CN109799652A - The production method of motherboard structure and liquid crystal display panel - Google Patents
The production method of motherboard structure and liquid crystal display panel Download PDFInfo
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- CN109799652A CN109799652A CN201910234487.2A CN201910234487A CN109799652A CN 109799652 A CN109799652 A CN 109799652A CN 201910234487 A CN201910234487 A CN 201910234487A CN 109799652 A CN109799652 A CN 109799652A
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- motherboard
- adhesive tape
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 136
- 239000002390 adhesive tape Substances 0.000 claims abstract description 133
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 238000007789 sealing Methods 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 7
- 230000035939 shock Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 10
- 238000012545 processing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
Abstract
The present invention provides the production method of a kind of motherboard structure and liquid crystal display panel.The motherboard structure includes: the first motherboard and multiple main glue frames, a peripheral glue frame, multiple conductive adhesive tapes and multiple protection glue frames on first motherboard；The periphery glue frame is arranged around the edge of first motherboard, and the peripheral glue frame is equipped with multiple spaced openings；First motherboard includes multiple first substrates of array arrangement; each main glue frame is corresponding around a first substrate setting; each corresponding first substrate is provided with a conductive adhesive tape; each conductive adhesive tape is surrounded in the multiple protection glue frame sealing; the protection glue frame of each conductive adhesive tape is surrounded by setting sealing; conductive adhesive tape is deformed or is fallen off caused by can be avoided because of gas shock or motherboard bending, and it is bad to reduce product.
Description
Technical field
The present invention relates to field of display technology more particularly to the production methods of a kind of motherboard structure and liquid crystal display panel.
Background technique
With the development of display technology, the planes such as liquid crystal display (Liquid Crystal Display, LCD) display dress
It sets because having many advantages, such as that high image quality, power saving, fuselage is thin and has a wide range of application, and is widely used in mobile phone, TV, a number
The various consumer electrical products such as word assistant, digital camera, laptop, desktop computer, become the master in display device
Stream.
Liquid crystal display device on existing market is largely backlight liquid crystal display comprising liquid crystal display panel and
Backlight module (backlight module).The working principle of liquid crystal display panel is put in the parallel glass substrate of two panels
Liquid crystal molecule is set, there are many tiny electric wires vertically and horizontally for two panels glass substrate centre, control liquid crystal whether by being powered
The light refraction of backlight module is come out and generates picture by molecular changes direction.
Usual liquid crystal display panel is by color membrane substrates (CF, Color Filter), thin film transistor base plate (TFT, Thin
Film Transistor), the liquid crystal (LC, Liquid Crystal) that is sandwiched between color membrane substrates and thin film transistor base plate and
Sealing glue frame (Sealant) composition, moulding process generally comprises: leading portion array (Array) processing procedure (film, yellow light, etching and
Stripping), middle section is at box (Cell) processing procedure (TFT substrate is bonded with CF substrate) and back segment module group assembling processing procedure (driving IC and printing
Press fit of circuit boards).Wherein, leading portion Array processing procedure mainly forms TFT substrate, in order to control the movement of liquid crystal molecule；Middle section
Cell processing procedure mainly adds liquid crystal between TFT substrate and CF substrate；Back segment module group assembling processing procedure mainly drives IC pressing
With the integration of printed circuit board, and then drive liquid crystal molecule rotation, show image.
