CN108990263A - One kind is printed on one side substrate and its bilayer conductive ink technology - Google Patents
One kind is printed on one side substrate and its bilayer conductive ink technology Download PDFInfo
- Publication number
- CN108990263A CN108990263A CN201811071696.1A CN201811071696A CN108990263A CN 108990263 A CN108990263 A CN 108990263A CN 201811071696 A CN201811071696 A CN 201811071696A CN 108990263 A CN108990263 A CN 108990263A
- Authority
- CN
- China
- Prior art keywords
- substrate
- printed
- conductive ink
- electrically conductive
- ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 53
- 238000005516 engineering process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 230000032683 aging Effects 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims 1
- -1 phenolic aldehyde Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000009413 insulation Methods 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000007639 printing Methods 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 201000001371 inclusion conjunctivitis Diseases 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010044325 trachoma Diseases 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
It is printed on one side substrate and its bilayer conductive ink technology the invention discloses one kind, including the substrate that is printed on one side, the substrate that is printed on one side includes substrate, substrate is equipped with electrically conductive ink, electrically conductive ink is divided into two layers, insulating layer is equipped between two layers of electrically conductive ink, insulating layer is equipped with several insulated holes, beneficial effects of the present invention: the present invention is using dielectric ink as separation layer, in the upper offline place for needing to connect, insulation is designed aperture processing, then two sandwich circuits are printed in above and below dielectric ink, cancel CNC drilling and its subsequent cleaning, it reduces manufacturing cost and shortens the production period, optimize production process and process, keep product lightening, instead of part high pollution PCB multilayer board, reduce environmental pollution.
Description
Technical field
The present invention relates to electrically conductive ink technical field, in particular to one kind is printed on one side substrate and its bilayer conductive ink skill
Art.
Background technique
At present in the printing of the route of hardboard and soft board, after the double-deck line conduction needs CNC to drill, joined using conductive material
Connect the requirement for realizing upper and lower level conducting function.Process and cost are not only increased, customer demand is unable to satisfy for short-term order.
If undoubtedly reduce production process in the single side printing on substrates bilayer conductive ink of flexible circuitry while accelerating sample friendship
Phase.
Problem of the existing technology: using CNC machining small, and electrically conductive ink is made to flow down realization upper and lower level by hole wall
Line conduction.It is easy to appear electrically conductive ink and is not paved with hole wall completely, cause open circuit；Due to carrying out upper and lower level using dielectric ink
Isolation.Trachoma can not be occurred by needing to guarantee to print ink, and breakage etc. is bad, and product will meet the insulating properties mark of electronic component
It is quasi-.
Summary of the invention:
It is printed on one side substrate and its bilayer conductive ink the object of the invention is that providing one kind to solve the above-mentioned problems
Technology solves the problems, such as of the existing technology.
To solve the above-mentioned problems, the present invention provides a kind of technical solutions:
One kind is printed on one side substrate, including the substrate that is printed on one side, and the substrate that is printed on one side includes substrate, and the substrate is equipped with conduction
Ink, the electrically conductive ink are divided into two layers, and insulating layer is equipped between two layers of electrically conductive ink, and the insulating layer is equipped with several
Insulated hole.
Preferably, the electrically conductive ink is conductive polymer ink.
Preferably, the electrically conductive ink is that two layers of halftone is constituted, and constitutes two halftone mesh numbers of the electrically conductive ink
It is not identical.
Preferably, two or more layers route is printed in above dielectric ink under on the substrate after being isolated
Side, to cancel subsequent cleaning.
Preferably, the substrate is PET polyester material.
Preferably, when being detected to the substrate using traditional ageing management process.
One kind is printed on one side substrate bilayer conductive ink technology, comprising the following steps:
(1), it takes the substrate greater than required specification and carries out sawing sheet according to drawing specification；
(2), wiring board senile experiment will be carried out to the substrate after sawing sheet, is printed after indices are qualified；
(3), the place by offline connection upper in the substrate is isolated using dielectric ink, and two or more layers route is printed
It brushes above and below dielectric ink.
Beneficial effects of the present invention: the present invention is using dielectric ink as separation layer, in the upper offline place for needing to connect,
Insulation be designed aperture processing, then two sandwich circuits are printed in above and below dielectric ink, cancel CNC drilling and thereafter
Continuous cleaning reduces manufacturing cost and shortens the production period, optimizes production process and process, keep product frivolous
Change, instead of part high pollution PCB multilayer board, reduces environmental pollution.
Detailed description of the invention
Detailed description will be given by the following detailed implementation and drawings by the present invention for ease of explanation,.
Fig. 1 is the structural diagram of the present invention.
In figure: 1, be printed on one side substrate；2, electrically conductive ink；3, insulating layer；4, insulated hole.
Specific embodiment
As shown in Figure 1, present embodiment uses following technical scheme: one kind is printed on one side substrate and its bilayer conductive
Ink technology, including the substrate that is printed on one side, the substrate that is printed on one side include substrate 1, and the substrate 1 is equipped with electrically conductive ink 2, described
It is two layers that electrically conductive ink 2, which divides, and insulating layer 3 is equipped between two layers of electrically conductive ink 2, and the insulating layer 3 is equipped with several insulation
Hole 4.
Wherein, the electrically conductive ink 2 is conductive polymer ink, and this electrically conductive ink in use stablize by performance, and
And use rear noresidue.
Wherein, in 1 printing process of substrate, the place of offline connection is needed to be isolated using dielectric ink,
Cancel CNC drilling and its subsequent processing.
Wherein, the electrically conductive ink 2 is that two layers of halftone is constituted, and constitutes two halftone mesh numbers of the electrically conductive ink 2 not
It is identical, to reach the insulation performance for improving the electrically conductive ink 2.
