CN108975718B - Glass etching device and glass etching method - Google Patents
Glass etching device and glass etching method Download PDFInfo
- Publication number
- CN108975718B CN108975718B CN201810263673.4A CN201810263673A CN108975718B CN 108975718 B CN108975718 B CN 108975718B CN 201810263673 A CN201810263673 A CN 201810263673A CN 108975718 B CN108975718 B CN 108975718B
- Authority
- CN
- China
- Prior art keywords
- heating unit
- present
- stage
- etching apparatus
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
- C03C15/02—Surface treatment of glass, not in the form of fibres or filaments, by etching for making a smooth surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/007—Other surface treatment of glass not in the form of fibres or filaments by thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0095—Solution impregnating; Solution doping; Molecular stuffing, e.g. of porous glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The glass etching apparatus according to an embodiment of the present invention includes a stage, a nozzle portion, and at least one first heating unit, wherein the stage provides a seating surface on which a glass substrate is disposed, the nozzle portion being opposite to the stage and spraying an etching solution in a direction toward the stage, wherein the glass substrate is interposed between the nozzle portion and the stage, and the at least one first heating unit heats a portion of the stage, wherein the stage includes a first portion and a second portion, wherein the first portion has a first average temperature, and the second portion is connected to the first portion and has a second average temperature lower than the first average temperature, wherein the first heating unit overlaps the first portion to heat the first portion.
Description
Technical Field
The present invention relates to a glass etching apparatus, and more particularly, to a glass etching apparatus that easily adjusts the thickness of a glass substrate according to an area.
Background
In order to reduce the weight of the glass substrate, or to change the designed shape of the glass substrate or to smooth the surface, an etching process may be performed on the thickness of the glass substrate.
For the etching process, the most common methods are: a Dipping (Dipping) method in which a glass substrate is immersed in a container filled with an etching solution to be etched, a spraying (Spray) method in which an etching solution is sprayed on the surface of a glass substrate, or the like.
Disclosure of Invention
The invention aims to provide a glass substrate etching device which can easily etch a glass substrate according to regions.
The glass etching apparatus according to an embodiment of the present invention includes a stage, a nozzle portion, and at least one first heating unit, wherein the stage provides a seating surface on which a glass substrate is disposed, the nozzle portion is opposite to the stage and sprays an etching solution in a direction toward the stage, wherein the glass substrate is interposed between the nozzle portion and the stage, and the at least one first heating unit heats a portion of the stage, wherein the stage includes a first portion and a second portion, wherein the first portion has a first average temperature, and the second portion is connected to the first portion and has a second average temperature lower than the first average temperature, wherein the first heating unit overlaps with the first portion to heat the first portion.
The first heating unit is disposed inside the first portion.
The second portion is provided in plurality and connected to both sides of the first portion in a direction, the first heating unit is provided in plurality and arranged in a direction, a virtual center line is defined on a plane, the center line is parallel to a direction perpendicular to the direction and passes through a center of the first portion, and a size of the first heating unit is reduced as a distance between the first heating unit and the center line increases.
The second portion is provided in plurality and connected to both sides of the first portion in a direction, the first heating unit is provided in plurality and arranged in a direction, a virtual center line is defined on a plane, the center line is parallel to a direction perpendicular to the direction and passes through a center of the first portion, and a distance between the first heating unit and the seating surface increases as a distance between the first heating unit and the center line increases.
The second portion is provided in plurality and connected to both sides of the first portion in a direction, the first heating units are provided in plurality and arranged in a direction, a virtual center line is defined on a plane, the center line is parallel to a direction parallel to the direction and passes through a center of the first portion, and a distance between the first heating units adjacent to each other increases as a distance between the first heating units and the center line increases.
The first portion includes a plurality of slots recessed toward an inner side from a seating surface facing the nozzle portion, and the first heating unit is inserted into the slots.
Each of the groove and the first heating unit extends in a direction.
A portion of an outer surface of the first heating unit is exposed through the groove, and the exposed portion of the outer surface of the first heating unit is disposed on the same plane as the seating surface.
The first heating unit is disposed on a rear surface of the stage opposite to the seating surface.
The glass etching apparatus according to an embodiment of the present invention further includes a second heating unit overlapping the second portion to heat the second portion.
The first heating unit is disposed inside the first portion, and the second heating unit is disposed on a rear surface of the stage.
The glass etching apparatus according to an embodiment of the present invention includes a stage and a plurality of spray heads, wherein the stage includes a first portion where a folded region of a glass substrate is disposed and a second portion where an unfolded region of the glass substrate is disposed, and the plurality of spray heads are opposite to the stage, wherein the glass substrate is interposed between the plurality of spray heads and the stage, the spray heads including at least one first spray head and a second spray head, wherein the at least one first spray head overlaps the first portion and sprays an etching solution of a first temperature to the first portion, and the second spray head overlaps the second portion and sprays an etching solution of a second temperature to the second portion, wherein the second temperature is lower than the first temperature.
