CN108987444A - Display base plate and preparation method thereof, display panel and display device - Google Patents
Display base plate and preparation method thereof, display panel and display device Download PDFInfo
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- CN108987444A CN108987444A CN201810736565.4A CN201810736565A CN108987444A CN 108987444 A CN108987444 A CN 108987444A CN 201810736565 A CN201810736565 A CN 201810736565A CN 108987444 A CN108987444 A CN 108987444A
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- pixel defining
- defining layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Abstract
The present invention relates to a kind of display base plates, including array substrate, pixel defining layer and inorganic material layer；Pixel defining layer is formed in the array substrate；The display base plate further includes the inorganic material layer for being formed in the pixel defining layer and deviating from the array substrate side.By forming inorganic material layer away from array substrate side in pixel defining layer, form organic layer and the compound structure of inorganic layer, increase the rigidity of pixel defining layer, and reduce the expansion rate of pixel defining layer, lead to its failure to effectively avoid pixel defining layer from squeezing OLED device, and then improves the flexural strength of display panel and receiving falls the reliability of impact strength.Production method, display panel and the display device of a kind of display base plate are also provided.
Description
Technical field
The present invention relates to field of display technology, more particularly to a kind of display base plate and preparation method thereof, display panel and
Display device.
Background technique
With the development of the technologies such as big data, cloud computing and mobile Internet, the mankind come into intellectualization times, packet
The smart machines such as intelligent mobile communication terminal, wearable device and smart home are included, are had become in people's work and life
Indispensable part.As the important window of intellectualization times human-computer interaction, also major transformation is occurring for display panel.Have
Machine light emitting diode (Organic Light-Emitting Diode, OLED) display panel, the thin, self-luminosity with thickness
Can, the advantages such as low in energy consumption, flexibility is good, have become after Thin Film Transistor-LCD, it is considered to be most have development
The flat-panel display device of potentiality.
To pursue more preferably visual experience and sense of touch experience, to the effective display area and thickness requirement of OLED display panel
It is higher and higher, but as the increase of effective display area and its thickness are thinning, the intensity of display panel decreases, especially soft
Property OLED display panel in multiple bending/curly course, and bear when falling shock, be bent region and hit region not
It is bad easily to there is the display such as blackspot, speck, variegation for the full-color display of energy.
Therefore, the intensity reliability for how improving OLED display panel is those skilled in the art's urgent problem to be solved.
Summary of the invention
Based on this, it is necessary to fall in shock for the display panel in existing design in bending and receiving and easily show
Bad problem provides display base plate of a kind of improvement above problem and preparation method thereof, display panel and display device.
A kind of display base plate, comprising:
Array substrate；
Pixel defining layer is formed in the array substrate；
The display base plate further includes the inorganic material for being formed in the pixel defining layer and deviating from the array substrate side
Layer.
Optionally, the inorganic material layer includes at least one of silica, silicon oxynitride or silicon nitride.
Optionally, the pixel defining layer is organic material layer；Or
The pixel defining layer is organic material layer, and adulterates organic and/or inorganic materials.
Optionally, the pixel defining layer is doped with silicon nitride, tin oxide, nitrogen oxidation tin, nitrogen oxide, silicon oxynitride, nitrogen
At least one of SiClx.
Optionally, the pixel defining layer defines multiple pixel definition openings；
Each pixel definition opening has bottom and side wall；The inorganic material layer covers the pixel defining layer and removes
At least partly region outside the bottom of the pixel definition opening.
Optionally, the inorganic material layer is formed by chemical vapor deposition, physical vapour deposition (PVD), coating or printing type
Deviate from the array substrate side in the pixel defining layer；
Preferably, the inorganic material layer is formed in the pixel defining layer away from described by chemical vapor deposition manner
Array substrate side.
Optionally, the display base plate further includes at least one slot and/or hole for being formed in the pixel defining layer；
The inorganic material layer is filled in the slot and/or hole.
The production method of display base plate, comprising:
Array basal plate is provided；
Pixel defining layer is formed in the array substrate；
Inorganic material layer is formed away from the array substrate side in the pixel defining layer.
The production method of above-mentioned display base plate and display base plate, by being formed in pixel defining layer away from array substrate side
Inorganic material layer forms organic layer and the compound structure of inorganic layer, increases the rigidity of pixel defining layer, and it is fixed to reduce pixel
The expansion rate of adopted layer so that pixel defining layer effectively be avoided to squeeze OLED device and lead to its failure, and then improves display surface
The flexural strength and receiving of plate fall the reliability of impact strength.