After forming the box, it needs to carry out orientation to liquid crystal, so that liquid crystal is had certain pre-tilt angle, light orientation is currently used
A kind of alignment direction, specifically: certain voltage is added in upper and lower base plate, liquid crystal experiences voltage, deflects, then irradiate one
Fixed ultraviolet light carries out orientation to liquid crystal, forms pre-tilt angle；Wherein, can only generally add to side substrate when being powered on to substrate
Electricity, the voltage of other side substrate are by connecting the conductive adhesive tape (transfer AU) of two substrates from side board transport to another
Side substrate, that is to say, that the substrate of the other side is surely unstable either with or without electric or addition voltage is added, and depends on conducting resinl
Whether item is good with two substrates contact, as shown in Figure 1, in existing motherboard structure, on peripheral glue frame (Loop Seal) 100
With multiple openings 101, conductive adhesive tape 300 outside main glue frame 200 in peripheral glue frame 100, alignment manufacture process is needed in motherboard
Structure carries out composition box with the opposed motherboard that the motherboard structure cooperates later, and needs during to composition box by vacuum
Fitting and the step of vacuum breaker, wherein air-flow can enter 100 internal impact of outline border glue frame from opening 101 the vacuum breaker the step of
Conductive adhesive tape 300 so that deform or fall off (Peeling) occurs in conductive adhesive tape 300, and then causes to connect liquid crystal display panel
Two sides substrate poor contact, voltage can not be conducted between two substrates, and then cause product bad, while cutting in motherboard
It cuts in step, the bending (bending) of substrate may also cause fall off (Peeling) of conductive adhesive tape 200, lead to product not
It is good.
Summary of the invention
The purpose of the present invention is to provide a kind of motherboard structures, can be avoided conductive adhesive tape deformation or fall off, prevent product
It is bad.
The object of the invention is also to provide a kind of production methods of liquid crystal display panel, can be avoided conductive adhesive tape deformation
Or fall off, prevent product bad.
To achieve the above object, the present invention provides a kind of motherboard structure, comprising: the first motherboard and to be set to described first female
Multiple main glue frames, a peripheral glue frame, multiple conductive adhesive tapes and multiple protection glue frames on plate；
The periphery glue frame is arranged around the edge of first motherboard, and the peripheral glue frame is arranged equipped with multiple intervals
The opening of column；
First motherboard includes multiple first substrates of array arrangement, each main glue frame is corresponding to surround first base
Plate setting, each corresponding first substrate are provided with a conductive adhesive tape, and the multiple protection glue frame sealing encirclement is described each to be led
Electric adhesive tape.
On the first motherboard in multiple first substrates of adjacent rows, wherein the first substrate of a line is respectively provided with the first ruler
Very little, the first substrate of another row is respectively provided with the second size, and the first size is different from the second size；
Adjacent corresponding two conductive adhesive tape of two first substrates is connected to form a conductive adhesive tape group on column direction；
The conductive adhesive tape group is corresponding to be located at one of the first substrate in two adjacent first substrates with the second size
Side and be located around this with the second size first substrate main glue frame outside.
The quantity of the protection glue frame is equal with the quantity of the conductive adhesive tape group, each protection glue frame sealing surrounds one
A conductive adhesive tape group and a main glue frame of the conductive adhesive tape group side.
The quantity of the protection glue frame is equal with the line number of the conductive adhesive tape group, each protection glue frame sealing surrounds one
Row conductive adhesive tape group and the main glue frame of a line corresponding with the row conductive adhesive tape group.
The present invention also provides a kind of production methods of liquid crystal display panel, include the following steps:
Step S1, the first motherboard is provided, first motherboard includes multiple first substrates of array arrangement；
Step S2, multiple main glue frames are set on first motherboard, each main glue frame is corresponding to surround first base
Plate setting, and liquid crystal material is instilled in each main glue frame；
Step S3, the peripheral glue frame of setting one on first motherboard, the periphery glue frame is around first motherboard
Edge setting, and the peripheral glue frame is equipped with multiple spaced openings；
Step S4, multiple conductive adhesive tapes are set in first motherboard, each conductive adhesive tape is correspondingly connected with one first
Substrate；
Step S5, multiple protection glue frames are set on first motherboard, and the multiple protection glue frame seals described in encirclement
Each conductive adhesive tape；
Step S6, the second motherboard is provided, second motherboard includes multiple the second substrates of array arrangement；
Step S7, second motherboard and first motherboard progress is vacuum abutted, so that each first substrate pair
Ying Yuyi the second substrate fitting, breaking vacuum obtains multiple liquid crystal display panels after the completion of fitting.
On the first motherboard in multiple first substrates of adjacent rows, wherein the first substrate of a line is respectively provided with the first ruler
Very little, the first substrate of another row is respectively provided with the second size, and the first size is different from the second size；
Adjacent corresponding two conductive adhesive tape of two first substrates is connected to form a conductive adhesive tape group on column direction；
The conductive adhesive tape group is corresponding to be located at one of the first substrate in two adjacent first substrates with the second size
Side and be located around this with the second size first substrate main glue frame outside.
