CN109003966A - Display panel and preparation method thereof - Google Patents

Display panel and preparation method thereof Download PDF

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Publication number
CN109003966A
CN109003966A CN201810812475.9A CN201810812475A CN109003966A CN 109003966 A CN109003966 A CN 109003966A CN 201810812475 A CN201810812475 A CN 201810812475A CN 109003966 A CN109003966 A CN 109003966A
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China
Prior art keywords
electrode
lead wire
led component
drive substrate
magnetic pole
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Granted
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CN201810812475.9A
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Chinese (zh)
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CN109003966B (en
Inventor
何泽尚
禹少荣
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Shanghai Tianma Microelectronics Co Ltd
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Shanghai Tianma Microelectronics Co Ltd
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Priority to CN201810812475.9A priority Critical patent/CN109003966B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The invention discloses a kind of display panels and preparation method thereof, belong to field of display technology, comprising: drive substrate, multiple LED components and the separation levee layer and electrode layer being set in drive substrate;Separation levee layer includes separation levee and the multiple separation levees being arranged in array opening, is separated between separation levee opening by separation levee, and a LED component is arranged in a separation levee opening;LED component includes first electrode and second electrode, and first electrode and second electrode are located at the ipsilateral of LED component, and second electrode is arranged around first electrode;Electrode layer includes ferromagnetic electrode and lead wire in separation levee opening.Compared with the existing technology, assembling of the LED component in drive substrate can be realized to lead wire energization, transport process is simple and easy to control, high-efficient, and transports head without in addition production, advantageously reduces the production cost of product.

Description

Display panel and preparation method thereof
Technical field
The present invention relates to field of display technology, more particularly, to a kind of display panel and preparation method thereof.
Background technique
Light emitting diode (Light Emitting Diode, abbreviation LED) is that electric energy can be converted into luminous energy by one kind Semiconductor diode.Since it has the characteristics that (can reach micron order) small in size, brightness is high, low energy consumption, long service life, quilt It is widely used in the fields such as display, illumination.
Light emitting diode needs to be transferred on drive circuit board after completing, and due to its small volume, shifts quantity again Quite big, using manually shifting, this method is clearly unpractical.The transfer method generallyd use at present is that production is special Transfer head, transfer head mainly utilizes electrostatic force, Van der Waals force etc. disposably to pick up multiple light emitting diodes, is then transferred into drive On dynamic substrate, but shift that header structure is more complicated, and manufacture difficulty is big, transfer process is not easy to control, be also unfavorable for production at This reduction, and when making large scale display product, working efficiency is very low.
Summary of the invention
In view of this, the present invention provides a kind of display panels and preparation method thereof.
The present invention provides a kind of display panels, comprising: drive substrate, multiple LED components and is set to drive substrate On separation levee layer and electrode layer;Separation levee layer includes separation levee and the multiple separation levees being arranged in array opening, is passed through between separation levee opening Separation levee separates, and a LED component is arranged in a separation levee opening;LED component includes first electrode and second electrode, first electrode It is located at the ipsilateral of LED component with second electrode, and second electrode is arranged around first electrode;Wherein, first electrode and the second electricity One of pole includes the first magnetic pole, and the first magnetic pole is the first magnetic pole, the first magnetic electricity close to the side of LED component Extremely the side far from LED component is the second magnetic pole, and the magnetism of the first magnetic pole and the second magnetic pole is opposite;
Electrode layer includes ferromagnetic electrode and lead wire in separation levee opening, in the direction for being parallel to drive substrate On, lead wire is located at the periphery of ferromagnetic electrode;Wherein, after lead wire is powered, lead wire is close to the side of drive substrate and the The magnetism of two magnetic poles is identical, and the magnetism of side and first magnetic pole of the lead wire far from drive substrate is identical, and ferromagnetic electrode is close Magnetic identical, the magnetic of side and first magnetic pole of the ferromagnetic electrode far from drive substrate of the side of drive substrate and the second magnetic pole Property is identical;First electrode is connected with ferromagnetic electrode, and second electrode is connected with lead wire.
The present invention also provides a kind of production methods of display panel, comprising: provides a drive substrate;Multiple LED are provided Device;Wherein, LED component includes first electrode and second electrode, and first electrode and second electrode are located at the ipsilateral of LED component, And second electrode is arranged around first electrode;Wherein, one of first electrode and second electrode include the first magnetic pole, the One magnetic pole is the first magnetic pole close to the side of LED component, and side of first magnetic pole far from LED component is the second magnetic The magnetism of pole, the first magnetic pole and the second magnetic pole is opposite;
Electrode layer and separation levee layer are formed in drive substrate;Wherein, separation levee layer includes separation levee and is arranged in array multiple Separation levee is open, and is separated between separation levee opening by separation levee;Electrode layer includes that the ferromagnetic electrode and drawing in separation levee opening connects Line, on the direction for being parallel to drive substrate, lead wire is located at the periphery of ferromagnetic electrode;Electrode layer and separation levee layer will be formed with Drive substrate be placed in viscous liquid, and multiple LED components are placed in viscous liquid;
It is powered to lead wire, lead wire is identical close to the side of drive substrate and the magnetism of the second magnetic pole, and lead wire is separate The magnetism of the side of drive substrate and the first magnetic pole is identical, and ferromagnetic electrode is close to the side of drive substrate and the magnetic of the second magnetic pole Property it is identical, side and first magnetic pole of the ferromagnetic electrode far from drive substrate magnetism it is identical, make at least one separation levee be open in The first electrode and ferromagnetic electrode for having a LED component are attracted, or make have a LED component at least one separation levee opening Second electrode and lead wire be attracted.
Compared with prior art, display panel provided by the invention and preparation method thereof at least realizes following beneficial Effect:
The ipsilateral setting of first electrode and second electrode of LED component, each LED component magnetism it is identical so that LED component it Between will not mutually adsorb, improve the efficiency of transhipment and assembling;Ferromagnetic electrode and lead wire are located in separation levee opening, and separation levee is opened It is separated between mouthful by separation levee, multiple LED components after lead wire energization magnetization can be effectively prevent to be adsorbed onto same separation levee opening, Improve the precision of transhipment and assembling;Ferromagnetic electrode is magnetized after lead wire is powered, to remain to after lead wire power-off by LED Device is adsorbed on electrode layer, is not necessarily to one direct power supply of lead wire, and can be passed through control power supply mode and be controlled LED component Difference transhipment requires, and manipulates more flexible and convenient;After LED component is placed in viscous liquid, LED can be realized to lead wire energization Self assembly of the device in drive substrate, transport process is simple and easy to control, high-efficient, and transports head without in addition production, is conducive to Reduce the production cost of product.
Certainly, implementing any of the products of the present invention specific needs while must not reach all the above technical effect.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even With its explanation together principle for explaining the present invention.
