JPS62235559A - Destructive vibration detector - Google Patents
Destructive vibration detectorInfo
- Publication number
- JPS62235559A JPS62235559A JP61078344A JP7834486A JPS62235559A JP S62235559 A JPS62235559 A JP S62235559A JP 61078344 A JP61078344 A JP 61078344A JP 7834486 A JP7834486 A JP 7834486A JP S62235559 A JPS62235559 A JP S62235559A
- Authority
- JP
- Japan
- Prior art keywords
- vibration
- detected
- detector
- destructive
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001066 destructive effect Effects 0.000 title claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 31
- 239000000284 extract Substances 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 abstract description 13
- 238000004092 self-diagnosis Methods 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 4
- 230000001360 synchronised effect Effects 0.000 abstract 1
- 238000012806 monitoring device Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
との発明は破壊による撮動周波数を検知し、被検出物の
破壊を感知する破壊振動検出器に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The invention relates to a destructive vibration detector that detects the imaging frequency due to destruction and detects destruction of an object to be detected.
従来の破壊振動検出器をガラス破壊検出器を例にして説
明する。第3図は従来のガラス破壊検出器の構成を示し
、被検出物1であるガラスの表面に検出器2が接着剤等
によシ固定されている。検出器2は振動検出素子3、バ
ンドパスフィルタ4、アンプ5および処理回路6によシ
構成される。7は監視装置である。A conventional breaking vibration detector will be explained using a glass breaking detector as an example. FIG. 3 shows the configuration of a conventional glass breakage detector, in which a detector 2 is fixed to the surface of glass, which is the object 1 to be detected, with adhesive or the like. The detector 2 includes a vibration detection element 3, a bandpass filter 4, an amplifier 5, and a processing circuit 6. 7 is a monitoring device.
上記構成において、被検出物1が破壊され九時やガラス
切シ等によシ切断され九時に生じる振動検出素子3によ
シ検出し、この検出信号をバンドパスフィルタ4に入力
して特定の破壊振動周波数だけを通過させ、この信号を
さらにアンプ5で増幅し、処理回路6に加える。処理回
路6はアンプ5の出力レベルが一定のしきい値を超えた
ら破壊警報として監視装置7に出力する、
〔発明が解決しようとする問題点〕
しかるに、上記しt従来の破壊振動検出器は検出方式が
受動的なため、被検出物1と検出器2がはがれてしまっ
た場合、あるいは検出素子3の不良等によシ被検出物1
からの振動が検出できなくなつ九場合、監視装置7はこ
のような異常状態を検知することができないという問題
点があった。In the above configuration, the vibration detection element 3 detects the vibration generated at 9 o'clock when the detected object 1 is broken and cut by a glass cutter, etc., and this detection signal is input to the band pass filter 4 to detect a specific vibration. Only the destructive vibration frequency is passed, and this signal is further amplified by an amplifier 5 and applied to a processing circuit 6. When the output level of the amplifier 5 exceeds a certain threshold, the processing circuit 6 outputs a breakdown alarm to the monitoring device 7. [Problems to be Solved by the Invention] However, the above-mentioned conventional breakdown vibration detector does not Since the detection method is passive, if the object to be detected 1 and the detector 2 are separated, or if the detection element 3 is defective, the object to be detected 1
There is a problem in that the monitoring device 7 cannot detect such an abnormal state when vibrations from the sensor cannot be detected.
この発明は上記のよう力問題点を解決する九めに成され
たものであシ、振動検出素子の不良あるいは振動検出素
子の被検出物からの離脱を検知することができる破壊振
動検出器を得ることを目的とする。This invention is the ninth to be made to solve the above-mentioned force problem, and it provides a destructive vibration detector capable of detecting a defective vibration detection element or separation of the vibration detection element from an object to be detected. The purpose is to obtain.
この発明に係る破壊振動検出器は、破壊振動とは別の振
動を励振発生される振動素子と、振動素子から発生され
被検出物を介して振動検出素子により検知された振動を
破壊振動と区別して取出す信号処理部を設けたものであ
る。The destructive vibration detector according to the present invention includes a vibrating element that excites and generates a vibration different from the destructive vibration, and a vibration generated from the vibrating element and detected by the vibration detecting element through the object to be detected, which is distinguished from the destructive vibration. This is provided with a signal processing section that extracts signals separately.
この発明による信号処理部は、振動素子から発生され被
検出物を介して振動検出素子によシ検知された振動を破
壊振動と区別して取出すようにしておシ、振動検出素子
が不良になったシ、被検出物から剥離した場合には、振
動素子から発生された振動を振動検出素子が検知するこ
とができず、この振動を取出すことができない。The signal processing unit according to the present invention is configured to extract the vibration generated from the vibration element and detected by the vibration detection element via the object to be detected, distinguishing it from destructive vibration. If it is separated from the object to be detected, the vibration detection element cannot detect the vibration generated from the vibration element, and this vibration cannot be extracted.
以下、この発明の実施例を図面とともに説明する。第1
図において、12は破壊振動周波数検出用ノパンドパス
フィルタ4の通過周波数帯と重ならない通過周波数帯t
−Vするパントノぞスフィルタ、11はバンドパスフィ
ルタ12の通過周波数帯内の周波数で発振する基準発振
回路、10は基準発振回路11の出力で振動する振動素
子、13はバンドパスフィルタ12の出力を増幅するア
ンプ、14はアンプ13の出力を処理する処理回路、1
5は処理回路14および基準発振回路11の出力を入力
される排他的論理和ゲートである。他の構成は従来と同
様である。Embodiments of the present invention will be described below with reference to the drawings. 1st
In the figure, 12 is a pass frequency band t that does not overlap with the pass frequency band of the nopando pass filter 4 for detecting destructive vibration frequency.
-V pantone noise filter; 11 is a reference oscillation circuit that oscillates at a frequency within the pass frequency band of the bandpass filter 12; 10 is a vibration element that oscillates with the output of the reference oscillation circuit 11; 13 is the output of the bandpass filter 12. 14 is a processing circuit that processes the output of the amplifier 13;
5 is an exclusive OR gate to which the outputs of the processing circuit 14 and the reference oscillation circuit 11 are input. Other configurations are the same as before.
次に、上記構成の動作を第2図を参照して説明する。振
動素子10は振動検出素子3と同じく被検出物1の表面
に取付けられており、基準発振回路11の基準発振のタ
イミングによる自己診断用周波数を加えられて励振振動
し、基準発振回路11からは基準発振と等しい同期信号
15Bが出力される。装置に故障がなく正常な場合には
、基準発振出力時に振動素子10によって出力された振
動は被検出物1を介して検出素子3によって検出され、
この検出信号はバンドパスフィルタ12t−通過し、処
理回路14に出力15Aが現われる。従って、ゲート1
5には処理回路14の出力15Aと基準発振の同期信号
15Bが加えられ、ゲート15に出力は現れない。この
場合、検出素子3の出力は通過周波数帯が異るためバン
ドパスフィルタ4を通過せず、処理回路6に出力は生じ
ない。Next, the operation of the above configuration will be explained with reference to FIG. The vibration element 10 is attached to the surface of the object to be detected 1 like the vibration detection element 3, and is excited to vibrate by applying a self-diagnosis frequency based on the reference oscillation timing of the reference oscillation circuit 11. A synchronization signal 15B equal to the reference oscillation is output. When the device is normal and has no failure, the vibration output by the vibration element 10 at the time of outputting the reference oscillation is detected by the detection element 3 via the object to be detected 1,
This detection signal passes through the bandpass filter 12t, and an output 15A appears in the processing circuit 14. Therefore, gate 1
The output 15A of the processing circuit 14 and the reference oscillation synchronization signal 15B are applied to the gate 5, and no output appears at the gate 15. In this case, since the output of the detection element 3 has a different pass frequency band, it does not pass through the bandpass filter 4, and no output is generated in the processing circuit 6.
次に、検出素子3が不良になった場合あるいは検出部2
が被検出物1から離れt場合には、振動素子10から出
力された自己診断用周波数は検出素子3によって検出で
きず、処理回路14には出力が現われない。このtめ、
ゲート15に出力が生じ、自己診断異常信号が監視装置
7に送られる。Next, if the detection element 3 becomes defective or the detection part 2
is away from the object 1 to be detected 1, the self-diagnosis frequency output from the vibration element 10 cannot be detected by the detection element 3, and no output appears in the processing circuit 14. This t-girl,
An output is generated at the gate 15 and a self-diagnosis abnormality signal is sent to the monitoring device 7.
一方、被検出物1の破壊振動を検出素子3が検出した場
合、この検出信号がバンドパスフィルタ4およびアンプ
5t−介して処理回路6に入力され、処理回路6は信号
レベルから破壊信号と判断し、監視装置7に出力を送る
。On the other hand, when the detection element 3 detects destructive vibration of the detected object 1, this detection signal is input to the processing circuit 6 via the bandpass filter 4 and the amplifier 5t, and the processing circuit 6 determines that it is a destructive signal from the signal level. and sends the output to the monitoring device 7.
尚、上記実施例では自己診断周波数の発振出力を断続的
なものとし友が、連続発振でも良い。又、破壊振動検出
周波数と自己診断用周波数を別々にしたが、同一の周波
数帯を用いても検出レベルや検出時間に差を付けること
によシ区別することは可能である。又、検出素子3と振
動素子1oは一体型パッケージと各々単独のパッケージ
のいずれでも良い。Incidentally, in the above embodiment, the oscillation output of the self-diagnosis frequency is made intermittent, but continuous oscillation may also be used. Further, although the destructive vibration detection frequency and the self-diagnosis frequency are separated, it is possible to differentiate them by making a difference in the detection level or detection time even if the same frequency band is used. Further, the detection element 3 and the vibration element 1o may be either an integrated package or a separate package.
以上のようにこの発明によれば、被検出物の破壊振動と
は別の振動を発生する振動素子と、この振動素子が発生
し被検出物を介して振動検出素子によシ検出された振動
を破壊振動と区別して取出す信号処理部を設けておシ、
振動素子による振動が検出できないことにより、振動検
出素子の不良あるいは振動検出素子の被検出物からの離
脱を検知することができる。As described above, according to the present invention, there is provided a vibration element that generates a vibration different from the destructive vibration of the object to be detected, and a vibration generated by the vibration element and detected by the vibration detection element via the object to be detected. A signal processing section is installed to distinguish vibration from destructive vibration and extract it.
