CN108758369A - A kind of Surface-mount LED lamp core - Google Patents

A kind of Surface-mount LED lamp core Download PDF

Info

Publication number
CN108758369A
CN108758369A CN201810975430.3A CN201810975430A CN108758369A CN 108758369 A CN108758369 A CN 108758369A CN 201810975430 A CN201810975430 A CN 201810975430A CN 108758369 A CN108758369 A CN 108758369A
Authority
CN
China
Prior art keywords
cooling stand
led lamp
tapering
lamp core
horn body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810975430.3A
Other languages
Chinese (zh)
Inventor
钟建华
傅根生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEQING DING HUI LIGHT Co Ltd
Original Assignee
DEQING DING HUI LIGHT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEQING DING HUI LIGHT Co Ltd filed Critical DEQING DING HUI LIGHT Co Ltd
Priority to CN201810975430.3A priority Critical patent/CN108758369A/en
Publication of CN108758369A publication Critical patent/CN108758369A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The present invention relates to LED field more particularly to a kind of Surface-mount LED lamp cores.A kind of Surface-mount LED lamp core, including cooling stand, and the LED paster components that are arranged on cooling stand;The cooling stand includes at least a tapering, and LED paster components are attached on the side wall in the tapering and the top in tapering.The Surface-mount LED lamp core increases illumination region, promotes illuminating effect.

