CN108957866A - A kind of sealant expansion control method of display panel motherboard - Google Patents
A kind of sealant expansion control method of display panel motherboard Download PDFInfo
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- CN108957866A CN108957866A CN201810571153.XA CN201810571153A CN108957866A CN 108957866 A CN108957866 A CN 108957866A CN 201810571153 A CN201810571153 A CN 201810571153A CN 108957866 A CN108957866 A CN 108957866A
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- etching
- groove
- etching groove
- depth
- desiccant
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Control method is unfolded in the sealant of display panel motherboard provided by the invention, by the outside in female cover board and/or the annular frame glue area of mother substrate, etching groove is set, sealant can effectively be controlled during the pressing process to the excessive expansion of cutting region, so as to avoid the appearance for cutting off viscose phenomenon between simple grain display screen after grain, improve production efficiency, the problem for also avoiding caused display screen breakage during separating viscose, improves the yield of product, reduces production cost；By the inside in female cover board and/or the annular frame glue area of mother substrate, etching groove is set, sealing glue can be effectively avoided to touch display device after pressing expansion, sealing glue is avoided excessively to be unfolded to corrode display device, it improves the yield of product, reduce costs, and due to the presence of etching groove on cutting path, so that the cutting thickness in cutting process is thinned, the efficiency of cutting is improved, the productivity of product is improved, reduces product cost.
Description
Technical field
The present invention relates to the sealants during technical field of display panel more particularly to a kind of fitting of display panel motherboard
Control method is unfolded.
Background technique
Display screen has been the quite high a kind of product of popularization since entering the 21 century unlatching intelligent epoch, is widely used in
It is mobile terminal such as mobile phone or tablet computer, the human-computer interaction of Industry Control such as Pipeline control or digital machine, electronic game, more
The closely bound up every field of multi media for teaching etc. human production life.Display screen is as a kind of mature, convenient and fast information output
Equipment, it is a kind of most simple, natural, the most popular man-machine interaction mode of today's society, it imparts life, production with fine
New looks are modern life, a part indispensable in work.
Currently, LCD display panel and OLED display panel are the display screens of two class mainstreams, LCD display panel has size
The favor that radiationless, flicker free, energy consumption are relatively low in advantage, the course of work, good visual effect is by vast touch screen manufacturer；
OLED is self luminous display screen, does not need backlight, can be realized the ultrathin of screen, and OLED anti-seismic performance it is good, can
Angle is big, the response time is short, refresh rate is fast, low temperature performance well, luminous efficiency are high, contrast is outstanding, flexible etc. many
Feature has been widely used for home videos, automobile middle control, mobile phone etc. now.
Either LCD or OLED is by the way that luminescent material or display material to be packaged by cover board and substrate
One, specific LCD is to be bonded by color membrane cover plate with array substrate, is respectively provided with conductive thin in color membrane cover plate or array substrate
Film layer, then liquid crystal layer is located between color membrane cover plate and array substrate；OLED is bonded by encapsulation cover plate and substrate, then base
Conductive membrane layer is set on plate, cathode, organic function layer are encapsulated between encapsulation cover plate and substrate, and in current production work
In skill, in order to realize automation and the flow line production of height, LCD and OLED are large stretch of fittings, are then cut into simple grain,
During fitting, cover board and substrate are bonded solid by the dispensing on the sticking part of cover board, glue expansion after cover board and substrate are pressurized
It is fixed.But since press equipment ability is limited and sealant has liquid fluidity, the expansion after glue compression is irregular,
On the one hand, the excessive expansion of glue is easy that it is made to touch the conductive membrane layer on substrate after compression, so as to cause conductive film
It is corroded, causes the bad of display screen；On the other hand, the excessive expansion after glue is pressurized tends to exceed the cleavage of cutter
It sets, there is glue to cohere so as to cause between simple grain and a simple grain when cutting off, thus cause to be not easy to disconnect between simple grain and simple grain,
To causing the pipelining of display screen to be affected, reduce working efficiency, toward contact occur cohering due to glue ability compared with
By force, lead to the bad phenomenon of bring display screen during the separation process.
Therefore, effectively controlled during display panel is bonded the expansion of sealant glue for promoted display screen yield,
That improves process efficiency and product competitiveness has vital meaning.
