CN108980649A - Surface-mount LED lamp core - Google Patents
Surface-mount LED lamp core Download PDFInfo
- Publication number
- CN108980649A CN108980649A CN201810975437.5A CN201810975437A CN108980649A CN 108980649 A CN108980649 A CN 108980649A CN 201810975437 A CN201810975437 A CN 201810975437A CN 108980649 A CN108980649 A CN 108980649A
- Authority
- CN
- China
- Prior art keywords
- cooling stand
- tapering
- sealing
- led
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The present invention relates to LED field more particularly to a kind of Surface-mount LED lamp cores.Surface-mount LED lamp core, including cooling stand, and the LED paster component being arranged on cooling stand；The cooling stand is ceramics bracket, and cooling stand includes at least a tapering, and LED paster component is attached on the side wall in the tapering and the top in tapering；The inside of the cooling stand is equipped with the channel for ganging up its bottom and top.The Surface-mount LED lamp core expands light angle and illumination zone；Simultaneously, it can be achieved that the airflow circulating of bulb, is conducive to heat dissipation.
Description
Technical field
The present invention relates to LED field more particularly to a kind of Surface-mount LED lamp cores.
Background technique
LED is the abbreviation of English light emitting diode (light emitting diode), is a kind of solid semiconductor device
Part, the heart of LED are the chips of a semiconductor, and one end of chip is attached on a bracket, and one end is cathode, other end connection
The anode of power supply is encapsulated entire chip by epoxy resin.Its major function is: electric energy is converted into luminous energy, chip
Main material is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole accounts for leading inside it
Status, the other end are N-type semiconductors, are mainly electronics in this side.But when both semiconductors connect, between them
With regard to forming a P-N junction.When electric current acts on this chip by lead, electronics will be pushed to the area P, in the area P
Then electronics will issue energy with hole-recombination in the form of photon, here it is the principles that LED shines.And the wavelength of light
It is exactly the color of light, is determined by the material of formation P-N junction.Its basic structure is one block of electroluminescent semiconductor material
Then chip connects chip and circuit board with silver wire or gold thread, then surrounding epoxy on elargol or latex solidified to bracket
Resin seal plays the role of protecting internal core.In contrast, LED lamp is scattered compared to needing more to focus on for tengsten lamp
Heat demand, but at present LED lamp radiator structure it is unreasonable, heat dissipation effect is bad, thus will have a direct impact on product service life and
Quality.
Summary of the invention
To solve the above-mentioned problems, the purpose of the present invention is to provide a kind of Surface-mount LED lamp core, which expands
Big light angle and illumination zone；Simultaneously, it can be achieved that the airflow circulating of bulb, is conducive to heat dissipation.
In order to achieve the above purpose, present invention employs technical solutions below:
Surface-mount LED lamp core, it is characterised in that: including cooling stand, and the LED patch group being arranged on cooling stand
Part；The cooling stand is ceramics bracket, and cooling stand includes at least a tapering, and LED paster component is attached at the tapering
On the top in side wall and tapering；The inside of the cooling stand is equipped with the channel for ganging up its bottom and top.
Preferably, further including sealing horn body, the lower end for sealing horn body is sealed equipped with taper；The cooling stand
Lower end is connected on the sealing horn body of taper sealing top；Be equipped with lead in sealing horn body, and with the LED patch
Component connection.The sealing horn body is the interior accent for connecting and closing light bulb, and simultaneously for cooling stand and
LED paster component thereon is supported.
Preferably, the cooling stand includes the socket part below tapering, offered on the side wall of socket part logical
Hole is communicated with its internal channel；The socket part is connected to the top of sealing horn body, and sealing horn body is in socket part
When, through-hole described in endless complete hiding.In the technical solution, it is contemplated that on the one hand sealing horn body need to prop up cooling stand
Support, therefore cooling stand is connected on sealing horn body；Channel in another aspect cooling stand be for radiate use, therefore
The lower port in channel cannot be closed in connection, need to guarantee through-hole described in endless complete hiding there are gap.
Preferably, the LED paster component includes more patches unit, more patches unit primitive rule is around cone
In portion's circumferential side wall；More patches unit is sequentially connected electrically.This programme is one of embodiment, can realize each angle substantially
The lighting requirement of degree.
Preferably, the LED paster component is full wafer LED patch, tapering circumferential side wall is completely covered in LED patch.This
Scheme is another embodiment, and LED patch integrally covers tapering circumferential side wall by the program, relative to first way,
Which simplify structure, do not need for more patches unit to be sequentially connected electrically；On the other hand lighting criteria is also farthest promoted.