The glass etching apparatus according to an embodiment of the present invention further includes a first heating unit disposed at the first shower head and heating the etching solution to a first temperature.
The glass etching apparatus according to an embodiment of the present invention further includes a second heating unit disposed at the second showerhead and heating the etching solution to a second temperature.
The glass etching apparatus according to an embodiment of the present invention further includes a storage tank connected to the spray heads and supplying the etching solution to each spray head.
The storage tank includes a first storage part connected with the first spray head and storing the etching solution at a first temperature, and at least one second storage part connected with the second spray head and storing the etching solution at a second temperature.
The first storage part includes a first heating unit that heats the etching solution to a first temperature, and the second storage part includes a second heating unit that heats the etching solution to a second temperature.
The glass etching method according to the embodiment of the invention comprises the following steps: providing a glass substrate defining a folding region and a non-folding region onto a stage; and providing an etching solution to the glass substrate to etch the glass substrate, wherein the glass substrate is etched at a faster rate in the folded region than in the unfolded region.
The step of etching the glass substrate comprises the steps of: heating a portion of the table overlapping the fold region to a first average temperature; and spraying an etching solution to the glass substrate through the nozzle portion.
The stage includes a first portion and a second portion, wherein the first portion corresponds to the folding area and is disposed with the first heating unit and has a first average temperature, and the second portion is disposed at both sides of the first portion and has a second average temperature lower than the first average temperature, and wherein the first portion is heated to the first average temperature by the first heating unit.
The step of etching the glass substrate comprises the steps of: providing an etching solution having a first temperature to a region of the stage corresponding to the folding region; and providing an etching solution having a second temperature lower than the first temperature to a region of the stage corresponding to the non-folded region.
The etching solution is supplied to the glass substrate through a plurality of nozzles, and a first heating unit is disposed at a nozzle corresponding to the above-described folding region among the nozzles.
The step of providing a glass substrate comprises the steps of: heating the folded region to a first average temperature; and disposing the heated glass substrate on a stage.
According to the embodiments of the present invention, the glass substrate can be easily etched according to the region.
Drawings
Fig. 1 is a perspective view of a glass etching apparatus according to an embodiment of the present invention.
Fig. 2 is a view showing a form of the glass etching apparatus shown in fig. 1 viewed from above.
Fig. 3 is a sequence diagram of a glass etching method according to an embodiment of the present invention.
Fig. 4 is a perspective view of the glass substrate on which etching is completed.
Fig. 5a to 5c are cross-sectional views of a first part according to another embodiment of the present invention.
Fig. 6 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 7 is a view showing a form of the glass etching apparatus shown in fig. 6 viewed from above.
Fig. 8 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 9 is a view showing a form of the glass etching apparatus shown in fig. 8 viewed from above.
Fig. 10 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 11 is a view showing a form of the glass etching apparatus shown in fig. 10 viewed from above.
Fig. 12 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 13 is a sequence diagram of a glass etching method according to another embodiment of the present invention.
Fig. 14 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 15 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 16 is a view showing a form of the glass etching apparatus shown in fig. 15 viewed from above.
Fig. 17 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
Fig. 18 is a view showing a form of the glass etching apparatus shown in fig. 17 viewed from above.
Detailed Description
The advantages and features of the present invention and methods of accomplishing the same will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed hereinafter, but may be implemented in various forms different from each other, and in addition, the embodiments are provided only for the purpose of making the disclosure of the present invention complete and informing a person of ordinary skill in the art to which the present invention pertains of the scope of the present invention, and the present invention is limited only by the scope of the claims. Throughout the specification, like reference numerals denote like constituent elements.
When a device or layer is referred to as being "on" or "over" another device or layer, it includes not only the case where the device or layer is directly on the other device or layer, but also the case where the other layer or layer is interposed therebetween. Conversely, a device that is said to be "directly on …" (directly on) or "directly over …" means that there are no other devices or layers interposed between. "and/or" includes each and all combinations of more than one of the referenced items.
As shown in the drawings, spatially relative terms such as "lower", "upper", and the like may be used to easily describe a correlation between one device or component and another device or component. Spatially relative terms are to be understood as encompassing the orientations shown in the figures, as well as orientations of the device that differ from one another in use or operation. Throughout the specification, like reference numerals denote like constituent elements.
Although the terms first, second, etc. may be used to describe various elements, components and/or sections, these elements, components and/or sections should not be limited by these terms. These terms are only used for the purpose of distinguishing one device, component, or section from other devices, components, or sections. Therefore, the first device, the first constituent element, or the first stage mentioned below may also be the second device, the second constituent element, or the second stage within the technical idea of the present invention.
