CN108962782A - A kind of manufacturing method of chip heating device and chip heating device - Google Patents
A kind of manufacturing method of chip heating device and chip heating device Download PDFInfo
- Publication number
- CN108962782A CN108962782A CN201810404797.XA CN201810404797A CN108962782A CN 108962782 A CN108962782 A CN 108962782A CN 201810404797 A CN201810404797 A CN 201810404797A CN 108962782 A CN108962782 A CN 108962782A
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- Prior art keywords
- thermally conductive
- heat
- soaking plate
- heating device
- mainboard
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000002791 soaking Methods 0.000 claims abstract description 44
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 239000011230 binding agent Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000011344 liquid material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000009418 renovation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
Abstract
The manufacturing method of a kind of chip heating device and chip heating device is related to a kind of heating device and manufacturing method.Soaking plate plate face is provided with multiple through-holes by array arrangement, there is snakelike detour inner cavity inside soaking plate, snakelike detour inner cavity merges with the matching of multiple through-holes to be shifted to install, resistive heater matching is arranged in intracavitary in snakelike detour, the each through-hole corresponding position in soaking plate upper surface is fixed with heat resistant rubber set, heat resistant rubber set is cylindrical shape, more thermally conductive round bars closely pass through a heat resistant rubber respectively and cover and be vertically inserted into corresponding through-hole, the fixed thermally conductive sheet in every thermally conductive round bar lower end, multiple thermally conductive sheets can be spliced into whole, the fixed insulating rubber head in every thermally conductive round bar upper end, base seat upper surface is plane and is equipped with heat insulation layer, soaking plate is affixed by four columns and base seat.The heat-conducting piece of different location different number can be pushed according to demand, to heat to chip local location or entirety, meet different demand for heat.
Description
Technical field
The present invention relates to a kind of heating device and manufacturing method, especially a kind of chip heating device and chip heating device
Manufacturing method.
Background technique
In semiconductor processing, often chip is heated, and there is local heating and entirety when heated
Two kinds of situations are heated, wherein local heating is mainly to detect the high temperature test of device performance.
But the heating layer of one layer of such as polysilicon is arranged in current high temperature test generally on chip, to entire heating layer into
Row heating test, is thus inevitably also heated to being not required to device to be tested, influences the device for being not required to heating
Performance.It is tested in addition, also having and device to be tested will be needed to cut down from chip, such renovation technique is more numb
It is tired.
Therefore, a kind of highly desirable production is simple, can both can heat according to demand to chip local location,
It can be to the chip heating device that chip is integrally heated.
Summary of the invention
To solve deficiency existing for background technique, the present invention provides the system of a kind of chip heating device and chip heating device
Make method.
Realize that above-mentioned purpose, the present invention take following technical proposals: a kind of chip heating device, including soaking plate, substrate
Seat, resistive heater, four columns and multiple heat-conducting pieces, the soaking plate is horizontally disposed and its plate face is set by array arrangement
Multiple through-holes are equipped with, soaking plate is internally provided with snakelike detour inner cavity, the snakelike detour inner cavity and multiple through-holes
Matching to merge and shift to install, the resistive heater matching is arranged in intracavitary in snakelike detour and is powered using external power supply,
The each through-hole corresponding position in soaking plate upper surface is fixed with heat resistant rubber set, and each heat resistant rubber set is cylindrical shape, institute
The multiple heat-conducting pieces stated include thermally conductive round bar and thermally conductive sheet, and thermally conductive round bar described in more closely passes through a heat-resisting rubber respectively
Gum cover is simultaneously vertically inserted into corresponding through-hole, and every thermally conductive round bar lower end level fixes a thermally conductive sheet, and multiple described leads
Backing can be spliced into whole, and an insulating rubber head is fixed in every thermally conductive round bar upper end, and the base seat is arranged at intervals at
Below hot plate, base seat upper surface is plane and is equipped with heat insulation layer, and soaking plate lower surface quadrangle passes through four columns and base seat
Upper surface is affixed.