Display panel, including display base plate, organic light-emitting units and encapsulated layer；
The display base plate includes:
Array substrate；
Pixel defining layer is formed in the array substrate, and defines multiple subpixel areas；
Inorganic material layer is formed in the pixel defining layer away from the array substrate side；
The organic light-emitting units are formed in the subpixel area, and the encapsulated layer is formed in the organic light-emitting units
Away from the side of the array substrate.
Display device, including display panel described in above-described embodiment.
Above-mentioned display panel and display device, by forming inorganic material away from array substrate side in pixel defining layer
Layer forms organic layer and the compound structure of inorganic layer, increases the rigidity of pixel defining layer, and reduce the swollen of pixel defining layer
Swollen rate so that pixel defining layer effectively be avoided to squeeze OLED device and lead to its failure, and then improves the bending resistance of display panel
Qu Qiangdu and the reliability for bearing to fall impact strength.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the display base plate in one embodiment of the invention；
Fig. 2 is the structural schematic diagram of the display base plate in another embodiment of the present invention；
Fig. 3 is the flow diagram of the production method of the display base plate in one embodiment of the invention.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Using " comprising " described herein, " having " and "comprising", unless having used specific restriction
Term, such as " only ", " by ... form " etc., it otherwise can also add another component.Unless refer on the contrary, otherwise singular shape
The term of formula may include plural form, and can not be interpreted as its quantity is one.
It will be appreciated that though term " first ", " second " etc. can be used herein to describe various elements, but these yuan
Part should not be limited by these terms.These terms are only used to distinguish an element and another element.For example, not taking off
In the case where the scope of the present invention, first element can be referred to as second element, and similarly, and second element can be claimed
For first element.
It is wide with flexible, good flexible characteristic with the fast development of OLED display panel technology
General application, but it is limited to structure and material, the flexural strength and receiving of the OLED display panel in existing design fall shock
The reliability of intensity is not high.
For bearing to fall bump test, when (diameter is the steel ball of 20mm to the falling sphere using 32.65g；Falling height
When 2cm-62.5cm) hitting OLED display panel, encapsulated layer will be bent downwardly along force direction, and then extremely by stress transfer
Structure in encapsulated layer.Stress due to being hit moment by falling sphere is concentrated and can not be dispersed, when falling height is more than 10cm, display
Panel is highly prone to damage, and the region hit is likely to full-color not show, the bad phenomenons such as blackspot, speck, variegation occurs.
In existing design to solve this problem, a kind of mode is to make buffer layer far from screen body emission side, for example, aobvious
Show and fill Optical transparent adhesive between panel and cover board, but so cause shield body thickness increase to a certain extent, be unable to satisfy compared with
Good visual experience and sense of touch experience, and increase process flow and manufacture difficulty.
Therefore, it is necessary to provide it is a kind of do not increase thickness, do not influence display effect, and flexural strength and receiving are fallen and are hit
The preferable display panel of hit intensity.
Before the present invention is described in detail, some contents in the present invention are explained first, in order to more
Technical solution of the present invention is expressly understood.
When describing positional relationship, unless otherwise defined, when an element such as layer, film or substrate are regarded as another
When element "upper", intermediary element can may be present directly in other elements or also.Furtherly, when layer is regarded as in another layer
When "lower", one or more middle layers can also may be present directly in lower section.It can also understand, when layer is regarded as at two layers
" between " when, it can be the sole layer between two layers, or one or more middle layers also may be present.
Array substrate: i.e. TFT (Thin-film transistor, thin film transistor (TFT)) array substrate refers to and is at least formed
There is the underlay substrate (for example, substrate that PI material is formed) of tft array, anode.
It is understood that display panel provided in an embodiment of the present invention, mainly it is applied to screen comprehensively or Rimless
Display panel, naturally it is also possible to which being applied to commonly has in frame or the display panel of narrow frame.
Inventor has found that, when display panel is repeatedly bent or bears to fall shock, encapsulated layer will be along work under study for action
Power thrusts are bent downwardly, and then bending force or impact force are transferred to the film layers such as supporting layer, cathode, pixel defining layer.From now
From the point of view of pixel arrangement structure and form on some display base plates, the factor in display base plate space is occupied, in addition to organic light emission list
Other than member, the space that pixel defining layer occupies is most.And the principle of luminosity of organic light emitting diode is by electronics and hole
It is compounded to form exciton, exciton forms photon in transition process, therefore any influence influences electronics and hole forms the factor of exciton
It will influence the luminescence process of Organic Light Emitting Diode.