The embodiments described in the present specification will be described with reference to plan views and cross-sectional views, which are idealized schematic diagrams of the present invention. Accordingly, the morphology of the exemplary figures may vary depending on manufacturing techniques and/or tolerances, etc. Therefore, the embodiments of the present invention are not limited to the specific forms shown, but include changes in form according to the manufacturing process. Accordingly, the regions illustrated in the drawings have a general property, and the form of the regions illustrated in the drawings is intended to exemplarily show a specific form of the region of the device, not to limit the scope of the invention.
Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
Fig. 1 is a perspective view of a glass etching apparatus according to an embodiment of the present invention, and fig. 2 is a view showing a form of the glass etching apparatus shown in fig. 1 viewed from above.
Referring to fig. 1 and 2, a glass etching apparatus 1000 according to an embodiment of the present invention includes a stage 100, a nozzle portion 200, a first heating unit HW1, and a storage tank 300.
The stage 100 has a plate shape. In the present embodiment, the stage 100 has a plate shape including a long side extending in the first direction DR1 and a short side extending in the second direction DR2 intersecting the first direction DR 1. In the present embodiment, the second direction DR2 is parallel to an upper direction and a lower direction to be described later.
The table 100 includes a first portion 110 and a second portion 120. In the present embodiment, the second portion 120 may be provided in plurality. The plurality of second parts 120 are connected to both sides of the first part 110 in the first direction DR 1. That is, the first portion 110 may be disposed between two second portions 120. The first and second parts 110 and 120 are combined with each other to have an integrated plate shape. In the present invention, the number and arrangement relationship of each of the first portion 110 and the second portion 120 are not limited to any one embodiment.
The outer surface of the table 100 includes a front surface FS and a rear surface RS. The front surface FS and the rear surface RS are opposite to each other in a third direction DR3 intersecting the first direction DR1 and the second direction DR 2. The third direction DR3 is defined as a thickness direction of the stage 100.
The glass substrate SUB may be disposed on the front surface FS of the stage 100. That is, the front surface FS of the stage 100 may be a seating surface.
The first and second areas AR1 and AR2 may be defined on the glass substrate SUB on a plane including the first and second directions DR1 and DR 2. In the above plane, the first area AR1 of the glass substrate SUB overlaps the first portion 110 of the stage 100, and the second area AR2 overlaps the second portion 120 of the stage 100.
The number and arrangement relationship of each of the first and second areas AR1 and AR2 of the glass substrate SUB may be changed corresponding to the number and arrangement relationship of each of the first and second portions 110 and 120 of the stage 100. Exemplarily, in the case where the first portion 110 of the stage 100 is provided in plurality, a plurality of first areas AR1 may be defined on the glass substrate SUB.
The nozzle portion 200 faces the table 100 in the third direction DR 3. The glass substrate SUB may be disposed between the nozzle portion 200 and the stage 100.
The spray heads 210, 220 include a first spray head 210 and a second spray head 220. In the present embodiment, the second showerhead 220 is provided in plurality. In plan, the first showerhead 210 overlaps the first portion 110 of the stage 100, and the second showerhead 220 overlaps the second portion 120 of the stage 100.
The invention is not limited by the number of spray heads 210, 220. Illustratively, the number of the first and second showerheads 210 and 220 may vary depending on the area of the first and second portions 110 and 120, respectively, the size of the showerheads 210, 220, or the spacing between the showerheads 210, 220 and the stage 100.
A first heating unit HW1 is arranged at the first portion 110 of the table 100. In the present embodiment, the first heating unit HW1 may be arranged inside the first portion 110. The first heating unit HW1 may be provided in plurality and have a bar shape extending in the second direction DR2, respectively. Exemplarily, the first heating unit HW1 may include a plurality of heating wires. However, the present invention is not limited to the shape of the first heating unit HW 1. In another embodiment of the present invention, each of the first heating units HW1 may be in the shape of a rod in a curved form, and in yet another embodiment, the first heating unit HW1 may have a button shape, a sheet shape, or the like.
In addition, in the present embodiment, the cross-section of the first heating unit HW1 may be a circular shape on a plane defined by the first direction DR1 and the third direction DR 3. However, the present invention is not limited to the sectional shape of the first heating unit HW 1.
The first heating unit HW1 heats the first portion 110 to a first average temperature ET 1. In the case where the second portion 120 has the second average temperature ET2, the first average temperature ET1 may be higher than the second average temperature ET 2. The heated first portion 110 may provide heat of the first average temperature ET1 to a first area AR1 of the glass substrate SUB disposed on the first portion 110.
The storage tank 300 stores the etching solution EL. The storage tank 300 is connected to the nozzle portion 200 to supply the etching solution EL to the nozzle portion 200. In the present embodiment, the etching solution EL may include hydrofluoric acid (HF).
Although the storage tank 300 is disposed opposite to the table 100 in the third direction DR3 with the nozzle portion 200 interposed between the storage tank 300 and the table 100 in fig. 1 and 2, the present invention does not particularly limit the position of the storage tank 300.
Although not shown, the storage tank 300 may include an etching solution mixing part (not shown), a concentration adjusting part (not shown), and a temperature control part (not shown).