The quantity of the protection glue frame is equal with the quantity of the conductive adhesive tape group, each protection glue frame sealing surrounds one
A conductive adhesive tape group and a main glue frame of the conductive adhesive tape group side.
The quantity of the protection glue frame is equal with the line number of the conductive adhesive tape group, each protection glue frame sealing surrounds one
Row conductive adhesive tape group and the main glue frame of a line corresponding with the row conductive adhesive tape group.
The liquid crystal material is photosensitive liquid crystal material.
The production method of the liquid crystal display panel further include:
Step S8, apply orientation signal to first substrate described in each, while being matched by described in by the conductive adhesive tape
It is transferred in corresponding the second substrate to signal；
Step S9, the liquid crystal material irradiating ultraviolet light into each liquid crystal display panel, to carry out orientation.
Beneficial effects of the present invention: the present invention provides a kind of motherboard structure.The motherboard structure include: the first motherboard and
Multiple main glue frames, a peripheral glue frame, multiple conductive adhesive tapes and multiple protection glue frames on first motherboard；The periphery
Glue frame is arranged around the edge of first motherboard, and the peripheral glue frame is equipped with multiple spaced openings；Described
One motherboard includes multiple first substrates of array arrangement, each main glue frame is corresponding around a first substrate setting, corresponding every
One first substrate is provided with a conductive adhesive tape, and each conductive adhesive tape is surrounded in the multiple protection glue frame sealing, by setting
The protection glue frame that each conductive adhesive tape is surrounded in sealing is set, conductive adhesive tape caused by can be avoided because of gas shock or motherboard bending
It deforms or falls off, it is bad to reduce product.The present invention also provides a kind of production methods of liquid crystal display panel, can be avoided conducting resinl
Item is deformed or is fallen off, and prevents product bad.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the schematic diagram of existing motherboard structure；
Fig. 2 is the schematic diagram of the first embodiment of motherboard structure of the invention；
Fig. 3 is the schematic diagram of the second embodiment of motherboard structure of the invention；
Fig. 4 is the schematic diagram of the step S7 of the production method of liquid crystal display panel of the invention；
Fig. 5 is the flow chart of the production method of liquid crystal display panel of the invention.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Please refer to figs. 2 and 3, and the present invention provides a kind of motherboard structure, comprising: the first motherboard 1 and be set to described first
The peripheral glue frame 3 of multiple main glue frames 2, one, multiple conductive adhesive tapes 4 and a protection glue frame 5 on motherboard 1；
The periphery glue frame 3 is arranged around the edge of first motherboard 1, and the peripheral glue frame 3 is equipped with multiple
Every the opening 31 of arrangement；
Multiple first substrates 11 of first motherboard 1 including array arrangement, each main glue frame 2 are corresponding around one the
The setting of one substrate 11, each corresponding first substrate 11 are provided with a conductive adhesive tape 4, and the multiple sealing of protection glue frame 5 is surrounded
Each conductive adhesive tape 4.
Specifically, as shown in Fig. 2, on the first motherboard 1 in multiple first substrates 11 of adjacent rows, wherein the of a line
One substrate 11 is respectively provided with first size, and the first substrate 11 of another row is respectively provided with the second size, and the first size is different
In the second size；
Adjacent corresponding two conductive adhesive tape 4 of two first substrates 11 is connected to form a conductive adhesive tape group on column direction
41；
The corresponding first substrate being located in two adjacent first substrates 11 with the second size of the conductive adhesive tape group 41
11 side and be located around this with the second size first substrate 11 main glue frame 2 outside；
Further, as shown in Fig. 2, in some embodiments of the invention, first motherboard 1 includes in 4 rows 4 column row
16 first substrates 11 of cloth, wherein first and the first substrate 11 of the third line be respectively provided with first size, second and fourth line
First substrate 11 be respectively provided with the second size, the left side of each the second size first substrate 11 be equipped with a conductive adhesive tape
Group 41, the conductive adhesive tape group 41 include two connected conductive adhesive tapes 4, which, which respectively corresponds this, has second
The first substrate 11 of size and this there is the first substrate 11 on the upside of the first substrate 11 of the second size with first size to be arranged.
