CN108976707A - A kind of epoxy sealing composition as material of main part - Google Patents
A kind of epoxy sealing composition as material of main part Download PDFInfo
- Publication number
- CN108976707A CN108976707A CN201710413562.2A CN201710413562A CN108976707A CN 108976707 A CN108976707 A CN 108976707A CN 201710413562 A CN201710413562 A CN 201710413562A CN 108976707 A CN108976707 A CN 108976707A
- Authority
- CN
- China
- Prior art keywords
- main part
- curing agent
- sealing composition
- epoxy
- epoxy sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 36
- 239000004593 Epoxy Substances 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- 238000007789 sealing Methods 0.000 title claims abstract description 23
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- 239000011342 resin composition Substances 0.000 claims abstract description 16
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 230000002745 absorbent Effects 0.000 claims abstract description 7
- 239000002250 absorbent Substances 0.000 claims abstract description 7
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 7
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 7
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 7
- 239000007822 coupling agent Substances 0.000 claims abstract description 7
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 230000005484 gravity Effects 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 4
- 239000003365 glass fiber Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000000051 modifying effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920006305 unsaturated polyester Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to epoxy resin.A kind of epoxy sealing composition as material of main part, it includes resin Composition and curing agent component, the resin Composition includes: epoxy resin EL-128E 36-42%, coupling agent XHL-187 0.5-2%, titanium dioxide 0.1-1%, silica GS-SI100 25-30%, aluminium oxide AM-210 26-32% and UV absorbent UV-1 0.2-0.5%;The curing agent component includes: anhydride curing agent MHHPA 34-36%, accelerant B PP 0.4-0.5%；Silica GS-SI100 29-32%, aluminium oxide AM-210 30-35%, antioxidant TP-10H 0.3-0.5%, gas silicon H18 0.25-0.4% and EG 0.8-1.2%；The percentage is weight percentage；After resin Composition and each self-heating of curing agent component are mixed, using the ratio mixing of the weight ratio 1:1 epoxy sealing composition as material of main part.The present invention is not necessarily to can be used as epoxy composite addition modified material the material of main part of product.
Description
Technical field
The present invention relates to epoxy resin more particularly to a kind of epoxy composites of heating cure.On the other hand, the present invention relates to
And the epoxy composite of house ornamentation construction material.
Background technique
The so-called embedding composition of the present invention is not intended to electrical encapsulating, but the material of main part as workpiece.Epoxy
Resin has obtained extensive utilization with its good performance in all trades and professions.But traditional simple epoxy systems are sufficiently solid
After change, brittleness is larger, not can be used as material of main part, causes its application to be confined to the fields such as adhesive, electrical casting glue, generally needs
Product main body material, such as wind electricity blade can be used as by adding the toughening modifyings such as glass fibre.
How to allow epoxy resin without the material of main part that toughening modifying is directly used as product is that those skilled in the art need
It solves the problems, such as.
Summary of the invention
The present invention is directed to overcome the drawbacks described above of the prior art, it is to provide a kind of epoxy sealing combination as material of main part
Object.The present invention is not necessarily to can be used as epoxy composite addition modified material the material of main part of product.
A kind of epoxy sealing composition as material of main part of the present invention, it includes resin Composition and curing agent component, institute
Stating resin Composition includes:
Epoxy resin EL-128E 36-42%,
Coupling agent XHL-187 0.5-2%,
Titanium dioxide 0.1-1%,
Silica GS-SI100 25-30%,
Aluminium oxide AM-210 26-32%, and
UV absorbent UV-1 0.2-0.5%;
The curing agent component includes:
Anhydride curing agent MHHPA 34-36%,
Accelerant B PP 0.4-0.5%；
Silica GS-SI100 29-32%,
Aluminium oxide AM-210 30-35%,
Antioxidant TP-10H 0.3-0.5%,
Gas silicon H18 0.25-0.4%, and
EG 0.8-1.2%；
The percentage is weight percentage；
It is described as master using the ratio mixing of weight ratio 1:1 after resin Composition and each self-heating of curing agent component are mixed
The epoxy sealing composition of body material.
A kind of epoxy sealing composition as material of main part, the specific gravity of the resin Composition are 1.4- at 25 degree
1.8,40 DEG C of 5000--8000cps of viscosity.
A kind of epoxy sealing composition as material of main part, the specific gravity of the curing agent component are at 25 degree
1.4-1.8 40 DEG C of 2000--5000cps of viscosity.