The etching solution mixing part (not shown) includes an etching raw solution supply part (not shown) and a DI supply part (not shown). The etching solution mixing part (not shown) mixes the etching solution of the etching solution supplying part (not shown) with Deionized water (DI) of the DI supplying part (not shown) corresponding to a preset concentration.
A concentration measuring portion (not shown) measures the concentration of the etching solution. The concentration measuring part (not shown) may provide the measured concentration information to the etching solution mixing part (not shown).
A temperature control part (not shown) adjusts the temperature of the etching solution. In this embodiment, the temperature of the etching solution may be constant.
The glass etching apparatus 1000 according to the embodiment of the present invention may further include a connection part CNP. The connection portion CNP extends in the third direction DR3 to connect the storage tank 300 and the nozzle portion 200. In the present embodiment, the connection portions CNP are provided in plurality and connected in one-to-one correspondence with the heads 210 and 220.
In the present embodiment, the connection portion CNP may be a pipe or a hose. Furthermore, according to another embodiment of the present invention, the connection portion CNP may be omitted. Specifically, the nozzle portion 200 may extend from a surface of the storage tank 300. That is, the nozzle portion 200 may have a shape integrated with the storage tank 300.
Although not shown, the glass etching apparatus 1000 can further include a washing section (not shown) and a drying section (not shown). The washing section (not shown) removes the etching stock solution and impurities remaining on the glass substrate SUB having completed etching. The washing part (not shown) may be, for example, a distilled water washer or an ultrasonic washer. The drying section (not shown) dries the glass substrate SUB subjected to the washing.
Fig. 3 is a sequence diagram of a glass etching method according to an embodiment of the present invention.
Referring to fig. 3 in conjunction with fig. 1 and 2, the glass substrate SUB is disposed on the stage 100 (S1). The first area AR1 of the positioned glass substrate SUB overlaps the first portion 110 of the stage 100 and the second area AR2 overlaps the second portion 120 of the stage 100.
The first heating unit HW1 is driven to heat the first portion 110 to the first average temperature ET1 (S2). The heated first portion 110 transfers heat of the first average temperature ET1 to the first area AR1 of the glass substrate SUB. The first average temperature ET1 is higher than the second average temperature ET2 possessed by the second area AR 2.
Although not shown, according to another embodiment of the present invention, the glass substrate SUB may be disposed on the stage 100 (S1) after the first portion 110 is heated (S2). Further, according to still another embodiment of the present invention, the glass substrate SUB may be disposed on the stage 100 after the first area AR1 is directly heated to the first average temperature ET1 by other heating means different from the first heating unit HW 1.
Then, the etching solution EL is sprayed onto the glass substrate SUB by the nozzle section 200 (S3). As the etching solution EL is sprayed onto the glass substrate SUB through the nozzle section 200, the glass substrate SUB is etched.
As described above, according to the present embodiment, since the temperature of the first region AR1 of the glass substrate SUB is higher than the temperature of the second region AR2, the first region AR1 may be etched at a faster rate than the second region AR 2.
Fig. 4 is a perspective view of the glass substrate on which etching is completed.
Referring to fig. 4, the thickness of the first area AR1 of the glass substrate SUB where the etching is completed may be greater than the thickness of the second area AR 2. Specifically, the etched surface of the glass substrate SUB has a curved surface shape recessed inward in the first region AR 1. In the present embodiment, the thickness d1 of the central portion of the first region AR1 is greater than the thickness d2 of the second region AR2 in the first direction DR 1. Therefore, the glass substrate SUB subjected to etching can be easily folded centering on the first area AR 1.
As a result, the glass etching apparatus 1000 according to the present embodiment can etch the glass substrate SUB so that the thickness thereof varies depending on the region. That is, the glass etching apparatus 1000 according to the present embodiment can easily etch the glass substrate SUB.
Fig. 5a to 5c are cross-sectional views of a first part according to another embodiment of the present invention.
According to another embodiment of the present invention, the first heating units HW1 disposed inside the first parts 110a, 110b, 110c may be arranged in various forms. Specifically, a virtual line parallel to the third direction DR3 and passing through the centers of the first portions 110a, 110b, 110c is defined as a center line CL. The first heating units HW1 may be symmetrically arranged with reference to the center line CL.
Exemplarily, as shown in fig. 5a, as each first heating unit HW1 is arranged within the first section 110a gradually further away from the centerline CL, the distance between the first heating unit HW1 and the placement surface FS may become farther. Accordingly, the glass substrates SUB disposed on the disposition face FS may have temperatures different from each other within the first area AR 1. That is, the first area AR1 of the glass substrate SUB is heated to the highest temperature at the center line CL, and the farther away from the center line CL, the lower the heating temperature. That is, the first region AR1 of the glass substrate SUB is heated to a temperature higher than the first average temperature ET1 in the vicinity of the center line CL, and both ends of the first region AR1 in the first direction DR1 are heated to a temperature lower than the first average temperature ET 1. The first area AR1 of the glass substrate SUB has on average a first average temperature ET 1.