Fig. 1 is a kind of planar structure schematic diagram of display panel provided in an embodiment of the present invention;
Fig. 2 is a kind of the schematic diagram of the section structure in Fig. 1 along the direction A-A;
Fig. 3 is a kind of structural schematic diagram of LED component provided in an embodiment of the present invention;
Fig. 4 is in Fig. 3 along the planar structure schematic diagram in the direction B;
Fig. 5 is the enlarged structure schematic diagram of first electrode in Fig. 3;
Fig. 6 is the structural schematic diagram of another LED component provided in an embodiment of the present invention;
Fig. 7 is the structural schematic diagram of another LED component provided in an embodiment of the present invention;
Fig. 8 is another the schematic diagram of the section structure in Fig. 1 along the direction A-A;
Fig. 9 is another the schematic diagram of the section structure in Fig. 1 along the direction A-A;
Figure 10 is a kind of enlarged structure schematic diagram in the region M in Fig. 1;
Figure 11 is in Figure 10 along the schematic diagram of the section structure in the direction C-C;
Figure 12 is in Figure 10 along the schematic diagram of the section structure in the direction D-D;
Figure 13 is another enlarged structure schematic diagram in the region M in Fig. 1;
Figure 14 is in Figure 13 along the schematic diagram of the section structure in the direction E-E;
Figure 15 is the planar structure schematic diagram of another display panel provided in an embodiment of the present invention;
Figure 16 is the planar structure schematic diagram of another display panel provided in an embodiment of the present invention;
Figure 17 is the planar structure schematic diagram of another display panel provided in an embodiment of the present invention;
Figure 18 is the planar structure schematic diagram of another display panel provided in an embodiment of the present invention;
Figure 19 is another the schematic diagram of the section structure in Fig. 1 along the direction A-A;
Figure 20 is the enlarged structure schematic diagram of n-quadrant in Figure 19;
Figure 21 is a kind of flow chart of the production method of display panel provided in an embodiment of the present invention;
Figure 22-Figure 24 is the schematic diagram of the section structure of production method shown in Figure 21;
Figure 25 is the flow chart of the production method of another display panel provided in an embodiment of the present invention;
Figure 26-Figure 27 is the schematic diagram of the section structure of production method shown in Figure 25;
Figure 28 is the flow chart of the production method of another display panel provided in an embodiment of the present invention;
Figure 29 is the schematic diagram of the section structure of production method shown in Figure 28.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
Incorporated by reference to referring to figs. 1 to shown in Fig. 5, the present invention provides a kind of display panels, comprising: drive substrate 10, multiple LED component 20 and the separation levee layer 30 and electrode layer 40 being set in drive substrate 10;Separation levee layer 30 includes separation levee 31 and is in battle array Multiple separation levees opening 32 of column arrangement is separated by separation levee 31 between separation levee opening 32, setting one in a separation levee opening 32 LED component 20;LED component 20 includes first electrode 21 and second electrode 22, and first electrode 21 and second electrode 22 are located at LED device Part 20 it is ipsilateral, and second electrode 22 around first electrode 21 be arranged;Wherein, one of first electrode 21 and second electrode 22 Including the first magnetic pole 210, the first magnetic pole 210 is the first magnetic pole 211 close to the side of LED component 20, and first is magnetic Side of the electrode 210 far from LED component 20 is the second magnetic pole 212, and the magnetism of the first magnetic pole 211 and the second magnetic pole 212 is opposite;
Electrode layer 40 includes 32 ferromagnetic electrode 41 and lead wire 42 in separation levee opening, is being parallel to drive substrate On 10 direction, lead wire 42 is located at the periphery of ferromagnetic electrode 41;Wherein, after lead wire 42 is powered, lead wire 42 is close to drive The side of dynamic substrate 10 and magnetic identical, side and first magnetic pole of the lead wire 42 far from drive substrate 10 of the second magnetic pole 212 211 magnetism is identical, and ferromagnetic electrode 41 is close to the side of drive substrate 10 and magnetic identical, the ferromagnetism of the second magnetic pole 212 The magnetism of side and first magnetic pole of the electrode 41 far from drive substrate 10 is identical;First electrode 21 and ferromagnetic electrode 41 connect, Second electrode 22 and lead wire 42 connect.
In the present embodiment, LED component 20 includes first electrode 21 and second electrode 22, to first electrode 21 and second electrode 22 one forward biases of application can make LED component 20 shine, and LED component 20 can also include a p-n diode.Drive substrate 10 Active location driving can be to the driving method of LED component 20, namely constituted using the thin film transistor (TFT) in drive substrate 10 Driving circuit provide driving current;Certainly, which is also possible to passive addressing driving etc., the present embodiment to this not Make concrete restriction.
Interaction between magnet needs to carry out by medium of magnetic field, and all there are two magnetic poles whether great or small for a magnet, can With the magnet being freely rotated in the horizontal plane, always a magnetic pole is directed toward south namely the pole S when static, another magnetic pole is directed toward The north namely the pole N, and the phenomenon that like pole is mutually exclusive, opposite pole attracts each other is presented between magnetic pole.First electrode One of 21 and second electrode 22 include the first magnetic pole 210, please continue to refer to shown in Fig. 3 and Fig. 5, the present embodiment only with First electrode 21 for the first magnetic pole 210 including being illustrated: the first magnetic pole 210 is close to the side of LED component 20 For the first magnetic pole 211, side of first magnetic pole 210 far from LED component 20 is the second magnetic pole 212, the first magnetic pole 211 and the Two magnetic poles 212 magnetism on the contrary, each LED component magnetism it is identical, will not adsorb between each other, improve the effect of transhipment and assembling Rate.
In order to make LED component 20 fall into separation levee opening 32 in after can be adsorbed on electrode layer 40, need to electrode layer 40 Magnetized.In the present embodiment, electrode layer 40 includes 32 ferromagnetic electrode 41 and lead wire 42 in separation levee opening, flat Row is on the direction of drive substrate 10, and lead wire 42 is located at the periphery of ferromagnetic electrode 41, to enable ferromagnetic electrode 41 It is attracted with the first electrode 21 of LED component 20, alternatively, lead wire 42 is enable to be attracted with second electrode 22.Specifically, ferromagnetism Electrode 41 can be made of ferrimagnet, and ferrimagnet has spontaneous magnetization phenomenon, such as iron, be conducive to enhancing and draw Magnetism after the energization of wiring 42.After the energization of lead wire 42 of 41 periphery of ferromagnetic electrode, on the one hand, inside lead wire 42 Electronics does directed movement under voltage effect, and the arrangement of electronics has fixed-direction at this time, and the magnetic field respectively generated is mutually folded Add, so that magnetic field is externally presented in lead wire 42;On the other hand, ferromagnetic electrode 41 is magnetized under the action of the external magnetic field Afterwards, it even if the power-off of lead wire 42 namely the external magnetic field disappear, is still able to maintain its magnetized state and there is magnetism.
By controlling the current direction of lead wire 42, side and second magnetic of the lead wire 42 close to drive substrate 10 can be made The magnetism of pole 212 is identical, and the magnetism of side and first magnetic pole 211 of the lead wire 42 far from drive substrate 10 is identical, ferromagnetism electricity Pole 41 is identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, and ferromagnetic electrode 41 is far from drive substrate 10 The magnetism of side and the first magnetic pole is identical, so that ferromagnetic electrode 41 and the first electrode 21 of LED component 20 is enable to be attracted, or Person enables lead wire 42 to be attracted with second electrode 22, and manipulation is flexible and convenient.