Specifically, each as shown in Fig. 2, the quantity of the protection glue frame 5 is equal with the quantity of the conductive adhesive tape group 41
A conductive adhesive tape group 41 and a main glue frame 2 namely the guarantor of 41 side of conductive adhesive tape group are surrounded in a protection glue frame 5 sealing
The quantity for protecting glue frame 5 is 8, and it is 2 conductive adhesive tapes 4 that each protection glue frame 5, which surrounds 1 conductive adhesive tape group 41,.
Further, as shown in Fig. 2, in some embodiments of the invention, first motherboard 1 includes in 4 rows 4 column row
16 first substrates 11 of cloth, wherein first and the first substrate 11 of the third line be respectively provided with first size, second and fourth line
First substrate 11 be respectively provided with the second size, the left side of each the second size first substrate 11 be equipped with a conductive adhesive tape
Group 41, the conductive adhesive tape group 41 include two connected conductive adhesive tapes 4, which, which respectively corresponds this, has second
The first substrate 11 of size and this there is the first substrate 11 with first size of the upside of first substrate 11 of the second size to set
It sets.
Specifically, each as shown in figure 3, the quantity of the protection glue frame 5 is equal with the line number of the conductive adhesive tape group 41
A line conductive adhesive tape group 41 and the main glue frame 2 of a line corresponding with the row conductive adhesive tape group 41 are surrounded in a sealing of protection glue frame 5, namely
The quantity of the protection glue frame 5 is 2, and it is 8 conductive adhesive tapes 4 that each protection glue frame 5, which surrounds 4 conductive adhesive tape groups 41,.
Optionally, the shape of each protection glue frame 5 is rectangle, round or ellipse.
Optionally, second size is less than first size.
Optionally, the material of the conductive adhesive tape 4 is conductive gold size (Au Seal).
It is worth mentioning, in other embodiments of the invention, the row of the arrangement mode of first substrate 11, conductive adhesive tape 4
Column mode and protect the set-up mode of glue frame 5 that can also make corresponding deformation, as long as the multiple protection glue frame 5 can will be every
One conductive adhesive tape 4 is all sealed protection, so that conductive adhesive tape 4 obtains protection.
It should be noted that the protection glue frame 5 of each conductive adhesive tape 4 is surrounded by setting sealing, in motherboard to a group fitting
When vacuum breaker, protection glue frame 5 can stop gas shock conductive adhesive tape 4, caused by avoiding because of gas shock conductive adhesive tape deformation or
It falls off, in motherboard bending, protection glue frame 5 can share pressure for conductive adhesive tape 4, prevent conductive caused by being bent because of motherboard
Adhesive tape falls off, and it is bad to reduce product.
Fig. 2 to Fig. 5 is please referred to, the present invention also provides a kind of production methods of liquid crystal display panel, include the following steps:
Step S1, the first motherboard 1 is provided, first motherboard 1 includes multiple first substrates 11 of array arrangement；
Step S2, multiple main glue frames 2 are set on first motherboard 1, each main glue frame 2 is corresponding to surround one first
Substrate 11 is arranged, and instills liquid crystal material in each main glue frame 2；
Step S3, the peripheral glue frame 3 of setting one on first motherboard 1, the periphery glue frame 3 surround first motherboard
1 edge setting, and the peripheral glue frame 3 is equipped with multiple spaced openings 31；
Step S4, multiple conductive adhesive tapes 4 are set in first motherboard 1, each conductive adhesive tape 4 is correspondingly connected with one
One substrate 11；
Step S5, multiple protection glue frames 5 are set on first motherboard 1, and institute is surrounded in the multiple sealing of protection glue frame 5
State each conductive adhesive tape 4；
Step S6, the second motherboard 6 is provided, second motherboard 6 includes multiple the second substrates 61 of array arrangement；
Step S7, second motherboard 6 is carried out with first motherboard 1 it is vacuum abutted so that each first substrate
11 correspondences are bonded with a second substrate 61, and breaking vacuum obtains multiple liquid crystal display panels after the completion of fitting.