As a further embodiment, as shown in fig. 5b, the size of each first heating unit HW1 may decrease as each first heating unit HW1 is disposed progressively further away from the centerline CL within the first portion 110 b. Accordingly, the glass substrates SUB disposed on the disposition face FS may have temperatures different from each other within the first area AR 1. That is, the first area AR1 of the glass substrate SUB is heated to the highest temperature at the center line CL, and the farther away from the center line CL, the lower the heating temperature. That is, the first region AR1 of the glass substrate SUB is heated to a temperature higher than the first average temperature ET1 in the vicinity of the center line CL, and both ends of the first region AR1 in the first direction DR1 are heated to a temperature lower than the first average temperature ET 1. The first area AR1 of the glass substrate SUB has on average a first average temperature ET 1.
Furthermore, as shown in fig. 5c, as each first heating unit HW1 is arranged gradually away from the centerline CL within the first portion 110c, the distance between the first heating units HW1 adjacent to each other may increase. That is, the density of the first heating unit HW1 may decrease the farther from the center line CL. Accordingly, the glass substrates SUB disposed on the disposition face FS may have temperatures different from each other within the first area AR 1. That is, the first area AR1 of the glass substrate SUB is heated to the highest temperature at the center line CL, and the farther away from the center line CL, the lower the heating temperature. That is, the first region AR1 of the glass substrate SUB is heated to a temperature higher than the first average temperature ET1 in the vicinity of the center line CL, and both ends of the first region AR1 in the first direction DR1 are heated to a temperature lower than the first average temperature ET 1. The first area AR1 of the glass substrate SUB has on average a first average temperature ET 1.
Fig. 6 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 7 is a view showing a form of the glass etching apparatus shown in fig. 6 viewed from above.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 6 and 7, a first heating unit HW1-1 according to another embodiment of the present invention is disposed on the rear surface RS of the stage 100-1. Accordingly, the first heating unit HW1-1 may be exposed to the outside. Although not shown, the glass etching apparatus 1000-1 may further include a heating regulation part (not shown) that regulates a heating temperature of the first heating unit HW 1-1. A heating regulation (not shown) may be electrically connected to the first heating unit HW 1-1.
Fig. 8 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 9 is a view showing a form of the glass etching apparatus shown in fig. 8 viewed from above.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 8 and 9, the glass etching apparatus 1000-2 according to another embodiment of the present invention further includes a second heating unit HW 2-2.
A second heating unit HW2-2 is arranged at the second portion 120 of the table 100. In this embodiment, the second heating unit HW2-2 may be arranged inside the second portion 120. The second heating unit HW2-2 may be provided in plurality and have a bar shape extending in the second direction DR2, respectively.
The first heating unit HW1-2 heats the first portion 110 to a first average temperature ET1, and the second heating unit HW2-2 heats the second portion 120 to a second average temperature ET 2. The second average temperature ET2 is lower than the first average temperature ET 1.
Fig. 10 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 11 is a view showing a form of the glass etching apparatus shown in fig. 10 viewed from above.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 10 and 11, the glass etching apparatus 1000-3 according to another embodiment of the present invention may further include a second heating unit HW 2-3.
In the present embodiment, the second heating unit HW2-3 may be provided in plurality. A second heating unit HW2-3 is arranged at the second portion 120 of the table 100. In the present embodiment, the first heating unit HW1-3 may be disposed inside the first portion 110 and the second heating unit HW2-3 may be disposed on the rear surface RS of the table 100. The second heating unit HW2-3 may be exposed to the outside. According to the present embodiment, the distance between the first heating unit HW1-3 and the seating surface FS may be smaller than the distance between the second heating unit HW2-3 and the seating surface FS. Thus, the first portion 110 may reach the predetermined heating temperature before the second portion 120. That is, the etching rate of the first area AR1 may be faster than that of the second area AR 2. Therefore, according to this embodiment mode, the etching process of the glass substrate SUB according to the region can be performed more easily.
Fig. 12 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 13 is a sequence diagram of a glass etching method according to another embodiment of the present invention.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 12 and 13, a first heating unit HW1-4 of a glass etching apparatus 1000-4 according to another embodiment of the present invention may be disposed at the first shower head 210. The first heating unit HW1-4 may have a bar shape extending in the second direction DR 2. In the present embodiment, the first heating unit HW1-4 may be a heating wire. However, the present invention is not limited thereto. Exemplarily, the first heating unit HW1-4 may have a curved shape. Further, the first heating unit HW1-4 may have a heating button or sheet shape.