In addition, in Fig. 2 only by separation levee opening 32 cross sectional shape be it is trapezoidal for be illustrated, perpendicular to drive substrate In 10 plane, the cross sectional shape of separation levee opening 32 can also be rectangle or other shapes, and the present embodiment does not make this to have Body limitation.Meanwhile the present embodiment is also not specifically limited the size of separation levee opening 32, as long as being able to satisfy a separation levee opening 32 It is inside only capable of accommodating a LED component 20, to be open what 32 pairs of LED components 20 were limited by separation levee when reaching assembling Purpose.
Display panel provided in this embodiment, at least has the following technical effect that:
The ipsilateral setting of first electrode and second electrode of LED component, each LED component magnetism it is identical so that LED component it Between will not mutually adsorb, improve the efficiency of transhipment and assembling;Ferromagnetic electrode and lead wire are located in separation levee opening, and separation levee is opened It is separated between mouthful by separation levee, multiple LED components after lead wire energization magnetization can be effectively prevent to be adsorbed onto same separation levee opening, Improve the precision of transhipment and assembling;Ferromagnetic electrode is magnetized after lead wire is powered, to remain to after lead wire power-off by LED Device is adsorbed on electrode layer, is not necessarily to one direct power supply of lead wire, and can be passed through control power supply mode and be controlled LED component Difference transhipment requires, and manipulates more flexible and convenient;After LED component to be placed in the liquid with certain viscosity, to lead wire Assembling of the LED component in drive substrate can be realized in energization, and transport process is simple and easy to control, high-efficient, and without in addition production Head is transported, the production cost of product is advantageously reduced.
In some alternative embodiments, it please refers to shown in Fig. 6, first electrode 21 includes the first magnetic pole 210 and resists Magnetosphere 23, diamagnetic layer 23 are at least set to the first magnetic pole 210 close to the side of LED component 20.
In the present embodiment, diamagnetic layer 23 is at least set to the first magnetic pole 210 close to the side of LED component 20, namely The magnetic field of first magnetic pole 210 generation is realized by diamagnetic layer 23 and being isolated between 20 other component of LED component, so as to To prevent from mutually adsorbing between LED component 20 because of the magnetism of the first magnetic pole 210, make the transhipment and assembling of LED component 20 It can be normally carried out.
It is understood that the difference of magnetic field line and electric field line is, electric field line can be by connecing the conductive gold of zero potential Belong to layer to be truncated, and magnetic field line is closure forming circuit always, therefore the effect of diamagnetic layer 23 is by the first magnetic in the present embodiment Property electrode 210 generate magnetic field be limited in the region being not directly contacted with 20 other component of LED component, be not to magnetic in magnetic field The truncation of field wire.
Optionally, it please refers to shown in Fig. 7, diamagnetic layer 23 further includes retaining ring 230, and retaining ring 230 surrounds the first magnetic pole 210 Setting.
In the present embodiment, the retaining ring 230 of the first magnetic pole 210 is surrounded by being arranged, can be better protected from the first magnetic Property the magnetic field that generates of electrode 210 influence 20 other component of LED component, and then be better protected between LED component 20 and mutually adsorb.
The shape of retaining ring 230 can there are many, such as circular annular form, square ring, polygonal ring shape etc., the present embodiment To this and it is not specifically limited.
Optionally, incorporated by reference to shown in reference Fig. 7 and Fig. 8, the height of retaining ring 230 is less than or equal to the first magnetic pole 210 height.
It in the present embodiment, is separated between separation levee opening 32 by separation levee 31, ferromagnetic electrode 41 is located in separation levee opening 32 Drive substrate 10 on, on the direction perpendicular to the first magnetic pole 210, the height of retaining ring 230 is no more than the first magnetic electricity The height of pole 210 can make LED component 20 directly contact and be adsorbed thereon with ferromagnetic electrode 41 when assembling, and ensure that drive The validity that dynamic substrate 10 drives LED component 20, and the magnetic intensity of the first magnetic pole 210 will not be influenced.
Optionally, please continue to refer to shown in Fig. 7, diamagnetic layer 23 is made of diamagnetism metal material.It is diamagnetic in the present embodiment Property metal material by externally-applied magnetic field, such as the first magnetic pole 210 generate magnetic fields when, it is additional that resistance can be obtained The intensity of magnetization in magnetic field, so that the first magnetic pole 210 is avoided to magnetize component of the LED component 20 in addition to first electrode 21, It prevents from mutually adsorbing between LED component 20.Wherein, diamagnetism metal material can be gold, silver, copper, alloy etc. with diamagnetism Metal material, the present embodiment is to this and is not specifically limited.
In some alternative embodiments, it please refers to shown in Fig. 9, display panel further includes the first bonded layer 50 and the second key Layer 51 is closed, the first bonded layer 50 is set between first electrode 21 and ferromagnetic electrode 41, and the second bonded layer 51 is set to second Between electrode 22 and lead wire 42;Wherein, first electrode 21 is connected by the first bonded layer 50 and ferromagnetic electrode 41, the second electricity Pole 22 is connected by the second bonded layer 51 and lead wire 42.
In the present embodiment, the first magnetic pole 210 and drive substrate 10 of first electrode 21 are made by the way that bonded layer is arranged On ferromagnetic electrode 41 between and second electrode 22 and drive substrate 10 on lead wire 42 between can pass through Van der Waals Power closely connects, junction stable chemical performance, not vulnerable, cracking, and then ensures LED component 20 in separation levee opening 23 The stability and fastness of assembling.
Also, bonding process can all carry out after transhipment is completed in LED component 20, even if transport process is in viscosity It carries out in liquid, will not influence each other between bonded layer and viscous liquid, it is ensured that the assembly precision of LED component 20.Together When, bonding process is not related to the process of high temperature and rapid cooling, avoid junction stress it is excessive caused by problem of Cracking, favorably In the qualification rate for improving product.The material of first bonded layer 50 and the second bonded layer 51 can there are many, such as based on indium, bismuth or The solder etc. of tin, the present embodiment is to this and is not specifically limited.
In some alternative embodiments, incorporated by reference to shown in reference Fig. 1, Figure 10 and Figure 11, what multiple LED components 20 were shown Color is identical, is electrically connected between lead wire 42.It should be noted that the technical solution in order to clearly illustrate the present embodiment, figure LED component 20 is omitted in 10 and Figure 11.
It in the present embodiment, is electrically connected between lead wire 42, allows the lead wire 32 being located in each separation levee opening 32 real It is now powered simultaneously or power-off, thus under the action of lead wire 42, ferromagnetic electrode 41 in each separation levee opening 32 can be with It realizes while being magnetized, LED component 20 can be respectively fallen in each separation levee opening 32 at this time, and be adsorbed on 41 He of ferromagnetic electrode On lead wire 42, realize assembling, when assembling, the quantity of LED component 20 can adjust according to the actual situation, the present embodiment to this simultaneously It is not specifically limited, for example in a fairly large number of situation of LED component 20, can assemble in batches, to improve LED component 20 Packaging efficiency.