Inventor in falling bump test the study found that generally, pixel defining layer is mainly made of organic material, example
Such as, polyimides, polyamide, benzocyclobutene, acryl resin or phenolic resin etc., and organic material can occur after stress
Expansion.For falling bump test, when 32.65g falling sphere (diameter be 20mm steel ball；Falling height 2cm-62.5cm) it hits
When middle display panel, since pixel defining layer takes up space larger, bump stress is conducted to pixel defining layer, compression and drawing
Stress is concentrated mainly on pixel defining layer, and can not disperse to cause forced expansion, and then inevitably to organic light emission
Diode generates different influences.For example, the luminous mechanism of organic light emitting diode changes, it specially originally can be compound
Electron-hole pair cannot be effectively compound due to being squeezed, so that exciton cannot be generated, and then influence luminous efficiency；Or
Compound electron-hole pair changes due to squeezing exciton transition track, and photon energy is caused to change, and changes the face that shines
Color.More notably, the damage of Organic Light Emitting Diode film layer, fracture be will lead to, cause to fail.
Theoretically, pixel defining layer has preferable intensity and expansion rate is lower, then it causes the extruding of OLED device
The risk of damage is lower.By forming inorganic material layer away from array substrate side in pixel defining layer in the present invention, composition has
Machine layer and the compound structure of inorganic layer, increase the rigidity of pixel defining layer, and reduce the expansion rate of pixel defining layer, thus
Pixel defining layer is effectively avoided to squeeze OLED device and lead to its failure.
It will be described in detail below with embodiment:
Fig. 1 shows the structural schematic diagram of the display base plate in one embodiment of the invention；For ease of description, attached drawing is only shown
Relevant to embodiment of the present invention structure.
Refering to attached drawing, display panel provided in an embodiment of the present invention, including display base plate 10, organic light-emitting units, cathode
And encapsulated layer.Display base plate 10 includes array substrate 12, pixel defining layer 14 and is formed in pixel defining layer 14 away from array base
The inorganic material layer 16 of 12 side of plate.
Array substrate 12 includes underlay substrate (for example, PI material is formed), the thin film transistor (TFT) (figure for being set to underlay substrate
Do not mark), and the anode being set on thin film transistor (TFT).Certainly, which can also include planarization layer, passivation layer
Etc. film layers, be not limited thereto.For example, array substrate 12 has multiple subpixel areas in some embodiments, transmitting can be divided into
The first sub-pixel area domain of feux rouges, the second subpixel area for emitting blue light, and the third subpixel area of transmitting green light, one
The first sub-pixel area domain, the second subpixel area and the third subpixel area of group may make up a pixel region.Anode, i.e. picture
Plain electrode is formed on planarization layer, and is corresponded with corresponding subpixel area.
It is appreciated that each pixel region also may include other subpixel areas, herein not in some other embodiment
It limits, for example, may also include the 4th subpixel area of transmitting white light.
Pixel defining layer 14 is formed in array substrate 12, and at least part of each pixel electrode of exposure.Some realities
It applies in example, pixel defining layer 14 can cover the edge of at least part of each pixel electrode, thus by each pixel electrode
At least part is exposed.In some embodiments, pixel defining layer 14 can be formed with multiple pixel definition openings 18, pixel
The middle section of electrode or all parts are via 18 exposure of pixel definition opening.That is, subpixel area can by pair
Should pixel definition opening 18 define, then define multiple sub-pixels.
In this way, pixel defining layer 14 can increase the end of each pixel electrode, and it is formed on each pixel electrode
The distance between opposite electrode (for example, cathode), and the antireflection that can prevent the end of pixel electrode from occurring.
For example, pixel electrode may be formed on planarization layer, and pixel defining layer 14 also may be formed on planarization layer,
Planarization layer to the upper surface of pixel defining layer 14 height, greater than the height of the upper surface of planarization layer to pixel electrode.Picture
Plain definition layer 14 can cover the edge of at least part of each pixel electrode, form multiple pixel definition openings 18, You Jifa
Luminescent material is filled in pixel definition opening 18.