Although the first heating unit HW1-4 is disposed at the outer surface of the first head 210 opposite to the spray nozzle ENL in the third direction DR3 in fig. 12, the present invention is not limited thereto. According to yet another embodiment of the present invention, the first heating unit HW1-4 may be arranged in a pattern surrounding the outer surface of the first nozzle 210. Furthermore, according to yet another embodiment of the present invention, the first heating unit HW1-4 may be disposed inside the first showerhead 210.
The first heating unit HW1-4 heats the first showerhead 210 to a first temperature T1. In the case where the second showerhead 220 has the second temperature T2, the first temperature T1 may be higher than the second temperature T2. The heated first showerhead 210 may provide heat of a first temperature T1 to the first etching solution inside the first showerhead 210.
While the substrate is seated on the stage 100 (S1 '), the first etching solution inside the first showerhead 210 heated to the first temperature T1 is sprayed from the first showerhead 210 toward the glass substrate SUB via the spray nozzles ENL (S2').
The second etching solution inside each of the second showerheads 220 has the second temperature T2 and is sprayed toward the glass substrate SUB via the spray nozzle ENL (S3').
The first etching solution in the first showerhead 210 and the second etching solution in the second showerhead 220 may be simultaneously sprayed. However, the present invention is not limited to the spray sequence of the spray heads 210, 220.
The first area AR1 of the glass substrate SUB is etched by the first etching solution sprayed from the first spray head 210, and the second area AR2 is etched by the second etching solution sprayed from the second spray head 220.
Since the first temperature T1 of the first etching solution is higher than the second temperature T2 of the second etching solution, the etching rate of the first area AR1 of the glass substrate SUB may be faster than that of the second area AR 2.
Fig. 14 is a perspective view of a glass etching apparatus according to another embodiment of the present invention.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 14, the glass etching apparatus 1000-5 according to another embodiment of the present invention further includes a second heating unit HW 2-5.
The second heating unit HW2-5 may be provided in plurality and disposed at the second spray head 220. Since the shape of the second heating unit HW2-5 is the same as that of the aforementioned first heating unit HW1-4, a description thereof will be omitted.
The second heating unit HW2-5 heats the second showerhead 220 to a second temperature T2. The heated second showerhead 220 may provide heat of a second temperature T2 to the etching solution inside the second showerhead 220.
Fig. 15 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 16 is a view showing a form of the glass etching apparatus shown in fig. 15 viewed from above.
For convenience of description, a difference from the embodiment of the present invention is mainly described, and a portion which is omitted is referred to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 15 and 16, a storage tank 300-6 of a glass etching apparatus 1000-6 according to another embodiment of the present invention includes a first storage part 310 and a second storage part 320.
The first storage part 310 stores the first etching solution EL 1. The first storage part 310 is connected to the first spray head 210 to supply the first etching solution EL1 to the first spray head 210.
The second storage part 320 stores the second etching solution EL 2. The second storage part 320 is connected to the second showerhead 220 to supply the second etching solution EL2 to the second showerhead 220.
In the present embodiment, the second storage part 320 is provided in plurality. The second storage portion 320 faces the first storage portion 310 in the first direction DR 1. However, the present invention is not limited to the number of the second storage parts 320. According to another embodiment of the present invention, only one second storage part 320 may be provided.
The first heating unit HW1-6 is disposed at the first storage part 310. The first heating unit HW1-6 heats the first etching solution EL1 stored in the first storage part 310 to a first temperature T1.
The second heating unit HW2-6 is arranged in the second storage portion 320. The second heating unit HW2-6 heats the second etching solution EL2 stored in the second storage part 320 to a second temperature T2.
In the present embodiment, the first and second heating units HW1-6 and HW2-6 may have a block shape and be disposed below the first and second storages 310 and 320. However, the present invention is not particularly limited by the shape and arrangement relationship of the first and second heating units HW1-6 and HW 2-6.
Fig. 17 is a perspective view of a glass etching apparatus according to another embodiment of the present invention, and fig. 18 is a view showing a form of the glass etching apparatus shown in fig. 17 viewed from above.
For convenience of description, a description will be given mainly of differences from the embodiment of the present invention, and the omitted portions refer to the embodiment of the present invention. In addition, the same reference numerals are given to the constituent elements described above, and repeated explanation of the above constituent elements is omitted.
Referring to fig. 17 and 18, the first portion 110 of the glass etching apparatus 1000-7 according to another embodiment of the present invention may include a plurality of grooves G. Each groove G may have a form recessed inward in the third direction DR3 from the seating surface FS of the first portion 110.
In the present embodiment, the inner side surface of the groove G may include a curved surface. Illustratively, the sectional shape of each groove G viewed on a plane including the first direction DR1 and the third direction DR3 may be a semicircular shape. However, the present invention is not limited to the sectional shape of the groove G. Illustratively, according to another embodiment of the present invention, the groove G may have a cross-section of a quadrangle or other polygonal shape.
According to the present embodiment, the first heating units HW1-7 are inserted into the grooves G in one-to-one correspondence. Each of the first heating units HW1-7 may have a shape corresponding to the groove G. Illustratively, each of the first heating units HW1-7 may have a semicircular shape in section on a plane including the first direction DR1 and the third direction DR 3.