A kind of manufacturing method of chip heating device of the invention, includes the following steps:
Step 1: prefabricated mold one corresponding with thin cover board, thick mainboard and heat-conducting piece, mold two and mold three respectively, and respectively
To the liquid material of the intracavitary casting thermal conductive ceramic of the same race of type of mold one, mold two and mold three, mold is removed after cooling and shaping
One, thin cover board, thick mainboard and multiple heat-conducting pieces is made in mold two and mold three, wherein the thermally conductive round bar of each heat-conducting piece and thermally conductive
Piece is integrally formed；
Step 2: being laid with resistive heater in the snakelike detour groove of thick mainboard, and resistive heater passes through conducting wire and outside
Thin cover board is adhesively fixed with thick mainboard by resin glue by attaching plug connection later；
Step 3: in soaking plate upper surface, each through-hole corresponding position is adhesively fixed heat resistant rubber set by high temperature resistant binder；
Step 4: the through-hole that the thermally conductive round bar upper end of multiple heat-conducting pieces passes through soaking plate from bottom to top is closely inserted into corresponding
In heat resistant rubber set；
Step 5: taking base seat surface rubbing and will attach heat insulation layer thereon, smears high temperature resistant binder at four columns both ends,
And soaking plate and base seat are adhesively fixed by four columns, the thermally conductive sheet of multiple heat-conducting pieces be located at soaking plate and base seat it
Between, it is adhesively fixed insulating rubber head every thermally conductive round bar upper end by high temperature resistant binder.
Compared with prior art, the beneficial effects of the present invention are: soaking plate of the invention and heat-conducting piece simple and ingenious structure,
Soaking plate can be evenly heated multiple heat-conducting pieces, and multiple heat-conducting pieces are vertically movable, multiple heat-conducting pieces it is thermally conductive
Piece can be spliced into whole, can push the heat-conducting piece of different location different number according to demand, thus to chip local location or whole
Body is heated, easy to operate, meets different demand for heat.
Detailed description of the invention
Fig. 1 is the overall structure axonometric drawing of chip heating device of the invention；
Fig. 2 is the fractionation structure axonometric drawing of soaking plate of the invention；
Fig. 3 is the axonometric drawing of heat-conducting piece of the invention；
Fig. 4 is the axonometric drawing of the through-hole of soaking plate of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, is clearly and completely retouched to the technical solution in the present invention
It states, it is clear that described embodiment is only a part of the embodiment of invention, instead of all the embodiments, based in the present invention
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
It shall fall within the protection scope of the present invention.
Specific embodiment 1: the invention discloses a kind of chip heating devices, including soaking plate as shown in Fig. 1 ~ Fig. 4
1, base seat 7, resistive heater 8, four columns 6 and multiple heat-conducting pieces, the soaking plate 1 is horizontally disposed and its plate face is pressed
Array arrangement is provided with multiple through-holes, and soaking plate 1 is internally provided with snakelike detour inner cavity, the snakelike detour inner cavity with it is described
Multiple through-holes match to merge and shift to install, the described matching of resistive heater 8 is arranged in intracavitary in snakelike detour and using outer
Power supply power supply is connect, each through-hole corresponding position in 1 upper surface of soaking plate is fixed with heat resistant rubber set 2, each heat resistant rubber
Set 2 is cylindrical shape, and multiple heat-conducting pieces include thermally conductive round bar 3 and thermally conductive sheet 4, and thermally conductive round bar 3 described in more is distinguished
Close to pass through a heat resistant rubber set 2 and be vertically inserted into corresponding through-hole, every thermally conductive 3 lower end level of round bar fixes one
Thermally conductive sheet 4, multiple thermally conductive sheets 4 can be spliced into whole, and an insulating rubber head 5, institute are fixed in every thermally conductive 3 upper end of round bar
The base seat 7 stated is arranged at intervals at 1 lower section of soaking plate, and plane is in 7 upper surface of base seat and is equipped with heat insulation layer 7-1, under soaking plate 1
Surface quadrangle is affixed by four columns 6 and 7 upper surface of base seat.