In some embodiments, each pixel definition opening 18 has bottom and side wall, and the bottom of pixel definition opening 18 is used
In exposure pixel electrode.Inorganic material layer 16 cover pixel defining layer 14 except pixel definition opening 18 bottom in addition at least partly
Region.It should be understood that improve the intensity of pixel defining layer 14 as much as possible and reducing expansion rate, inorganic material layer 16
Coverage area answers difficulty as large as possible, while considering 16 manufacture craft of inorganic material layer, and most simple and direct being designed as is inorganic
Material layer 16 covers region of the pixel defining layer 14 in addition to pixel definition opening 18.But inventors have found that organic light-emitting units shape
At in pixel definition opening 18, the main reason for being damaged is the sidewall extrusion organic light-emitting units of pixel definition opening 18
Cause.
Therefore, as a kind of preferably embodiment, inorganic material layer 16 should cover pixel defining layer 14 except pixel definition
Region outside the bottom of opening 18.In this way, further improving the rigidity of pixel defining layer 14, and reduce its expansion rate, thus
Pixel defining layer 14 is effectively avoided to squeeze OLED device and lead to its failure.
Organic light-emitting units include at least organic light emitting material.In some embodiments, organic light-emitting units be can have
Multilayered structure, for example, may also include electron transfer layer and the hole of balance electronic and hole other than organic light emitting material
Transport layer, and injected electrons implanted layer and hole injection layer for enhancing electrons and holes.Cathode is formed in organic hair
For light unit in the side of array substrate 12, some embodiments, cathode covers the flood of display base plate 10, that is to say, that yin
Pole cover pixel defining layer 14, and be filled in pixel defining layer 14 formation pixel definition mouth in, with organic light-emitting units phase
It connects.
Encapsulated layer is set to the side that organic light-emitting units deviate from array substrate 12.It is easily understood that due to organic hair
Optical material layer is very sensitive to external environments such as steam and oxygen, if the organic light emitting material in display panel is exposed to
In the environment for having steam or oxygen, the performance that will cause display panel sharply declines or damage completely.Encapsulated layer can be to have
Machine luminescence unit stops air and steam, to guarantee the reliability of display panel.
It is understood that encapsulated layer can be one or more layers structure, it can be organic film or inorganic film, also may be used
It is the laminated construction of organic film and inorganic film.For example, encapsulated layer may include two layers of inorganic film and one in some embodiments
Layer is located at the organic film between two layers of inorganic film.
It is emphasized that encapsulated layer may be with 16 phase of inorganic material layer during the actual fabrication of display panel
Contact, therefore, setting inorganic material layer 16 can also increase the engaging force of itself and the inorganic material of encapsulated layer lower layer, thus certain
The removing that such as cathode is avoided in degree improves the reliability of display panel.
In some embodiments of the present invention, inorganic material layer 16 include silica, silicon oxynitride or silicon nitride at least
It is a kind of.It is easily understood that pixel defining layer 14 is mainly organic material, the coefficient of expansion of inorganic material is less than organic material
Expansion rate, thus under the interaction of pixel defining layer 14 and the interface layer of inorganic material layer 16, compared to only with organic
The expansion rate for the pixel defining layer 14 that material layer is formed is lower.In this way, 14 expansion rate of pixel defining layer is reduced, to effectively keep away
Exempt from pixel defining layer 14 to squeeze OLED device and lead to its failure.
Inventor also found that the inorganic material such as silica, silicon oxynitride or silicon nitride are reducing pixel defining layer 14
While expansion rate, its rigidity is also improved, pixel defining layer 14 is further effectively avoided to squeeze OLED device and lead to it
Failure.It should be noted that on the one hand can not only be played to picture using inorganic material such as silica, silicon oxynitride or silicon nitrides
On the other hand the protective effect of plain definition layer 14 is compared in existing design in the side far from screen body emission side production buffer layer
Formula, bending strength are relatively low, it is easier to be bent, avoid display panel receiving from falling in shock or bending process, the film of generation
The phenomenon that layer separation.
In some embodiments of the present invention, the shape in such a way that chemical vapor deposition or physical vapor are heavy of inorganic material layer 16
At in pixel defining layer 14, certainly, in further embodiments, which also can be by way of being coated with or printing
It is formed in pixel defining layer 14.In this way, make inorganic material layer 16 and pixel defining layer 14 that there is a preferable chemisorption power,
Inorganic material layer 16 is set closely to be incorporated into pixel defining layer 14, to avoid bearing to fall in knockout process or bending process
In separated with pixel defining layer 14.