In addition, although lead wire 42 is short-circuited after absorption LED component 20, since ferromagnetic electrode 41 has spontaneity Magnetization phenomenon, the ferromagnetic electrode 41 still are able to adsorb LED component 20.LED component 20 assemble after, due to lead wire 42 it Between be electrically connected, when subsequent application forward bias makes LED component 20 shine, lead wire 42 can for each LED component 20 second electricity Pole 22 provides identical voltage, and lead wire 42 can be multiplexed with public electrode at this time, without being additionally formed public electrode film layer, favorably In the lightening of realization display panel;Also, since the electrode layer 40 where lead wire 42 can be before transporting LED component 20 It is formed, manufacture difficulty is smaller, is conducive to the production efficiency for improving product.
In the following, the situation identical based on the color that LED component 20 is shown, the present invention herein setting the specific of lead wire 42 Mode is set illustratively to be illustrated.
Optionally, incorporated by reference to shown in reference Fig. 6, Figure 10 to Figure 12, drive substrate 10 includes conductive layer 11;Lead wire 42 is in Snail is linear, is electrically connected between lead wire 42 by conductive layer 11.
In the present embodiment, since lead wire 42 is linear in snail, if in same film layer head and the tail between lead wire 42 Connect, then inevitably result in short circuit, so that ferromagnetic electrode 41 can not be magnetized by lead wire 42, to pass through setting conductive layer 11 Realize the connection transition between lead wire 42.
After lead wire 42 is powered, the linear lead wire 42 of snail is equivalent to a bar magnet, according to Ampere's law, The control in lead wire 42 between current direction and magnetic pole may be implemented, to make lead wire 42 close to the side of drive substrate 10 Identical with the magnetism of the second magnetic pole 212, the magnetism of side and first magnetic pole 211 of the lead wire 42 far from drive substrate 10 is identical, Ferromagnetic electrode 41 is identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, and ferromagnetic electrode 41 is far from driving The magnetism of the side of substrate 10 and the first magnetic pole 211 is identical.
In the identical situation of color of multiple LED components 20 display, the shape of conductive layer 11 can there are many, such as it is flat Planar, bulk, latticed etc., the present embodiment is to this and is not specifically limited.
Optionally, incorporated by reference to shown in reference Fig. 6, Figure 13 and Figure 14, lead wire 42 draws socket part 421 and second including first and draws Socket part 422, on the direction for being parallel to drive substrate 10, first, which draws socket part 421 and second, draws socket part 422 and is located at ferromagnetic electrode 41 opposite two sides;Wherein, first draws and is electrically connected between socket part 421, and second draws and be electrically connected between socket part 422.It needs to illustrate It is, in order to clearly illustrate the technical solution of the present embodiment, LED component 20 to be omitted in Figure 13.
In the present embodiment, in order to keep lead wire 42 identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, The magnetism of side and first magnetic pole 211 of the lead wire 42 far from drive substrate 10 is identical, and ferromagnetic electrode 41 is close to drive substrate The magnetism of 10 side and the second magnetic pole 212 is identical, side and first magnetic pole of the ferromagnetic electrode 41 far from drive substrate 10 It is magnetic identical, it needs to make first to draw socket part 421 and second and draws after socket part 422 is powered current direction on the contrary, drawing socket part as first 421 and second draw the specific current direction of socket part 422, and the basis of 212 magnetism of the first magnetic pole 211 and the second magnetic pole is being determined On, it can be obtained according to Ampere's law.
First draw the mode that is electrically connected between socket part 421 can there are many, for example first draw head and the tail phase between socket part 421 It connects;Second draw the mode that is electrically connected between socket part 422 can also there are many, such as second draw it is end to end between socket part 422, this Embodiment is not specifically limited this.
In some alternative embodiments, incorporated by reference to shown in reference Fig. 6 and Figure 15, multiple LED components 20 show at least two The different color of kind;It is electrically connected between the lead wire 42 being connect with the LED component 20 of display same color;With display face not of the same race It insulate between the lead wire 42 that the LED component 20 of color connects.It should be noted that the technology in order to clearly illustrate the present embodiment LED component 20 and separation levee 31 is omitted in Figure 15 in scheme.
Ferromagnetic electrode 41 and lead wire 42 and a LED after lead wire 42 is powered, in a separation levee opening 32 Device 20 adsorbs.In the present embodiment, it is electrically connected between the lead wire 42 that connect of LED component 20 of display same color, meanwhile, It insulate between the lead wire 42 being connect with the LED component 20 of display not same color.For example the first is shown transporting and assembling When the LED component 20 of color, the lead wire 42 for adsorbing the LED component 20 for showing the first color is powered and magnetizes corresponding Ferromagnetic electrode 41 shows that the LED component 20 of the first color is fallen into separation levee opening 32, and only inhales with the lead wire of energization 42 It closes, to realize the purpose for showing that the LED component 20 of not same color is assembled apart by the on-off of control lead wire 42, improves The efficiency of transhipment and assembling.
After LED component 20 assembles, due to being electrically connected between the lead wire 42 that connect of LED component 20 of display same color It connects, when subsequent application forward bias makes LED component 20 shine, lead wire 42 can be the LED component 20 of display same color Second electrode 22 provides identical voltage, and lead wire 42 can also be multiplexed with public electrode at this time, without being additionally formed public electrode Film layer is advantageously implemented the lightening of display panel;Also, since the electrode layer 40 where lead wire 42 can be in transhipment LED It is formed before device 20, manufacture difficulty is smaller, is conducive to the production efficiency for improving product.
In the following, the case where showing at least two different colors based on LED component 20, the present invention is herein for lead wire 42 Specific set-up mode illustratively illustrated.
Optionally, incorporated by reference to shown in reference Fig. 6, Figure 10 to Figure 12 and Figure 15, drive substrate 10 includes conductive layer 11;Draw Wiring 42 is linear in snail, and passes through conductive layer between the lead wire 42 connecting with the LED component 20 of display same color 11 electrical connections.
In the present embodiment, since lead wire 42 is linear in snail, it is still desirable to be realized and be drawn by setting conductive layer 11 Connection transition between wiring 42.After lead wire 42 is powered, the linear lead wire 42 of snail is equivalent to a bar magnet, According to Ampere's law, the control in lead wire 42 between current direction and magnetic pole may be implemented, to make lead wire 42 close to drive The side of dynamic substrate 10 and magnetic identical, side and first magnetic pole of the lead wire 42 far from drive substrate 10 of the second magnetic pole 212 211 magnetism is identical, and ferromagnetic electrode 41 is close to the side of drive substrate 10 and magnetic identical, the ferromagnetism of the second magnetic pole 212 The magnetism of side and first magnetic pole 211 of the electrode 41 far from drive substrate 10 is identical.
In the case where multiple LED components 20 show at least two different colors, control lead wire 42 can be passed through On-off realizes the purpose for showing that the LED component 20 of not same color is assembled apart.For example, incorporated by reference to shown in reference Figure 16, it is multiple LED component 20 includes showing the LED component of second of color of LED component 201 and display of the first color, first group of lead wire It is electrically connected, is electrically connected between second group of lead wire 4202 by conductive layer 11, and ensure first by conductive layer 11 between 4201 It insulate between group lead wire 4201 and second group of lead wire 4202, if there are also the LED of display n-th (integer that n is > 2) kind color Device repeats aforesaid operations, to realize independent control system of switching on or off electricity of the lead wire 42 between group and group, so that LED component 20 can realize self assembly according to the different grouping of display color.