Specific embodiment 2: as shown in Figure 1, 2, present embodiment is made furtherly to specific embodiment one
Bright, the soaking plate 1 includes thin cover board 1-2 and thickness mainboard 1-1, the thin cover board 1-2 and thick mainboard 1-1 setting up and down
Plate face is correspondingly arranged on multiple circular hole 1-3 by array arrangement respectively, and it is recessed that the upper surface thick mainboard 1-1 is provided with snakelike detour
Slot 1-4, the snakelike detour groove 1-4 multiple circular hole 1-3s corresponding with thickness mainboard 1-1, which match to merge, to be shifted to install,
The lower surface thin cover board 1-2 and the thickness upper surface mainboard 1-1, which are adhesively fixed, closes snakelike detour groove 1-4 at snakelike detour inner cavity,
Multiple circular hole 1-3 of multiple circular hole 1-3 of thin cover board 1-2 and thick mainboard 1-1 are butted into multiple through-holes simultaneously.
Specific embodiment 3: as shown in Figure 1, 2, 3, present embodiment is to specific embodiment one or specific embodiment party
The further explanation that formula two is made, the soaking plate 1 and multiple heat-conducting pieces are all made of thermal conductive ceramic material of the same race and are made.
Specific embodiment 4: as shown in figure 3, present embodiment is made furtherly to specific embodiment three
Bright, the thermally conductive round bar 3 and thermally conductive sheet 4 of each heat-conducting piece are made as one.
Specific embodiment 5: as shown in Figure 3,4, present embodiment is made furtherly to specific embodiment three
Bright, 3 side wall of thermally conductive round bar of each heat-conducting piece is provided along its length a limit card slot 3-1, the soaking
Each through-hole wall of plate 1 is fixed with a limit strip 9, and the limit strip 9 is set with the limit card slot 3-1 cooperation
It sets, slide thermally conductive round bar 3 can only in corresponding through-hole without being able to rotate.
Specific embodiment 6: as shown in Fig. 1 ~ Fig. 3, present embodiment is disclosed described in a kind of specific embodiment three
A kind of manufacturing method of chip heating device, the manufacturing method include the following steps:
Step 1: prefabricated mold one corresponding with thin cover board 1-2, thickness mainboard 1-1 and heat-conducting piece, mold two and mold three respectively,
And it is torn open after cooling and shaping to the type intracavitary liquid material for being poured thermal conductive ceramic of the same race of mold one, mold two and mold three respectively
Except thin cover board 1-2, thickness mainboard 1-1 and multiple heat-conducting pieces is made in mold one, mold two and mold three, wherein each heat-conducting piece is led
Hot round bar 3 and thermally conductive sheet 4 are integrally formed；
Step 2: being laid with resistive heater 8 in the snakelike detour groove 1-4 of thick mainboard 1-1, and resistive heater 8 passes through conducting wire
It connect with external attaching plug, thin cover board 1-2 and thickness mainboard 1-1 is adhesively fixed by resin glue later；
Step 3: in 1 upper surface of soaking plate, each through-hole corresponding position is adhesively fixed heat resistant rubber set by high temperature resistant binder
2；
Step 4: the through-hole that 3 upper end of thermally conductive round bar of multiple heat-conducting pieces passes through soaking plate 1 from bottom to top is closely inserted into correspondence
Heat resistant rubber set 2 in；
Step 5: taking base seat 7 surface rubbing and will attach heat insulation layer 7-1 thereon, and it is viscous to smear high temperature resistant at 6 both ends of four columns
Agent is tied, and soaking plate 1 and base seat 7 are adhesively fixed by four columns 6, the thermally conductive sheet 4 of multiple heat-conducting pieces is located at soaking plate 1
And between base seat 7, it is adhesively fixed insulating rubber head 5 every thermally conductive 3 upper end of round bar by high temperature resistant binder.
In using the present invention, resistive heater 8 and external power supply connection preheat soaking plate 1, it later will be brilliant
Piece is placed on 7 upper surface suitable location of base seat, by depressing the insulating rubber head 5 of different location, to make corresponding position
The thermally conductive sheet 4 of heat-conducting piece is bonded with chip, can both be heated to chip local location, can also integrally be heated to chip,
It is simple to operate, meet different demand for heat.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in the form of others dress body.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that by all in the meaning and scope for the condition of equivalent for falling in claim
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. a kind of chip heating device, it is characterised in that: including soaking plate (1), base seat (7), resistive heater (8), four
Column (6) and multiple heat-conducting pieces, the soaking plate (1) is horizontally disposed and its plate face be provided with by array arrangement it is multiple logical
Hole, soaking plate (1) are internally provided with snakelike detour inner cavity, and the snakelike detour inner cavity merges with multiple through-holes matching
It shifts to install, the resistive heater (8) matching is arranged in intracavitary in snakelike detour and is powered using external power supply, soaking plate
(1) each through-hole corresponding position in upper surface is fixed with heat resistant rubber set (2), and each heat resistant rubber set (2) is cylindrical shape,
Multiple heat-conducting pieces include thermally conductive round bar (3) and thermally conductive sheet (4), and thermally conductive round bar (3) described in more is closely worn respectively
It crosses a heat resistant rubber set (2) and is vertically inserted into corresponding through-hole, every thermally conductive round bar (3) lower end level is fixed one and led
Backing (4), multiple thermally conductive sheets (4) can be spliced into whole, and an insulating rubber head is fixed in every thermally conductive round bar (3) upper end
(5), the base seat (7) is arranged at intervals at below soaking plate (1), and base seat (7) upper surface is plane and is equipped with heat insulation layer
(7-1), soaking plate (1) lower surface quadrangle are affixed by four columns (6) and base seat (7) upper surface.
2. a kind of chip heating device according to claim 1, it is characterised in that: the soaking plate (1) includes up and down
The thin cover board (1-2) being arranged and thick mainboard (1-1), the thin cover board (1-2) and thick mainboard (1-1) plate face press array row respectively
Cloth is correspondingly arranged on multiple circular holes (1-3), and described upper surface thick mainboard (1-1) is provided with snakelike detour groove (1-4), described
The merging that matches of snakelike detour groove (1-4) multiple circular holes (1-3) corresponding with thick mainboard (1-1) shift to install, thin lid
The plate lower surface (1-2) and thick upper surface mainboard (1-1) are adhesively fixed and close snakelike detour groove (1-4) in snakelike detour
Chamber, while multiple circular holes (1-3) of thin cover board (1-2) and multiple circular holes (1-3) of thick mainboard (1-1) are butted into multiple through-holes.
3. a kind of chip heating device according to claim 1 or 2, it is characterised in that: the soaking plate (1) and multiple
Heat-conducting piece is all made of thermal conductive ceramic material of the same race and is made.
4. a kind of chip heating device according to claim 3, it is characterised in that: the thermally conductive circle of each heat-conducting piece
Bar (3) and thermally conductive sheet (4) are made as one.
5. a kind of chip heating device according to claim 3, it is characterised in that: the thermally conductive circle of each heat-conducting piece
Bar (3) side wall is provided along its length a limit card slot (3-1), and each through-hole wall of the soaking plate (1) is fixed
There is a limit strip (9), the limit strip (9) is equipped with the limit card slot (3-1), makes thermally conductive round bar
(3) it can only slide in corresponding through-hole without being able to rotate.
6. a kind of manufacturing method of chip heating device according to claim 3, it is characterised in that: the manufacturing method
Include the following steps:
Step 1: prefabricated mold one corresponding with thin cover board (1-2), thick mainboard (1-1) and heat-conducting piece, mold two and mold respectively
Three, and respectively to the intracavitary liquid material for being poured thermal conductive ceramic of the same race of type of mold one, mold two and mold three, after cooling and shaping
It removes mold one, mold two and mold three and thin cover board (1-2), thick mainboard (1-1) and multiple heat-conducting pieces is made, wherein each thermally conductive
The thermally conductive round bar (3) and thermally conductive sheet (4) of part are integrally formed；
Step 2: resistive heater (8) are laid in the snakelike detour groove (1-4) of thick mainboard (1-1), resistive heater (8)
It is connect by conducting wire with external attaching plug, it is later that thin cover board (1-2) and thick mainboard (1-1) is solid by resin glue sticking
It is fixed；
Step 3: it is adhesively fixed heat resistant rubber in each through-hole corresponding position in soaking plate (1) upper surface by high temperature resistant binder
It covers (2)；
Step 4: the through-hole that thermally conductive round bar (3) upper end of multiple heat-conducting pieces passes through soaking plate (1) from bottom to top is closely inserted into
In corresponding heat resistant rubber set (2)；
Step 5: taking base seat (7) surface rubbing and will attach heat insulation layer (7-1) thereon, smears at four columns (6) both ends resistance to
High-temperature agglomerant, and soaking plate (1) and base seat (7) are adhesively fixed by four columns (6), the thermally conductive sheet of multiple heat-conducting pieces
(4) it between soaking plate (1) and base seat (7), is adhesively fixed every thermally conductive round bar (3) upper end by high temperature resistant binder
Insulating rubber head (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810404797.XA CN108962782A (en) | 2018-04-28 | 2018-04-28 | A kind of manufacturing method of chip heating device and chip heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810404797.XA CN108962782A (en) | 2018-04-28 | 2018-04-28 | A kind of manufacturing method of chip heating device and chip heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962782A true CN108962782A (en) | 2018-12-07 |
Family
ID=64499062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810404797.XA Pending CN108962782A (en) | 2018-04-28 | 2018-04-28 | A kind of manufacturing method of chip heating device and chip heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962782A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109798507A (en) * | 2019-01-18 | 2019-05-24 | 江苏久华环保科技股份有限公司 | A kind of high-efficiency evaporator applied to steel production |
| CN111452236A (en) * | 2020-04-16 | 2020-07-28 | 西安奕斯伟硅片技术有限公司 | Crystal bar bonding method and crystal bar bonding device |
| CN118507924A (en) * | 2024-07-18 | 2024-08-16 | 深圳大学 | Soaking plate capable of being used for heating power battery and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001033617A1 (en) * | 1999-10-29 | 2001-05-10 | Applied Materials Inc. | Semiconductor-manufacturing apparatus |
| JP2001338862A (en) * | 2000-05-29 | 2001-12-07 | Kyocera Corp | Wafer heating apparatus |
| JP2002184683A (en) * | 2000-12-19 | 2002-06-28 | Kyocera Corp | Wafer-heating device |
| KR20040001430A (en) * | 2002-06-28 | 2004-01-07 | 참엔지니어링(주) | Apparatus for heating wafer |
| CN208062033U (en) * | 2018-04-28 | 2018-11-06 | 盐城中自科技有限公司 | A kind of chip heating device |
-
2018
- 2018-04-28 CN CN201810404797.XA patent/CN108962782A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001033617A1 (en) * | 1999-10-29 | 2001-05-10 | Applied Materials Inc. | Semiconductor-manufacturing apparatus |
| JP2001338862A (en) * | 2000-05-29 | 2001-12-07 | Kyocera Corp | Wafer heating apparatus |
| JP2002184683A (en) * | 2000-12-19 | 2002-06-28 | Kyocera Corp | Wafer-heating device |
| KR20040001430A (en) * | 2002-06-28 | 2004-01-07 | 참엔지니어링(주) | Apparatus for heating wafer |
| CN208062033U (en) * | 2018-04-28 | 2018-11-06 | 盐城中自科技有限公司 | A kind of chip heating device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109798507A (en) * | 2019-01-18 | 2019-05-24 | 江苏久华环保科技股份有限公司 | A kind of high-efficiency evaporator applied to steel production |
| CN111452236A (en) * | 2020-04-16 | 2020-07-28 | 西安奕斯伟硅片技术有限公司 | Crystal bar bonding method and crystal bar bonding device |
| CN111452236B (en) * | 2020-04-16 | 2022-05-03 | 西安奕斯伟材料科技有限公司 | Crystal bar bonding method and crystal bar bonding device |
| CN118507924A (en) * | 2024-07-18 | 2024-08-16 | 深圳大学 | Soaking plate capable of being used for heating power battery and preparation method thereof |
| CN118507924B (en) * | 2024-07-18 | 2024-10-11 | 深圳大学 | Soaking plate capable of being used for heating power battery and preparation method thereof |
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