It is appreciated that chemical vapor deposition refers to containing the gaseous reactant or liquid reactants for constituting film layer element
Other gases required for steam and reaction introduce reaction chamber, and chemical reaction occurs on 14 surface of pixel defining layer and produces film layer
Process has deposition temperature low, and membranous layer ingredient and thickness are easily-controllable, and thicknesses of layers is proportional with deposition time, uniformity and repetition
Property is good, and Step Coverage is good, easy to operate advantage.Therefore as a kind of preferable embodiment, inorganic material material layer is using chemistry
Vapor deposition is formed in pixel defining layer 14.
It will also be appreciated that during forming inorganic material layer 16 using gas-phase deposition, if deposition and atomic
The mobility on surface is poor, then ultimately forms more loose structure；If deposition and atomic is not adjusted to also on growth film surface
Just buried by the film layer of subsequent deposition when minimum energy position, then the activation energy of deposition and atomic increases, and the same structure that generates lacks
It falls into.Therefore, a large amount of fault of construction easy to form in inorganic material layer 16, for example, vacancy, vacancy group etc., these faults of construction
The disordered layer structural instability of formation, therefore, if then by hot activation or stress activation (for example, the kinetic energy of deposition and atomic passes
Pass the release etc. with condensation heat), then the rearrangement of atom can be generated, and change to finer and close lower state structure, generate and laterally receive
Contracting.
And since inorganic material layer 16 is different from the expansion rate of pixel defining layer 14, after heating, thermal expansion coefficient
The small generation residual compressive stress of inorganic material layer 16, and the generation tensile residual stresses of pixel defining layer 14 that thermal expansion coefficient is big.Such as
This, when falling sphere falls on a display panel, it is tensile stress that impact force, which is transmitted to inorganic material layer 16, and due to inorganic material layer
The presence of residual compressive stress on 16, therefore at least partly tensile stress is counteracted, to prevent 14 extrusion expansion of pixel defining layer, reach
The effect for improving the mechanical property of display panel is arrived.
It should be understood that excessive will lead to of the thickness of inorganic material layer 16 itself forms difficulty increase, to substantially increase
Manufacturing cost is added, and uniformity is difficult to ensure.And when the thickness of inorganic material layer 16 is too small, it is fixed to pixel to be unable to reach
The protection of adopted layer 14, and reduce the effect of expansion rate.Only when the thickness of inorganic material layer 16 is in reasonable range,
Effect above-mentioned can be reached.Specific in embodiment, inorganic material layer 16 with a thickness of 200 nanometers~500 nanometers.
In some embodiments of the present invention, pixel defining layer 14 adulterates organic and/or inorganic materials, for example, silicon nitride, tin oxide, nitrogen
At least one of tin oxide, nitrogen oxide, silicon oxynitride, silicon nitride.In this way, the expansion of pixel defining layer 14 on the one hand can be reduced
On the other hand coefficient can increase the binding force of itself and film layer, for example, pixel defining layer 14 and inorganic material layer 16 and planarization layer
Binding force improve the reliability of display panel so that the segregation phenomenon of such as film layer be avoided to occur to a certain extent.
It is appreciated that in other embodiment, it also can be in pixel defining layer 14 doped with such as silica, oxidation
The nano inoganic particles such as aluminium or titanium oxide, are not limited thereto.In this way, increase pixel defining layer 14 and inorganic material layer 16 it
Between adhesive effect, the separation between pixel defining layer 14 and inorganic material layer 16 is prevented, in addition, reducing pixel defining layer 14
The coefficient of expansion, improve the counter-bending and impact strength of display panel.
Fig. 2 shows the structural schematic diagrams of the display base plate 10 in another embodiment of the present invention；For ease of description, identical
Structure label is constant.
Referring to Fig.2, display base plate 10 further includes the slot that at least one is formed in pixel defining layer 14 in some embodiments
The hole and/or；Inorganic material layer 16 is filled in slot and/or hole.In this way, improving inorganic material layer 16 and pixel defining layer 14
Conjugation further prevents the separation between pixel defining layer 14 and inorganic material layer 16.
In addition, impact force is transferred to pixel defining layer 14 when display panel receiving falls shock, pixel defining layer 14 to
Its extension direction expands.Slot and/or hole can play the role of discharging stress, and the coefficient of expansion of inorganic material is less than organic
Material, reduces the expansion of pixel defining layer 14, so that pixel defining layer 14 effectively be avoided to squeeze OLED device and lead to its failure.
In addition, the setting in slot and/or hole can also preferably promote Flexible Displays face when above-mentioned display panel is flexible display panels
The flexibility of plate.
In this way, further increasing the flexural strength of display panel and receiving falls impact strength.