Specifically, the liquid crystal material is photosensitive liquid crystal material comprising liquid crystal parent and reactive monomer.
Further, the production method of the liquid crystal display panel further include:
Step S8, apply orientation signal to first substrate 11 described in each, while will be described by the conductive adhesive tape 4
Orientation signal is transferred in corresponding the second substrate 21, so that the liquid crystal rotates；
Step S9, the liquid crystal irradiating ultraviolet light into each liquid crystal display panel, to carry out orientation to the liquid crystal.
Specifically, as shown in Fig. 2, on the first motherboard 1 in multiple first substrates 11 of adjacent rows, wherein the of a line
One substrate 11 is respectively provided with first size, and the first substrate 11 of another row is respectively provided with the second size, and the first size is different
In the second size；
Adjacent corresponding two conductive adhesive tape 4 of two first substrates 11 is connected to form a conductive adhesive tape group on column direction
41；
The corresponding first substrate being located in two adjacent first substrates 11 with the second size of the conductive adhesive tape group 41
11 side and be located around this with the second size first substrate 11 main glue frame 2 outside；
Further, as shown in Fig. 2, in some embodiments of the invention, first motherboard 1 includes in 4 rows 4 column row
16 first substrates 11 of cloth, wherein first and the first substrate 11 of the third line be respectively provided with first size, second and fourth line
First substrate 11 be respectively provided with the second size, the left side of each the second size first substrate 11 be equipped with a conductive adhesive tape
Group 41, the conductive adhesive tape group 41 include two connected conductive adhesive tapes 4, which, which respectively corresponds this, has second
The first substrate 11 of size and this there is the first substrate 11 with first size of the upside of first substrate 11 of the second size to set
It sets.
Specifically, each as shown in Fig. 2, the quantity of the protection glue frame 5 is equal with the quantity of the conductive adhesive tape group 41
A conductive adhesive tape group 41 and a main glue frame 2 namely the guarantor of 41 side of conductive adhesive tape group are surrounded in a protection glue frame 5 sealing
The quantity for protecting glue frame 5 is 8, and it is 2 conductive adhesive tapes 4 that each protection glue frame 5, which surrounds 1 conductive adhesive tape group 41,.
Further, as shown in Fig. 2, in some embodiments of the invention, first motherboard 1 includes in 4 rows 4 column row
16 first substrates 11 of cloth, wherein first and the first substrate 11 of the third line be respectively provided with first size, second and fourth line
First substrate 11 be respectively provided with the second size, each have the second size first substrate 11 left side be equipped with a conduction
Adhesive tape group 41, the conductive adhesive tape group 41 include two connected conductive adhesive tapes 4, which, which respectively corresponds this, has
The first substrate 11 of second size and this there is the first substrate with first size of the upside of first substrate 11 of the second size
11 settings.
Specifically, as shown in figure 3, specifically, as shown in figure 3, the quantity and the conductive adhesive tape group of the protection glue frame 5
41 line number is equal, and a line conductive adhesive tape group 41 and corresponding with the row conductive adhesive tape group 41 is surrounded in each protection sealing of glue frame 5
The main glue frame 2 of a line namely it is described protection glue frame 5 quantity be 2, each protection glue frame 5 surround 4 conductive adhesive tape groups 41
That is 8 conductive adhesive tapes 4.
Optionally, the shape of each protection glue frame 5 is rectangle, round or ellipse.
Optionally, second size is less than first size.
Optionally, the material of the conductive adhesive tape 4 is conductive gold size (Au Seal).
It is worth mentioning, in other embodiments of the invention, the row of the arrangement mode of first substrate 11, conductive adhesive tape 4
The set-up mode of column mode and protection glue frame 5 can also make corresponding deformation, as long as the protection glue frame 5 can be by each
Conductive adhesive tape 4 is all sealed protection, so that conductive adhesive tape 4 obtains protection.