The first heating unit HW1-7 and the groove G extend in the second direction DR 2.
According to the present embodiment, a portion of the outer surface of the first heating unit HW1-7 may be exposed to the outside through the groove G. The exposed outer surface of the above-described first heating unit HW1-7 may be disposed on the same plane as the front surface FS of the stage 100.
Although the description has been given above with reference to the accompanying drawings, it will be understood by those skilled in the art that various modifications and changes can be made to the present invention without departing from the scope and spirit of the invention as set forth in the appended claims. Further, the embodiments disclosed in the present invention are not intended to limit the technical ideas of the present invention, but should be construed that all technical ideas falling within the scope of the appended claims and equivalents thereof are included in the scope of the claims of the present invention.
Description of the reference numerals
1000: glass etching device SUB: glass substrate
100: the stage 110: first part
120: second portion 200: nozzle part
210: first nozzle 220: second nozzle
ENL: the spray nozzle 300: storage tank
310: first storage unit 320: a second storage part
CNP: connection HW 1: first heating unit
EL: etching solution CL: center line
Claims (10)
1. A glass etching apparatus, comprising:
a stage providing a seating surface on which a glass substrate is disposed;
a nozzle portion that is opposed to the stage and that ejects an etching solution in a direction toward the stage, wherein the glass substrate is interposed between the nozzle portion and the stage; and
at least one first heating unit that heats a portion of the stage,
wherein the table comprises:
a first portion having a first average temperature; and
a second portion connected to the first portion and having a second average temperature lower than the first average temperature,
wherein the first heating unit overlaps the first portion to heat the first portion.
2. The glass etching apparatus of claim 1, wherein the first heating unit is disposed inside the first portion.
3. The glass etching apparatus of claim 2,
the second portion is provided in plurality and connected to both sides of the first portion in a direction,
the first heating unit is provided in plurality and arranged in the direction,
a virtual center line is defined on a plane, the center line being parallel to a direction perpendicular to the one direction and passing through a center of the first portion, an
The first heating unit decreases in size as a distance between the first heating unit and the centerline increases.
4. The glass etching apparatus of claim 2,
the second portion is provided in plurality and connected to both sides of the first portion in a direction,
the first heating unit is provided in plurality and arranged in the direction,
a virtual center line is defined on a plane, the center line being parallel to a direction perpendicular to the one direction and passing through a center of the first portion, an
The distance between the first heating unit and the seating surface increases as the distance between the first heating unit and the center line increases.
5. The glass etching apparatus of claim 2,
the second portion is provided in plurality and connected to both sides of the first portion in one direction,
the first heating unit is provided in plurality and arranged in the direction,
a virtual center line is defined on a plane, the center line being parallel to a direction perpendicular to the one direction and passing through a center of the first portion, an
As the distance between the first heating unit and the center line increases, the distance between the first heating units adjacent to each other increases.
6. The glass etching apparatus according to claim 1,
the first portion includes a plurality of grooves depressed toward an inner side from the seating surface facing the nozzle portion, and
the first heating unit is inserted into the groove.
7. The glass etching apparatus of claim 6, wherein each of the groove and the first heating unit extends in a direction.
8. The glass etching apparatus of claim 7, wherein a portion of the outer surface of the first heating unit is exposed through the slot, and the exposed portion of the outer surface of the first heating unit is disposed on the same plane as the seating surface.
9. The glass etching apparatus of claim 1, wherein the first heating unit is disposed on a rear surface of the stage opposite the seating surface.