For convenient for further understanding technical solution of the present invention, the embodiment of the present invention also provides a kind of display base plate 10
Production method.
Fig. 3 shows the flow diagram of the production method of the display base plate 10 in one embodiment of the invention；
Refering to attached drawing, the production method of the display base plate 10 in one embodiment of the invention, comprising:
Step S110: array basal plate 1212 is provided；
Array substrate 12 includes underlay substrate, thin film transistor (TFT) and the anode being set on thin film transistor (TFT).
By taking flexible display panels as an example, underlay substrate is formed on bearing substrate.Underlay substrate is flexible substrate, optional
Ground is that organic polymer, silicon nitride and silica are formed, for example, organic polymer can be polyimide substrate, polyamide-based
One of plate, polycarbonate substrate, Poly-s 179 substrate etc..In some embodiments, underlay substrate can be by carrying base
Coating polyimide glue on plate, is solidified to obtain to polyimides later.
Thin film transistor (TFT) is formed on underlay substrate, in some embodiments, can served as a contrast before forming thin film transistor (TFT)
The other layer of such as buffer layer is formed on substrate.Buffer layer can be formed in underlay substrate whole surface, can also be led to
Patterning is crossed to be formed.
Buffer layer can have including suitable material in the materials such as PET, PEN polyacrylate and/or polyimides, with
The form that single-layer or multi-layer stacks forms layer structure.Buffer layer can also be formed by silicon oxide or silicon nitride, or can wrap
Include the composite layer of organic material layer and/or inorganic material.
Thin film transistor (TFT) can control the transmitting of each sub-pixel, or while can control each sub-pixel emissive emits
Amount.Thin film transistor (TFT) may include semiconductor layer, gate electrode, source electrode and drain electrode.Semiconductor layer can be by amorphous silicon layer, gold
Belong to oxide or polysilicon layer is formed, or can be formed by organic semiconducting materials.In some embodiments, semiconductor layer includes
Channel region and source region and drain region doped with dopant.
It can use gate insulating layer covering semiconductor layer, gate electrode can be set on gate insulating layer.Generally, grid
Insulating layer can cover the whole surface of underlay substrate.In some embodiments, gate insulating layer can be formed by patterning.It examines
The formability and profile pattern considered the bonding with adjacent layer, stack destination layer, gate insulating layer can be by silica, nitrogen
SiClx or other insulation organic or inorganic materials are formed.Gate electrode can be by by silica, silicon nitride and/or other are suitable exhausted
The interlayer insulating film covering that edge organic or inorganic material is formed.A part of gate insulating layer and interlayer insulating film can be removed,
Form contact hole after the removal with the presumptive area of exposed semiconductor layer.Source electrode and drain electrode can be via contact holes contact
Semiconductor layer.
Since thin film transistor (TFT) has complicated layer structure, top surface may be not to be flat, some implementations
In example, thin film transistor (TFT) further includes planarization layer, to form sufficiently flat top surface.It, can be with after forming planarization layer
Through-hole is formed, in planarization layer with the source electrode and drain electrode of exposed film transistor.
Anode is pixel electrode, and pixel electrode includes pixel electrode corresponding with subpixel area, multiple sub-pixel electricity
Pole is formed on planarization layer.It is easily understood that multiple pixel electrodes are electrically connected to film crystal by through-hole above-mentioned
Pipe.
S120: pixel defining layer 14 is formed in array substrate 12；
Pixel defining layer 14 can be formed by organic material, for example, such as polyimides, polyamide, phenylpropyl alcohol cyclobutane, Asia
Gram force resin or phenolic resin etc..After planarization layer has formed multiple pixel electrodes, pass through coating or inkjet printing work
Skill forms pixel defining layer 14 on planarization layer, and patterns and form multiple pixel definition openings 18.
It should be understood that also there is inorganic material in pixel defining layer 14 in some embodiments, for example, tin oxide, nitrogen
Change silicon and/or nitrogen oxidation tin, or some nano inoganic particles of doping.
S130: inorganic material layer 16 is formed away from 12 side of array substrate in pixel defining layer 14；
Specifically inorganic layer can be formed by techniques such as chemical vapor deposition, physical vapour deposition (PVD), coating or printings.It is easy
Understand, chemical vapor deposition refers to the steam containing the gaseous reactant or liquid reactants for constituting film layer element and anti-
Other gases required for answering introduce reaction chamber, and the process of chemical reaction production film layer, tool occurs on 14 surface of pixel defining layer
Have that deposition temperature is low, membranous layer ingredient and thickness are easily-controllable, and thicknesses of layers is proportional with deposition time, uniformity and reproducible, platform
Rank covers, easy to operate advantage.