It should be noted that the protection glue frame 5 of each conductive adhesive tape 4 is surrounded by setting sealing, in motherboard to a group fitting
When vacuum breaker, protection glue frame 5 can stop gas shock conductive adhesive tape 4, caused by avoiding because of gas shock conductive adhesive tape deformation or
It falls off, in motherboard bending, protection glue frame 5 can share pressure for conductive adhesive tape 4, prevent conductive caused by being bent because of motherboard
Adhesive tape falls off, and it is bad to reduce product.
In conclusion the present invention provides a kind of motherboard structure.The motherboard structure includes: the first motherboard and is set to described
Multiple main glue frames, a peripheral glue frame, multiple conductive adhesive tapes and multiple protection glue frames on first motherboard；The periphery glue frame surrounds
The edge of first motherboard is arranged, and the peripheral glue frame is equipped with multiple spaced openings；The first motherboard packet
Include multiple first substrates of array arrangement, each main glue frame is corresponding around a first substrate setting, it is corresponding each first
Substrate is provided with a conductive adhesive tape, and each conductive adhesive tape is surrounded in the multiple protection glue frame sealing, passes through setting sealing packet
The protection glue frame for enclosing each conductive adhesive tape, conductive adhesive tape deformation or de- caused by can be avoided because of gas shock or motherboard bending
It falls, it is bad to reduce product.The present invention also provides a kind of production method of liquid crystal display panel, can be avoided conductive adhesive tape deformation or
It falls off, prevents product bad.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (10)
1. a kind of motherboard structure characterized by comprising the first motherboard (1) and be set to first motherboard (1) on it is multiple
Main glue frame (2), a peripheral glue frame (3), multiple conductive adhesive tapes (4) and multiple protection glue frames (5)；
The periphery glue frame (3) is arranged around the edge of first motherboard (1), and the peripheral glue frame (3) is equipped with multiple
Spaced opening (31)；
First motherboard (1) includes multiple first substrates (11) of array arrangement, each main glue frame (2) is corresponding to surround one
First substrate (11) setting, each corresponding first substrate (11) are provided with a conductive adhesive tape (4), the multiple protection glue frame
(5) each conductive adhesive tape (4) is surrounded in sealing.
2. motherboard structure as described in claim 1, which is characterized in that multiple the first of adjacent rows on the first motherboard (1)
In substrate (11), wherein the first substrate (11) of a line is respectively provided with first size, and the first substrate (11) of another row has respectively
There is the second size, the first size is different from the second size；
Adjacent corresponding two conductive adhesive tape (4) of two first substrates (11) is connected to form a conductive adhesive tape group on column direction
(41)；
The corresponding first substrate being located in two adjacent first substrates (11) with the second size of the conductive adhesive tape group (41)
(11) side and it is located around the main glue frame (2) of the first substrate (11) with the second size outside.
3. motherboard structure as claimed in claim 2, which is characterized in that the quantity of protection glue frame (5) and the conducting resinl
The quantity of item group (41) is equal, and a conductive adhesive tape group (41) and the conductive adhesive tape group are surrounded in each protection glue frame (5) sealing
(41) the one of side main glue frame (2).
4. motherboard structure as claimed in claim 2, which is characterized in that the quantity of protection glue frame (5) and the conducting resinl
The line number of item group (41) is equal, each protection glue frame (5) sealing surround a line conductive adhesive tape group (41) and with the row conducting resinl
The corresponding main glue frame of a line (2) of item group (41).
5. a kind of production method of liquid crystal display panel, which comprises the steps of:
Step S1, the first motherboard (1) is provided, first motherboard (1) includes multiple first substrates (11) of array arrangement；
Step S2, multiple main glue frames (2) are set on first motherboard (1), each main glue frame (2) is corresponding around one the
One substrate (11) setting, and liquid crystal material is instilled in each main glue frame (2)；
Step S3, the peripheral glue frame (3) of setting one on first motherboard (1), the periphery glue frame (3) are female around described first
The edge of plate (1) is arranged, and the peripheral glue frame (3) is equipped with multiple spaced openings (31)；
Step S4, multiple conductive adhesive tapes (4) are set in first motherboard (1), each conductive adhesive tape (4) is correspondingly connected with one
First substrate (11)；
Step S5, multiple protection glue frames (5) are set on first motherboard (1), and the multiple protection glue frame (5) sealing is surrounded
Each conductive adhesive tape (4)；
Step S6, the second motherboard (6) are provided, second motherboard (6) includes multiple the second substrates (61) of array arrangement；
Step S7, second motherboard (6) and first motherboard (1) progress is vacuum abutted, so that each first substrate
(11) correspondence is bonded with a second substrate (61), and breaking vacuum obtains multiple liquid crystal display panels after the completion of fitting.
6. the production method of liquid crystal display panel as claimed in claim 5, which is characterized in that adjacent on the first motherboard (1)
In multiple first substrates (11) of two rows, wherein the first substrate (11) of a line is respectively provided with first size, and the first of another row
Substrate (11) is respectively provided with the second size, and the first size is different from the second size；
Adjacent corresponding two conductive adhesive tape (4) of two first substrates (11) is connected to form a conductive adhesive tape group on column direction
(41)；
The corresponding first substrate being located in two adjacent first substrates (11) with the second size of the conductive adhesive tape group (41)
(11) side and it is located around the main glue frame (2) of the first substrate (11) with the second size outside.
7. the production method of liquid crystal display panel as claimed in claim 6, which is characterized in that the number of protection glue frame (5)
Measure, each protection glue frame (5) sealing encirclement one conductive adhesive tape group (41) equal with the quantity of the conductive adhesive tape group (41)
An and main glue frame (2) of conductive adhesive tape group (41) side.
8. the production method of liquid crystal display panel as claimed in claim 6, which is characterized in that the number of protection glue frame (5)
Measure, each protection glue frame (5) sealing encirclement a line conductive adhesive tape group (41) equal with the line number of the conductive adhesive tape group (41)
And the main glue frame of a line corresponding with row conductive adhesive tape group (41) (2).
9. the production method of liquid crystal display panel as claimed in claim 5, which is characterized in that the liquid crystal material is photosensitive liquid
Brilliant material.
10. the production method of liquid crystal display panel as claimed in claim 9, which is characterized in that further include:
Step S8, apply orientation signal to first substrate described in each (11), while will be described by the conductive adhesive tape (4)
Orientation signal is transferred on corresponding the second substrate (21)；
Step S9, the liquid crystal material irradiating ultraviolet light into each liquid crystal display panel, to carry out orientation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234487.2A CN109799652B (en) | 2019-03-26 | 2019-03-26 | Mother board structure and manufacturing method of liquid crystal display panel |
| PCT/CN2019/083057 WO2020191831A1 (en) | 2019-03-26 | 2019-04-17 | Motherboard structure and method for manufacturing liquid crystal display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910234487.2A CN109799652B (en) | 2019-03-26 | 2019-03-26 | Mother board structure and manufacturing method of liquid crystal display panel |
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| Publication Number | Publication Date |
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| CN109799652A true CN109799652A (en) | 2019-05-24 |
| CN109799652B CN109799652B (en) | 2021-04-02 |
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| CN201910234487.2A Active CN109799652B (en) | 2019-03-26 | 2019-03-26 | Mother board structure and manufacturing method of liquid crystal display panel |
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| Country | Link |
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| CN (1) | CN109799652B (en) |
| WO (1) | WO2020191831A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110346984A (en) * | 2019-07-03 | 2019-10-18 | 深圳市华星光电技术有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN114185204A (en) * | 2021-11-19 | 2022-03-15 | Tcl华星光电技术有限公司 | Preparation method of liquid crystal display panel and liquid crystal display panel |