A kind of epoxy sealing composition as material of main part, 40 DEG C of 4000-7000cps of viscosity, when can be used
Between in 40 DEG C of 60min.
A kind of epoxy sealing composition as material of main part, wherein the condition of cure of the composition is 170
DEG C, 140 DEG C are cooled to after 7-10min, 2h.
A kind of epoxy sealing composition as material of main part, the condition of cure of the interim composition is 130-
140 DEG C, to 140 DEG C after 15min, 2h.
Epoxy systems of the invention using silicon systems filler cooperate aluminium oxide, curing rate is very fast, it is easy to process and material
Various good mechanical performances can be used as material of main part without using glass fibre；It simultaneously can also be to avoid Workplace glass
Fibre damages operator.After epoxide resin material solidification, there is good compression strength, bending strength and hard
Degree, is the good material for making sanitary ware, and cost is lower than unsaturated polyester (UP)；In addition, its water absorption rate is low, surface hardness is high, it is resistance to
It scrapes, anti-pollution, is the outstanding substrate for making the ornament materials such as walltile, floor tile.
Specific embodiment:
A kind of epoxy sealing composition as material of main part of the present invention, it includes resin Composition and curing agent component, the tree
Rouge component includes:
Epoxy resin EL-128E 36-42%,
Coupling agent XHL-187 0.5-2%,
Titanium dioxide 0.1-1%,
Silica GS-SI100 25-30%,
Aluminium oxide AM-210 26-32%, and
UV absorbent UV-1 0.2-0.5%;
The curing agent component includes:
Anhydride curing agent MHHPA 34-36%,
Accelerant B PP 0.4-0.5%；
Silica GS-SI100 29-32%,
Aluminium oxide AM-210 30-35%,
Antioxidant TP-10H 0.3-0.5%,
Gas silicon H18 0.25-0.4%, and
EG 0.8-1.2%；
The percentage is weight percentage；
It is described as master using the ratio mixing of weight ratio 1:1 after resin Composition and each self-heating of curing agent component are mixed
The epoxy sealing composition of body material.
A kind of epoxy sealing composition as material of main part, wherein the condition of cure of the composition is 170
DEG C, 140 DEG C are cooled to after 7-10min, 2h.
A kind of epoxy sealing composition as material of main part, wherein the condition of cure of the composition is 130-
140 DEG C, to 140 DEG C after 15min, 2h.
Embodiment 1
The resin Composition includes:
Epoxy resin EL-128E 38.1%,
Coupling agent XHL-187 1.5%,
Titanium dioxide 0.5%,
Silica GS-SI100 29.5%,
Aluminium oxide AM-210 30%, and
UV absorbent UV-1 0.4%;
The curing agent component includes:
Anhydride curing agent MHHPA 34.6%,
Accelerant B PP 0.462%；
Silica GS-SI100 30%,
Aluminium oxide AM-210 33.3%,
Antioxidant TP-10H 0.4%,
Gas silicon H18 0.3%, and
EG 0.938%。
Embodiment 2
The resin Composition includes:
Epoxy resin EL-128E 40%,
Coupling agent XHL-187 1.6%,
Titanium dioxide 0.9%,
Silica GS-SI100 28%,
Aluminium oxide AM-210 29%, and
UV absorbent UV-1 0.5%;
The curing agent component includes:
Anhydride curing agent MHHPA 35%,
Accelerant B PP 0.5%；
Silica GS-SI100 30.8%,
Aluminium oxide AM-210 32%,
Antioxidant TP-10H 0.4%,
Gas silicon H18 0.3%, and
EG 1%
Embodiment 3
The resin Composition includes:
Epoxy resin EL-128E 36.6%,
Coupling agent XHL-187 0.88%,
Titanium dioxide 0.4%,
Silica GS-SI100 30%,
Aluminium oxide AM-210 31.7%, and
UV absorbent UV-1 0.42%;
The curing agent component includes:
Anhydride curing agent MHHPA 34.4%,
Accelerant B PP 0.4%；
Silica GS-SI100 31%,
Aluminium oxide AM-210 32.9%,
Antioxidant TP-10H 0.3%,
Gas silicon H18 0.3%, and
EG 0.7%
It mixes, is respectively adopted solid according to the ratio of 1:1 after the resin Composition of each embodiment and curing agent component are mixed respectively
A:170 DEG C of change condition, is cooled to 140 DEG C after 7-10min, 2h and B130-140 DEG C of condition of cure, to 140 DEG C after 15min, 2h.