Therefore, preferably embodiment, inorganic material layer 16 are formed by chemical vapor deposition process.In this way, also
Make inorganic material layer 16 and pixel defining layer 14 that there is a preferable chemisorption power, inorganic material layer 16 is closely incorporated into
Pixel defining layer 14, to avoid falling in knockout process bearing or separating with pixel defining layer 14 in bending process.
In some embodiments, inorganic material layer 16 includes at least one of silica, silicon oxynitride or silicon nitride.It is another
In a little embodiments, inorganic material layer 16 also may include the materials such as aluminium oxide, titanium oxide, be not limited thereto.
In some embodiments of the present invention, further comprised the steps of: before step S130
S122: patterned pixel definition layer, to form at least one slot and/or hole；
Pixel defining layer is patterned using patterning processes to obtain at least one slot and/or hole, for example, some implementations
In example, then can be developed pixel defining layer by mask exposure, so that slot and/or hole are formed, it in further embodiments, can shape
Above-mentioned slot and/or hole are formed using etching technics after pixel definition layer.It is appreciated that patterning processes can also be other shapes
Formula, including but not limited to the two of the example above kind form.
It should be noted that when forming slot and/or hole using such as mask exposure development pixel defining layer to pattern
When, step S122 can be carried out simultaneously with step S120.When forming slot and/or hole using such as etching technics, step S122 exists
It is carried out after step S120.
It should also be noted that, when the production method of the display base plate includes step S122, in pixel in step S130
Definition layer 14 forms inorganic material layer 16 away from 12 side of array substrate, it can be understood as inorganic material layer 16 is filled in above-mentioned
In slot and/or hole.
Based on above-mentioned display panel, the embodiment of the present invention also provides a kind of display device, and in some embodiments, this is aobvious
Showing device can be display terminal, such as tablet computer, and in further embodiments, which also can be whole for mobile communication
End, such as mobile phone terminal.
In some embodiments, which includes display panel and control unit, which is used for display surface
Plate transmitting display signal therefor.
In conclusion display base plate 10 provided in an embodiment of the present invention and preparation method thereof, display panel and display device,
By forming inorganic material layer 16 away from 12 side of array substrate in pixel defining layer 14, forms organic layer and inorganic layer is compound
Structure, increases the rigidity of pixel defining layer 14, and reduces the expansion rate of pixel defining layer 14, to effectively avoid pixel fixed
Adopted layer 14 squeezes OLED device and leads to its failure, so improve the flexural strength of display panel and receiving to fall shock strong
The reliability of degree.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of display base plate, comprising:
Array substrate；
Pixel defining layer is formed in the array substrate；
It is characterized in that, the display base plate further includes the nothing for being formed in the pixel defining layer and deviating from the array substrate side
Machine material layer.
2. display base plate according to claim 1, which is characterized in that the inorganic material layer includes silica, nitrogen oxidation
At least one of silicon or silicon nitride.
3. display base plate according to claim 1, which is characterized in that the inorganic material layer with a thickness of 200 nanometers~
500 nanometers.
4. described in any item display base plates according to claim 1~3, which is characterized in that the pixel defining layer is organic material
The bed of material；Or
The pixel defining layer is organic material layer, and adulterates organic and/or inorganic materials.
5. described in any item display base plates according to claim 1~3, which is characterized in that the pixel defining layer defines more
A pixel definition opening；
Each pixel definition opening has bottom and side wall；The inorganic material layer covers the pixel defining layer except described
At least partly region outside the bottom of pixel definition opening.
6. described in any item display base plates according to claim 1~3, which is characterized in that the inorganic material layer passes through chemistry
Vapor deposition, physical vapour deposition (PVD), coating or printing type are formed in the pixel defining layer away from the array substrate side；
Preferably, the inorganic material layer is formed in the pixel defining layer away from the array by chemical vapor deposition manner
Substrate side.
7. described in any item display base plates according to claim 1~3, which is characterized in that the display base plate further includes at least
One slot for being formed in the pixel defining layer and/or hole；
The inorganic material layer is filled in the slot and/or hole.