| CN114236917A (en) * | 2021-12-29 | 2022-03-25 | 滁州惠科光电科技有限公司 | Display assembly and manufacturing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101051126A (en) * | 2006-04-07 | 2007-10-10 | 群康科技(深圳)有限公司 | Panel for liquid crystal display |
| CN102012576A (en) * | 2009-09-07 | 2011-04-13 | 北京京东方光电科技有限公司 | Mother board of liquid crystal panel and manufacturing method thereof |
| CN202081054U (en) * | 2011-06-16 | 2011-12-21 | 北京京东方光电科技有限公司 | Adhesive tape and panel |
| CN203055376U (en) * | 2013-01-11 | 2013-07-10 | 深圳市晶福源电子技术有限公司 | Fixing structure of liquid crystal display (LCD) screen |
| CN203178629U (en) * | 2013-04-26 | 2013-09-04 | 北京京东方光电科技有限公司 | Mother board of liquid crystal display panel |
| CN105717710A (en) * | 2016-04-05 | 2016-06-29 | 友达光电（昆山）有限公司 | Display panel and manufacturing method thereof |
| CN105929608A (en) * | 2016-07-14 | 2016-09-07 | 京东方科技集团股份有限公司 | Display main panel and manufacturing method and display device of display main panel |
| CN106019727A (en) * | 2016-07-29 | 2016-10-12 | 京东方科技集团股份有限公司 | Display mother board, display panel and display device |
| CN108121116A (en) * | 2017-12-29 | 2018-06-05 | 深圳市华星光电半导体显示技术有限公司 | A kind of alignment method of liquid crystal display panel |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005148214A (en) * | 2003-11-12 | 2005-06-09 | Seiko Epson Corp | Method for manufacturing liquid crystal display device, liquid crystal display device manufactured with the method, and electronic apparatus with liquid crystal display device mounted thereon |
| CN105022197A (en) * | 2014-04-30 | 2015-11-04 | 瀚宇彩晶股份有限公司 | Mother plate stacking structure and manufacturing method thereof |
| CN104090404B (en) * | 2014-06-30 | 2017-02-08 | 成都天马微电子有限公司 | Liquid crystal display motherboard and manufacturing method of liquid crystal display motherboard |
| JP6502638B2 (en) * | 2014-09-10 | 2019-04-17 | 株式会社ジャパンディスプレイ | Liquid crystal display device and mother substrate |
| CN106338863A (en) * | 2016-11-08 | 2017-01-18 | 深圳市华星光电技术有限公司 | The PSVA liquid crystal display panel and liquid crystal display |
-
2019
- 2019-03-26 CN CN201910234487.2A patent/CN109799652B/en active Active
- 2019-04-17 WO PCT/CN2019/083057 patent/WO2020191831A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101051126A (en) * | 2006-04-07 | 2007-10-10 | 群康科技(深圳)有限公司 | Panel for liquid crystal display |
| CN102012576A (en) * | 2009-09-07 | 2011-04-13 | 北京京东方光电科技有限公司 | Mother board of liquid crystal panel and manufacturing method thereof |
| CN202081054U (en) * | 2011-06-16 | 2011-12-21 | 北京京东方光电科技有限公司 | Adhesive tape and panel |
| CN203055376U (en) * | 2013-01-11 | 2013-07-10 | 深圳市晶福源电子技术有限公司 | Fixing structure of liquid crystal display (LCD) screen |
| CN203178629U (en) * | 2013-04-26 | 2013-09-04 | 北京京东方光电科技有限公司 | Mother board of liquid crystal display panel |
| CN105717710A (en) * | 2016-04-05 | 2016-06-29 | 友达光电（昆山）有限公司 | Display panel and manufacturing method thereof |
| CN105929608A (en) * | 2016-07-14 | 2016-09-07 | 京东方科技集团股份有限公司 | Display main panel and manufacturing method and display device of display main panel |
| CN106019727A (en) * | 2016-07-29 | 2016-10-12 | 京东方科技集团股份有限公司 | Display mother board, display panel and display device |
| CN108121116A (en) * | 2017-12-29 | 2018-06-05 | 深圳市华星光电半导体显示技术有限公司 | A kind of alignment method of liquid crystal display panel |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110346984A (en) * | 2019-07-03 | 2019-10-18 | 深圳市华星光电技术有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN114185204A (en) * | 2021-11-19 | 2022-03-15 | Tcl华星光电技术有限公司 | Preparation method of liquid crystal display panel and liquid crystal display panel |
| CN114236917A (en) * | 2021-12-29 | 2022-03-25 | 滁州惠科光电科技有限公司 | Display assembly and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109799652B (en) | 2021-04-02 |
| WO2020191831A1 (en) | 2020-10-01 |
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