Summary of the invention
The purpose of the present invention is to provide a kind of sealants of display panel motherboard, and control method is unfolded, to solve existing skill
During the fitting of art display panel glue expansion process is uncontrolled and when bring conductive film cuts off vulnerable to burn into
It is not easy to disconnect and bring display screen yield is lower, production efficiency is low technical problem between simple grain and simple grain.
Control method is unfolded in a kind of sealant of display panel motherboard provided by the invention, and the display panel motherboard includes
Array is provided with several ring frames on the opposite mother substrate being bonded of sealed glue and female cover board, the mother substrate and/or female cover board
Jiao Qu is preset with cutting line between the adjacent annular frame glue area；The sealant is opposite with female cover board in the mother substrate
It is coated in front of fitting in the annular frame glue area, is additionally provided with display device floor in the annular frame glue area；
Wherein the control method of sealant expansion at least carries out one of as follows:
(1) the first etching groove is formed on the outside of the annular frame glue area edge of female cover board, in the annular frame glue of female cover board
The second etching groove is formed on the inside of area edge；
(2) third etching groove is formed on the outside of the annular frame glue area edge of the mother substrate, in the annular frame glue of the mother substrate
The 4th etching groove is formed on the inside of area edge.
Further, if the width in the annular frame glue area of female cover board is LC, the width L of the first etching groove1=0.5~1.5LC；
The width L of second etching groove2=0.5~1.5LC；
Further, if the width in the annular frame glue area of mother substrate is LS；The width L of third etching groove3=0.5~1.5LS；4th
The width L of etching groove4=0.5~1.5LS；
Further, if it is described mother cover board with a thickness of HC, the depth of first etching groove is H1=0.3~0.8HC, described
The depth of two etching grooves is H2 =0.3~0.8HC。
Further, if the mother substrate with a thickness of HS, the depth of the third etching groove is H3=0.3~0.8HS, institute
The depth for stating the 4th etching groove is H4=0.3~0.8HS。
Further, when the deep equality of the first etching groove depth and the second etching groove, the first etching groove and the second erosion
Cutting is by with an etch-forming；
Further, when the first etching groove depth is greater than the second etching groove depth, the first etching groove and the second etching groove are logical
After etch-forming twice, the first etching groove, the second etching groove are etched into together specifically, first passing through first time etching work procedure
The depth of second etching groove, then the first etching groove is etched by second of etching work procedure the depth of the first etching groove；
Further, when the second etching groove depth is greater than the first etching groove depth, the first etching groove and the second etching groove are logical
After etch-forming twice, the first etching groove, the second etching groove are etched into together specifically, first passing through first time etching work procedure
The depth of first etching groove, then the second etching groove is etched by second of etching work procedure the depth of the second etching groove.
Further, when the deep equality of third etching groove depth and the 4th etching groove, third etching groove and the 4th erosion
Cutting is by with an etch-forming；
Further, when third etching groove depth is greater than the 4th etching groove depth, third etching groove and the 4th etching groove are logical
After etch-forming twice, third etching groove, the 4th etching groove are etched into together specifically, first passing through first time etching work procedure
The depth of 4th etching groove, then third etching groove is etched by second of etching work procedure the depth of third etching groove；
Further, when the 4th etching groove depth is greater than third etching groove depth, third etching groove and the 4th etching groove are logical
After etch-forming twice, third etching groove, the 4th etching groove are etched into together specifically, first passing through first time etching work procedure
The depth of third etching groove, then the 4th etching groove is etched by second of etching work procedure the depth of the 4th etching groove.
Further, female cover inner surface is provided with desiccant groove, in the first etching groove depth, the second erosion
It is at least equal there are two depth in groove depth, desiccant depth of groove.
Further, the first etching groove depth, the second etching groove depth are respectively less than and are equal to desiccant depth of groove.