When transporting and assembling the LED component 201 for showing the first color, for adsorbing the LED for showing the first color First group of lead wire 4201 of device 201 is powered and magnetizes corresponding ferromagnetic electrode 41, for adsorbing second of color of display LED component second group of lead wire 4202 then no power, show that the LED component 201 of the first color falls into separation levee opening 32 It is interior, and be only attracted with the lead wire of energization 42;It is aobvious for adsorbing after the LED component 201 of the first color to be shown is completed Show that the lead wire 4202 of the LED component of second of color is powered, and is used to adsorb the LED component 201 for showing the first color Lead wire 42 can both remain powered on state at this time, also may be at off-position, and the LED component of second of color of display is fallen into Separation levee opening 32 in after and unadsorbed LED component and in energized state lead wire 4202 be attracted.It should be noted that being Clearly illustrate the technical solution of the present embodiment, separation levee 31 is omitted in Figure 16 and shows the LED component of second color.
Certainly, conductive layer 11 can also be other shapes, such as strip, bulk, latticed etc., the present embodiment to this not Make concrete restriction.
Optionally, incorporated by reference to shown in reference Fig. 6, Figure 13, Figure 14 and Figure 17, lead wire 42 draws 421 He of socket part including first Second draws socket part 422, and on the direction for being parallel to drive substrate 10, first, which draws socket part 421 and second, draws socket part 422 positioned at ferromagnetic The property opposite two sides of electrode 41;Wherein, first connect with the LED component 20 of display same color is drawn to be electrically connected between socket part 421 It connects, second connect with the LED component 20 of display same color is drawn to be electrically connected between socket part 422.It should be noted that in order to clear Illustrate to Chu the technical solution of the present embodiment, LED component 20 and separation levee 31 are omitted in Figure 17.
In the present embodiment, according to Ampere's law, makes first to draw socket part 421 and second and draw current direction after socket part 422 is powered On the contrary, and keep lead wire 42 identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, lead wire 42 is far from drive The side of dynamic substrate 10 and the magnetism of the first magnetic pole 211 are identical, and ferromagnetic electrode 41 is close to the side of drive substrate 10 and second The magnetism of magnetic pole 212 is identical, and the magnetism of side and first magnetic pole of the ferromagnetic electrode 41 far from drive substrate 10 is identical.
First draw the mode that is electrically connected between socket part 421 can there are many, for example first draw head and the tail phase between socket part 421 It connects;Second draw the mode that is electrically connected between socket part 422 can also there are many, such as second draw it is end to end between socket part 422, this Embodiment is not specifically limited this.
In the case where multiple LED components 20 show at least two different colors, control lead wire 42 can be passed through On-off realizes the purpose for showing that the LED component 20 of not same color is assembled apart.For example, incorporated by reference to shown in reference Figure 18, it is multiple LED component 20 includes showing the LED component of second of color of LED component 201 and display of the first color, first group of lead wire The first of 4201 draws between socket part 421 electrical connection, second draws and be electrically connected between socket part 422, and the first of second group of lead wire 4202 Draw between socket part 421 electrical connection, second draw and be electrically connected between socket part 422, if there are also display n-th (integer that n is > 2) kind colors LED component, repeat aforesaid operations, to realize independent control system of switching on or off electricity of the lead wire 42 between group and group, so that LED component 20 can realize self assembly according to the different grouping of display color.
When transporting and assembling the LED component 201 for showing the first color, for adsorbing the LED for showing the first color First group of lead wire 4201 of device 201 is powered and magnetizes corresponding ferromagnetic electrode 41, for adsorbing second of color of display LED component second group of lead wire 4202 then no power, show that the LED component 201 of the first color falls into separation levee opening 32 It is interior, and be only attracted with first group of lead wire 4201 of energization;After the LED component 201 of the first color to be shown is completed, use It is powered in second group of lead wire 4202 of the LED component of absorption second of color of display, and is used to adsorb and shows the first color First group of lead wire 4201 of LED component 201 can both remain powered on state at this time, also may be at off-position, show Unadsorbed LED component and draw after the LED component of second of color is fallen into separation levee opening 32 and in second group of energized state Wiring 4202 is attracted.It should be noted that the technical solution in order to clearly illustrate the present embodiment, separation levee 31 is omitted in Figure 18 With the LED component of second of color of display.
In some alternative embodiments, incorporated by reference to shown in reference Figure 19 and Figure 20, in the side perpendicular to drive substrate 10 Upwards, the distance between the side and drive substrate 10 of ferromagnetic electrode 41 far from drive substrate 10 is h1, and lead wire 42 is separate The distance between the side of drive substrate 10 and drive substrate 10 are h2;Wherein, h1 > h2.
In the present embodiment, realize h1 greater than h2 mode can there are many, such as increase ferromagnetic electrode 41 thickness, or Person can also add bed course etc., the present embodiment pair between side and drive substrate of the ferromagnetic electrode 41 close to drive substrate 10 This is simultaneously not specifically limited.
It is greater than h2 by setting h1, on the one hand, the first electrode 21 that LED component 20 can be effectively prevented falls into separation levee opening It is attracted after in 32 with lead wire 42;On the other hand, the LED component 20 that can be more convenient for and ferromagnetic electrode 41 and lead wire 42 are right The precision of LED component 20 transhipment and assembling is improved in position.At this point, in order to be attracted second electrode 22 and lead wire 42, the should be increased The height h3 of two electrodes 22.
The present invention also provides a kind of production methods of display panel, incorporated by reference to reference Fig. 1-Fig. 5, Figure 21, Figure 22-Figure 24 It is shown, comprising:
One drive substrate 10 is provided;
Multiple LED components 20 are provided;Wherein, LED component 20 includes first electrode 21 and second electrode 22, first electrode 21 It is located at the ipsilateral of LED component 20 with second electrode 22, and second electrode 22 is arranged around first electrode 21;Wherein, first electrode One of 21 and second electrode 22 include the first magnetic pole 210, and the first magnetic pole 210 is close to the side of LED component 20 For the first magnetic pole 211, side of first magnetic pole 210 far from LED component 20 is the second magnetic pole 212, the first magnetic pole 211 and the The magnetism of two magnetic poles 212 is opposite;
Electrode layer 40 and separation levee layer 30 are formed in drive substrate 10;Wherein, separation levee layer 30 includes separation levee 31 and is in array Multiple separation levees opening 32 of arrangement is separated by separation levee 31 between separation levee opening 32;Electrode layer 40 includes being located at separation levee opening 32 Interior ferromagnetic electrode 41 and lead wire 42, on the direction for being parallel to drive substrate 10, lead wire 42 is located at ferromagnetic electrode 41 periphery;
The drive substrate 10 for being formed with electrode layer 40 and separation levee layer 30 is placed in viscous liquid 60, and by multiple LED devices Part 20 is placed in viscous liquid 60;
It is powered to lead wire 42, lead wire 42 is identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, draws The magnetism of side and first magnetic pole 211 of the wiring 42 far from drive substrate 10 is identical, and ferromagnetic electrode 41 is close to drive substrate 10 Side and the second magnetic pole 212 magnetism it is identical, side and first magnetic pole 211 of the ferromagnetic electrode 41 far from drive substrate 10 It is magnetic identical, make there is the first electrode 21 of a LED component 20 and ferromagnetic electrode 41 to be attracted at least one separation levee opening 32, Or make there is the second electrode 22 of a LED component 20 and lead wire 42 to be attracted at least one separation levee opening 32.