10. The glass etching apparatus of claim 1, further comprising:
a second heating unit overlapping the second portion to heat the second portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0068607 | 2017-06-01 | ||
| KR1020170068607A KR102286060B1 (en) | 2017-06-01 | 2017-06-01 | Etching apparatus and etching method for glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108975718A CN108975718A (en) | 2018-12-11 |
| CN108975718B true CN108975718B (en) | 2022-07-05 |
Family
ID=64541776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810263673.4A Active CN108975718B (en) | 2017-06-01 | 2018-03-28 | Glass etching device and glass etching method |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR102286060B1 (en) |
| CN (1) | CN108975718B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102441930B1 (en) | 2017-12-04 | 2022-09-14 | 삼성디스플레이 주식회사 | Flexible display device and method for manufacturing the flexilbe display device |
| CN112573833B (en) * | 2019-09-29 | 2022-03-18 | 比亚迪股份有限公司 | Method for treating surface of section bar |
| KR20210052654A (en) | 2019-10-29 | 2021-05-11 | 삼성디스플레이 주식회사 | Window and display device including the same |
| KR20210150651A (en) * | 2020-06-03 | 2021-12-13 | 삼성디스플레이 주식회사 | Method of fabricating cover window, cover window and display device comprising the same |
| KR20220021939A (en) * | 2020-08-13 | 2022-02-23 | 삼성디스플레이 주식회사 | Manufacturing method of a cover window for a flexible display device and manufacturing method of the flexible display device |
| KR20220117077A (en) * | 2021-02-16 | 2022-08-23 | 삼성전자주식회사 | Electronic device including glass with differential edge shape |
| KR20220136540A (en) | 2021-03-30 | 2022-10-11 | 삼성디스플레이 주식회사 | Display device, method of manufacturing window, and method of manufacturing display device |
| KR102566793B1 (en) | 2021-06-08 | 2023-08-14 | 하나에이엠티 주식회사 | Etching device for glass substrates |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4505781A (en) * | 1981-08-20 | 1985-03-19 | Glaverbel | Method of reducing light reflection from glass surfaces |
| JP2013157418A (en) * | 2012-01-30 | 2013-08-15 | Sumitomo Precision Prod Co Ltd | Etching device |
| JP2016513887A (en) * | 2013-03-15 | 2016-05-16 | ティーイーエル エフエスアイ，インコーポレイティド | Processing system and method for providing a heated etchant |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08153700A (en) * | 1994-11-25 | 1996-06-11 | Semiconductor Energy Lab Co Ltd | Anisotropic etching of electrically conductive coating |
| KR200285964Y1 (en) * | 2002-04-04 | 2002-08-22 | 아남반도체 주식회사 | Semiconductor wafer etcher |
| JP2008013389A (en) * | 2006-07-04 | 2008-01-24 | Nec Corp | Etching device and method for manufacturing thin type glass substrate |
| JP5238782B2 (en) * | 2010-09-22 | 2013-07-17 | 株式会社東芝 | Substrate processing apparatus and substrate processing method |
| KR101373306B1 (en) * | 2013-12-20 | 2014-03-11 | 김문환 | Apparatus for etching glass substrate and method of etching glass substrate using the same |
| KR102410492B1 (en) * | 2015-07-23 | 2022-06-20 | 삼성디스플레이 주식회사 | Glass molding apparatus |
-
2017
- 2017-06-01 KR KR1020170068607A patent/KR102286060B1/en active IP Right Grant
-
2018
- 2018-03-28 CN CN201810263673.4A patent/CN108975718B/en active Active
-
2021
- 2021-07-29 KR KR1020210100212A patent/KR102443100B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4505781A (en) * | 1981-08-20 | 1985-03-19 | Glaverbel | Method of reducing light reflection from glass surfaces |
| JP2013157418A (en) * | 2012-01-30 | 2013-08-15 | Sumitomo Precision Prod Co Ltd | Etching device |
| JP2016513887A (en) * | 2013-03-15 | 2016-05-16 | ティーイーエル エフエスアイ，インコーポレイティド | Processing system and method for providing a heated etchant |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180132201A (en) | 2018-12-12 |
| KR102286060B1 (en) | 2021-08-06 |
| CN108975718A (en) | 2018-12-11 |
| KR20210097668A (en) | 2021-08-09 |
| KR102443100B1 (en) | 2022-09-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108975718B (en) | Glass etching device and glass etching method | |
| US9925545B2 (en) | Immersive showerhead | |
| US6435425B1 (en) | Module and nozzle for dispensing controlled patterns of liquid material | |
| TW201713413A (en) | Anti-transient showerhead | |
| KR101217371B1 (en) | Substrate processing apparatus | |
| US20110168024A1 (en) | Electret filter element and method for the production thereof | |
| KR20160109108A (en) | Purge gas injection plate and apparatus for removing fume with same | |
| KR102180040B1 (en) | Apparatus for drying substrate | |
| JP2004261794A (en) | Module, nozzle, and method for discharging controlled patterns of liquid material | |
| JP2004261794A5 (en) | ||
| TW201401424A (en) | Distributed electro-static chuck cooling | |
| CN110621411A (en) | Nozzle device and method for manufacturing the same | |
| US7478769B1 (en) | Method and apparatus for cooling electronic components | |
| JP7191855B2 (en) | Nozzle and applicator system with nozzle | |
| CN114361079A (en) | Scrubbing device, wafer, three-dimensional memory and storage system | |
| CN109877732A (en) | Holding device for holding circuit boards and the like | |
| US20150202555A1 (en) | Method and apparatus for conditioning process liquids | |
| TWI549779B (en) | A slurry transfer device for chemical mechanical grinding | |
| US20180185857A1 (en) | Spray bar design for uniform liquid flow distribution on a substrate | |
| KR101652481B1 (en) | chemical coating apparatus using double slit nozzle | |
| JP3278664B2 (en) | Coating nozzle device in curtain fiber spray coating device | |
| TWI568500B (en) | Apparatuses for jetting fluid | |
| KR101739807B1 (en) | Fluid heating device | |
| JP2003164786A (en) | Method for adhesive application | |
| KR101915287B1 (en) | Apparatus for jetting mixed fluid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |