CN108966669A - Sensor adhering state decision-making system, sensor adhering state decision maker and sensor adhering state determination method - Google Patents
Sensor adhering state decision-making system, sensor adhering state decision maker and sensor adhering state determination method Download PDFInfo
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Abstract
The sensor adhering state decision-making system of embodiment has multiple sensors, calculation part and determination unit.Multiple sensors detect elastic wave.Calculation part calculates the crest frequency of the elastic wave according to the elastic wave detected by the multiple sensor.Determination unit determines the adhering state of the sensor by comparing the crest frequency and as the information of determinating reference.
Description
Technical field
Embodiments of the present invention be related to sensor adhering state decision-making system, sensor adhering state decision maker and
Sensor adhering state determination method.
The application based on March 17th, 2017 Japanese publication No. 2017-053719 request priority of Patent, herein
Quote its content.
Background technique
AE (Acoustic Emission, sound emission) is generated due to the development of the cracking inside structure, friction etc..
AE is the development of the fatigue cracking with material and the elastic wave that generates.It is detected using the sensor for being set to structure surface
AE analyzes obtained signal, thus allows for the deterioration evaluation inside structure.In general, sensor utilizes bonding
Agent etc. is adhered to the structure surface of the object as deterioration evaluation.However, it is possible to sometimes due to bonding process it is bad, through time-varying
Change etc. and sensor bonding become insufficient state.To be bonded insufficient state, it may occasionally result in
The accuracy decline of the deterioration evaluation of structure, mistaken diagnosis.In addition, being bonded the sensor of insufficient state may have from structure table
Emaciated face is fallen and the danger that falls, and countermeasure is also required for from the point of view of secure context.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2005-83752 bulletin
Summary of the invention
The technical problem to be solved in the present invention is that providing the adhering state that can determine the sensor Nian Jie with structure
Sensor adhering state decision-making system, sensor adhering state decision maker and sensor adhering state determination method.
The sensor adhering state decision-making system of embodiment has multiple sensors, calculation part and determination unit.It is multiple
Sensor detects elastic wave.Calculation part calculates the elastic wave according to the elastic wave detected by the multiple sensor
Crest frequency.Determination unit determines the viscous of the sensor by comparing the crest frequency and as the information of determinating reference
Connect state.
Detailed description of the invention
Fig. 1 is the figure for showing the system structure of the sensor adhering state decision-making system in the 1st embodiment.
Fig. 2 is the figure for showing an example by the data being measured from.
Fig. 3 is the timing diagram for showing the process of processing of the sensor adhering state decision-making system in the 1st embodiment.
Fig. 4 is the figure for showing the system structure of the sensor adhering state decision-making system in the 2nd embodiment.
Fig. 5 is the figure for showing an example by the data being measured from.
Fig. 6 A is the figure for showing the result for having carried out wavelet transformation.
Fig. 6 B is the figure for showing the result for having carried out wavelet transformation.
Fig. 7 is the flow chart for showing the process of processing of the signal processing part in the 2nd embodiment.
Specific embodiment
Hereinafter, illustrating that the sensor adhering state decision-making system of embodiment, sensor adhering state determine referring to attached drawing
Device and sensor adhering state determination method.
(the 1st embodiment)
Fig. 1 is the figure for showing the system structure of the sensor adhering state decision-making system 100 in the 1st embodiment.Sensing
Device adhering state decision-making system 100 is used to be adhered to the judgement of the adhering state of the sensor of structure.In the present embodiment,
As an example of structure, it is illustrated by taking bridge as an example, but structure is not necessarily limited to bridge.For example, structure is only
The structure of elastic wave is generated for the adjoint generation being cracked or development or the impact of outside (such as rain, rain making etc.)
The divine force that created the universe can then be arbitrary structure.In addition, bridge is not limited to be set up in the structure on river, trench etc., further include
Various structures (such as overpass of super expressway) of setting more against the top than ground etc..