In the present embodiment, when multiple LED components 20 are placed in viscous liquid 60, due to the viscosity property of viscous liquid 60, Multiple LED components 20 can be made slowly to sink, this process slowly sunk is actually the process transported.Drawn by control The current direction of wiring 42 can make lead wire 42 identical close to the side of drive substrate 10 and the magnetism of the second magnetic pole 212, draw The magnetism of side and first magnetic pole 211 of the wiring 42 far from drive substrate 10 is identical, and ferromagnetic electrode 41 is close to drive substrate 10 Side and the second magnetic pole 212 magnetic identical, the magnetic of side and first magnetic pole of the ferromagnetic electrode 41 far from drive substrate 10 Property it is identical, so that LED component 20 is adsorbed on electrode layer 40 because of magneticaction in transport process, realize automatic assembling.
In transhipment and assembling process, certain vibration can be applied to the container for filling viscous liquid 60, make LED component 20 It is more evenly distributed in viscous liquid 60, while the LED component 20 for being stuck in separation levee opening 32 can be made to suspend again, thus raising group The efficiency of dress.
Assembling is realized since LED component 20 is placed in viscous liquid 60, therefore on the one hand, viscous liquid 60 can be effective The problem for avoiding packaging efficiency caused by the too fast sinking of LED component 20 low;On the other hand, LED component 20 is being transported in order to prevent With mutually absorption and to the electrical isolation of lead wire 42 in assembling process, viscous liquid 60 need to be for without magnetic conductivity and electric conductivity Viscous liquid 60, such as acetone, oil etc., the present embodiment is to this and is not specifically limited.
It should be noted that the quantity for the LED component 20 being put into viscous liquid 60 can adjust according to the actual situation, this Embodiment is also not specifically limited this.For example, it is put into LED component 20 in batches, since the number of devices being put into every time is less, It can not have to apply container and shake transhipment and assembling that device can be realized;For another example, in the case that separation levee opening 32 is less, Disposable input quantity prevents in individual separation levee openings 32 more than the LED component 20 of separation levee opening 32 without device, thus raising group Fill efficiency.
In some alternative embodiments, incorporated by reference to shown in reference Fig. 9, Figure 25, Figure 26-Figure 27, process shown in Figure 21 Figure is before drive substrate 10 is placed in viscous liquid 60, further includes:
The first bonded layer 50 is formed far from the side of LED component 20 in first electrode 21, in second electrode 22 far from LED device The side of part 20 forms the second bonded layer 51;Alternatively, forming the first key far from the side of drive substrate 10 in ferromagnetic electrode 41 Layer 50 is closed, forms the second bonded layer 51 far from the side of drive substrate 10 in lead wire 42;
First electrode 21 and ferromagnetic electrode 41 actuation of LED component 20 or second electrode 22 and lead wire 42 are attracted Afterwards, the drive substrate 10 for being adsorbed with LED component 20 is taken out from viscous liquid 60, LED component 20 is then passed through into the first key It closes layer 50 and the second bonded layer 51 is bonded with electrode layer 40.
Specifically, the bonding process of the first bonded layer 50 and the second bonded layer 51 is actually to heat up to melt mistake cooling again Journey, the process can usually carry out within the temperature range of 15 DEG C -35 DEG C, not be related to the process of high temperature and rapid cooling, thus Make between first electrode 21 and ferromagnetic electrode 41, can closely be connected by Van der Waals force between second electrode 22 and lead wire 42 It connects, stable chemical performance at bonding, not vulnerable, cracking, and then it is steady to ensure that LED component 20 assembles in separation levee opening 23 Qualitative and fastness.In addition, drive substrate 10 should be dried sufficiently after taking out in viscous liquid, the sticky liquid of surface adhesion is prevented Body influences bonding process.
Please continue to refer to shown in Figure 26, the first bonded layer 50 is formed in side of the first electrode 21 far from LED component 20, the Two bonded layers 51 are formed in side of the second electrode 22 far from LED component 20, to need to ensure before assembling each LED component 20 On bonded layer has been set.Alternatively, the first bonded layer 50 is formed in ferromagnetic electrode 41 far from drive please continue to refer to shown in Figure 19 The side of dynamic substrate 10, the second bonded layer 51 are formed in side of the lead wire 42 far from drive substrate, namely on electrode layer 40 Bonded layer is directly formed, without forming bonded layer to LED component 20 one by one, labor intensity is both reduced, also improves product Production efficiency.Certainly, the first bonded layer 50 and the second bonded layer 51 can also have other generation types, and the present embodiment is only with above-mentioned Two kinds of generation types make exemplary illustration.
In addition, first electrode 21 may include the first magnetic pole 210 and diamagnetic layer 23, in the present embodiment with preferably It prevents from mutually adsorbing between LED component 20.
Optionally, incorporated by reference to shown in reference Fig. 9, Figure 28 and Figure 29, flow chart shown in Figure 25 is in drive substrate 10 from viscous Property liquid 60 in take out after and before LED component 20 is bonded with electrode layer 40, further includes:
One assisting base plate 11 is provided, assisting base plate 11 is placed in side of the LED component 20 far from drive substrate 10, and with The pressing contact of LED component 20.To on the one hand make each LED component 20 will not be because of external interference under the action of assisting base plate 11 And shift, on the other hand make the first bonded layer 50 and the second bonded layer 51 pressure suffered by each LED component 20 in bonding process Power is essentially identical, then ensures the consistency that LED component 20 is bonded.
In some alternative embodiments, incorporated by reference to shown in reference Figure 10, Figure 11 and Figure 24, multiple LED components 20 are shown Color it is identical, be electrically connected between lead wire 42, multiple LED components 20 be placed in viscous liquid 60, to lead wire 42 be powered, Make that the first electrode 21 of LED component 20 and ferromagnetic electrode 41 are attracted or second electrode 22 and lead wire 42 are attracted.
Wherein, the electric connection mode between lead wire 42 can there are many, the present embodiment is to this and is not specifically limited, only The lead wire 42 that can be located in each separation levee opening 32 is wanted to may be implemented to be powered or power off simultaneously, thus in lead wire 42 Under the action of, the ferromagnetic electrode 41 in each separation levee opening 32 may be implemented to be magnetized simultaneously, at this time in viscous liquid 60 In the LED component 20 slowly sunk can be adsorbed in the ferromagnetic electrode 41 and lead wire 42 in separation levee opening 32, realize from Assembling.
In some alternative embodiments, incorporated by reference to shown in reference Figure 10, Figure 11, Figure 16 and Figure 24, multiple LED components 20 It shows at least two different colors, the LED component 201 for showing the first color is placed in viscous liquid 60, to first group Lead wire 4201 is powered, and is attracted the first electrode 21 for the LED component 201 for showing the first color and ferromagnetic electrode 41, or Person's second electrode 22 and first group of lead wire 42 are attracted;
Then the LED component for showing second of color is placed in viscous liquid 60, is powered to second group of lead wire 4202, Make the first electrode 21 for showing the LED component of second of color and ferromagnetic electrode 41 is attracted or second electrode 22 and second Group lead wire 4202 is attracted.