Description

A kind of Surface-mount LED lamp core
Technical field
The present invention relates to LED field more particularly to a kind of Surface-mount LED lamp cores.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), is a kind of solid semiconductor device Part, the heart of LED are the chips of a semiconductor, and one end of chip is attached on a holder, and one end is cathode, other end connection The anode of power supply makes entire chip by epoxy encapsulation.Its major function is:Electric energy is converted into luminous energy, chip Main material is monocrystalline silicon.Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole accounts for leading inside it Status, the other end are N-type semiconductors, are mainly electronics in this side.But when both semiconductors connect, between them With regard to forming a P-N junction.When electric current acts on this chip by lead, electronics will be pushed to the areas P, in the areas P Then electronics will send out energy with hole-recombination in the form of photon, here it is the principles that LED shines.And the wavelength of light It is exactly the color of light, is determined by the material of formation P-N junction.Its basic structure is one block of electroluminescent semi-conducting material Then chip uses silver wire or gold thread to connect chip and circuit board, then surrounding epoxy on elargol or latex solidified to holder Resin seal plays the role of protecting internal core.
In the prior art, Surface-mount LED lamp core is that LED patches are attached on circular flat, therefore the Surface-mount LED lamp The illumination region of core is only limitted to the front surface region of circular flat, and its rear surface regions can not just illuminate.Thus, the Surface-mount LED lamp The illumination region of core is smaller, spatially at maximum up to 180 °, its inferior quality, urgent need is made to be improved this.
Invention content
To solve the above-mentioned problems, the purpose of the present invention is to provide a kind of Surface-mount LED lamp core, which increases Add illumination region, promotes illuminating effect.
In order to achieve the above purpose, present invention employs technical solutions below:
A kind of Surface-mount LED lamp core, it is characterised in that:Including cooling stand, and the LED patches that are arranged on cooling stand Component;The cooling stand includes at least a tapering, and LED paster components are attached at the side wall in the tapering and the top in tapering On.
Preferably, the LED paster components include more patches unit, more patches unit primitive rule is around cone In portion's circumferential side wall;More patches unit is sequentially connected electrically.This programme is one of which embodiment, can realize each angle substantially The lighting requirement of degree.
Preferably, the LED paster components are full wafer LED patches, tapering circumferential side wall is completely covered in LED patches.This Scheme is another embodiment, and LED patches integrally cover tapering circumferential side wall by the program, relative to first way, Which simplify structures, need not be sequentially connected electrically more patches unit;On the other hand lighting criteria is also farthest promoted.
Preferably, the cooling stand is internally provided with the channel for ganging up its bottom and top.In the technical solution, by It is related to heat dissipation problem in LED lamp, and the problem of the cooling stand of tapering shape is easy to cause its central area heat build-up; Therefore inside it setting gang up its bottom and top channel, it can be achieved that bulb airflow circulating, so as to by heat It radiates on carrying to light bulb.
Preferably, further including sealing horn body, the lower end for sealing horn body is sealed equipped with taper;The cooling stand Lower end is connected on the sealing horn body of taper sealing top;Seal horn body in be laid with it is leaded, and with the LED patches Component connects.The sealing horn body is the interior accent for connecting and closing light bulb, and be used for simultaneously to cooling stand and LED paster components thereon are supported.
Preferably, the cooling stand includes the socket part below tapering, offered on the side wall of socket part logical Hole is communicated with its internal channel;The socket part is connected to the top of sealing horn body, and sealing horn body is in socket part When, through-hole described in endless complete hiding.In the technical solution, it is contemplated that on the one hand sealing horn body need to prop up cooling stand Support, therefore cooling stand is connected on sealing horn body;Channel in another aspect cooling stand be for radiate use, therefore The lower port in channel cannot be closed in connection, needs to ensure through-hole described in endless complete hiding there are gap.
Preferably, the inside of the sealing horn body is equipped with air column;The lower end of air column is in taper sealing outside, gas The upper end of column is connected on the sealing horn body of taper sealing top.In above-mentioned technical proposal, the effect of the air column be Light bulb extracts inner air in making, and for being filled with inert gas, such as helium.
Preferably, the cooling stand is metallic support, rule is equipped on the socket part outer circumferential wall of cooling stand Multiple radiating grooves.
Preferably, the cooling stand is ceramics bracket.
The present invention uses above-mentioned technical proposal, the technical solution to be related to a kind of Surface-mount LED lamp core, the Surface-mount LED lamp core Cooling stand includes a tapering, and LED paster components are attached on the side wall in the tapering and the top in tapering;To increase The illumination region of the Surface-mount LED lamp core promotes illuminating effect.
Description of the drawings
Fig. 1 is the structural schematic diagram (heat dissipation metal holder) of Surface-mount LED lamp core.
Fig. 2 is the structural schematic diagram (ceramic heat-dissipating holder) of Surface-mount LED lamp core.
Fig. 3 is the structural schematic diagram of ceramic heat-dissipating holder.
Fig. 4 is the structural schematic diagram of bulb lamp.
Specific implementation mode
Below in conjunction with the accompanying drawings, the preferred embodiments of the invention are described in further detail.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In the description of the present invention, it is to be understood that, term "upper", "lower", "front", "rear", "left", "right", "top", The orientation or positional relationship of the instructions such as "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, merely to just In the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation, with Specific azimuth configuration and operation, therefore be not considered as limiting the invention.
Embodiment 1:
A kind of Surface-mount LED lamp core as shown in Figures 1 to 3, including cooling stand 1, and be arranged on cooling stand 1 LED paster components 2, and it is used to support the sealing horn body 3 of the cooling stand 1.Wherein, the sealing horn body 3 is Interior accent for connecting and closing light bulb, and the LED paster components 2 being used for simultaneously to cooling stand 1 and thereon are supported.
The cooling stand 1 includes at least a tapering 11, and the socket part 12 in 11 lower section of tapering.Such as the institutes of Fig. 2 and 3 Show, in wherein a kind of embodiment, the cooling stand 1 is ceramics bracket.As shown in Fig. 1, in another embodiment In, cooling stand 1 is metallic support, and metal used by metallic support can be the heat-conducting metals such as aluminium, copper, cooling stand 1 Rule is equipped with multiple radiating grooves 13 on 12 outer circumferential wall of socket part.It is described to dissipate on the basis of above two embodiment Hot holder 1 is internally provided with the channel 14 for ganging up its bottom and top.The reason is that LED lamp is related to heat dissipation problem, and The cooling stand 1 of 11 shape of tapering is easy to cause the problem of its central area heat build-up.Therefore its bottom is ganged up in setting inside it The channel 14 at portion and top, it can be achieved that bulb airflow circulating, so as to carry heat to radiating on light bulb.