Sensor adhering state decision-making system 100 has multiple AE sensor 10-1~10-n (integer that n is 2 or more)
And signal processing part 20.AE sensor 10-1~10-n and signal processing part 20 pass through wired or wirelessly can be communicatedly
Connection.In addition, in the following description, being recorded as AE sensor in the case where not distinguishing about AE sensor 10-1~10-n
10。
AE sensor 10 is adhered to the structure surface of the object as deterioration evaluation by bonding agent etc..For example, AE is passed
Sensor 10 is adhered to the mattess 30 of bridge.AE sensor 10 has the oscillation for the elastic wave for causing to have specific frequency
The detection function for the elastic wave that function and detection are generated from structure.That is, AE sensor 10 has oscillation as measurement device
Portion and test section.Oscillation functions are bonding with structure surface in AE sensor 10 and being vibrated with specific frequency
Portion generates the function of the pulse of elastic wave.Since AE sensor 10 is vibrated and the elastic wave that generates is in structure using oscillation functions
It is propagated in the divine force that created the universe.
In addition, the oscillation based on AE sensor 10 both can progress at the time of presetting, can also be according to setting in advance
The fixed period carries out, and can also carry out in the timing indicated by user.AE sensor 10 have piezoelectric element, detection from
The elastic wave that structure generates, the elastic wave that will test are transformed to voltage signal (AE source signal).AE sensor 10 is to the source AE
Signal implements the processing such as amplification, frequency limit, is output to signal processing part 20.In addition it is also possible to AE sensor 10 is not used, and
Use acceleration transducer.In this case, acceleration transducer is similarly handled by carrying out with AE sensor 10, will be handled
Signal afterwards is output to signal processing part 20.
Signal processing part 20 will implement the AE source signal of the processing based on AE sensor 10 as input.Signal processing part
20 determine the adhering state of the AE sensor 10 of oscillation source according to the frequency obtained from the AE source signal inputted.For example, letter
Number processing unit 20 determine be AE sensor 10 the good state of bonding or AE sensor 10 poor attachment state.Signal
Processing unit 20 is functioned as sensor adhering state decision maker.In addition, what the holding of signal processing part 20 was connect with itself
The identification information of all AE sensors 10.
Next, illustrating the functional structure of signal processing part 20.
Signal processing part 20 has CPU (Central Processing Unit, the central processing list connected by bus
Member), memory, auxilary unit etc., execute adhering state decision procedure.Pass through the execution of adhering state decision procedure, letter
Number processing unit 20 as have calculation part 201, reference information storage unit 202, determination unit 203 device function.In addition, letter
ASIC (Application Specific also can be used in all or part of each function of number processing unit 20
Integrated Circuit, specific integrated circuit), PLD (Programmable Logic Device, programmable logic device
Part), the hardware such as FPGA (Field Programmable Gate Array, field programmable gate array) and realize.In addition, viscous
The state decision procedure of connecing also can recorde the recording medium that can be read in computer.The recording medium that computer can be read is
Refer to the storage devices such as the removable medium such as floppy disk, magneto-optic disk, ROM, CD-ROM, the hard disk for being built in computer system.Separately
Outside, adhering state decision procedure can also be received and dispatched via electrical communication lines.
Calculation part 201 calculates crest frequency according to the AE source signal inputted.
Reference information storage unit 202 is constituted using storage devices such as magnetic hard disk device, semiconductor storages.Base
The information of 202 Memory Reference range of calibration information storage unit.Reference range indicates it can be determined that being the peak for being bonded good state
It is worth the range of frequency.Reference range can also suitably be set.Reference information storage unit 202 can also be for each of sensor
The information of type and Memory Reference range.
Determination unit 203 is sentenced according to crest frequency and reference range by the calculated each AE sensor 10 of calculation part 201
Determine the adhering state of the AE sensor 10 of oscillation source.
Fig. 2 is the figure for showing an example by the data being measured from.Data shown in Fig. 2 are by by 15
AE sensor 10 is adhered to structure surface and each AE sensor 10 successively vibrated obtained from whole AE sensors 10
Related data.Horizontal axis indicates that the AE sensor 10 of each oscillation source, the longitudinal axis indicate crest frequency.In fig. 2 it is shown that each AE is passed
Sensor 10 is successively vibrated at certain intervals, to discharge the example of the pulse of elastic wave.Near crest frequency 140kHz
Shown in point range indicate the pulse of elastic wave generated by the oscillation of each AE sensor 10.Crest frequency 50kHz~
Point range shown in 120kHz indicates the peak value obtained from the AE source signal based on the elastic wave detected by other AE sensors 10
Frequency.In addition, R indicates reference range in Fig. 2.AE source signal has the substantially crest frequency of 60kHz, but due to AE sensor
The influence of 10 positional relationship etc. and have deviation.