8. display panel, which is characterized in that including display base plate, organic light-emitting units and encapsulated layer；
The display base plate includes:
Array substrate；
Pixel defining layer is formed in the array substrate, and defines multiple subpixel areas；
Inorganic material layer is formed in the pixel defining layer away from the array substrate side；
The organic light-emitting units are formed in the subpixel area, and the encapsulated layer, which is formed in the organic light-emitting units, to deviate from
The side of the array substrate.
9. display device, which is characterized in that including display panel as claimed in claim 8.
10. the production method of display base plate characterized by comprising
Array basal plate is provided；
Pixel defining layer is formed in the array substrate；
Inorganic material layer is formed away from the array substrate side in the pixel defining layer.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148520A (en) * | 2018-08-06 | 2019-01-04 | 云谷（固安）科技有限公司 | display module and display screen |
| CN109742114A (en) * | 2019-01-08 | 2019-05-10 | 京东方科技集团股份有限公司 | Show backboard production method and display backboard, display device |
| CN111293150A (en) * | 2020-02-20 | 2020-06-16 | 合肥维信诺科技有限公司 | Display module, manufacturing method thereof and display device |
| CN112736118A (en) * | 2020-12-28 | 2021-04-30 | 广东聚华印刷显示技术有限公司 | OLED display panel, display device and preparation method |
| US11605694B2 (en) | 2019-04-09 | 2023-03-14 | Samsung Display Co., Ltd. | Display apparatus including a planarization layer having a recess around a unit display portion |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183436A1 (en) * | 2003-03-20 | 2004-09-23 | Masato Ito | Organic EL display device |
| US20130248867A1 (en) * | 2012-03-23 | 2013-09-26 | Mu-gyeom Kim | Flexible display apparatus and method of manufacturing the same |
| CN104037357A (en) * | 2014-06-05 | 2014-09-10 | 京东方科技集团股份有限公司 | Organic light emitting display device and manufacturing method thereof |
| US20170092708A1 (en) * | 2015-09-30 | 2017-03-30 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN106920826A (en) * | 2017-02-27 | 2017-07-04 | 上海天马微电子有限公司 | A kind of flexible display panels, its preparation method and display device |
| CN108183108A (en) * | 2017-12-28 | 2018-06-19 | 信利（惠州）智能显示有限公司 | The production method and array substrate and display device of a kind of array substrate |
| CN108198843A (en) * | 2017-12-29 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | Display panel preparation method, display panel and display device |
| CN108231824A (en) * | 2016-12-16 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof |
-
2018
- 2018-07-06 CN CN201810736565.4A patent/CN108987444B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183436A1 (en) * | 2003-03-20 | 2004-09-23 | Masato Ito | Organic EL display device |
| US20130248867A1 (en) * | 2012-03-23 | 2013-09-26 | Mu-gyeom Kim | Flexible display apparatus and method of manufacturing the same |
| CN104037357A (en) * | 2014-06-05 | 2014-09-10 | 京东方科技集团股份有限公司 | Organic light emitting display device and manufacturing method thereof |
| US20170092708A1 (en) * | 2015-09-30 | 2017-03-30 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| CN108231824A (en) * | 2016-12-16 | 2018-06-29 | 京东方科技集团股份有限公司 | A kind of OLED display panel and preparation method thereof |
| CN106920826A (en) * | 2017-02-27 | 2017-07-04 | 上海天马微电子有限公司 | A kind of flexible display panels, its preparation method and display device |
| CN108183108A (en) * | 2017-12-28 | 2018-06-19 | 信利（惠州）智能显示有限公司 | The production method and array substrate and display device of a kind of array substrate |
| CN108198843A (en) * | 2017-12-29 | 2018-06-22 | 武汉华星光电半导体显示技术有限公司 | Display panel preparation method, display panel and display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148520A (en) * | 2018-08-06 | 2019-01-04 | 云谷（固安）科技有限公司 | display module and display screen |
| CN109742114A (en) * | 2019-01-08 | 2019-05-10 | 京东方科技集团股份有限公司 | Show backboard production method and display backboard, display device |
| US11605694B2 (en) | 2019-04-09 | 2023-03-14 | Samsung Display Co., Ltd. | Display apparatus including a planarization layer having a recess around a unit display portion |
| CN111293150A (en) * | 2020-02-20 | 2020-06-16 | 合肥维信诺科技有限公司 | Display module, manufacturing method thereof and display device |
| CN112736118A (en) * | 2020-12-28 | 2021-04-30 | 广东聚华印刷显示技术有限公司 | OLED display panel, display device and preparation method |
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| Publication number | Publication date |
|---|---|
| CN108987444B (en) | 2021-06-11 |
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