Preferably, the inside of the sealing horn body is equipped with air column；The lower end of air column is in taper sealing outside, gas
The upper end of column is connected on the sealing horn body of taper sealing top.In above-mentioned technical proposal, the effect of the air column be
Inner air is extracted in light bulb production, and for being filled with inert gas, such as helium.
By adopting the above technical scheme, which is related to a kind of Surface-mount LED lamp core to the present invention, in the Surface-mount LED lamp core
Cooling stand include a tapering, using on tapering be arranged LED paster component by the way of, the light angle of wick can be expanded
And illumination zone.Further, since LED lamp is related to heat dissipation problem, and the cooling stand of tapering shape is easy to cause it
The problem of central area heat build-up；Therefore setting gangs up the channel at its bottom and top, it can be achieved that bulb inside it
Airflow circulating, so as to carry heat to radiating on light bulb.
Detailed description of the invention
Fig. 1 is the structural schematic diagram (heat dissipation metal bracket) of Surface-mount LED lamp core.
Fig. 2 is the structural schematic diagram (ceramic heat-dissipating bracket) of Surface-mount LED lamp core.
Fig. 3 is the structural schematic diagram of ceramic heat-dissipating bracket.
Fig. 4 is the structural schematic diagram of bulb lamp.
Specific embodiment
With reference to the accompanying drawing, the preferred embodiments of the invention are described in further detail.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", "top",
The orientation or positional relationship of the instructions such as "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, merely to just
In description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore be not considered as limiting the invention.
Embodiment 1:
A kind of Surface-mount LED lamp core as shown in Figures 1 to 3, including cooling stand 1, and be arranged on cooling stand 1
LED paster component 2, and it is used to support the sealing horn body 3 of the cooling stand 1.Wherein, the sealing horn body 3 is
It is supported for connecting and closing the interior accent of light bulb, and simultaneously for LED paster component 2 to cooling stand 1 and thereon.
The cooling stand 1 includes at least a tapering 11, and the socket part 12 in 11 lower section of tapering.Such as the institute of Fig. 2 and 3
Show, in a kind of wherein embodiment, the cooling stand 1 is ceramics bracket.As shown in Fig. 1, in another embodiment
In, cooling stand 1 is metallic support, and metal used by metallic support can be the heat-conducting metals such as aluminium, copper, cooling stand 1
Rule is equipped with multiple radiating grooves 13 on 12 outer circumferential wall of socket part.It is described to dissipate on the basis of above two embodiment
The inside of hot bracket 1 is equipped with the channel 14 for ganging up its bottom and top.The reason is that LED lamp is related to heat dissipation problem, and
The cooling stand 1 of 11 shape of tapering is easy to cause the problem of its central area heat build-up.Therefore its bottom is ganged up in setting inside it
The channel 14 at portion and top, it can be achieved that bulb airflow circulating, so as to carry heat to radiating on light bulb.
Through-hole 15, and channel 14 phase internal with it are offered on the side wall of socket part 12 on the cooling stand 1
It is logical.Cooling stand 1 and the connection type of sealing horn body 3 are: the lower end of the sealing horn body 3 is equipped with taper sealing 31, institute
The lower end for stating cooling stand 1 is connected on the sealing horn body 3 of 31 top of taper sealing.Further scheme is, described to dissipate
The socket part 12 of hot bracket 1 is connected to the top of sealing horn body 3, when sealing horn body 3 is in socket part 12, endless complete hiding
The through-hole 15；" endless complete hiding " therein refers to that the through-hole 15 there are gap, can guarantee that gas flows.In the skill
In art scheme, it is contemplated that on the one hand sealing horn body 3 need to be supported cooling stand 1, therefore cooling stand 1 is connected to envelope
On mouth horn body 3.Channel 14 in another aspect cooling stand 1 be for radiate use, therefore connection when cannot be by channel 14
Lower port closing, need to guarantee through-hole 15 described in endless complete hiding there are gap.
The inside of the sealing horn body 3 is equipped with air column 4.The lower end of air column 4 is in 31 outside of taper sealing, air column 4
Upper end be connected to taper sealing 31 top sealing horn body 3 on.In above-mentioned technical proposal, the effect of the air column 4 is
Inner air is extracted in light bulb production, and for being filled with inert gas, such as helium.