Further, when the first etching groove depth, the second etching groove depth, desiccant depth of groove are equal, the first erosion
Cutting, the second etching groove, desiccant groove are by with an etch-forming；
Further, when the first etching groove depth and the second etching groove deep equality, and the depth of the two is respectively less than desiccant
When the depth of groove；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first
The first etching groove, the second etching groove and desiccant groove are etched into the first etching groove, together by first time etching work procedure
The depth of two etching grooves, then pass through second of etching work procedure for desiccant groove etching to the depth of desiccant groove；
Further, when the first etching groove depth is equal with desiccant depth of groove, and the depth of the two is all larger than the second erosion
When the depth of cutting；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first
First etching groove, the second etching groove and desiccant groove are etched into the depth of the second etching groove together by first time etching work procedure
Degree, then the first etching groove, desiccant groove etching to first are etched by groove depth by second of etching work procedure；
Further, when the second etching groove depth is equal with desiccant depth of groove, and the depth of the two is all larger than the first erosion
When the depth of cutting；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first
First etching groove, the second etching groove and desiccant groove are etched into the depth of the first etching groove together by first time etching work procedure
Degree, then the second etching groove, desiccant groove etching to second are etched by groove depth by second of etching work procedure.
Control method is unfolded in a kind of sealant of display panel motherboard provided by the invention, and the display panel motherboard includes
Array is provided with several ring frames on the opposite mother substrate being bonded of sealed glue and female cover board, the mother substrate and/or female cover board
Jiao Qu is preset with cutting line between the adjacent annular frame glue area；The sealant is opposite with female cover board in the mother substrate
It is coated in front of fitting in the annular frame glue area, is additionally provided with display device floor in the annular frame glue area；
Wherein the control method of sealant expansion at least carries out one of as follows:
(1) the first etching groove is formed on the outside of the annular frame glue area edge of female cover board, in the annular frame glue of female cover board
The second etching groove is formed on the inside of area edge；
(2) third etching groove is formed on the outside of the annular frame glue area edge of the mother substrate, in the annular frame glue of the mother substrate
The 4th etching groove is formed on the inside of area edge.
Control method is unfolded in the sealant of display panel motherboard provided by the present invention, on the one hand passes through the ring in female cover board
The first etching groove is arranged in the outside in shape frame glue area, and/or third etching groove, energy is arranged in the outside in the annular frame glue area of mother substrate
Enough effectively control sealants are during the pressing process to the excessive expansion of cutter cutting region, after cutting off grain
The appearance of viscose phenomenon between simple grain display screen, improves production efficiency, and then also avoids causing during separating viscose
Display screen breakage problem, improve the yield of product, reduce production cost；On the other hand, pass through the ring in female cover board
The second etching groove is arranged in the inside in shape frame glue area, and/or the 4th etching groove, energy is arranged in the inside in the annular frame glue area of mother substrate
It is enough that sealing glue is effectively avoided to touch display device after pressing expansion, it eliminates since sealing glue is excessively unfolded to corrode
Display device and the problem for causing display screen bad, further improve the yield of display screen, reduce costs, in addition, due to
The presence of first etching groove and/or third etching groove on cutting path, so that the cutting thickness in cutting process is thinned, to mention
The efficiency for having risen cutting is beneficial for promoting the productivity of product, reducing product cost.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the close of the display panel motherboard improved for female ceiling plate portion that one of embodiment of the present invention provides
The OLED display panel sheet schematic diagram that sealing expansion control method is prepared；
Fig. 2 is the partial enlargement diagram of Fig. 1；
Fig. 3 is the sealant of the present invention display panel motherboard improved for female cover board that wherein another embodiment provides
The OLED display panel sheet schematic diagram that expansion control method is prepared；
Fig. 4 is the partial enlargement diagram of Fig. 3；
Fig. 5 is the sealant of the present invention display panel motherboard improved for female cover board that wherein another embodiment provides
The OLED display panel sheet schematic diagram that expansion control method is prepared；
Fig. 6 is the partial enlargement diagram of Fig. 5；
Fig. 7 is the sealant of the present invention display panel motherboard improved for female cover board that wherein another embodiment provides
The OLED display panel sheet schematic diagram that expansion control method is prepared；
Fig. 8 is the partial enlargement diagram of Fig. 7；
Fig. 9 is the sealant of the present invention display panel motherboard improved for mother substrate that wherein another embodiment provides
The OLED display panel sheet schematic diagram that expansion control method is prepared；
Figure 10 is the partial enlargement diagram of Fig. 9；
Figure 11 is directed to female cover board and mother substrate while the display surface improved for what wherein another embodiment of the invention provided
The LCD display panel sheet schematic diagram that the sealant expansion control method of plate motherboard is prepared；
Figure 12 is the partial enlargement diagram of Figure 11.