Through-hole 15, and channel 14 phase internal with it are offered on the side wall of socket part 12 on the cooling stand 1 It is logical.Cooling stand 1 and the connection type of sealing horn body 3 are:The lower end of the sealing horn body 3 is equipped with taper and seals 31, institute The lower end for stating cooling stand 1 is connected on the sealing horn body 3 of 31 top of taper sealing.Further scheme is, described to dissipate The socket part 12 of hot holder 1 is connected to the top of sealing horn body 3, when sealing horn body 3 is in socket part 12, endless complete hiding The through-hole 15;" endless complete hiding " therein refers to that there are gaps for the through-hole 15, can ensure gas flowing.In the skill In art scheme, it is contemplated that on the one hand sealing horn body 3 need to be supported cooling stand 1, therefore cooling stand 1 is connected to envelope On mouth horn body 3.Channel 14 in another aspect cooling stand 1 be for radiate use, therefore connection when cannot be by channel 14 Lower port closing, need to ensure through-hole 15 described in endless complete hiding there are gap.
The inside of the sealing horn body 3 is equipped with air column 4.The lower end of air column 4 is in 31 outside of taper sealing, air column 4 Upper end be connected to taper sealing 31 top sealing horn body 3 on.In above-mentioned technical proposal, the effect of the air column 4 is Inner air is extracted in light bulb making, and for being filled with inert gas, such as helium.
In addition, laying is leaded in sealing horn body 3, and it is connect with the LED paster components 2.The LED patch groups Part 2 is attached on the side wall in the tapering 11 and the top in tapering 11.As shown in Figure 1, in wherein a kind of embodiment, institute It includes more patches unit 21 to state LED paster components 2, and 21 primitive rule of more patches unit is around 11 circumferential side wall of tapering On.More patches unit 21 is sequentially connected electrically.This programme is one of which embodiment, can realize the illumination of each angle substantially It is required that.As shown in Fig. 2, in another embodiment, the LED paster components 2 are full wafer LED patches, LED patches cover completely 11 circumferential side wall of lid tapering.This programme is another embodiment, and LED patches are integrally covered 11 peripheral side of tapering by the program Wall, relative to first way, which simplify structures, need not be sequentially connected electrically more patches unit 21.On the other hand Farthest promote lighting criteria.
The present invention uses above-mentioned technical proposal, the technical solution to be related to a kind of Surface-mount LED lamp core, the Surface-mount LED lamp core Cooling stand 1 includes a tapering 11, and LED paster components 2 are attached on the side wall in the tapering 11 and the top in tapering 11. To increase the illumination region of the Surface-mount LED lamp core, illuminating effect is promoted.
Embodiment 2:
As shown in figures 1-4, the present embodiment is related to a kind of bulb lamp, including bulb shell 5, and is arranged in bulb shell 5 On Surface-mount LED lamp core, and the conductive base 6 that is connected on bulb shell 5.The Surface-mount LED lamp core is used as implemented Surface-mount LED lamp core described in example 1.Specifically, Surface-mount LED lamp core, including cooling stand 1, and be arranged in cooling stand 1 On LED paster components 2, and be used to support the sealing horn body 3 of the cooling stand 1.Wherein, the sealing horn body 3 be the interior accent for connecting and closing light bulb, and the LED paster components 2 being used for simultaneously to cooling stand 1 and thereon prop up Support.The sealing horn body 3 is closed on the inner cavity accent of bulb shell 5, cooling stand 1 and LED paster components 2 thereon In the inner cavity of bulb shell 5.
The cooling stand 1 includes at least a tapering 11, and the socket part 12 in 11 lower section of tapering.It is a kind of wherein In embodiment, the cooling stand 1 is ceramics bracket;In another embodiment, cooling stand 1 is metallic support, Rule is equipped with multiple radiating grooves 13 on the 12 outer circumferential wall of socket part of cooling stand 1.On the basis of above two embodiment On, the cooling stand 1 is internally provided with the channel 14 for ganging up its bottom and top.The reason is that LED lamp is related to Heat dissipation problem, and the problem of the cooling stand 1 of 11 shape of tapering is easy to cause its central area heat build-up.Therefore it sets inside it Set the channel 14 for ganging up its bottom and top, it can be achieved that bulb airflow circulating, so as to carry heat to light bulb On radiate.
Through-hole 15, and channel 14 phase internal with it are offered on the side wall of socket part 12 on the cooling stand 1 It is logical.Cooling stand 1 and the connection type of sealing horn body 3 are:The lower end of the sealing horn body 3 is equipped with taper and seals 31, institute The lower end for stating cooling stand 1 is connected on the sealing horn body 3 of 31 top of taper sealing.Further scheme is, described to dissipate The socket part 12 of hot holder 1 is connected to the top of sealing horn body 3, when sealing horn body 3 is in socket part 12, endless complete hiding The through-hole 15;" endless complete hiding " therein refers to that there are gaps for the through-hole 15, can ensure gas flowing.In the skill In art scheme, it is contemplated that on the one hand sealing horn body 3 need to be supported cooling stand 1, therefore cooling stand 1 is connected to envelope On mouth horn body 3.Channel 14 in another aspect cooling stand 1 be for radiate use, therefore connection when cannot be by channel 14 Lower port closing, need to ensure through-hole 15 described in endless complete hiding there are gap.
The inside of the sealing horn body 3 is equipped with air column 4.The lower end of air column 4 is in 31 outside of taper sealing, air column 4 Upper end be connected to taper sealing 31 top sealing horn body 3 on.In above-mentioned technical proposal, the effect of the air column 4 is Inner air is extracted in light bulb making, and for being filled with inert gas, such as helium.
In addition, laying is leaded in sealing horn body 3, and it is connected with the LED paster components 2, conductive base 6.Institute The LED paster components 2 stated are attached on the side wall in the tapering 11 and the top in tapering 11.In wherein a kind of embodiment, The LED paster components 2 include more patches unit 21, and 21 primitive rule of more patches unit is around 11 circumferential side wall of tapering On.More patches unit 21 is sequentially connected electrically.This programme is one of which embodiment, can realize the illumination of each angle substantially It is required that.In another embodiment, the LED paster components 2 are full wafer LED patches, and tapering 11 is completely covered in LED patches Circumferential side wall.This programme is another embodiment, and LED patches are integrally covered 11 circumferential side wall of tapering by the program, relatively In first way, which simplify structures, need not be sequentially connected electrically more patches unit 21.On the other hand also utmostly Ground promotes lighting criteria.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.