In addition, being equipped with lead in sealing horn body 3, and it is connect with the LED paster component 2.The LED patch group
Part 2 is attached on the side wall in the tapering 11 and the top in tapering 11.As shown in Figure 1, in a kind of wherein embodiment, institute
Stating LED paster component 2 includes more patches unit 21, and 21 primitive rule of more patches unit is around 11 circumferential side wall of tapering
On.More patches unit 21 is sequentially connected electrically.This programme is one of embodiment, can realize the illumination of each angle substantially
It is required that.As shown in Fig. 2, in another embodiment, the LED paster component 2 is full wafer LED patch, LED patch covers completely
11 circumferential side wall of lid tapering.This programme is another embodiment, and LED patch is integrally covered 11 peripheral side of tapering by the program
Wall, which simplify structure, does not need for more patches unit 21 to be sequentially connected electrically relative to first way.On the other hand
Farthest promote lighting criteria.
By adopting the above technical scheme, which is related to a kind of Surface-mount LED lamp core to the present invention, the Surface-mount LED lamp core
Cooling stand 1 includes a tapering 11, and LED paster component 2 is attached on the side wall in the tapering 11 and the top in tapering 11.
To increase the illumination region of the Surface-mount LED lamp core, illuminating effect is promoted.
Embodiment 2:
As shown in figures 1-4, the present embodiment is related to a kind of bulb lamp, including bulb shell 5, and is arranged in bulb shell 5
On Surface-mount LED lamp core, and the conductive base 6 being connected on bulb shell 5.The Surface-mount LED lamp core is used as implemented
The Surface-mount LED lamp core recorded in example 1.Specifically, Surface-mount LED lamp core, including cooling stand 1, and be arranged in cooling stand 1
On LED paster component 2, and be used to support the sealing horn body 3 of the cooling stand 1.Wherein, the sealing horn body
3 be the interior accent for connecting and closing light bulb, and is propped up simultaneously for LED paster component 2 to cooling stand 1 and thereon
Support.The sealing horn body 3 is closed on the inner cavity accent of bulb shell 5, at cooling stand 1 and LED paster component 2 thereon
In the inner cavity of bulb shell 5.
The cooling stand 1 includes at least a tapering 11, and the socket part 12 in 11 lower section of tapering.It is a kind of wherein
In embodiment, the cooling stand 1 is ceramics bracket；In another embodiment, cooling stand 1 is metallic support,
Rule is equipped with multiple radiating grooves 13 on the 12 outer circumferential wall of socket part of cooling stand 1.On the basis of above two embodiment
On, the inside of the cooling stand 1 is equipped with the channel 14 for ganging up its bottom and top.The reason is that LED lamp is related to
Heat dissipation problem, and the problem of the cooling stand 1 of 11 shape of tapering is easy to cause its central area heat build-up.Therefore it sets inside it
Set the channel 14 for ganging up its bottom and top, it can be achieved that bulb airflow circulating, so as to carry heat to light bulb
On radiate.
Through-hole 15 is offered on the side wall of socket part 12 on the cooling stand 1, and is communicated with its internal channel 14.
Cooling stand 1 and the connection type of sealing horn body 3 are: the lower end of the sealing horn body 3 is equipped with taper sealing 31, described to dissipate
The lower end of hot bracket 1 is connected on the sealing horn body 3 of 31 top of taper sealing.Further scheme is the heat dissipation branch
The socket part 12 of frame 1 is connected to the top of sealing horn body 3, when sealing horn body 3 is in socket part 12, described in endless complete hiding
Through-hole 15；" endless complete hiding " therein refers to that the through-hole 15 there are gap, can guarantee that gas flows.In the technical side
In case, it is contemplated that on the one hand sealing horn body 3 need to be supported cooling stand 1, therefore cooling stand 1 is connected to sealing loudspeaker
On body 3.Channel 14 in another aspect cooling stand 1 is used for radiating, therefore cannot will be under channel 14 in connection
Port closed needs to guarantee through-hole 15 described in endless complete hiding there are gap.
The inside of the sealing horn body 3 is equipped with air column 4.The lower end of air column 4 is in 31 outside of taper sealing, air column 4
Upper end be connected to taper sealing 31 top sealing horn body 3 on.In above-mentioned technical proposal, the effect of the air column 4 is
Inner air is extracted in light bulb production, and for being filled with inert gas, such as helium.