In AE sensor 10 shown in Fig. 2, the AE sensor 10 indicated with " 5 " and the AE sensor 10 indicated with " 6 "
Although the state in the detection for being able to carry out signal, the state insufficient in bonding.As shown in Figure 2, it is known that pass through
The oscillation of the AE sensor 10 of state in poor attachment and the elastic wave that generates based on being detected by other AE sensors 10
The crest frequency of the elastic wave arrived is on the lower than reference range R.In this way using will be generated by the oscillation of AE sensor 10
Crest frequency when elastic wave is detected by other AE sensors 10, thus, it is possible to determine the shape of the AE sensor 10 of oscillation source
State.In the following description, using the data of distribution shown in Fig. 2 as frequency distribution.
Fig. 3 is the timing for showing the process of processing of the sensor adhering state decision-making system 100 in the 1st embodiment
Figure.In Fig. 3, it is illustrated in case where AE sensor 10 is 4.In addition, 4 AE sensors 10 are divided in Fig. 4
The 1st sensor, the 2nd sensor, the 3rd sensor and the 4th sensor is not set as to be illustrated.
1st sensor is vibrated (step S101) with specific frequency.Transmitting is vibrated by the oscillation of the 1st sensor
To structure, the pulse of elastic wave is generated from structure due to vibration.The pulse (elastic wave) generated from structure is constructing
It propagates in object, is detected by the 2nd sensor~the 4th sensor.The elastic wave that 2nd sensor will test is transformed to AE source signal,
Implement processing and is output to signal processing part 20 (step S102).The elastic wave that 3rd sensor will test is transformed to the source AE letter
Number, implement processing and is output to signal processing part 20 (step S103).The elastic wave that 4th sensor will test is transformed to the source AE
Signal implements processing and is output to signal processing part 20 (step S104).
Calculation part 201 inputs the AE source signal exported from each sensor.Calculation part 201 is according to the AE source signal inputted point
It Ji Suan not crest frequency f2, f3 and f4 (step S105).Crest frequency f2 indicates the AE source signal exported from the 2nd sensor
Crest frequency.Crest frequency f3 indicates the crest frequency of the AE source signal exported from the 3rd sensor.Crest frequency f4 is indicated from the
The crest frequency of the AE source signal of 4 sensors output.Calculated crest frequency f2, f3 and f4 are output to by calculation part 201
Determination unit 203.Determination unit 203 generates frequency distribution (step according to crest frequency f2, f3 and the f4 exported from calculation part 201
Rapid S106).Namely it is decided that portion 203 generates the frequency distribution that horizontal axis is set as the 1st sensor and the longitudinal axis is set as to crest frequency.?
In this case, determination unit 203 is drawn on and the comparable crest frequency of crest frequency f2, f3 and f4 from the output of calculation part 201
Position.In addition, determination unit 203 carries out repeatedly same in the case where having carried out the release of multiple pulses from the 1st sensor
Processing.Through this process, determination unit 203 generates frequency distribution as shown in Figure 2.
Later, determination unit 203 according to frequency distribution generated and is stored in the reference range of reference information storage unit 202
Information whether converge in reference range (step S107) come crest frequency f2, f3 and the f4 determined in frequency distribution.?
In the case that crest frequency f2, f3 and f4 are converged in reference range (step S107- is), determination unit 203 is sensed the 1st
Device is judged to being bonded good (step S108).Namely it is decided that portion 203 is determined as that the bonding of the 1st sensor is in good state.
On the other hand, in not converged (step S107- in the case where in reference range of crest frequency f2, f3 and f4
It is no), the 1st sensor is determined as poor attachment (step S109) by determination unit 203.Namely it is decided that portion 203 is determined as the 1st sensor
Bonding be in undesirable state.