Wherein, two or more layers route is printed in above and below dielectric ink on the substrate 1 after being isolated, with
Cancel subsequent cleaning.
Wherein, the substrate 1 is PET polyester material, higher, heat-resisting compared with electric insulating quality for papery phenolic aldehyde copper clad laminate
Wearability is higher, intensity is higher.
Wherein, when being detected to the substrate 1 using traditional ageing management process.
One kind is printed on one side substrate bilayer conductive ink technology, comprising the following steps:
(1), it takes the substrate 1 greater than required specification and carries out sawing sheet according to drawing specification；
(2), wiring board senile experiment will be carried out to the substrate 1 after sawing sheet, is printed after indices are qualified；
(3), the place by offline connection upper in the substrate 1 is isolated using dielectric ink, and by two or more layers route
It is printed in above and below dielectric ink.
Beneficial effects of the present invention: the present invention is using dielectric ink as separation layer, in the upper offline place for needing to connect,
Insulation be designed aperture processing, then two sandwich circuits are printed in above and below dielectric ink, cancel CNC drilling and thereafter
Continuous cleaning reduces manufacturing cost and shortens the production period, optimizes production process and process, keep product frivolous
Change, instead of part high pollution PCB multilayer board, reduces environmental pollution.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, the technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention, the claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (7)
- The substrate 1. one kind is printed on one side, including the substrate that is printed on one side, the substrate that is printed on one side include substrate (1), which is characterized in that institute Substrate (1) is stated equipped with electrically conductive ink (2), the electrically conductive ink (2) is divided into two layers, sets between two layers of electrically conductive ink (2) Have insulating layer (3), the insulating layer (3) is equipped with several insulated holes (4).
- The substrate 2. one kind according to claim 1 is printed on one side, it is characterised in that: the electrically conductive ink (2) is macromolecule Conductive ink.
- The substrate 3. one kind according to claim 1 is printed on one side, it is characterised in that: the electrically conductive ink (2) is two layers of mesh Version is constituted, and two halftone mesh numbers for constituting the electrically conductive ink (2) are not identical.
- The substrate 4. one kind according to claim 1 is printed on one side, it is characterised in that: the substrate after being isolated (1) two or more layers route is printed in above and below dielectric ink on, to cancel subsequent cleaning.
- The substrate 5. one kind according to claim 1 is printed on one side, it is characterised in that: the substrate (1) is papery phenolic aldehyde base Material plate.
- The substrate 6. one kind according to claim 1 is printed on one side, it is characterised in that: detected to the substrate (1) Shi Caiyong traditional ageing management process.
- The substrate bilayer conductive ink technology 7. one kind is printed on one side, it is characterised in that: the following steps are included:(1), it takes the substrate (1) greater than required specification and carries out sawing sheet according to drawing specification；(2), wiring board senile experiment will be carried out to the substrate (1) after sawing sheet, is printed after indices are qualified；(3), the place by offline connection upper in the substrate (1) is isolated using dielectric ink, and by two or more layers line Road is printed in above and below dielectric ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811071696.1A CN108990263A (en) | 2018-09-14 | 2018-09-14 | One kind is printed on one side substrate and its bilayer conductive ink technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811071696.1A CN108990263A (en) | 2018-09-14 | 2018-09-14 | One kind is printed on one side substrate and its bilayer conductive ink technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108990263A true CN108990263A (en) | 2018-12-11 |
Family
ID=64546215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811071696.1A Pending CN108990263A (en) | 2018-09-14 | 2018-09-14 | One kind is printed on one side substrate and its bilayer conductive ink technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108990263A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103092445A (en) * | 2013-01-08 | 2013-05-08 | 苏州市智诚光学科技有限公司 | Manufacturing method of capacitive touchpad |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN103246423A (en) * | 2013-05-21 | 2013-08-14 | 天津铂创国茂电子科技发展有限公司 | Touch tablet and method for producing the same by ink printing mode |
| CN103336642A (en) * | 2013-06-18 | 2013-10-02 | 苏州市健邦触摸屏技术有限公司 | Manufacturing method of capacitive touch screen |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
| CN203708630U (en) * | 2013-12-31 | 2014-07-09 | 上海意力寰宇电路世界有限公司 | Upper and lower layer line conduction structure for screen printing grouting |
| CN209201390U (en) * | 2018-09-14 | 2019-08-02 | 无锡市科虹标牌有限公司 | One kind is printed on one side substrate |
-
2018
- 2018-09-14 CN CN201811071696.1A patent/CN108990263A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103092445A (en) * | 2013-01-08 | 2013-05-08 | 苏州市智诚光学科技有限公司 | Manufacturing method of capacitive touchpad |
| CN103200782A (en) * | 2013-04-18 | 2013-07-10 | 汕头超声印制板（二厂）有限公司 | Manufacturing method of full-inkjet printed-circuit board |
| CN103246423A (en) * | 2013-05-21 | 2013-08-14 | 天津铂创国茂电子科技发展有限公司 | Touch tablet and method for producing the same by ink printing mode |
| CN103336642A (en) * | 2013-06-18 | 2013-10-02 | 苏州市健邦触摸屏技术有限公司 | Manufacturing method of capacitive touch screen |
| CN203708630U (en) * | 2013-12-31 | 2014-07-09 | 上海意力寰宇电路世界有限公司 | Upper and lower layer line conduction structure for screen printing grouting |
| CN103763854A (en) * | 2014-01-18 | 2014-04-30 | 上海美维电子有限公司 | Printed circuit board and manufacturing method thereof |
| CN209201390U (en) * | 2018-09-14 | 2019-08-02 | 无锡市科虹标牌有限公司 | One kind is printed on one side substrate |
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