In the present embodiment, the first of every group of lead wire 42 draw the mode that is electrically connected between socket part 421 can there are many, this reality Example is applied to this and is not specifically limited, as long as can allow each group lead wire 42 that energization and power-off is implemented separately, thus Under the action of lead wire 42, the ferromagnetic electrode 41 in each separation levee opening 32, which can be grouped, to be magnetized, and LED component 20 can To realize self assembly according to the different grouping of display color, so that transhipment and assembly operation are more flexible and convenient.
Through the foregoing embodiment it is found that display panel provided by the invention and preparation method thereof, at least realizes following The utility model has the advantages that
The ipsilateral setting of first electrode and second electrode of LED component, each LED component magnetism it is identical so that LED component it Between will not mutually adsorb, improve the efficiency of transhipment and assembling;Ferromagnetic electrode and lead wire are located in separation levee opening, and separation levee is opened It is separated between mouthful by separation levee, multiple LED components after lead wire energization magnetization can be effectively prevent to be adsorbed onto same separation levee opening, Improve the precision of transhipment and assembling;Ferromagnetic electrode is magnetized after lead wire is powered, to remain to after lead wire power-off by LED Device is adsorbed on electrode layer, is not necessarily to one direct power supply of lead wire, and can be passed through control power supply mode and be controlled LED component Difference transhipment requires, and manipulates more flexible and convenient;After LED component is placed in viscous liquid, LED can be realized to lead wire energization Self assembly of the device in drive substrate, transport process is simple and easy to control, high-efficient, and transports head without in addition production, is conducive to Reduce the production cost of product.
Although some specific embodiments of the invention are described in detail by example, the skill of this field Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair Bright range is defined by the following claims.

Claims (18)

1. a kind of display panel characterized by comprising
Drive substrate, multiple LED components and the separation levee layer and electrode layer being set in the drive substrate;
The separation levee layer includes separation levee and the multiple separation levees being arranged in array opening, passes through the separation levee between the separation levee opening It separates, a LED component is set in a separation levee opening;
The LED component includes first electrode and second electrode, and the first electrode and the second electrode are located at the LED device Part it is ipsilateral, and the second electrode around the first electrode be arranged;Wherein, in the first electrode and the second electrode One of include the first magnetic pole, first magnetic pole is the first magnetic pole close to the side of the LED component, described the Side of one magnetic pole far from the LED component is the second magnetic pole, the magnetic phase of first magnetic pole and second magnetic pole Instead;
The electrode layer includes ferromagnetic electrode and lead wire in separation levee opening, is being parallel to the drive substrate Direction on, the lead wire is located at the periphery of the ferromagnetic electrode;Wherein, after the lead wire is powered, the lead wire Close to the drive substrate side and second magnetic pole magnetism it is identical, the lead wire far from the drive substrate one Magnetic identical, side and second magnetic pole of the ferromagnetic electrode close to the drive substrate of side and first magnetic pole Magnetism it is identical, side and first magnetic pole of the ferromagnetic electrode far from the drive substrate magnetism it is identical;
The first electrode is connected with the ferromagnetic electrode, and the second electrode is connected with the lead wire.
2. display panel according to claim 1, which is characterized in that
The first electrode includes the first magnetic pole and diamagnetic layer, and the diamagnetic layer is at least set to first magnetic pole Close to the side of the LED component.
3. display panel according to claim 2, which is characterized in that
The diamagnetic layer further includes retaining ring, and the retaining ring is arranged around first magnetic pole.
4. display panel according to claim 3, which is characterized in that
The height of the retaining ring is less than or equal to the height of first magnetic pole.
5. display panel according to claim 2, which is characterized in that
The diamagnetic layer is made of diamagnetism metal material.
6. display panel according to claim 1, which is characterized in that
The display panel further includes the first bonded layer and the second bonded layer, and first bonded layer is set to the first electrode Between the ferromagnetic electrode, second bonded layer is set between the second electrode and the lead wire;Wherein,
The first electrode is connected by first bonded layer with the ferromagnetic electrode, and the second electrode passes through described the Two bonded layers are connected with the lead wire.
7. display panel according to claim 1, which is characterized in that
The color that the multiple LED component is shown is identical, is electrically connected between the lead wire.
8. display panel according to claim 7, which is characterized in that
The drive substrate includes conductive layer;
The lead wire is linear in snail, is electrically connected between the lead wire by the conductive layer.
9. display panel according to claim 7, which is characterized in that
The lead wire includes first drawing socket part and second and drawing socket part, on the direction for being parallel to the drive substrate, described the One, which draws socket part and described second, draws socket part and is located at the opposite two sides of the ferromagnetic electrode;Wherein, described first draws between socket part Electrical connection, described second draws and is electrically connected between socket part.
10. display panel according to claim 1, which is characterized in that
The multiple LED component shows at least two different colors;
It is electrically connected between the lead wire being connect with the LED component of display same color;
It insulate between the lead wire being connect with the LED component of display not same color.
11. display panel according to claim 10, which is characterized in that
The drive substrate includes conductive layer;
The lead wire is linear in snail, and with the lead wire that connect of the LED component of display same color it Between be electrically connected by the conductive layer.
12. display panel according to claim 10, which is characterized in that
The lead wire includes first drawing socket part and second and drawing socket part, on the direction for being parallel to the drive substrate, described the One, which draws socket part and described second, draws socket part and is located at the opposite two sides of the ferromagnetic electrode;Wherein,
Described first connect with the LED component of display same color is drawn to be electrically connected between socket part, with display same color LED component connection described second draw and be electrically connected between socket part.
13. display panel according to claim 1, which is characterized in that
In the direction perpendicular to the drive substrate, side and the drive of the ferromagnetic electrode far from the drive substrate The distance between dynamic substrate is h1, side and the drive substrate the distance between of the lead wire far from the drive substrate For h2;Wherein, h1 > h2.
14. a kind of production method of display panel characterized by comprising
One drive substrate is provided;
Multiple LED components are provided;Wherein, the LED component includes first electrode and second electrode, the first electrode and described Second electrode is located at the ipsilateral of the LED component, and the second electrode is arranged around the first electrode;Wherein, described One of one electrode and the second electrode include the first magnetic pole, and first magnetic pole is close to the LED component Side be the first magnetic pole, first magnetic pole far from the LED component side be the second magnetic pole, first magnetic pole It is opposite with the magnetism of second magnetic pole;
Electrode layer and separation levee layer are formed in the drive substrate;Wherein, the separation levee layer includes separation levee and is arranged in array Multiple separation levees are open, and are separated between the separation levee opening by the separation levee;The electrode layer includes being located at the separation levee to be open Interior ferromagnetic electrode and lead wire, on the direction for being parallel to the drive substrate, the lead wire is located at the ferromagnetism The periphery of electrode;
The drive substrate for being formed with the electrode layer and the separation levee layer is placed in viscous liquid, and will be the multiple LED component is placed in the viscous liquid;
It is powered to the lead wire, the lead wire is close to the side of the drive substrate and the magnetic phase of second magnetic pole Together, the magnetism of side and first magnetic pole of the lead wire far from the drive substrate is identical, and the ferromagnetic electrode is leaned on The side of the nearly drive substrate and the magnetism of second magnetic pole are identical, and the ferromagnetic electrode is far from the drive substrate The magnetism of side and first magnetic pole is identical, makes have the first of a LED component at least one described separation levee opening Electrode and the ferromagnetic electrode are attracted, or make have the second of a LED component at least one described separation levee opening Electrode and the lead wire are attracted.
