in 2% gelatin solution, stirs 10~15min, obtains lotion, and three ethyl alcohol are added dropwise
Dehydrated alcohol is slowly added dropwise after continuing 1~2h of stirring in amine, and being added dropwise reduces mixing speed and stop stirring, and obtains composite curing
Agent；
(2) according to parts by weight, 40~60 parts of epoxy resin, 10~18 parts of composite curing agents, 1~8 part of solidification rush are weighed respectively
Into agent, 10~20 parts of diluents, 5~12 parts of toughener, 8~12 parts of inorganic fillers, by epoxy resin, diluent, toughener, nothing
Machine filler, composite curing agent and curing accelerator carry out mixing processing, obtain SMT Heraeus.
2. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: epoxy described in step (2)
Resin is at least one of bisphenol A epoxide resin, bisphenol F epoxy resin and phenolic aldehyde based epoxy resin.
3. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: solidification described in step (2)
Promotor is to mix polyethylene wax and stearic acid in mass ratio 1: 1.
4. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: dilution described in step (2)
Agent is epoxy propane butyl ether.
5. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: toughening described in step (2)
Agent is one of dioctyl phthalate, dibutyl phthalate and citrate.
6. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: inorganic described in step (2)
Filler is the mixing of talcum powder, silicon powder and sodium bentonite in mass ratio 1: 1: 2.
7. a kind of preparation method of SMT Heraeus according to claim 1, it is characterised in that: mixing described in step (2)
Stir process is to mix epoxy resin, diluent, toughener and inorganic filler, in 0.05~1MPa of vacuum degree, 20~30 DEG C,
Under conditions of 300~350r/min, 1~2h is mixed；Composite curing agent and curing accelerator is added, revolving speed be 50~
Under conditions of 100r/min, it is stirred 60~90min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810798500.2A CN109021848A (en) | 2018-07-19 | 2018-07-19 | A kind of preparation method of SMT Heraeus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810798500.2A CN109021848A (en) | 2018-07-19 | 2018-07-19 | A kind of preparation method of SMT Heraeus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109021848A true CN109021848A (en) | 2018-12-18 |
Family
ID=64644428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810798500.2A Pending CN109021848A (en) | 2018-07-19 | 2018-07-19 | A kind of preparation method of SMT Heraeus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109021848A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602897A (en) * | 2019-09-09 | 2019-12-20 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1872936A (en) * | 2005-05-31 | 2006-12-06 | 北京联合钛得胶粘剂有限公司 | Rapid solidifed mesothermal epoxy patch glue in monocomponent, and preparation method |
| CN101440266A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Novel paster glue for surface mounting technology and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
-
2018
- 2018-07-19 CN CN201810798500.2A patent/CN109021848A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1872936A (en) * | 2005-05-31 | 2006-12-06 | 北京联合钛得胶粘剂有限公司 | Rapid solidifed mesothermal epoxy patch glue in monocomponent, and preparation method |
| CN101440266A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Novel paster glue for surface mounting technology and preparation thereof |
| CN102850948A (en) * | 2012-09-20 | 2013-01-02 | 烟台德邦科技有限公司 | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 王国建: "《功能高分子材料》", 30 June 2014, 同济大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602897A (en) * | 2019-09-09 | 2019-12-20 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
| CN110602897B (en) * | 2019-09-09 | 2021-07-27 | 东莞市合权电子有限公司 | SMT (surface mount technology) chip mounting process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103468187B (en) | Anisotropic-electroconductive adhesive | |
| CN105802563B (en) | A kind of flow model chip-level bottom filling adhesive and preparation method thereof | |
| CN102850948A (en) | Surface mount adhesive for surface mount technology and preparation method of surface mount adhesive | |
| CN109135611A (en) | One kind is i.e. with low temperature curing type liquid metal conducting resinl in using and preparation method thereof | |
| CN104673111B (en) | Formula and preparation method of epoxy resin based anisotropic conductive adhesive film | |
| CN113372844B (en) | High-temperature-resistant epoxy resin conductive adhesive and preparation method thereof | |
| CN109233716A (en) | A kind of aluminum honeycomb sandwich epoxy adhesive, preparation method and the application of high adhesion force | |
| CN107236485B (en) | A kind of dendritic heat curing type pastes conducting resinl and preparation method thereof | |
| CN103013358A (en) | Low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass and preparation method thereof | |
| CN108925062B (en) | Installation method for CQFP (CQFP) device of spacecraft electronic product | |
| CN109021848A (en) | A kind of preparation method of SMT Heraeus | |
| CN110607150A (en) | Conductive adhesive composition capable of being stored at normal temperature and preparation method thereof | |
| CN109666413A (en) | A kind of anisotropy conductiving glue sticks agent and its conductive film | |
| CN106833465A (en) | A kind of lower glass transition temperatures use for electronic products insulating cement and its preparation method and application | |
| CN106811173A (en) | Aluminum-based copper-clad plate silk-screen insulating cement and screen printing method | |
| CN108300360A (en) | Profiled metal particle conductive glued membrane and preparation method thereof | |
| CN109280522A (en) | Fire resistant epoxy sealant | |
| CN109548301A (en) | A kind of electronic circuit 3D printing method based on FR-4 substrate | |
| CN101985549A (en) | SMT (surface mounted technology) surface mount adhesive and preparation method thereof | |
| CN111675994A (en) | Polyurethane surface mount adhesive and preparation method thereof | |
| CN101440266A (en) | Novel paster glue for surface mounting technology and preparation thereof | |
| CN106190008A (en) | A kind of preparation technology of LED high heat conductance conducting resinl | |
| CN101864250A (en) | Surface mount adhesive for use in lead-free packaging process and preparation method | |
| CN114672190A (en) | PCB hole plugging ink and preparation method thereof | |
| CN112500820A (en) | Novel high-temperature-resistant epoxy resin adhesive and preparation method and use method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181218 |