CN108993096A - It is a kind of for film base gas absorb thermal cycle utilize system - Google Patents
It is a kind of for film base gas absorb thermal cycle utilize system Download PDFInfo
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- CN108993096A CN108993096A CN201810635630.4A CN201810635630A CN108993096A CN 108993096 A CN108993096 A CN 108993096A CN 201810635630 A CN201810635630 A CN 201810635630A CN 108993096 A CN108993096 A CN 108993096A
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- thermocirculator
- cooling device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/14—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by absorption
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- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
The present invention relates to hot swapping, propose that a kind of thermal cycle absorbed for film base gas utilizes system, comprising: heat riser (3) is arranged on a delivery conduit of the first container (1) and second container (2)；Cooling device (4) is arranged on a return-flow catheter of the first container (1) and second container (2)；Thermocirculator, thermocirculator is arranged between heat riser (3) and cooling device (4), for the cryogen in the high temperature fluid and return-flow catheter in delivery conduit to be carried out heat exchange, wherein, the thermocirculator includes semiconductor group, semiconductor group is connected between heat riser (3) and cooling device (4) by heat conducting element, and semiconductor group is powered.The present invention directly utilizes the waste heat in device, cooperates a small amount of electric energy that can complete transmitting of the heat from low-temperature heat source to high temperature heat source, and the occupied area of device can greatly reduce, compactness greatly improves.
Description
Technical field
The present invention relates to hot swappings, utilize dress more particularly, to a kind of thermal cycle absorbed for film base gas
It sets and system.
Background technique
Film absorption is a kind of a kind of novel absorbent process by membrane technology in conjunction with regular absorbent technology, it has gas-liquid flow
It is dynamic not interfere with each other, the big advantage of large specific surface area gas liquid interfacial area.The process that film absorbs is mainly by absorbing and dissociating two portions
It is grouped as, wherein the temperature that the temperature for absorbing part at low-temperature space (such as 30 DEG C), dissociates part is about (such as 65 DEG C of high-temperature region
5).Under normal conditions, it absorbs and is individually carried out with heating in dissociation with cooling, need two sets of equipment, do so and need to consume
Energy it is larger, and therefore device can also increase many areas.
Summary of the invention
For the problems of the prior art, the invention proposes a kind of thermal cycles absorbed for film base gas to utilize system
System, comprising: heat riser is arranged on a delivery conduit of the first container and second container；Cooling device is arranged first
On one return-flow catheter of container and second container；Thermocirculator, thermocirculator are arranged in heat riser and cooling device
Between, for the cryogen in the high temperature fluid and return-flow catheter in delivery conduit to be carried out heat exchange, wherein the heat is followed
Loop device includes semiconductor group, and semiconductor group is connected between heat riser and cooling device by heat conducting element, and is partly led
Body group is powered.
Optionally, the thermal cycle includes: the heat conducting element for being connected to semiconductor end, the heat conducting element using device
Including thermally conductive gel and copper sheet, thermally conductive gel is coated on copper sheet.
Optionally, the semiconductor group is made of P-type semiconductor piece and N-type semiconductor piece, wherein N-type semiconductor connection electricity
Source anode, P-type semiconductor piece connect power cathode.
Optionally, the semiconductor group includes multiple groups P-type semiconductor piece and N-type semiconductor piece, and outermost N-type semiconductor connects
Positive pole is connect, outermost P-type semiconductor piece connects power cathode.
Optionally, the system further include: micro-structure heat exchange element, the micro-structure heat exchange element are located at heat riser
Inside cooling device, micro-structure heat exchange element one end is connected to the thermocirculator.
Optionally, there are the multiple holes passed through for fluid inside the micro-structure heat exchange element.
Optionally, the micro-structure heat exchange element has the copper wire of heat-barrier material package, and copper wire is connected to thermocirculator.
Optionally, the copper wire is connected on thermally conductive gel and/or copper sheet.
Optionally, the first container is adsorption box, and second container is dissociation case, the liquid portion of adsorption box and the liquid of dissociation case
Body portion is connected by the delivery conduit with the return-flow catheter.