15. the production method of display panel according to claim 14, which is characterized in that
Before the drive substrate is placed in the viscous liquid, further includes:
The first bonded layer is formed far from the side of the LED component in the first electrode, in the second electrode far from described The side of LED component forms the second bonded layer;Alternatively, forming the far from the side of the drive substrate in the ferromagnetic electrode One bonded layer forms the second bonded layer far from the side of the drive substrate in the lead wire;
The first electrode of the LED component and the ferromagnetic electrode be attracted or the second electrode and it is described draw connect After line is attracted, the drive substrate for being adsorbed with the LED component is taken out from the viscous liquid, then by the LED Device is bonded by first bonded layer and second bonded layer with the electrode layer.
16. the production method of display panel according to claim 15, which is characterized in that
The drive substrate is also wrapped after taking out in the viscous liquid and before the LED component is bonded with the electrode layer It includes:
One assisting base plate is provided, the assisting base plate is placed in side of the LED component far from the drive substrate, and with The LED component pressing contact.
17. the production method of display panel according to claim 14, which is characterized in that
The color that the multiple LED component is shown is identical, is electrically connected between the lead wire, and the multiple LED component is placed It in the viscous liquid, is powered to the lead wire, inhales the first electrode of the LED component and the ferromagnetic electrode Conjunction or the second electrode and the lead wire are attracted.
18. the production method of display panel according to claim 14, which is characterized in that
The multiple LED component shows at least two different colors, and the LED component for showing the first color is placed in The viscous liquid, the lead wire described in first group are powered, and make first electricity for the LED component for showing the first color Lead wire described in pole and ferromagnetic electrode actuation or the second electrode and first group is attracted;
Then the LED component for showing second of color is placed in the viscous liquid, the lead wire described in second group is logical Electricity is attracted the first electrode for showing the LED component of second of color and the ferromagnetic electrode or described the Lead wire described in two electrodes and second group is attracted.
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WO2021017498A1 (en) * 2019-07-31 2021-02-04 成都辰显光电有限公司 Display panel, display device, and method for preparing display panel
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CN114695618A (en) * 2022-05-30 2022-07-01 惠科股份有限公司 Display panel and manufacturing method thereof
US11626553B2 (en) 2020-10-06 2023-04-11 Au Optronics Corporation Light-emitting apparatus and manufacturing method thereof
CN116053387A (en) * 2023-03-07 2023-05-02 惠科股份有限公司 Display panel manufacturing method and display panel

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103792722A (en) * 2014-01-22 2014-05-14 京东方科技集团股份有限公司 Display device, display panel and manufacturing method thereof
JP2014090052A (en) * 2012-10-30 2014-05-15 Nichia Chem Ind Ltd Light-emitting element, light-emitting device and light-emitting device manufacturing method
JP2015153931A (en) * 2014-02-17 2015-08-24 スタンレー電気株式会社 Semiconductor light emitting device, semiconductor light emitting element and semiconductor light emitting device manufacturing method
JP2016025205A (en) * 2014-07-18 2016-02-08 スタンレー電気株式会社 Method of manufacturing semiconductor optical device
CN106847796A (en) * 2015-11-19 2017-06-13 三星电子株式会社 LED chip, light source module, LED display panel and the LED display device including it
WO2017150910A1 (en) * 2016-03-02 2017-09-08 엘지이노텍 주식회사 Light emitting module and display device
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电(浙江)有限公司 A kind of method of micro-led chip flood tide transfer
CN107783331A (en) * 2017-10-20 2018-03-09 深圳市华星光电技术有限公司 The method of device transfer device and its transferring device, device transfer blade
CN107863433A (en) * 2017-11-07 2018-03-30 深圳市华星光电技术有限公司 Display device and display panel

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014090052A (en) * 2012-10-30 2014-05-15 Nichia Chem Ind Ltd Light-emitting element, light-emitting device and light-emitting device manufacturing method
CN103792722A (en) * 2014-01-22 2014-05-14 京东方科技集团股份有限公司 Display device, display panel and manufacturing method thereof
JP2015153931A (en) * 2014-02-17 2015-08-24 スタンレー電気株式会社 Semiconductor light emitting device, semiconductor light emitting element and semiconductor light emitting device manufacturing method
JP2016025205A (en) * 2014-07-18 2016-02-08 スタンレー電気株式会社 Method of manufacturing semiconductor optical device
CN106847796A (en) * 2015-11-19 2017-06-13 三星电子株式会社 LED chip, light source module, LED display panel and the LED display device including it
WO2017150910A1 (en) * 2016-03-02 2017-09-08 엘지이노텍 주식회사 Light emitting module and display device
CN107425101A (en) * 2017-07-11 2017-12-01 华灿光电(浙江)有限公司 A kind of method of micro-led chip flood tide transfer
CN107783331A (en) * 2017-10-20 2018-03-09 深圳市华星光电技术有限公司 The method of device transfer device and its transferring device, device transfer blade
CN107863433A (en) * 2017-11-07 2018-03-30 深圳市华星光电技术有限公司 Display device and display panel

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李慧娟等: "一种双稳态电磁型MEMS开关 ", 《微纳电子技术》 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020206985A1 (en) * 2019-04-12 2020-10-15 云谷(固安)科技有限公司 Micro light emitting diode display panel and manufacturing method therefor
US11489004B2 (en) 2019-06-28 2022-11-01 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display substrate, method for manufacturing same, and display device thereof
WO2020258634A1 (en) * 2019-06-28 2020-12-30 深圳市华星光电半导体显示技术有限公司 Display substrate, preparation method therefor and display apparatus thereof
CN110323309A (en) * 2019-07-05 2019-10-11 深超光电(深圳)有限公司 Display panel production method, display panel manufacturing system and active-matrix substrate
CN110400861A (en) * 2019-07-30 2019-11-01 上海天马有机发光显示技术有限公司 Preparation method, display panel and the display device of display panel
CN110400861B (en) * 2019-07-30 2020-11-20 上海天马有机发光显示技术有限公司 Preparation method of display panel, display panel and display device
WO2021017498A1 (en) * 2019-07-31 2021-02-04 成都辰显光电有限公司 Display panel, display device, and method for preparing display panel
CN111430521A (en) * 2020-04-03 2020-07-17 东莞市中晶半导体科技有限公司 L ED chip and crystal mixing method
US11626553B2 (en) 2020-10-06 2023-04-11 Au Optronics Corporation Light-emitting apparatus and manufacturing method thereof
CN113380937A (en) * 2021-05-28 2021-09-10 上海天马微电子有限公司 Display panel and display device
CN114695618A (en) * 2022-05-30 2022-07-01 惠科股份有限公司 Display panel and manufacturing method thereof
CN114695618B (en) * 2022-05-30 2022-09-02 惠科股份有限公司 Display panel and manufacturing method thereof
CN116053387A (en) * 2023-03-07 2023-05-02 惠科股份有限公司 Display panel manufacturing method and display panel

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