In sensor adhering state decision-making system 100, the processing of Fig. 3 is carried out to each AE sensor 10.For example, the 2nd
In the case that sensor discharges pulse, signal processing part 20 is detected according to by the 1st sensor, the 3rd sensor and the 4th sensor
To elastic wave determine the adhering state of the 2nd sensor.The determination method of adhering state is same as described above.
According to the sensor adhering state decision-making system 100 constituted as above, signal processing part 20 is according to based on by each
The AE source signal for the elastic wave that AE sensor 10 detects calculates crest frequency, in calculated crest frequency converges on benchmark
The adhering state of the AE sensor 10 of oscillation source is determined as well in the case where in range, not converged in reference range
In the case of the adhering state of the AE sensor 10 of oscillation source is determined as it is bad.Therefore, it can determine the biography for being adhered to structure
The adhering state of sensor.
Hereinafter, illustrating the variation of sensor adhering state decision-making system 100.
In the present embodiment, the structure that determination unit 203 generates frequency distribution is shown, but determination unit 203 can not also
Generate frequency distribution.In this case of composition, determination unit 203 is according to by the calculated crest frequency of calculation part 201 and base
Quasi- range determines whether crest frequency converges in reference range.
Determination unit 203 can also in multiple crest frequencies, specific quantity (for example, two, 3 etc.) peak value frequency
Not converged 10 poor attachment of AE sensor for being determined as oscillation source in the case where in reference range of rate.
With this configuration, will not only with due to noise be mixed into etc. and 1 value is not converged in being just judged in reference range
It is set to poor attachment.Therefore, can more accurately be determined.
Determination unit 203 can also carry out the judgement of adhering state according to the statistical value of crest frequency.Statistical value is, for example,
Average value, mode, intermediate value etc..In the case where the judgement according to the average value of crest frequency to carry out adhering state, benchmark letter
Cease the information of the reference range of 202 average storage of storage unit.In this case, determination unit 203 compares being averaged for crest frequency
The reference range of value and average value, is determined as in the case where the average value of crest frequency converges in the reference range of average value
The AE sensor 10 of oscillation source is bonded well, the situation in the not converged reference range in average value of average value of crest frequency
Under be determined as 10 poor attachment of AE sensor of oscillation source.
Determination unit 203 can also calculate separately each AE sensor 10 as obtained from the respective oscillation of each AE sensor 10
Detection signal frequency distribution, and compare them, by deviating from for threshold value from the distribution of the value of other AE sensors 10
Above AE sensor 10 is determined as poor attachment.
Signal processing part 20 is also configured to output and determines result.In this case of composition, signal processing part 20
It is also equipped with display unit.Display unit shows the judgement result based on determination unit 203.For example, display unit can both show poor attachment
AE sensor 10 information, can also show frequency distribution shown in Fig. 2.
With this configuration, the user of sensor adhering state decision-making system 100 can easily find poor attachment
AE sensor 10.
(the 2nd embodiment)
In the 2nd embodiment, AE sensor does not have oscillation functions, using the detection of AE sensor due to from outside
Impact, load and from structure generate elastic wave.
Fig. 4 is the figure for showing the system structure of the sensor adhering state decision-making system 100a in the 2nd embodiment.Sensing
Device adhering state decision-making system 100a is used to be adhered to the judgement of the adhering state of the sensor of structure.In present embodiment
In, as an example of structure, it is illustrated by taking bridge as an example, but structure is not necessarily limited to bridge.
Sensor adhering state decision-making system 100a has multiple AE sensor 10a-1~10a-n and signal processing
Portion 20a.AE sensor 10a-1~10a-n and signal processing part 20a pass through wired or wirelessly can communicatedly connect.This
Outside, in the following description, AE sensor 10a is recorded as in the case where not distinguishing about AE sensor 10a-1~10a-n.