Claims (9)

1. a kind of Surface-mount LED lamp core, it is characterised in that:Including cooling stand, and the LED patch groups that are arranged on cooling stand Part;The cooling stand includes at least a tapering, and LED paster components are attached on the side wall in the tapering and the top in tapering.
2. a kind of Surface-mount LED lamp core according to claim 1, it is characterised in that:The LED paster components include multi-disc patch Blade unit, more patches unit primitive rule is around in the circumferential side wall of tapering;More patches unit is sequentially connected electrically.
3. a kind of Surface-mount LED lamp core according to claim 1, it is characterised in that:The LED paster components are full wafer LED Tapering circumferential side wall is completely covered in patch, LED patches.
4. a kind of Surface-mount LED lamp core described in any one of claim 1 to 3, it is characterised in that:The cooling stand It is internally provided with the channel for ganging up its bottom and top.
5. a kind of Surface-mount LED lamp core according to claim 4, it is characterised in that:Further include sealing horn body, seals loudspeaker It is sealed equipped with taper the lower end of body;The lower end of the cooling stand is connected on the sealing horn body of taper sealing top;Envelope Laying is leaded in mouth horn body, and is connect with the LED paster components.
6. a kind of Surface-mount LED lamp core according to claim 5, it is characterised in that:The cooling stand includes being in tapering The socket part of lower section offers through-hole on the side wall of socket part, is communicated with its internal channel;The socket part is connected to sealing The top of horn body, when sealing horn body is in socket part, through-hole described in endless complete hiding.
7. a kind of Surface-mount LED lamp core according to claim 5, it is characterised in that:The inside of the sealing horn body is worn There is air column;The lower end of air column is in taper sealing outside, and the upper end of air column is connected to the sealing horn body of taper sealing top On.
8. a kind of Surface-mount LED lamp core according to claim 6, it is characterised in that:The cooling stand is metallic support, is dissipated Rule is equipped with multiple radiating grooves on the socket part outer circumferential wall of hot holder.
9. a kind of Surface-mount LED lamp core according to claim 1, it is characterised in that:The cooling stand is ceramics bracket.
CN201810975430.3A 2018-08-24 2018-08-24 A kind of Surface-mount LED lamp core Withdrawn CN108758369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810975430.3A CN108758369A (en) 2018-08-24 2018-08-24 A kind of Surface-mount LED lamp core

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810975430.3A CN108758369A (en) 2018-08-24 2018-08-24 A kind of Surface-mount LED lamp core

Publications (1)

Publication Number Publication Date
CN108758369A true CN108758369A (en) 2018-11-06

Family

ID=63967620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810975430.3A Withdrawn CN108758369A (en) 2018-08-24 2018-08-24 A kind of Surface-mount LED lamp core

Country Status (1)

Country Link
CN (1) CN108758369A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203823499U (en) * 2014-04-02 2014-09-10 厦门市东林电子有限公司 Integrated heat dissipation type LED bulb
WO2014187335A1 (en) * 2013-05-23 2014-11-27 Zhao Yijun Led lamp core and led bulb lamp comprising same
WO2015070670A1 (en) * 2013-11-14 2015-05-21 深圳市西德利集团有限公司 Led bracket, led lamp element and lamp
CN104776327A (en) * 2014-11-12 2015-07-15 吴喜荣 LED (Light Emitting Diode) lighting source with radiating function, filament lamp and lighting device
CN204611413U (en) * 2015-04-08 2015-09-02 海宁融辉照明有限公司 LED ball is steeped

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014187335A1 (en) * 2013-05-23 2014-11-27 Zhao Yijun Led lamp core and led bulb lamp comprising same
WO2015070670A1 (en) * 2013-11-14 2015-05-21 深圳市西德利集团有限公司 Led bracket, led lamp element and lamp
CN203823499U (en) * 2014-04-02 2014-09-10 厦门市东林电子有限公司 Integrated heat dissipation type LED bulb
CN104776327A (en) * 2014-11-12 2015-07-15 吴喜荣 LED (Light Emitting Diode) lighting source with radiating function, filament lamp and lighting device
CN204611413U (en) * 2015-04-08 2015-09-02 海宁融辉照明有限公司 LED ball is steeped

Similar Documents

Publication Publication Date Title
US20120106140A1 (en) Light-emitting diode lamp and method of making
JP2010045030A (en) Light-emitting diode illumination apparatus
JP2009135440A (en) Light-emitting device having heat dissipating function, and process for manufacturing such device
JP2010015754A (en) Lamp and lighting device
CN103322437B (en) There is LED ball lamp and the manufacture method thereof of strong heat-sinking capability
CN102820412A (en) Chip package and manufacturing method thereof
CN107726059A (en) A kind of easy-to-mount high-efficient heat-dissipating LED lamp
KR20080060737A (en) Light emitting diode
CN107305922B (en) preparation method of integrated 360-degree three-dimensional light-emitting source with power supply
JP6366045B2 (en) Lighting apparatus and LED lighting apparatus incorporating the same
CN208566228U (en) A kind of Surface-mount LED lamp core
CN108758369A (en) A kind of Surface-mount LED lamp core
WO2009063255A1 (en) Improved led device
CN208579179U (en) LED lamp
CN206943847U (en) A kind of LED that can quickly assemble
CN208579178U (en) Surface-mount LED lamp core
CN208579180U (en) Bulb lamp
CN103375704B (en) High power LED lamp and its manufacture method
CN208566242U (en) A kind of bulb lamp
CN208579181U (en) A kind of bulb lamp of built-in LED patch
CN108954035A (en) LED lamp
CN108799866A (en) A kind of bulb lamp
CN108980649A (en) Surface-mount LED lamp core
CN108826037A (en) Bulb lamp
CN108870114A (en) A kind of bulb lamp of built-in LED patch

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20181106

WW01 Invention patent application withdrawn after publication