In addition, being equipped with lead in sealing horn body 3, and it is connected with the LED paster component 2, conductive base 6.Institute
The LED paster component 2 stated is attached on the side wall in the tapering 11 and the top in tapering 11.In a kind of wherein embodiment,
The LED paster component 2 includes more patches unit 21, and 21 primitive rule of more patches unit is around 11 circumferential side wall of tapering
On.More patches unit 21 is sequentially connected electrically.This programme is one of embodiment, can realize the illumination of each angle substantially
It is required that.In another embodiment, the LED paster component 2 is full wafer LED patch, and tapering 11 is completely covered in LED patch
Circumferential side wall.This programme is another embodiment, and LED patch is integrally covered 11 circumferential side wall of tapering by the program, relatively
In first way, which simplify structure, do not need for more patches unit 21 to be sequentially connected electrically.On the other hand also utmostly
Ground promotes lighting criteria.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (6)
1.LED patch wick, it is characterised in that: including cooling stand, and the LED paster component being arranged on cooling stand；
The cooling stand is ceramics bracket, and cooling stand includes at least a tapering, and LED paster component is attached at the side in the tapering
On the top in wall and tapering；The inside of cooling stand is equipped with the channel for ganging up its bottom and top.
2. Surface-mount LED lamp core according to claim 1, it is characterised in that: further include sealing horn body, seal horn body
It is sealed equipped with taper lower end；The lower end of the cooling stand is connected on the sealing horn body of taper sealing top；Seal loudspeaker
Be equipped with lead in vivo, and connect with the LED paster component.
3. Surface-mount LED lamp core according to claim 1, it is characterised in that: the cooling stand includes below tapering
Socket part, offer through-hole on the side wall of socket part, communicated with its internal channel；The socket part is connected to sealing loudspeaker
The top of body, when sealing horn body is in socket part, through-hole described in endless complete hiding.
4. Surface-mount LED lamp core according to claim 1, it is characterised in that: the LED paster component includes more patches list
Member, more patches unit primitive rule is around in the circumferential side wall of tapering；More patches unit is sequentially connected electrically.
5. Surface-mount LED lamp core according to claim 1, it is characterised in that: the LED paster component is full wafer LED patch,
Tapering circumferential side wall is completely covered in LED patch.
6. Surface-mount LED lamp core according to claim 2, it is characterised in that: the inside of the sealing horn body is equipped with gas
Column；The lower end of air column is in taper sealing outside, and the upper end of air column is connected on the sealing horn body of taper sealing top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975437.5A CN108980649A (en) | 2018-08-24 | 2018-08-24 | Surface-mount LED lamp core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810975437.5A CN108980649A (en) | 2018-08-24 | 2018-08-24 | Surface-mount LED lamp core |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108980649A true CN108980649A (en) | 2018-12-11 |
Family
ID=64546748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810975437.5A Withdrawn CN108980649A (en) | 2018-08-24 | 2018-08-24 | Surface-mount LED lamp core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108980649A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203823499U (en) * | 2014-04-02 | 2014-09-10 | 厦门市东林电子有限公司 | Integrated heat dissipation type LED bulb |
| WO2014187335A1 (en) * | 2013-05-23 | 2014-11-27 | Zhao Yijun | Led lamp core and led bulb lamp comprising same |
| CN104776327A (en) * | 2014-11-12 | 2015-07-15 | 吴喜荣 | LED (Light Emitting Diode) lighting source with radiating function, filament lamp and lighting device |
| CN204611413U (en) * | 2015-04-08 | 2015-09-02 | 海宁融辉照明有限公司 | LED ball is steeped |
| WO2016065566A1 (en) * | 2014-10-30 | 2016-05-06 | 正屋(厦门)电子有限公司 | Bulb lamp structure |
-
2018
- 2018-08-24 CN CN201810975437.5A patent/CN108980649A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014187335A1 (en) * | 2013-05-23 | 2014-11-27 | Zhao Yijun | Led lamp core and led bulb lamp comprising same |
| CN203823499U (en) * | 2014-04-02 | 2014-09-10 | 厦门市东林电子有限公司 | Integrated heat dissipation type LED bulb |
| WO2016065566A1 (en) * | 2014-10-30 | 2016-05-06 | 正屋(厦门)电子有限公司 | Bulb lamp structure |
| CN104776327A (en) * | 2014-11-12 | 2015-07-15 | 吴喜荣 | LED (Light Emitting Diode) lighting source with radiating function, filament lamp and lighting device |
| CN204611413U (en) * | 2015-04-08 | 2015-09-02 | 海宁融辉照明有限公司 | LED ball is steeped |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181211 |
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| WW01 | Invention patent application withdrawn after publication |