Since the vibration caused by the vibration element cannot be detected, it is possible to detect a failure of the vibration detection element or separation of the vibration detection element from the object to be detected.
第1図および第2図は夫々この発明に係る破壊振動検出
器の構成図およびその動作を示すタイムチャート、第3
図は従来の破壊振動検出器の構底図である。
1・・・被検出物、2・・・検出器、3・・・振動検出
素子、4.12・・・パントノぞスフィルタ、6.14
・・・処理回路、10・・・振動素子、11・・・基準
発振回路、15・・・排他的論理和ゲート。
jll 図FIG. 1 and FIG. 2 are a block diagram and a time chart showing the operation of the destructive vibration detector according to the present invention, respectively, and FIG.
The figure is a bottom view of a conventional destructive vibration detector. DESCRIPTION OF SYMBOLS 1... Object to be detected, 2... Detector, 3... Vibration detection element, 4.12... Pantone noise filter, 6.14
. . . processing circuit, 10 . . . oscillation element, 11 . . . reference oscillation circuit, 15 . . . exclusive OR gate. jll figure
Claims (1)
検出物が破壊した際の破壊振動を振動検出素子を介して
検知する破壊振動検出器において、被検出物に取付けら
れ、破壊振動とは異る振動を励振発生される振動素子と
、振動素子から発生され被検出物を介して振動検出素子
により検知された振動を破壊振動と区別して取出す信号
処理部を備えたことを特徴とする破壊振動検出器。(1) In a destructive vibration detector that has a vibration detection element attached to the detected object and detects destructive vibration when the detected object breaks through the vibration detection element, the It is characterized by being equipped with a vibrating element that excites and generates vibrations different from vibrations, and a signal processing unit that extracts the vibrations generated by the vibrating elements and detected by the vibration detection element via the object to be detected, distinguishing them from destructive vibrations. Destructive vibration detector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61078344A JPS62235559A (en) | 1986-04-07 | 1986-04-07 | Destructive vibration detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61078344A JPS62235559A (en) | 1986-04-07 | 1986-04-07 | Destructive vibration detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62235559A true JPS62235559A (en) | 1987-10-15 |
Family
ID=13659368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61078344A Pending JPS62235559A (en) | 1986-04-07 | 1986-04-07 | Destructive vibration detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62235559A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018168218A1 (en) * | 2017-03-17 | 2018-09-20 | 株式会社東芝 | Sensor adhesion state determination system, sensor adhesion state determination device, and sensor adhesion state determination method |
-
1986
- 1986-04-07 JP JP61078344A patent/JPS62235559A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018168218A1 (en) * | 2017-03-17 | 2018-09-20 | 株式会社東芝 | Sensor adhesion state determination system, sensor adhesion state determination device, and sensor adhesion state determination method |
JP2018155661A (en) * | 2017-03-17 | 2018-10-04 | 株式会社東芝 | Sensor attachment state determination system, sensor attachment state determination device, and method for determining sensor attachment state |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5375468A (en) | Acceleration sensor unit having self-checking function | |
US5377523A (en) | Acceleration sensor suitable for self-checking and a self-checking circuit therefore | |
FI955921A0 (en) | Method and apparatus for analyzing elevator functionsMethod and equipment for analyzing elevator functions for suction | |
GB1379695A (en) | Pressure and vacuum monitoring apparatus | |
US20040183177A1 (en) | Methods and apparatus for attaching getters to MEMS device housings | |
WO1995016190A1 (en) | Ultrasonic level instrument with dual frequency operation | |
JPH0431437B2 (en) | ||
JPS62235559A (en) | Destructive vibration detector | |
JPS62235560A (en) | Destructive vibration detector | |
JP3143864B2 (en) | Glass break detector | |
GB2088107A (en) | Arrangement for detecting the breaking of window glass | |
JPH0883090A (en) | Environmental sound detecting device | |
JPS6179159A (en) | Self-diagnostic sensor | |
US20050258716A1 (en) | Transducer-based sensor system with multiple drive signal variants | |
KR100442647B1 (en) | Ultrasonic sensor driving system equipped with natural frequency restoring means | |
JP3400219B2 (en) | Signal change detection device | |
CZ298425B6 (en) | Apparatus for continuous measurement of oscillations of string-type strain gauge pick-ups with two-wire connection | |
JP2620211B2 (en) | Window security equipment | |
JPS58174817A (en) | Method for detecting destruction and fracture of rigid body | |
JP3993531B2 (en) | Sensor device for detecting fracture of laminated glass | |
SU1000774A1 (en) | Vibration parameter checking device | |
KR100611131B1 (en) | Resonant sensor and method for self-test of resonant sensor | |
SU1700383A1 (en) | System of vibromonitoring | |
JPH0137323Y2 (en) | ||
JP2004348316A (en) | Sensor for destructive detection of glass laminate |