Optionally, there is anisotropic membrane to separate the gentle body portion of liquid portion inside adsorption box, has inside dissociation case
Anisotropic membrane is to separate the gentle body portion of liquid portion.
The invention has the benefit that
And this patent is to increase the utilization efficiency of energy, selection using semiconductor using its Peltier effect come by cold end
Temperature be transmitted to hot end, so as to achieve the purpose that reduce energy consumption.
If can cooperate a small amount of electric energy that can complete heat directly using the waste heat in device using the present invention
The transmitting from low-temperature heat source to high temperature heat source is measured, and the occupied area of device can greatly reduce, compactness greatly improves.
Detailed description of the invention
Fig. 1 is the structure principle chart of the device of the invention.
Fig. 2 is the sectional view of micro- heat exchange element.
Fig. 3 is the side view of micro- heat exchange element.
Appended drawing reference
Adsorption box 1 dissociates case 2, heat riser 3, cooling device 4, heat conducting element 5.
Specific embodiment
Embodiments of the present invention are described with reference to the accompanying drawings, wherein identical component is presented with like reference characters.
In the absence of conflict, the technical characteristic in following embodiment and embodiment can be combined with each other.
System of the invention includes adsorption box 1, dissociates case 2, heat riser 3, cooling device 4 and heat conducting element 5.
Adsorption box 1 (the first container) is rectangular parallelepiped structure, and centre is separated by anisotropic membrane.The wherein left side of adsorption box 1
Dividing (G indicates gas in figure) is gas part, and right half part is liquid portion (L indicates liquid portion in figure), therefore asymmetric
Dense film is on the right side close to liquid in film, and filter membrane is in left side.Dissociating case 2 (second container) is rectangular parallelepiped structure, it is intermediate by
Anisotropic membrane separates.Case 2 and adsorption box 1 are dissociated then on the contrary, left side is liquid portion (L indicates liquid portion in figure), and right side is
Gas part (G indicates gas in figure), therefore the non-dense film to film forming, on the left side, filter membrane is on the right.Adsorption box 1 and dissociation
The gas of case 2 and liquid portion are all connected to two conduits up and down, to guarantee transporting for gas and liquid, wherein company of liquid portion institute
The catheter requirements connect have preferable heat transfer property, to guarantee the efficiency of semiconductor heat transfer.
In the connecting conduit (delivery conduit) of the liquid portion of the liquid portion from adsorption box 1 to dissociation case 2, setting is risen
Warm device 3.In the connecting conduit (return-flow catheter) from the liquid portion of dissociation case 2 to the liquid portion of adsorption box 1, setting drop
Warm device 4.In addition, the temperature in order to guarantee required absorption and dissociation, has installed additional semiconductor heat transfer unit (HTU) to carry out heat
The heat for needing the part to cool down is transmitted to the part for needing to heat up by transmitting
Between heat riser 3 and cooling device 4, it is connected with heat transfer unit (HTU), the heat transfer unit (HTU) includes: P-type semiconductor
Piece, N-type semiconductor piece, metal plate, heat conducting element 5.N-type semiconductor connects positive pole, and P-type semiconductor connects power cathode.P
Type semiconductor chip is connected between heat riser 3 and cooling device 4 by metal plate and heat conducting element 5, and N-type semiconductor piece passes through
Metal plate and heat conducting element 5 are connected between heat riser 3 and cooling device 4.Heat conducting element 5 can be thermally conductive gel.Metal
Plate can be copper sheet.The metal plate and heat conducting element 5 can be muti-piece and be composed, such as can add one among two pieces of copper sheets
The very thin thermally conductive gel of layer.Due to the characteristic of thermally conductive gel, fabulous heat transfer property can be not only obtained using thermally conductive gel, together
When due to its chemical property stabilization also increase the service life of equipment.
In addition, the heat transfer unit (HTU) may include that multiple P-type semiconductor pieces and N-type semiconductor piece (only show one in Fig. 1
P-type semiconductor piece and a N-type semiconductor piece).The p-type connect on cooling device 4 and N-type semiconductor piece of the extreme side need each
A thermally conductive gel and copper sheet group are connect, remaining each semiconductor chip group connects a thermally conductive gel and copper sheet group.Finally, to most
N-type semiconductor on side connects positive pole, and P-type semiconductor piece connects power cathode.