AE sensor 10a is adhered to the structure surface of the object as deterioration evaluation by bonding agent etc..For example, AE is passed
Sensor 10a is adhered to the mattess 30 of bridge.The detection for the elastic wave that there is AE sensor 10a detection to generate from structure
Function.AE sensor 10a has piezoelectric element, detects the elastic wave generated from structure, and the elastic wave that will test is transformed to
Voltage signal (AE source signal).AE sensor 10a implements the processing such as amplification, frequency limit to AE source signal, is output at signal
Reason portion 20a.In addition it is also possible to not use AE sensor 10a, and use acceleration transducer.In this case, acceleration sensing
Device is similarly handled by carrying out with AE sensor 10a, and by treated, signal is output to signal processing part 20a.
Signal processing part 20a will implement the AE source signal of the processing based on AE sensor 10a as input.Signal processing
Portion 20a determines the adhering state of AE sensor 10a according to the frequency obtained from the AE source signal inputted.Signal processing part
20a is functioned as sensor adhering state decision maker.In addition, signal processing part 20a keep connect with itself own
AE sensor 10a identification information.
Next, illustrating the functional structure of signal processing part 20a.
Signal processing part 20a has CPU, memory, the auxilary unit etc. connected by bus, executes adhering state
Decision procedure.By the execution of adhering state decision procedure, signal processing part 20a conduct has calculation part 201, reference information is deposited
Storage portion 202a, determination unit 203a device function.In addition, all or part of each function of signal processing part 20a
Also the hardware such as ASIC, PLD, FPGA can be used and realize.In addition, adhering state decision procedure also can recorde in computer capacity
The recording medium enough read.The recording medium that computer can be read refers to can such as floppy disk, magneto-optic disk, ROM, CD-ROM
The storage devices such as move media, the hard disk for being built in computer system.In addition, adhering state decision procedure can also be logical via electricity
Letter route is received and dispatched.
Signal processing part 20a replaces reference information to store having reference information storage unit 202a and a determination unit 203a
It is different from the structure of signal processing part 20 in portion 202 and determination unit 203 this aspect.About other structures, signal processing part 20a with
Signal processing part 20 is identical.Therefore, omit signal processing part 20a entirety explanation, illustrate reference information storage unit 202a and
Determination unit 203a.
Reference information storage unit 202a is constituted using storage devices such as magnetic hard disk device, semiconductor storages.Base
The information and a reference value of the resonant frequency of calibration information storage unit 202a storage sensor.Reference information storage unit 202a can also be with needle
To each type of sensor and the information of the resonant frequency of storage sensor.A reference value indicates to be used as it can be determined that being bonding
The value of the benchmark of good state.A reference value can also suitably be set.
Determination unit 203a is total to according to crest frequency, the sensor by the calculated each AE sensor 10a of calculation part 201
Vibration frequency and a reference value determine the adhering state of AE sensor 10a.
Fig. 5 is the figure for showing an example by the data being measured from.Data shown in fig. 5 are to pass two AE
Sensor 10a (sensor 1 and sensor 2) be adhered to the surface of structure and by sensor 1 and sensor 2 detect due to
Impacted caused by structure and generate elastic wave when data.In Fig. 5, horizontal axis indicates the time, and the longitudinal axis indicates peak value frequency
Rate.Fig. 5 is plotted in made of the crest frequency of the AE source signal obtained when intermittently causing impact to structure.In Fig. 5 institute
In the example shown, sensor 1 is to be bonded good state, and sensor 2 is the state of poor attachment.
As shown in figure 5, sensor 1 is different from the distribution of the crest frequency of sensor 2.AE sensor 10a as used herein
Resonant frequency be 60kHz.In the good sensor 1 of adhering state, the majority seen in structure with propagating
The elastic wave of crest frequency in the range of main frequency i.e. 20~30kHz of elastic wave, in contrast, adhering state not
In good sensor 2, only the resonant component of AE sensor 10a becomes ascendancy, and the crest frequency of elastic wave concentrates on AE biography
Near resonant frequency, that is, 60kHz of sensor 10a.Signal processing part 20a can compare in the elastic wave detected by AE sensor 10a
Crest frequency distribution shown in crest frequency and detect elastic wave AE sensor 10a resonant frequency, comparing
As a result in the case where more than being worth on the basis of the ratio of roughly the same elastic wave, AE sensor 10a is determined as poor attachment.
Here, roughly the same mutual difference of the value (for example, crest frequency and resonant frequency) that refers to as comparison other is ± a few KHz
The case where (for example, ± 5kHz).