Appended drawing reference:
1- cutter；Mother's 2- cover board；3- annular frame glue area；The first etching groove of 4-；5- sealant；6- desiccant；7- mother substrate；8-
Anode layer；9- organic function layer；10- cathode layer；The second etching groove of 11-；12- desiccant groove；13- third etching groove；14-
Four etching grooves；15- liquid crystal layer.
Specific embodiment
In the description of the present invention, it should be noted that unless being equipped with specific regulation and limiting, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 is the close of the display panel motherboard improved for female ceiling plate portion that one of embodiment of the present invention provides
The OLED display panel sheet schematic diagram that sealing expansion control method is prepared；Fig. 2 is the partial enlargement diagram of Fig. 1；Fig. 3
For the sealant expansion control of the present invention display panel motherboard improved for female cover board that wherein another embodiment provides
The OLED display panel sheet schematic diagram that method processed is prepared；Fig. 4 is the partial enlargement diagram of Fig. 3；Fig. 5 be the present invention its
In the sealant expansion control method preparation of the display panel motherboard improved for female cover board that provides of another embodiment
Obtained OLED display panel sheet schematic diagram；Fig. 6 is the partial enlargement diagram of Fig. 5；Fig. 7 is the present invention wherein another reality
Apply the OLED that the sealant expansion control method for the display panel motherboard of example offer improved for female cover board is prepared
Display panel sheet schematic diagram；Fig. 8 is the partial enlargement diagram of Fig. 7；Wherein another embodiment provides Fig. 9 present invention
The OLED display panel being prepared for the sealant expansion control method for the display panel motherboard that mother substrate improves is big
Piece schematic diagram；Figure 10 is the partial enlargement diagram of Fig. 9；Figure 11 is that the present invention mother that is directed to that wherein another embodiment provides is covered
The LCD display panel that the sealant expansion control method for the display panel motherboard that plate and mother substrate improve simultaneously is prepared
Large stretch of schematic diagram；Figure 12 is the partial enlargement diagram of Figure 11.
Embodiment 1
As shown in Figs. 1-2, control method is unfolded in a kind of sealant of OLED display panel motherboard provided in this embodiment, in sheet
Several annular frame glue areas 3 are set on female cover board 2 of OLED display panel, and the sealant 5 is in 2 phase of mother substrate 7 and female cover board
To being coated in the annular frame glue area 3 before fitting, it is preset with cutting line between adjacent annular frame glue area 3, cutter 1
Cutting path is overlapped with cutting line, forms the first etching groove 4 on the outside of annular 3 edge of frame glue area of female cover board 2,
The second etching groove is formed on the inside of annular 3 edge of frame glue area of mother's cover board 2, mother's 2 inner surface of cover board is provided with desiccant
Groove；It further include display device and desiccant 6 between female cover board 2 and mother substrate 7, display device includes being sequentially formed at the mother
Anode layer 8, organic function layer 9 and cathode layer 10 on substrate 7；Desiccant 6 is arranged in the desiccant groove of female cover board 2；
In the present embodiment, the first etching groove, the second etching groove and desiccant groove depth having the same, therefore, definition the
The width L of two etching grooves2For the minimum range between annular 3 inward flange of frame glue area and display device, if the width in annular frame glue area 3
Degree is LCIf the width of the first etching groove 4 is L1, L1=0.6LC, L2=0.5LC；If it is described mother cover board 2 with a thickness of HC, described
The depth of one etching groove 4 is H1=0.5HC, the depth of second etching groove is H2 =0.5HC；The depth of the desiccant groove
HD=0.5HC。
First etching groove, the second etching groove and desiccant groove are obtained by an etch-forming.
The technical solution of substitution as the present embodiment, the width L of the second etching groove2It can be 0.5 ~ 1.5LCIn remove
0.5LCOther values, if L2It is too small, although being controlled favorably for screen size, sealant can be greatly increased and touch display
The probability of device, if L2Without the control of the upper limit, although it, which can be avoided sealant, touches display device, this for
The size Control of display screen is unfavorable.
The technical solution of substitution as the present embodiment, the width L of the first etching groove1It can be 0.5 ~ 1.5LCIn remove
0.6LCOther values, L1Reserve too small, then the viscose problem between simple grain display screen cannot be avoided effectively, but L1If crossed
Greatly, then it will lead to that display screen tailing is excessive, influence the size arrangement of display screen, while cover plate materials cannot be made full use of,
Cause material waste.
As the technical solution of the present embodiment, the depth H of the first etching groove1It can be 0.3 ~ 0.8HCIn remove 0.5HCIts
It is worth, H1Too small, the excessive expansion for sealing glue controls unfavorable while unobvious to the raising of cutting process efficiency, H1It crosses
Greatly, leading to the endurance of female cover board can be deteriorated.
Embodiment 2
As shown in Figure 3-4, control method is unfolded in a kind of sealant of OLED display panel motherboard provided in this embodiment, in sheet
Several annular frame glue areas 3 are set on female cover board 2 of OLED display panel, and the sealant 5 is in 2 phase of mother substrate 7 and female cover board
To being coated in the annular frame glue area 3 before fitting, it is preset with cutting line between adjacent annular frame glue area 3, cutter 1
Cutting path is overlapped with cutting line, forms the first etching groove 4 on the outside of annular 3 edge of frame glue area of female cover board 2,
The second etching groove is formed on the inside of annular 3 edge of frame glue area of mother's cover board 2, mother's 2 inner surface of cover board is provided with desiccant
Groove；It further include display device and desiccant 6 between female cover board 2 and mother substrate 7, display device includes being sequentially formed at the mother
Anode layer 8, organic function layer 9 and cathode layer 10 on substrate 7；Desiccant 6 is arranged in the desiccant groove of female cover board 2；
In the present embodiment, the second etching groove and desiccant groove depth having the same, before the depth of the first etching groove is less than
The depth of the two is stated, therefore, defines the width L of the second etching groove2Between annular 3 inward flange of frame glue area and display device most
Small distance, if the width in annular frame glue area 3 is LCIf the width of the first etching groove 4 is L1, L1=0.7LC, L2=0.4LC；If described
Female cover board 2 with a thickness of HC, the depth of first etching groove 4 is H1=0.3HC, the depth of second etching groove is H2 =
0.5HC；The depth H of the desiccant grooveD=0.5HC。
First etching groove, the second etching groove and desiccant groove are formed by second etch；Specifically,
It first passes through first time etching work procedure and the first etching groove, the second etching groove and desiccant groove is etched into the first etching groove together
Depth H1, then pass through second of etching work procedure for the second etching groove, desiccant groove etching to the second etching groove depth H2。
Embodiment 3
As seen in figs. 5-6, control method is unfolded in a kind of sealant of OLED display panel motherboard provided in this embodiment, in sheet
Several annular frame glue areas 3 are set on female cover board 2 of OLED display panel, and the sealant 5 is in 2 phase of mother substrate 7 and female cover board
To being coated in the annular frame glue area 3 before fitting, it is preset with cutting line between adjacent annular frame glue area 3, cutter 1
Cutting path is overlapped with cutting line, forms the first etching groove 4 on the outside of annular 3 edge of frame glue area of female cover board 2,
Forming 11 second etching groove 11 of the second etching groove on the inside of annular 3 edge of frame glue area of mother's cover board 2 is dotted line in Fig. 5, Fig. 6
With the region between annular 3 inward flange of frame glue area, mother's 2 inner surface of cover board is provided with desiccant groove 12；Female cover board 2 and mother
It further include display device and desiccant 6 between substrate 7, display device includes the anode layer being sequentially formed on the mother substrate 7
8, organic function layer 9 and cathode layer 10；Desiccant 6 is arranged in the desiccant groove 12 of female cover board 2；
In the present embodiment, the first etching groove 4 and the depth having the same of desiccant groove 12, the depth of the second etching groove 11 are small
In the depth of both, therefore, if the width L of the second etching groove 112If the width in annular frame glue area 3 is LCIf the first erosion
The width of cutting 4 is L1, L1=0.75LC, L2=0.45LC；If it is described mother cover board 2 with a thickness of HC, the depth of first etching groove 4
Degree is H1=0.5HC, the depth of second etching groove 11 is H2 =0.3HC；The depth H of the desiccant groove 12D=0.5HC。
First etching groove, the second etching groove and desiccant groove are formed by second etch；Specifically,
It first passes through first time etching work procedure and the first etching groove, the second etching groove and desiccant groove is etched into the second etching groove together
Depth H2, then pass through second of etching work procedure for the first etching groove, desiccant groove etching to the first etching groove depth H1。
Embodiment 4
As Figure 7-8, control method is unfolded in a kind of sealant of OLED display panel motherboard provided in this embodiment, in sheet
Several annular frame glue areas 3 are set on female cover board 2 of OLED display panel, and the sealant 5 is in 2 phase of mother substrate 7 and female cover board
To being coated in the annular frame glue area 3 before fitting, it is preset with cutting line between adjacent annular frame glue area 3, cutter 1
Cutting path is overlapped with cutting line, forms the first etching groove 4 on the outside of annular 3 edge of frame glue area of female cover board 2,
Forming 11 second etching groove 11 of the second etching groove on the inside of annular 3 edge of frame glue area of mother's cover board 2 is dotted line in Fig. 7, Fig. 8
With the region between annular 3 inward flange of frame glue area, mother's 2 inner surface of cover board is provided with desiccant groove 12；Female cover board 2 and mother
It further include display device and desiccant 6 between substrate 7, display device includes the anode layer being sequentially formed on the mother substrate 7
8, organic function layer 9 and cathode layer 10；Desiccant 6 is arranged in the desiccant groove 12 of female cover board 2；
In the present embodiment, the deep equality of the first etching groove 4 and the second etching groove 11, the first etching groove 4, the second etching groove 11
Depth be less than desiccant groove 12 depth, therefore, if the width L of the second etching groove 112If the width in annular frame glue area 3
For LCIf the width of the first etching groove 4 is L1, L1=0.8LC, L2=0.6LC；If it is described mother cover board 2 with a thickness of HC, described first
The depth of etching groove 4 is H1=0.3HC, the depth of second etching groove 11 is H2 =0.3HC；The depth of the desiccant groove 12
Spend HD=0.5HC。
First etching groove, the second etching groove and desiccant groove are formed by second etch；Specifically,
It first passes through first time etching work procedure and the first etching groove, the second etching groove and desiccant groove is etched into the second etching groove together
Depth H2, then pass through second of etching work procedure for desiccant groove etching to desiccant depth of groove HD。
Embodiment 5
As shown in Fig. 9 ~ 10, a kind of sealant expansion control method of OLED display panel motherboard provided in this embodiment, big
Several annular frame glue areas 3 are set on female cover board 2 of piece OLED display panel, and the sealant 5 is in mother substrate 7 and female cover board 2
It is coated in front of opposite fitting in the annular frame glue area 3, is preset with cutting line, cutter 1 between adjacent annular frame glue area 3
Cutting path be overlapped with cutting line, on the outside of annular 3 edge of frame glue area of the mother substrate 7 formed third etching groove
13, the 4th etching groove 14 is formed on the inside of annular 3 edge of frame glue area of the mother substrate 7, mother's 2 inner surface of cover board is provided with
Desiccant groove 12；It further include display device and desiccant 6 between female cover board 2 and mother substrate 7, display device includes sequentially forming
Anode layer 8, organic function layer 9 and cathode layer 10 on the mother substrate 7；The desiccant that female cover board 2 is arranged in desiccant 6 is recessed
In slot 12；
In the present embodiment, third etching groove 13 and the depth having the same of the 4th etching groove 14, therefore, if third etching groove 13
Width L3If the width in annular frame glue area 3 is LSIf the width of third etching groove 13 is L3, L3=0.6LS, L4=0.8LS；If
The mother substrate 7 with a thickness of HS, the depth of the third etching groove 13 is H3=0.3HS, the depth of the 4th etching groove 14
For H4 =0.3HS；That is third etching groove 13 and the depth having the same of the 4th etching groove 14.
The third etching groove, the 4th etching groove are obtained by an etch-forming.
The technical solution of substitution as the present embodiment, the width L of third etching groove3It can be 0.5 ~ 1.5LSIn remove
0.6LSOther values, L3Reserve too small, then the viscose problem between simple grain display screen cannot be avoided effectively, but L3If crossed
Greatly, then it will lead to that display screen tailing is excessive, influence the size arrangement of display screen, while cover plate materials cannot be made full use of,
Cause material waste.
The technical solution of substitution as the present embodiment, the depth H of the 4th etching groove4It can be with 0.3 ~ 0.8HSIn remove
0.3HSOther values, if H4It is too small, then it cannot effectively avoid the expansion of sealant to control, if H4Excessive, then mother substrate is held
Stress can be deteriorated.
Embodiment 6
As shown in Figure 11 ~ 12, a kind of sealant expansion control method of LCD display panel motherboard provided in this embodiment, big
Several annular frame glue areas 3 are respectively provided on the female cover board 2 and mother substrate 7 of piece LCD display panel, the sealant 5 is in mother substrate 7
It is coated in the annular frame glue area 3 with before the opposite fitting of female cover board 2, is preset with cutting between adjacent annular frame glue area 3
The cutting path of line, cutter 1 is overlapped with cutting line, and the is formed on the outside of annular 3 edge of frame glue area of female cover board 2
One etching groove 4 forms the second etching groove 11 on the inside of annular 3 edge of frame glue area of female cover board 2；In the mother substrate 7
Third etching groove 13 is formed on the outside of annular 3 edge of frame glue area, and the 4th is formed on the inside of the cyclic annular frame glue area edge of the mother substrate 7
Etching groove 14；It further include liquid crystal layer 15 between female cover board 2 and mother substrate 7；
In the present embodiment, the deep equality of the first etching groove 4 and the second etching groove 11, if the width of the first etching groove 4 is L1,
If the width of the second etching groove 11 is L2If the width in the cyclic annular frame glue area of female cover board 2 is LC；L1=0.7LC, L2=0.6LC；If institute
State female cover board 2 with a thickness of HC, the depth of first etching groove 4 is H1=0.5HC, the depth of second etching groove 11 is H2
=0.5HC；
The deep equality of third etching groove 13 and the 4th etching groove 14, if the width of third etching groove 13 is L3If the 4th etching
The width of slot 14 is L4If the width in the cyclic annular frame glue area of mother substrate 7 is LS；L3=0.7LS, L4=0.6LS；If the mother substrate 7
With a thickness of HS, the depth of the third etching groove 13 is H3=0.3HS, the depth of the 4th etching groove 14 is H4 =0.3HS；
First etching groove, the second etching groove and desiccant groove are obtained by an etch-forming；Third etching groove,
4th etching groove and desiccant groove are obtained by an etch-forming.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, but those skilled in the art should understand that: its
It is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features
It is equivalently replaced；And these are modified or replaceed, various embodiments of the present invention skill that it does not separate the essence of the corresponding technical solution
The range of art scheme.
Claims (8)
1. control method is unfolded in a kind of sealant of display panel motherboard, which is characterized in that the display panel motherboard includes warp
Array is provided with several annular frame glues on the opposite mother substrate being bonded of sealant and female cover board, the mother substrate and/or female cover board
Area is preset with cutting line between the adjacent annular frame glue area；The sealant is in the mother substrate and the opposite patch of female cover board
It is coated in front of closing in the annular frame glue area, is additionally provided with display device floor in the annular frame glue area；
Wherein the control method of sealant expansion at least carries out one of as follows:
(1) the first etching groove is formed on the outside of the annular frame glue area edge of female cover board, in the annular frame glue of female cover board
The second etching groove is formed on the inside of area edge；
(2) third etching groove is formed on the outside of the annular frame glue area edge of the mother substrate, in the annular frame glue of the mother substrate
The 4th etching groove is formed on the inside of area edge.
2. control method is unfolded in a kind of sealant of display panel motherboard according to claim 1, which is characterized in that set institute
State female cover board with a thickness of HC, the depth of first etching groove is H1=0.3~0.8HC, the depth of second etching groove is H2
=0.3~0.8HC。
3. control method is unfolded in a kind of sealant of display panel motherboard according to claim 1, which is characterized in that set institute
State mother substrate with a thickness of HS, the depth of the third etching groove is H3=0.3~0.8HS, the depth of the 4th etching groove is H4
=0.3~0.8HS。
4. a kind of according to claim 1, sealant expansion controlling party of display panel motherboard described in any one of 2 claims
Method, it is characterised in that:
When the deep equality of the first etching groove depth and the second etching groove, the first etching groove and the second etching groove are by same
Secondary etch-forming；
When the first etching groove depth is greater than the second etching groove depth, the first etching groove and the second etching groove are by etching twice
It is molding, the first etching groove, the second etching groove are etched into the second etching groove together specifically, first passing through first time etching work procedure
Depth, then the first etching groove is etched by second of etching work procedure the depth of the first etching groove；
When the second etching groove depth is greater than the first etching groove depth, the first etching groove and the second etching groove are by etching twice
It is molding, the first etching groove, the second etching groove are etched into the first etching groove together specifically, first passing through first time etching work procedure
Depth, then the second etching groove is etched by second of etching work procedure the depth of the second etching groove.