It is provided with micro-structure heat exchange element in heat riser 3 and cooling device 4, structure is as Figure 2-3.Micro-structure is changed
Thermal element using copper pipe does material to reinforce its heat-transfer capability, front and rear end distinguish some be convenient for screw thread and other
Component is connected.Have multiple holes (such as rectangular) inside micro-structure heat exchange element, convenient for fluid by when reinforce heat exchange effect
Fruit improves heat-transfer capability.Its heat by the copper wire wrapped up by heat-barrier material pass to the thermally conductive gel of the heat transfer unit (HTU) with
Copper sheet group, and conducted by semiconductor heat transfer unit (HTU).Increasing heat-barrier material is to guarantee heat in the way that copper wire conducts heat
Amount does not have extra scatter and disappear.
The operational process of system of the invention is described by taking carbon dioxide and nitrogen as an example.The mixing of carbon dioxide and nitrogen
Gas enters adsorption box 1 by the first root canal road.The left side of adsorption box 1 is gas part, and wherein carbon dioxide gas passes through band
There is the anisotropic membrane of dense film to enter the absorbing liquid on the right, nitrogen can not be through anisotropic membrane therefore with top the second root canal road
Discharge.It is to preferably guarantee that pressure at both sides is unlikely to make liquid in the case where not reducing gas absorptivity using anisotropic membrane
Body appears.
The carbonated adsorption liquid come out from adsorption box 1 enters pipeline, is heated via heat riser 3, then
Into dissociation case 2.In dissociation case 2, carbon dioxide can be surveyed from liquid and diffuse to gas side due to temperature, will via scavenging
It is taken out of.After the absorbing liquid of dissociation obtains lower temperature by cooling device 4, it is again introduced into adsorption box 1 and carries out next round
Circulation.
Among these, the heat of heat riser 3 can pass through Peltier effect since the temperature difference is little from cooling device
(heat transfer efficiency is related with electric current and Peltier coefficient) just completes the heat transfer between 35 DEG C of temperature difference with very low electricity,
The heat transfer that just using 20w electricity 1kg fluid can about completed 1 second.3 the extreme side of Cryo Equipment, two copper sheet end is led to
Upper direct current notices that anode is connected on N-type semiconductor, and cathode is connected on P-type semiconductor, completes to assign to high temperature from low temperature portion in this way
Partial heat transfer.
Embodiment described above, the only present invention more preferably specific embodiment, those skilled in the art is at this
The usual variations and alternatives carried out within the scope of inventive technique scheme should be all included within the scope of the present invention.
Claims (10)
1. a kind of thermal cycle absorbed for film base gas utilizes system characterized by comprising
Heat riser (3) is arranged on a delivery conduit of the first container (1) and second container (2)；
Cooling device (4) is arranged on a return-flow catheter of the first container (1) and second container (2)；
Thermocirculator, thermocirculator are arranged between heat riser (3) and cooling device (4), and being used for will be in delivery conduit
High temperature fluid and return-flow catheter in cryogen carry out heat exchange,
Wherein, the thermocirculator includes semiconductor group, and semiconductor group is connected to heat riser (3) and drop by heat conducting element
Between warm device (4), and semiconductor group is powered.
2. system according to claim 1, which is characterized in that
The thermocirculator includes: the heat conducting element for being connected to semiconductor end, the heat conducting element include thermally conductive gel and
Copper sheet, thermally conductive gel are coated on copper sheet.
3. system according to claim 1, which is characterized in that
The semiconductor group is made of P-type semiconductor piece and N-type semiconductor piece, and wherein N-type semiconductor connects positive pole, p-type
Semiconductor chip connects power cathode.
4. system according to claim 1, which is characterized in that
The semiconductor group includes multiple groups P-type semiconductor piece and N-type semiconductor piece, and outermost N-type semiconductor connects positive pole,
Outermost P-type semiconductor piece connects power cathode.
5. system according to claim 2, which is characterized in that further include:
Micro-structure heat exchange element, the micro-structure heat exchange element is located at heat riser (3) and cooling device (4) is internal, micro-structure
Heat exchange element one end is connected to the thermocirculator.
6. system according to claim 5, which is characterized in that
There are the multiple holes passed through for fluid inside the micro-structure heat exchange element.
7. system according to claim 5, which is characterized in that
The micro-structure heat exchange element has the copper wire of heat-barrier material package, and copper wire is connected to thermocirculator.
8. system according to claim 1, which is characterized in that
The copper wire is connected on thermally conductive gel and/or copper sheet.
9. system according to claim 1, which is characterized in that
The first container (1) is adsorption box, and second container (2) is dissociation case, the liquid portion of adsorption box and the liquid portion of dissociation case
Divide and is connected by the delivery conduit with the return-flow catheter.
10. system according to claim 9, which is characterized in that
There is anisotropic membrane to separate the gentle body portion of liquid portion inside adsorption box, have inside dissociation case anisotropic membrane with every
Open the gentle body portion of liquid portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810635630.4A CN108993096B (en) | 2018-06-20 | 2018-06-20 | Heat recycling system for membrane-based gas absorption |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810635630.4A CN108993096B (en) | 2018-06-20 | 2018-06-20 | Heat recycling system for membrane-based gas absorption |
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| Publication Number | Publication Date |
|---|---|
| CN108993096A true CN108993096A (en) | 2018-12-14 |
| CN108993096B CN108993096B (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810635630.4A Active CN108993096B (en) | 2018-06-20 | 2018-06-20 | Heat recycling system for membrane-based gas absorption |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1273565A (en) * | 1997-10-03 | 2000-11-15 | Usf过滤分离集团公司 | Purification of liquid flow |
| CN1759922A (en) * | 2004-10-13 | 2006-04-19 | 中国科学院大连化学物理研究所 | A kind of application of membrane module in mixed gas separation of adopting the densified polymer film |
| KR20110031940A (en) * | 2011-03-16 | 2011-03-29 | 임광희 | Visible ray utilizing devices to treat waste-air |
| WO2012144189A1 (en) * | 2011-04-21 | 2012-10-26 | パナソニック株式会社 | Device for adsorbing and emitting carbon dioxide |
| WO2015109283A1 (en) * | 2014-01-20 | 2015-07-23 | Prism Analytical Technologies, Inc. | Ambient air purifier with humidification and dehumidification |
| CN106523057A (en) * | 2016-11-24 | 2017-03-22 | 华北电力大学 | Atmospheric low temperature source utilization device |
-
2018
- 2018-06-20 CN CN201810635630.4A patent/CN108993096B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1273565A (en) * | 1997-10-03 | 2000-11-15 | Usf过滤分离集团公司 | Purification of liquid flow |
| CN1759922A (en) * | 2004-10-13 | 2006-04-19 | 中国科学院大连化学物理研究所 | A kind of application of membrane module in mixed gas separation of adopting the densified polymer film |
| KR20110031940A (en) * | 2011-03-16 | 2011-03-29 | 임광희 | Visible ray utilizing devices to treat waste-air |
| WO2012144189A1 (en) * | 2011-04-21 | 2012-10-26 | パナソニック株式会社 | Device for adsorbing and emitting carbon dioxide |
| WO2015109283A1 (en) * | 2014-01-20 | 2015-07-23 | Prism Analytical Technologies, Inc. | Ambient air purifier with humidification and dehumidification |
| CN106523057A (en) * | 2016-11-24 | 2017-03-22 | 华北电力大学 | Atmospheric low temperature source utilization device |
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| Publication number | Publication date |
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| CN108993096B (en) | 2023-09-26 |
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Effective date of registration: 20230808 Address after: 102206 No. 2 Nong Road, Changping District, Beijing Applicant after: NORTH CHINA ELECTRIC POWER University Address before: 102206 No. 2 Nong Road, Zhu Xin Zhuang, Beijing, Changping District Applicant before: NORTH CHINA ELECTRIC POWER University Applicant before: JIANGSU CHANGQING AGROCHEMICAL Co.,Ltd. |
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