In addition, can more accurately detect poor attachment by carrying out small echo parsing.It shows and takes in Fig. 6 A and Fig. 6 B
2 respective 1 waveforms of the sensor 1 in Fig. 5 and sensor and the result of wavelet transformation is carried out out.In Fig. 6 A and Fig. 6 B
In, horizontal axis indicates the time, and the longitudinal axis indicates frequency.Fig. 6 A be 1 waveform about the good sensor 1 of adhering state is shown and into
Gone wavelet transformation result figure.Fig. 6 B is to show 1 waveform about the undesirable sensor 2 of adhering state and carried out small
The figure of the result of wave conversion.As shown in Figure 6A, in the good sensor 1 of adhering state, it can be seen that including in structure
The main frequency i.e. range of 20~30kHz of the elastic wave of propagation, the region (circle of Fig. 6 A with various frequency components
31).In contrast, as shown in Figure 6B, in the sensor 2 of poor attachment, the position stabilization of crest frequency is being passed on the whole
Resonant frequency, that is, 60kHz of sensor is nearby (circle 32 of Fig. 6 B).Signal processing part 20a is to being detected by AE sensor 10a
In the case that elastic wave has carried out wavelet transformation, examined in the elastic wave stablized crest frequency near the resonant frequency of sensor
In the case where measuring a reference value or more, AE sensor 10a can be determined as poor attachment.Namely it is decided that portion 203a is by AE
Crest frequency and resonant frequency be substantially in the time more than pre-determined ratio in the elastic wave that sensor 10a is detected
In the case where more than being worth on the basis of the ratio of consistent elastic wave, AE sensor 10a can be determined as poor attachment.This
It outside, is concrete in Fig. 5 and structure illustrated in fig. 6.
Fig. 7 is the flow chart for showing the process of processing of the signal processing part 20a in the 2nd embodiment.In addition, in Fig. 7
In, it is said in case where having used the elastic wave detected by 1 AE sensor 10a in multiple AE sensor 10a
It is bright.In addition, illustrating 1 AE sensor 10a as the 1st sensor in Fig. 7.
Calculation part 201 calculates crest frequency (step S201) according to the elastic wave obtained by the 1st sensor.Calculation part
Calculated crest frequency is output to determination unit 203a by 201.Next, the more calculated crest frequency of determination unit 203a and
The resonant frequency of AE sensor 10a.For example, determination unit 203a determine calculated crest frequency and sensor resonant frequency it
Difference whether be pre-determined feasible value δ (for example, a few kHz) below.In turn, determination unit 203a is directed to obtained elastic wave and counts
Calculate the frequency (step S202) that difference on the frequency is δ elastic wave below.
Then, it is determined that the more calculated frequency of portion 203a and a reference value for being stored in reference information storage unit 202a, sentence
Determine whether frequency is less than a reference value (step S203).In the case where frequency is less than a reference value (step S203- is), determination unit
1st sensor is judged to being bonded good (step S204) by 203a.Namely it is decided that portion 203a is determined as the abutting edge of the 1st sensor
In good state.
On the other hand, in the case where frequency is less than a reference value (step S203- is no), determination unit 203a is by the 1st sensor
It is determined as poor attachment (step S205).Namely it is decided that portion 203a is determined as that the bonding of the 1st sensor is in undesirable state.
In the present embodiment, the resonant frequency of AE sensor 10a and branch is being accounted in the structure as measurement object
In the case that the crest frequency of elastic wave with status is roughly the same, sensor bonding it is good whether caused crest frequency
Difference is small.Therefore, the AE sensor 10a used in the 2nd embodiment preferably have in the construction as measurement object
The AE sensor 10a of the different resonant frequency of the crest frequency of dominant elastic wave in object.
According to sensor adhering state the decision-making system 100a, signal processing part 20a constituted as above according to based on by
The AE source signal of the elastic wave that each AE sensor 10a is detected calculates crest frequency.Later, signal processing part 20a compares meter
The crest frequency of calculating and the resonant frequency of AE sensor 10a are in the difference of crest frequency and the resonant frequency of AE sensor 10a
The frequency of δ elastic wave below will test the adhering state of the AE sensor 10a of the elastic wave in the case where being less than a reference value
The adhering state for being judged to well will test the AE sensor 10a of the elastic wave in the case where on the basis of more than value determines
It is bad.Therefore, it can determine the adhering state of the sensor Nian Jie with structure.