Test performance see the table below after solidification:
Table 1
It will be clear to one skilled in the art that the technical solution of present embodiment description is only of the invention for understanding, without
It is considered as the restriction to protection scope.Protection scope of the present invention should be defined by the following claims, any
The deformation replacement done on the basis of the technical solution that claims provide falls within what the claims in the present invention were protected
Range.
Claims (6)
1. a kind of epoxy sealing composition as material of main part, it includes resin Composition and curing agent component, which is characterized in that
The resin Composition includes:
Epoxy resin EL-128E 36-42%,
Coupling agent XHL-187 0.5-2%,
Titanium dioxide 0.1-1%,
Silica GS-SI100 25-30%,
Aluminium oxide AM-210 26-32%, and
UV absorbent UV-1 0.2-0.5%;
The curing agent component includes:
Anhydride curing agent MHHPA 34-36%,
Accelerant B PP 0.4-0.5%；
Silica GS-SI100 29-32%,
Aluminium oxide AM-210 30-35%,
Antioxidant TP-10H 0.3-0.5%,
Gas silicon H18 0.25-0.4%, and
EG 0.8-1.2%；
The percentage is weight percentage；
It is described as master using the ratio mixing of weight ratio 1:1 after resin Composition and each self-heating of curing agent component are mixed
The epoxy sealing composition of body material.
2. a kind of epoxy sealing composition as material of main part according to claim 1, which is characterized in that the resin
The specific gravity of component is 1.4-1.8,40 DEG C of 5000--8000cps of viscosity at 25 degree.
3. a kind of epoxy sealing composition as material of main part according to claim 1, which is characterized in that the solidification
The specific gravity of agent component is 1.4-1.8,40 DEG C of 2000--5000cps of viscosity at 25 degree.
4. a kind of epoxy sealing composition as material of main part according to claim 1, which is characterized in that the group
40 DEG C of 4000-7000cps of object viscosity are closed, the up time is in 40 DEG C of * 60min.
5. a kind of epoxy sealing composition as material of main part according to claim 1, which is characterized in that the combination
The condition of cure of object is 170 DEG C, 140 DEG C is cooled to after 7-10min, 2h.
6. a kind of epoxy sealing composition as material of main part according to claim 1, which is characterized in that the combination
The condition of cure of object is 130-140 DEG C, to 140 DEG C after 15min, 2h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710413562.2A CN108976707A (en) | 2017-06-05 | 2017-06-05 | A kind of epoxy sealing composition as material of main part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710413562.2A CN108976707A (en) | 2017-06-05 | 2017-06-05 | A kind of epoxy sealing composition as material of main part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108976707A true CN108976707A (en) | 2018-12-11 |
Family
ID=64501859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710413562.2A Pending CN108976707A (en) | 2017-06-05 | 2017-06-05 | A kind of epoxy sealing composition as material of main part |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108976707A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282105A (en) * | 2000-08-25 | 2001-01-31 | 中国科学院化学研究所 | Liquid epoxy composite for packaging semiconductor and its application |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
| CN104559892A (en) * | 2014-11-17 | 2015-04-29 | 南京艾布纳密封技术有限公司 | Novel epoxy resin sealant adhesive and preparation method thereof |
| CN106634749A (en) * | 2016-12-06 | 2017-05-10 | 上海拜高高分子材料有限公司 | Temperature-resistant epoxy resin potting adhesive with high thermal conductivity and flame retardance and preparation method thereof |
-
2017
- 2017-06-05 CN CN201710413562.2A patent/CN108976707A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282105A (en) * | 2000-08-25 | 2001-01-31 | 中国科学院化学研究所 | Liquid epoxy composite for packaging semiconductor and its application |
| CN102031081A (en) * | 2010-11-26 | 2011-04-27 | 烟台德邦电子材料有限公司 | Liquid epoxy encapsulating material and preparation method thereof |
| CN104152093A (en) * | 2014-08-16 | 2014-11-19 | 烟台德邦科技有限公司 | Flame-retardant heat-conducting double-component epoxy resin pouring sealant and preparation method thereof |
| CN104559892A (en) * | 2014-11-17 | 2015-04-29 | 南京艾布纳密封技术有限公司 | Novel epoxy resin sealant adhesive and preparation method thereof |
| CN106634749A (en) * | 2016-12-06 | 2017-05-10 | 上海拜高高分子材料有限公司 | Temperature-resistant epoxy resin potting adhesive with high thermal conductivity and flame retardance and preparation method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181211 |