5. a kind of according to claim 1, sealant expansion controlling party of display panel motherboard described in any one of 3 claims
Method, it is characterised in that:
When the deep equality of third etching groove depth and the 4th etching groove, third etching groove and the 4th etching groove are by same
Secondary etch-forming；
When third etching groove depth is greater than the 4th etching groove depth, third etching groove and the 4th etching groove are by etching twice
It is molding, third etching groove, the 4th etching groove are etched into the 4th etching groove together specifically, first passing through first time etching work procedure
Depth, then third etching groove is etched by second of etching work procedure the depth of third etching groove；
When the 4th etching groove depth is greater than third etching groove depth, third etching groove and the 4th etching groove are by etching twice
It is molding, third etching groove, the 4th etching groove are etched into third etching groove together specifically, first passing through first time etching work procedure
Depth, then the 4th etching groove is etched by second of etching work procedure the depth of the 4th etching groove.
6. a kind of according to claim 1, sealant expansion controlling party of display panel motherboard described in any one of 2 claims
Method, which is characterized in that mother's cover inner surface is provided with desiccant groove, in the first etching groove depth, the second etching
It is at least equal there are two depth in groove depth, desiccant depth of groove.
7. control method is unfolded in a kind of sealant of display panel motherboard according to claim 6, which is characterized in that first
Etching groove depth, the second etching groove depth are respectively less than and are equal to desiccant depth of groove.
8. control method is unfolded in a kind of sealant of display panel motherboard according to claim 7, it is characterised in that:
When the first etching groove depth, the second etching groove depth, desiccant depth of groove are equal, the first etching groove, the second etching
Slot, desiccant groove are by with an etch-forming；
When the first etching groove depth and the second etching groove deep equality, and the depth of the two is respectively less than the depth of desiccant groove
When；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first passing through for the first time
First etching groove, the second etching groove and desiccant groove are etched into the first etching groove, the second etching groove by etching work procedure together
Depth, then pass through second of etching work procedure for desiccant groove etching to the depth of desiccant groove；
When the first etching groove depth is equal with desiccant depth of groove, and the depth of the two is all larger than the depth of the second etching groove
When；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first passing through for the first time
First etching groove, the second etching groove and desiccant groove are etched into the depth of the second etching groove by etching work procedure together, then are passed through
First etching groove, desiccant groove etching to first are etched groove depth by second of etching work procedure；
When the second etching groove depth is equal with desiccant depth of groove, and the depth of the two is all larger than the depth of the first etching groove
When；First etching groove, the second etching groove and desiccant groove are by etch-forming twice, specifically, first passing through for the first time
First etching groove, the second etching groove and desiccant groove are etched into the depth of the first etching groove by etching work procedure together, then are passed through
Second etching groove, desiccant groove etching to second are etched groove depth by second of etching work procedure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810571153.XA CN108957866A (en) | 2018-06-05 | 2018-06-05 | A kind of sealant expansion control method of display panel motherboard |
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|---|---|---|---|
| CN201810571153.XA CN108957866A (en) | 2018-06-05 | 2018-06-05 | A kind of sealant expansion control method of display panel motherboard |
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| CN201810571153.XA Pending CN108957866A (en) | 2018-06-05 | 2018-06-05 | A kind of sealant expansion control method of display panel motherboard |
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| CN111007686A (en) * | 2019-11-14 | 2020-04-14 | Tcl华星光电技术有限公司 | Array substrate, display panel and preparation method |
| CN111479431A (en) * | 2019-09-27 | 2020-07-31 | 友达光电股份有限公司 | System frame sealing structure and display device comprising same |
| CN111638605A (en) * | 2020-06-04 | 2020-09-08 | 武汉华星光电技术有限公司 | Display panel mother board and display panel |
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Application publication date: 20181207 |