At least one embodiment from the description above, the multiple sensings for the elastic wave that there is detection to generate from structure
Device, calculated according to the elastic wave detected by multiple sensors elastic wave crest frequency calculation part and by comparing
Crest frequency with whether be that the information of determinating reference of good state determines the bonding of sensor as the Nian Jie of sensor
The determination unit of state, so as to determine the adhering state of the sensor Nian Jie with structure.
It illustrates several embodiments of the invention, but these embodiments are suggested as examples, is not intended to limit
Surely the range invented.These embodiments can be carried out in a manner of various other, can be in the model for the main idea for not departing from invention
It encloses and carries out various omissions, displacement, change.These embodiments and modifications thereof be contained in the range of invention, in the same manner as main idea, packet
Contained in invention documented by claims and the range impartial with it.
Claims (8)
1. a kind of sensor adhering state decision-making system, has:
Multiple sensors detect elastic wave；
Calculation part calculates the crest frequency of the elastic wave according to the elastic wave detected by the multiple sensor；
And
Determination unit determines the adhering state of the sensor by comparing the crest frequency and the information as determinating reference.
2. sensor adhering state decision-making system according to claim 1, wherein
The multiple sensor has the oscillation functions vibrated with specific frequency,
The calculation part is counted according to the elastic wave from the sensor output for detecting the elastic wave generated by oscillation
Calculate the crest frequency of the elastic wave.
3. sensor adhering state decision-making system according to claim 2, wherein
The determination unit does not converge in some or all of crest frequency of the elastic wave as the determinating reference
Crest frequency in the range of in the case where the sensor of oscillation source is determined as poor attachment.
4. sensor adhering state decision-making system according to claim 1, wherein
The determination unit is in the crest frequency with the resonant frequency of more than pre-determined frequency frequency and the sensor
The sensor is determined as poor attachment in the case where roughly the same.
5. according to claim 1 or sensor adhering state decision-making system described in 4, wherein
Determination unit peak in the time more than pre-determined ratio in the elastic wave detected by the sensor
The sensor is determined as in the case that value is above on the basis of the ratio of value frequency and roughly the same elastic wave of resonant frequency
Poor attachment.
6. according to sensor adhering state decision-making system described in claim 4 or 5, wherein
The sensor has the resonant frequency different from the main frequency of elastic wave propagated in structure.
7. a kind of sensor adhering state decision maker, has:
Calculation part calculates the peak of the elastic wave according to the elastic wave detected by multiple sensors of detection elastic wave
It is worth frequency；And
Determination unit determines the adhering state of the sensor by comparing the crest frequency and the information as determinating reference.
8. a kind of sensor adhering state determination method, comprising:
Step is calculated, the elastic wave is calculated according to the elastic wave detected by multiple sensors of detection elastic wave
Crest frequency；And
Determination step determines the bonding shape of the sensor by comparing the crest frequency and the information as determinating reference
State.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017053719A JP6710653B2 (en) | 2017-03-17 | 2017-03-17 | Sensor adhesion state determination system, sensor adhesion state determination device, and sensor adhesion state determination method |
| JP2017-053719 | 2017-03-17 | ||
| PCT/JP2018/002486 WO2018168218A1 (en) | 2017-03-17 | 2018-01-26 | Sensor adhesion state determination system, sensor adhesion state determination device, and sensor adhesion state determination method |
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| CN108966669A true CN108966669A (en) | 2018-12-07 |
| CN108966669B CN108966669B (en) | 2021-10-01 |
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| Country | Link |
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| EP (1) | EP3598124A4 (en) |
| JP (1) | JP6710653B2 (en) |
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| WO (1) | WO2018168218A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113219067A (en) * | 2021-05-27 | 2021-08-06 | 北京钛方科技有限责任公司 | Elastic wave sensor paste state judgment method, device and system |
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| JP7349971B2 (en) * | 2020-11-16 | 2023-09-25 | 芝浦機械株式会社 | Predictive maintenance judgment device, predictive maintenance judgment method and program |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003135459A (en) * | 2001-10-31 | 2003-05-13 | Ge Medical Systems Global Technology Co Llc | Method for judging ultrasonic probe state and ultrasonic diagnostic instrument |
| JP2003173897A (en) * | 2001-12-04 | 2003-06-20 | Japan Science & Technology Corp | Confirmation method of contact state of ultrasonic sensor, plasma abnormal discharge checking device with confirmation function of contact state of ultrasonic sensor, and plasma treatment device |
| JP2006153801A (en) * | 2004-12-01 | 2006-06-15 | Denso Corp | Sensing device for contact state |
| CN103591972A (en) * | 2013-11-21 | 2014-02-19 | 济南大学 | Method for fixing sensor |
| CN103703793A (en) * | 2012-06-26 | 2014-04-02 | 本多电子株式会社 | Electromechanical conversion element and manufacturing method therefor |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62235560A (en) * | 1986-04-07 | 1987-10-15 | Sogo Keibi Hoshiyou Kk | Destructive vibration detector |
| JPS62235559A (en) * | 1986-04-07 | 1987-10-15 | Sogo Keibi Hoshiyou Kk | Destructive vibration detector |
| JP3956486B2 (en) * | 1998-06-17 | 2007-08-08 | 石川島播磨重工業株式会社 | Method and apparatus for detecting thermal spray coating peeling on structure surface |
| JP4949568B2 (en) * | 2001-05-29 | 2012-06-13 | 三菱重工業株式会社 | Blow inspection device |
| JP2005083752A (en) | 2003-09-04 | 2005-03-31 | Taiheiyo Cement Corp | Breaking sound sensor |
| JP6290054B2 (en) * | 2014-09-18 | 2018-03-07 | 株式会社東芝 | Detection system, sensor module, and detection method |
| JP6553970B2 (en) * | 2015-07-24 | 2019-07-31 | Ntn株式会社 | Abnormality diagnosis device and sensor disconnection detection method |
-
2017
- 2017-03-17 JP JP2017053719A patent/JP6710653B2/en active Active
-
2018
- 2018-01-26 EP EP18706950.5A patent/EP3598124A4/en active Pending
- 2018-01-26 WO PCT/JP2018/002486 patent/WO2018168218A1/en unknown
- 2018-01-26 CN CN201880000153.2A patent/CN108966669B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003135459A (en) * | 2001-10-31 | 2003-05-13 | Ge Medical Systems Global Technology Co Llc | Method for judging ultrasonic probe state and ultrasonic diagnostic instrument |
| JP2003173897A (en) * | 2001-12-04 | 2003-06-20 | Japan Science & Technology Corp | Confirmation method of contact state of ultrasonic sensor, plasma abnormal discharge checking device with confirmation function of contact state of ultrasonic sensor, and plasma treatment device |
| JP2006153801A (en) * | 2004-12-01 | 2006-06-15 | Denso Corp | Sensing device for contact state |
| CN103703793A (en) * | 2012-06-26 | 2014-04-02 | 本多电子株式会社 | Electromechanical conversion element and manufacturing method therefor |
| CN103591972A (en) * | 2013-11-21 | 2014-02-19 | 济南大学 | Method for fixing sensor |
Non-Patent Citations (2)
| Title |
|---|
| 敦怡 等: "非线性超声在金属基复合材料结构界面粘接强度评价中的应用", 《中国机械工程》 * |
| 袁艺 等: "构件粘接的一种在线检测技术", 《兵工学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113219067A (en) * | 2021-05-27 | 2021-08-06 | 北京钛方科技有限责任公司 | Elastic wave sensor paste state judgment method, device and system |
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| CN108966669B (en) | 2021-10-01 |
| EP3598124A1 (en) | 2020-01-22 |
| JP6710653B2 (en) | 2020-06-17 |
| EP3598124A4 (en) | 2020-12-16 |
| WO2018168218A1 (en) | 2018-09-20 |
| JP2018155661A (en) | 2018-10-04 |
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